JP5264399B2 - Variable mounting mechanism of flat display module assembly apparatus and flat display manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To render an assembling apparatus conventionally used variable to flexibly respond assembling of a printed board. <P>SOLUTION: A variable mounting mechanism 1 of an assembling apparatus for a flat display module is provided for assembling a flat display module, wherein the mechanism includes a frame mount base 10 where a plurality of pretreatment units 11 for pretreating a printed board 4 to be assembled in a liquid crystal cell 2 are mounted, and a coupling element between the pretreatment unit 11 and the frame mount base 10 is disposed on the frame mount base 10. Accordingly, the plurality of pretreatment units 11 can be additionally mounted on the frame mount base 10, which allows construction of a new production line while utilizing a conventionally used production line. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

The present invention relates to a variable loading mechanism and a manufacturing unit for a planar display according to the variable mounting mechanism of the flat display module assembly unit for a planar display module assembling apparatus for assembling a printed circuit board on a glass substrate.

  The liquid crystal display has a configuration in which a TFT array substrate and a color filter substrate are bonded together to form a liquid crystal cell, and a printed circuit board (PCB) is assembled to one to four sides of the periphery. TCP as a driver IC is interposed between the printed circuit board and the liquid crystal cell, and the two are thermocompression bonded between the printed circuit board and the TCP and between the liquid crystal cell and the TCP by an ACF as an anisotropic conductive film. I am letting.

When assembling a printed circuit board to a liquid crystal cell, carry in a liquid crystal cell in which a plurality of TCPs are mounted in advance, and perform thermocompression bonding between the printed circuit board with the ACF attached and the TCP of the liquid crystal cell. Yes. As an apparatus for assembling a printed circuit board in a liquid crystal cell, there is a technique disclosed in Patent Document 1. In this technique, a printed circuit board is taken out one by one from a pallet on which a plurality of printed circuit boards are mounted, and an ACF is attached to the printed circuit board, and the printed circuit board on which the ACF is attached is mounted with TCP. The liquid crystal cell is thermocompression bonded. Patent Document 2 discloses a technique that enables two types of printed circuit boards to be attached to a liquid crystal cell. In this technique, a plurality of different types of printed circuit boards are placed on the first pallet and the second pallet, the ACF is applied to the printed circuit board taken out from the first pallet, and then the printed circuit board on which the ACF is applied. Is transferred to the main crimping section, and the printed circuit board with the ACF attached is crimped to a predetermined position of the liquid crystal cell on which the TCP is mounted.
JP-A-9-185079 JP 11-261214 A

  The liquid crystal cell is composed of two sides, a gate side (short side) and a source side (long side), and these two sides have different sizes. There are various printed circuit board sizes, but if the same size printed circuit board is used on the gate side and the source side, the printed circuit board assembled on the gate side and the printed circuit board assembled on the source side are assembled. The number of sheets is different. For example, in the case of a liquid crystal display with a screen size that is not so large, one printed circuit board is assembled on the gate side and two printed circuit boards are assembled on the source side.

  In the techniques of Patent Documents 1 and 2 described above, a single printed board is assembled in a liquid crystal cell. Therefore, when the printed circuit board is assembled using the same apparatus, the throughput of assembling the printed circuit board on the source side is reduced, not only on the gate side, but the overall processing efficiency is lowered. In particular, liquid crystal displays in recent years have been increasing in size, and the number of printed circuit boards that can be assembled in liquid crystal cells has also been increasing. A large number of printed circuit boards are assembled on the source side. In the conventional method of assembling, the overall throughput is greatly reduced.

  In this regard, there is a configuration in which two printed circuit board assembly apparatuses are arranged in parallel so that two printed circuit boards can be assembled simultaneously to one side of the liquid crystal cell. In this case, since two printed boards can be assembled at the same time, the throughput can be improved, and the overall processing efficiency can be greatly improved. However, when two printed circuit board assembling apparatuses are arranged in parallel, these are configured as one unit that is inseparable, and do not adopt an independent configuration. Therefore, when a production line is built using a device that assembles printed circuit boards for each sheet, it is possible to assemble two printed circuit boards in order to meet the demand for assembling two printed circuit boards. Such a device must be newly introduced to construct a production line.

