JP5264924B2 - 熱伝導性プラスチック樹脂組成物 - Google Patents
熱伝導性プラスチック樹脂組成物 Download PDFInfo
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- JP5264924B2 JP5264924B2 JP2010534173A JP2010534173A JP5264924B2 JP 5264924 B2 JP5264924 B2 JP 5264924B2 JP 2010534173 A JP2010534173 A JP 2010534173A JP 2010534173 A JP2010534173 A JP 2010534173A JP 5264924 B2 JP5264924 B2 JP 5264924B2
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- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001279 poly(ester amides) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- BPILDHPJSYVNAF-UHFFFAOYSA-M sodium;diiodomethanesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(I)I BPILDHPJSYVNAF-UHFFFAOYSA-M 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000003017 thermal stabilizer Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- VJDDQSBNUHLBTD-UHFFFAOYSA-N trans-crotonic acid-anhydride Natural products CC=CC(=O)OC(=O)C=CC VJDDQSBNUHLBTD-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/40—Glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
- Y10T428/31765—Inorganic-containing or next to inorganic-containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US355607P | 2007-11-16 | 2007-11-16 | |
| US61/003,556 | 2007-11-16 | ||
| PCT/US2008/083389 WO2009064873A1 (en) | 2007-11-16 | 2008-11-13 | Thermally conductive plastic resin composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011503327A JP2011503327A (ja) | 2011-01-27 |
| JP2011503327A5 JP2011503327A5 (OSRAM) | 2011-11-17 |
| JP5264924B2 true JP5264924B2 (ja) | 2013-08-14 |
Family
ID=40297752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010534173A Expired - Fee Related JP5264924B2 (ja) | 2007-11-16 | 2008-11-13 | 熱伝導性プラスチック樹脂組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20090130471A1 (OSRAM) |
| EP (1) | EP2209845B1 (OSRAM) |
| JP (1) | JP5264924B2 (OSRAM) |
| CN (1) | CN101861354A (OSRAM) |
| AT (1) | ATE509979T1 (OSRAM) |
| WO (1) | WO2009064873A1 (OSRAM) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080153959A1 (en) * | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
| US20090152491A1 (en) * | 2007-11-16 | 2009-06-18 | E. I. Du Pont De Nemours And Company | Thermally conductive resin compositions |
| US8293831B2 (en) * | 2008-10-30 | 2012-10-23 | E I Du Pont De Nemours And Company | Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide |
| JP5767245B2 (ja) * | 2009-12-30 | 2015-08-19 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ Ｇｅｓｅｌｌｓｃｈａｆｔ ｍｉｔ ｂｅｓｃｈｒａｅｎｋｔｅｒ Ｈａｆｔｕｎｇ | 水分子に対する拡散障壁としての成型構成物 |
| DK2595802T3 (en) * | 2010-07-22 | 2015-11-09 | Ferro Corp | A hermetically sealed electronic device having coated glass flakes |
| US20120080640A1 (en) * | 2010-09-30 | 2012-04-05 | E.I. Du Pont De Nemours And Company | Thermally conductive resin composition |
| US20120153217A1 (en) * | 2010-12-20 | 2012-06-21 | E.I.Du Pont De Nemours And Company | Thermally conductive polymeric resin composition |
| US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| EP2596936B1 (en) * | 2011-11-24 | 2015-09-09 | ABB Research Ltd. | Mold and method for producing shaped articles from a UV-curable composition |
| CN103146355B (zh) * | 2011-12-07 | 2016-02-10 | 北京中石伟业科技股份有限公司 | 一种吸热材料 |
| US9227347B2 (en) | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
| JP6618144B2 (ja) * | 2015-11-17 | 2019-12-11 | デンカ株式会社 | 球状フッ化カルシウム |
| DE102016119751A1 (de) | 2016-10-17 | 2018-04-19 | Ensinger Gmbh | Polymer-Compounds für die Herstellung von Polyester-Folien mit erhöhter Wärmeleitfähigkeit |
| DE102016220280A1 (de) | 2016-10-17 | 2018-04-19 | Mitsubishi Polyester Film Gmbh | Orientierte Polyesterfolien mit erhöhter Wärmeleitfähigkeit |
| CN107603211B (zh) * | 2017-09-26 | 2020-07-14 | 上海日之升科技有限公司 | 一种高流动高韧性导热尼龙复合材料及其制备方法 |
| CN111433026B (zh) * | 2017-12-05 | 2021-09-17 | 利安德巴塞尔先进聚合物公司 | 高性能聚酰胺化合物及其用途 |
| JP6755376B2 (ja) * | 2019-09-27 | 2020-09-16 | デンカ株式会社 | 球状フッ化カルシウム |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0982136A (ja) * | 1995-09-11 | 1997-03-28 | Hitachi Ltd | 高熱伝導半導電性プリプレグシート，固定子コイル及びそれを用いた回転電機と回転電機固定子の製造方法 |
| JPH10271730A (ja) * | 1997-03-19 | 1998-10-09 | Fujitsu General Ltd | 電動機 |
| WO2001096458A1 (de) * | 2000-06-16 | 2001-12-20 | Siemens Aktiengesellschaft | Füllstoff für wärmeleitende kunststoffe, wärmeleitender kunststoff und herstellungsverfahren dazu |
| JP2002188007A (ja) * | 2000-12-21 | 2002-07-05 | Hitachi Metals Ltd | 複合材料及び回路基板 |
| JP2003040619A (ja) * | 2001-07-27 | 2003-02-13 | Hitachi Metals Ltd | ＣａＦ２粉末の表面処理方法、樹脂複合材料及びそれを用いた構成部材 |
| US20050176835A1 (en) * | 2004-01-12 | 2005-08-11 | Toshikazu Kobayashi | Thermally conductive thermoplastic resin compositions |
| US20060293427A1 (en) * | 2005-06-10 | 2006-12-28 | Martens Marvin M | Thermally conductive polyamide-based components used in light emitting diode reflector applications |
-
2008
- 2008-11-12 US US12/291,627 patent/US20090130471A1/en not_active Abandoned
- 2008-11-13 CN CN200880116190A patent/CN101861354A/zh active Pending
- 2008-11-13 AT AT08850469T patent/ATE509979T1/de not_active IP Right Cessation
- 2008-11-13 JP JP2010534173A patent/JP5264924B2/ja not_active Expired - Fee Related
- 2008-11-13 EP EP20080850469 patent/EP2209845B1/en not_active Not-in-force
- 2008-11-13 WO PCT/US2008/083389 patent/WO2009064873A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN101861354A (zh) | 2010-10-13 |
| WO2009064873A1 (en) | 2009-05-22 |
| ATE509979T1 (de) | 2011-06-15 |
| US20090130471A1 (en) | 2009-05-21 |
| EP2209845A1 (en) | 2010-07-28 |
| JP2011503327A (ja) | 2011-01-27 |
| EP2209845B1 (en) | 2011-05-18 |
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