ATE509979T1 - Wärmeleitfähige kunststoffharzzusammensetzung - Google Patents

Wärmeleitfähige kunststoffharzzusammensetzung

Info

Publication number
ATE509979T1
ATE509979T1 AT08850469T AT08850469T ATE509979T1 AT E509979 T1 ATE509979 T1 AT E509979T1 AT 08850469 T AT08850469 T AT 08850469T AT 08850469 T AT08850469 T AT 08850469T AT E509979 T1 ATE509979 T1 AT E509979T1
Authority
AT
Austria
Prior art keywords
thermally conductive
resin composition
plastic resin
conductive plastic
polymer
Prior art date
Application number
AT08850469T
Other languages
German (de)
English (en)
Inventor
Yuji Saga
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Application granted granted Critical
Publication of ATE509979T1 publication Critical patent/ATE509979T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide
    • Y10T428/31765—Inorganic-containing or next to inorganic-containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT08850469T 2007-11-16 2008-11-13 Wärmeleitfähige kunststoffharzzusammensetzung ATE509979T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US355607P 2007-11-16 2007-11-16
PCT/US2008/083389 WO2009064873A1 (en) 2007-11-16 2008-11-13 Thermally conductive plastic resin composition

Publications (1)

Publication Number Publication Date
ATE509979T1 true ATE509979T1 (de) 2011-06-15

Family

ID=40297752

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08850469T ATE509979T1 (de) 2007-11-16 2008-11-13 Wärmeleitfähige kunststoffharzzusammensetzung

Country Status (6)

Country Link
US (1) US20090130471A1 (OSRAM)
EP (1) EP2209845B1 (OSRAM)
JP (1) JP5264924B2 (OSRAM)
CN (1) CN101861354A (OSRAM)
AT (1) ATE509979T1 (OSRAM)
WO (1) WO2009064873A1 (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080153959A1 (en) * 2006-12-20 2008-06-26 General Electric Company Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof
US20090152491A1 (en) * 2007-11-16 2009-06-18 E. I. Du Pont De Nemours And Company Thermally conductive resin compositions
US8293831B2 (en) * 2008-10-30 2012-10-23 E I Du Pont De Nemours And Company Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide
US9093623B2 (en) * 2009-12-30 2015-07-28 Merck Patent Gmbh Casting composition as diffusion barrier for water molecules
CN103025516B (zh) * 2010-07-22 2016-04-20 费罗公司 使用玻璃片的气密密封的电子装置
US20120080640A1 (en) * 2010-09-30 2012-04-05 E.I. Du Pont De Nemours And Company Thermally conductive resin composition
US20120153217A1 (en) * 2010-12-20 2012-06-21 E.I.Du Pont De Nemours And Company Thermally conductive polymeric resin composition
US8552101B2 (en) 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
US8741998B2 (en) 2011-02-25 2014-06-03 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
EP2596936B1 (en) * 2011-11-24 2015-09-09 ABB Research Ltd. Mold and method for producing shaped articles from a UV-curable composition
CN103146355B (zh) * 2011-12-07 2016-02-10 北京中石伟业科技股份有限公司 一种吸热材料
US9227347B2 (en) 2013-02-25 2016-01-05 Sabic Global Technologies B.V. Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
JP6618144B2 (ja) * 2015-11-17 2019-12-11 デンカ株式会社 球状フッ化カルシウム
DE102016220280A1 (de) 2016-10-17 2018-04-19 Mitsubishi Polyester Film Gmbh Orientierte Polyesterfolien mit erhöhter Wärmeleitfähigkeit
DE102016119751A1 (de) 2016-10-17 2018-04-19 Ensinger Gmbh Polymer-Compounds für die Herstellung von Polyester-Folien mit erhöhter Wärmeleitfähigkeit
CN107603211B (zh) * 2017-09-26 2020-07-14 上海日之升科技有限公司 一种高流动高韧性导热尼龙复合材料及其制备方法
CN111433026B (zh) * 2017-12-05 2021-09-17 利安德巴塞尔先进聚合物公司 高性能聚酰胺化合物及其用途
JP6755376B2 (ja) * 2019-09-27 2020-09-16 デンカ株式会社 球状フッ化カルシウム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0982136A (ja) * 1995-09-11 1997-03-28 Hitachi Ltd 高熱伝導半導電性プリプレグシート，固定子コイル及びそれを用いた回転電機と回転電機固定子の製造方法
JPH10271730A (ja) * 1997-03-19 1998-10-09 Fujitsu General Ltd 電動機
WO2001096458A1 (de) * 2000-06-16 2001-12-20 Siemens Aktiengesellschaft Füllstoff für wärmeleitende kunststoffe, wärmeleitender kunststoff und herstellungsverfahren dazu
JP2002188007A (ja) * 2000-12-21 2002-07-05 Hitachi Metals Ltd 複合材料及び回路基板
JP2003040619A (ja) * 2001-07-27 2003-02-13 Hitachi Metals Ltd ＣａＦ２粉末の表面処理方法、樹脂複合材料及びそれを用いた構成部材
US20050176835A1 (en) * 2004-01-12 2005-08-11 Toshikazu Kobayashi Thermally conductive thermoplastic resin compositions
US20060293427A1 (en) * 2005-06-10 2006-12-28 Martens Marvin M Thermally conductive polyamide-based components used in light emitting diode reflector applications

Also Published As

Publication number Publication date
WO2009064873A1 (en) 2009-05-22
US20090130471A1 (en) 2009-05-21
EP2209845A1 (en) 2010-07-28
JP5264924B2 (ja) 2013-08-14
JP2011503327A (ja) 2011-01-27
CN101861354A (zh) 2010-10-13
EP2209845B1 (en) 2011-05-18

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Legal Events

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