  As described above, the screen size of liquid crystal displays tends to increase, but while home-use liquid crystal displays are increasing in size, commercial-use liquid crystal display screen sizes are still relatively small. ing. Accordingly, the screen size of the liquid crystal display has a large width, and the number of printed boards to be assembled varies greatly depending on the screen size. In this regard, when using an assembly device compatible with a liquid crystal cell of a small-sized liquid crystal display, when trying to construct a new production line compatible with a large-sized liquid crystal cell, the above-mentioned two assembly devices are integrated. There was no choice but to either introduce a new assembly device that was configured as inseparable or sacrifice the throughput using a conventional assembly device. In addition, there is also a request that the device for assembling the printed circuit board on the gate side should be diverted to the source side, and diverting the assembly device on the gate side, where the number of printed circuit boards that can be assembled is small, causes a decrease in throughput, resulting in a decrease in throughput. In order to avoid this, it is necessary to introduce a new assembling apparatus.

  Therefore, an object of the present invention is to make it possible to change an assembling apparatus that has been used before, and to flexibly cope with the assembling of a printed board.

In order to solve the above problems, the variable mounting mechanism of the flat display module assembling apparatus according to claim 1 of the present invention is a variable mounting mechanism of the flat display module assembling apparatus for assembling the flat display module, and is a print mounted on the glass substrate. A pretreatment unit that performs pretreatment on a substrate, a frame cradle on which a plurality of the pretreatment units can be installed, and a coupling element for joining the frame cradle and the pretreatment unit , When the assembly process of printed circuit boards is performed, the preprocessing unit is controlled by a program, and the function of the program can be switched according to the number of preprocessing units installed on the frame stand. characterized in that it in.

  According to the variable mounting mechanism of the flat display module assembling apparatus, the frame stage is configured by arranging the coupling elements between the pre-processing unit and the frame stage, so a new pre-processing unit is added to the frame stage. It becomes possible to do. Thereby, by adding to a plurality of pretreatment units, the number of printed circuit boards to be assembled can be freely changed, and it becomes possible to flexibly cope with the reconstruction of the production line.

  According to a second aspect of the present invention, in the variable mounting mechanism of the flat display module assembling apparatus according to the first aspect, the coupling element includes a positioning mechanism.

  According to the variable mounting mechanism of the flat display module assembling apparatus, since the positioning mechanism is provided, when a new pre-processing unit is newly added, the positioning mechanism can accurately position.

  According to a third aspect of the present invention, in the variable mounting mechanism of the flat display module assembling apparatus according to the first or second aspect, the coupling element detects the presence or absence of the pre-processing unit. It is characterized by including a sensor.

  According to the variable mounting mechanism of the flat display module assembling apparatus, since the sensor is provided, the presence / absence of the preprocessing unit can be detected. Thereby, according to the detected number of pre-processing units, it becomes possible to automatically change the assembly control of the printed circuit board.

  A flat display module assembly apparatus variable mounting mechanism according to a fourth aspect of the present invention is the variable mounting mechanism of the flat display module assembly apparatus according to any one of the first to third aspects, wherein the pre-processing unit is anisotropic. It has a temporary pressure bonding mechanism for the conductive conductive film.

  According to the variable mounting mechanism of the flat display module assembling apparatus, the pretreatment unit is provided with a temporary pressure bonding mechanism for the anisotropic conductive film (ACF), so that the printed circuit board in which the ACF is temporarily pressure bonded is applied to the liquid crystal cell. Can be assembled.

The variable mounting mechanism of the flat display module assembling apparatus according to claim 5 of the present invention is the variable mounting mechanism of the flat display module assembling apparatus according to claim 4, wherein the anisotropic conductive film is temporarily bonded by the temporary pressing mechanism. A main processing unit for assembling the printed circuit board to the glass substrate by main pressure bonding, and the frame mounting table on which a plurality of the preprocessing units can be installed, are extended from the preprocessing unit to the main processing unit. And a conveying means for conveying. According to a sixth aspect of the present invention, there is provided a flat display manufacturing apparatus including the variable mounting mechanism of the flat display module assembling apparatus according to any one of the first to fifth aspects.

  The variable mounting mechanism of the flat display module assembling apparatus described above can be applied to a flat display manufacturing apparatus. As a flat display, in addition to a liquid crystal display, it can be applied to a plasma display, an organic EL display, and the like.

  In the present invention, since a frame stand on which a plurality of pretreatment units can be installed is arranged as a coupling element between the pretreatment unit and the frame stand, the pretreatment units can be freely added and printed according to the situation. The assembly of the board can be flexibly changed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following, a case where a printed circuit board (PCB) is assembled to a liquid crystal cell constituting a liquid crystal display will be described, but the present invention is not limited to this, and any flat display such as a plasma display or an organic EL display can be applied. The liquid crystal cell is a glass substrate in which liquid crystal is sealed between a TFT substrate having a TFT circuit formed on a glass substrate and a color filter substrate having a color filter formed on the glass substrate.

  FIG. 1 shows a schematic configuration of a variable mounting mechanism (hereinafter simply referred to as a variable mounting mechanism 1) of the flat display module assembling apparatus of the present invention. The variable mounting mechanism 1 is an apparatus that is assembled by press-bonding a plurality of TCPs (driver ICs) 3 mounted at predetermined positions of the liquid crystal cell 2 and the printed circuit board 4 in a pre-process (temporary pressure-bonding process). And as the structure, it comprises the pre-processing unit 11 installed in the flame | frame stand 10, the main crimping | compression-bonding conveyance part 12, and the main crimping apparatus 13, and has comprised roughly.

  In FIG. 1, the frame table 10 is divided into two frame tables 10a and 10b, and a pre-processing unit 11 is installed on the frame table 10a. Accordingly, the frame mounting table 10 has a configuration in which the coupling elements of the preprocessing unit 11 and the frame mounting table 10b are arranged. In this case, since only one pre-processing unit 11 is installed, the printed circuit board 4 is assembled to the liquid crystal cell 2 one by one. As will be described later, the pretreatment unit 11 can be expanded, and a new production line can be constructed in which two printed circuit boards 4 are assembled to the liquid crystal cell 2 at the same time. In FIG. 1, the printed circuit board 4 is assembled to the source side (long side) of the liquid crystal cell 2, but the printed circuit board 4 is assembled to the gate side (short side). Also good. In the configuration of FIG. 1, it is possible to add up to two preprocessing units 11 in the frame mounting table 10, but three or more preprocessing units 11 may be added. In this case, the number of printed circuit boards 4 corresponding to the number of added preprocessing units 11 can be simultaneously assembled to the liquid crystal cell 2.

  The pretreatment unit 11 includes a tray 20, a PP device 30, two ACF placing tables 41 and 42, and an ACF device 50. The tray 20 is a printed circuit board supply means on which a plurality of printed circuit boards 4 are mounted, and the printed circuit boards 4 are taken out from the tray 20 one by one. The tray 20 emptied after all the printed boards 4 are taken out is discharged to the lower part of the preprocessing unit 11, and a new tray 20 on which the printed board 4 is mounted is set from the lower part of the preprocessing unit 11.

  The PP device 30 is a pick-and-place means for taking out one printed board 4 from the tray 20 and transferring it to the ACF placing tables 41 and 42, and taking out the printed board 4 from the ACF device 50 and transferring it to the Y base 62. is there. The PP device 30 includes a PP part Y-axis 31, a Y-axis motor 32, a Y-axis movable part 33, a PP part X-axis 34, an X-axis motor 35, an X-axis movable part 36, a PP part Z-axis 37, and a clamping part 38. The schematic configuration. The PP unit Y-axis 31 is a means for guiding the operation of the Y-axis movable unit 33 (operation in the Y direction in FIG. 1). The Y-axis movable unit 33 is moved to the PP unit Y-axis 31 by the driving force of the Y-axis motor 32. Along the Y direction. The PP portion X-axis 34 is a means for guiding the operation of the X-axis movable portion 36 (operation in the X direction in FIG. 1). The driving force of the X-axis motor 35 causes the X-axis movable portion 36 to move to the PP portion X-axis 34. Along the X direction. The PP portion Z-axis 37 is a means for guiding the operation of the sandwiching portion 38 in the Z direction (direction perpendicular to the X direction and the Y direction in FIG. 1: the ascending / descending direction). The sandwiching portion 38 is driven by the driving force of a motor (not shown). It moves in the Z direction along the PP part Z axis 37. The clamping unit 38 is a clamping unit such as a chuck unit or a vacuum suction unit, and can hold the printed circuit board 4 taken out from the tray 20.

  As shown in FIG. 1, the preprocessing unit 11 includes two ACF stands 41 and 42. The ACF stands 41 and 42 can reciprocate in the Y direction between a position where the printed circuit board 4 is delivered from the clamping unit 38 of the PP apparatus 30 and a position where the printed circuit board 4 is delivered to the ACF apparatus 50. The ACF table 41 is provided with a gripping claw 43, and the ACF table 42 is provided with a gripping claw 44. The gripping claws 43, 44 can be moved while gripping the printed circuit board 4. . The ACF stands 41 and 42 can operate independently. Although FIG. 1 illustrates an example provided with two ACF tables, the present invention is not limited to this, and three or more ACF tables may be provided, or one ACF table may be provided. May be provided. When three or more ACF stands are provided, each ACF stand is configured to be independently operable.

  The ACF device 50 includes two ACF heads 51 and 52, and is an ACF pressure bonding unit that attaches an ACF (not shown) to the printed circuit board 4 delivered by the ACF mounting tables 41 and 42. The ACF device 50 is provided with a mounting table 53 corresponding to the ACF heads 51 and 52, and the printed circuit board 4 is mounted on the mounting table 53 (the printed circuit board 4 is mounted by the ACF mounting tables 41 and 42. ACF is affixed to the printed circuit board 4. Any method can be used as the method of attaching the ACF to the printed circuit board 4. For example, an ACF supply reel and an ACF recovery reel are provided on the ACF heads 51 and 52, and the ACF is wound around both reels. The ACF is thermocompression bonded to the printed circuit board 4 by a heated crimping means provided at an intermediate portion of both reels. Since the ACF is temporarily bonded to the printed circuit board 4, the ACF is subjected to thermocompression bonding at a low temperature and a low pressure. In addition, an appropriate alignment unit is provided to strictly adjust the position between the ACF and the printed circuit board 4.

   The ACF heads 51 and 52 are movable along an ACF head rail 55 disposed on the ACF head base 54. The movement of the ACF heads 51 and 52 will be described later. The ACF head may be provided with one ACF head, or may be provided with three or more ACF heads, similarly to the ACF mount. By increasing the number of ACF heads, many ACFs can be temporarily bonded in parallel.

  The main crimping conveyance unit 12 is a conveying unit that conveys the printed circuit board 4 from the pretreatment unit 11 to the main crimping device 13. The main-bonding conveyance unit 12 is schematically configured to include an X-axis guide unit for moving the printed circuit board 4 in the X-axis direction and a Y-axis guide unit for moving the printed circuit board 4 in the Y-axis direction. . The X-axis guide means is schematically configured to include an X base 61 that is a base extending in the X-axis direction and an X rail 63 provided on the X base 61. On this X rail 63, Y bases 62a and 62b (collectively referred to as Y base 62) are slidably disposed. The Y bases 62a and 62b are provided with Y rails 64a and 64b (collectively referred to as Y rails 64), and the Y base 62 and the Y rails 64 roughly constitute Y axis guide means. The entire lengths of the X base 61 and the X rail 63 are provided so that the Y base 62a can be moved to the position of the preprocessing unit 11 and the Y base 62b can be moved to the position of the frame mounting table 10b. .

  On the Y rails 64a and 64b, main press-bonding bases 65a and 65b (collectively referred to as the main press-bonding base 65) are provided. A main press chuck 66a is mounted on the main press base 65a. The main crimping base 65a slides on the Y rail 64a and reciprocates in the Y direction, and the main crimping base 65b slides on the Y rail 64b and reciprocates in the Y direction. The main crimping chuck 66a mounted on the main crimping base 65a has a gripping claw 67a for gripping the printed circuit board 4, and moves while gripping the printed circuit board 4. In FIG. 1, the main crimping chuck 65 is not attached to the main crimping base 65 b, but the main crimping chuck 65 can be freely attached to and detached from the main crimping base 65 b.

  The main pressure bonding device 13 is a main processing unit for performing the main pressure bonding of the printed circuit board 4 on which the ACF is temporarily bonded and the TCP 3 mounted on the liquid crystal cell 2 and assembling the printed circuit board 4. After strict alignment, the printed circuit board 4 is thermocompression bonded to the TCP 3 mounted on the liquid crystal cell 2 at high temperature and high pressure. Thereby, the printed circuit board 4 and the TCP 3 mounted on the liquid crystal cell 2 are surely thermocompression bonded. That is, after pre-processing (processing for crimping the ACF to the printed circuit board 4) by the pre-processing unit 11, the printed circuit board 4 is transferred to the main crimping apparatus 13 that is the main processing unit by the main pressing and conveying unit 12 that is a conveying unit. It is configured such that it is mounted and subjected to main pressure bonding.

  The preprocessing unit 11 is configured as described above, and is installed on the frame mounting table 10a as one unit. On the other hand, the pretreatment unit 11 is not installed on the frame table 10b, and the frame table 10b is an open space. The frame table 10 is provided with positioning pins 71 as positioning mechanisms at four corners and a sensor 72 for detecting the presence or absence of the pre-processing unit 11, but it is an open space where people can go in and out. . The positioning pin 71 and the sensor 72 are also provided on the frame mounting base 10a, and the preprocessing unit 11 is positioned with high accuracy by fitting the positioning pin 71 into a fitting hole (not shown) provided in the preprocessing unit 11. The When the preprocessing unit 11 is installed, the sensor 72 detects that fact. The positioning pin 71 is a mechanism for positioning the preprocessing unit 11, and any positioning mechanism may be applied as long as the preprocessing unit 11 can be positioned.

  The frame mounting table 10 is provided with a control device 100. The control device 100 is a control means such as a computer for controlling the operation of the variable mounting mechanism 1 and stores a control program. This program is constructed so that different operation control is performed when one preprocessing unit 11 is installed on the frame mounting table 10 and when two preprocessing units 11 are installed. For example, different subroutines are prepared for the case where the number of pre-processing units 11 is one and two, and the subroutine to be executed can be switched according to the number of actually installed units. A sensor 72 is used to determine the number of preprocessing units 11 that are actually installed. The sensor 72 and the control device 100 are connected, and the number of the preprocessing units 11 is determined based on whether or not the sensor 72 is detected, and the control device 100 can appropriately select a subroutine to be executed.

  Next, the assembly operation of the printed circuit board 4 with respect to the liquid crystal cell 2 will be described. First, when the tray 20 loaded with a plurality of printed circuit boards 4 is set, the Y-axis motor 32 and the X-axis motor 35 of the PP device 30 are driven, and the X-axis movable unit 36 is placed on the printed circuit board 4. Position. Next, the clamping part 38 is lowered along the PP part Z-axis 37, and the printed circuit board 4 is clamped by the clamping part 38. After the clamping unit 38 clamps the printed circuit board 4, each motor is driven to move the clamping unit 38 in the three directions of X, Y, and Z, and the printed circuit board 4 is delivered to the ACF placing table 41 or 42. The ACF stand 41 grips the printed circuit board 4 by the gripping claws 43 and 44, moves in the Y direction, places the printed circuit board 4 on the mounting base 53, and releases the gripping claws 43 and 44. After placing the printed circuit board 4, the ACF mounting table 41 returns to the position where the printed circuit board 4 is transferred from the clamping unit 38.

  The printed circuit board 4 set in the ACF device 50 is temporarily pressure-bonded to the ACF by the ACF head 51. After the ACF temporary crimping process for the printed circuit board 4 is completed, the printed circuit board 4 is clamped by the clamping unit 38 of the PP device 30, and the printed circuit board 4 is moved to the upper position of the X rail 63 of the main crimping transport unit 12. . At this time, the Y base 62a is kept waiting at the lower position of the clamping portion 38, and the printed circuit board 4 is delivered to the main pressure bonding chuck 66a disposed on the Y base 62a. After the delivery of the printed circuit board 4 is completed, the Y base 62 a moves the X rail 63 to a position facing the main crimping device 13, and then the main crimp base 65 a moves the Y rail 64 a toward the main crimping device 13. . Then, after moving to the position where the printed circuit board 4 is delivered to the main crimping apparatus 13, the printed circuit board 4 is delivered to the main crimping apparatus 13. The main pressure bonding device 13 performs a main pressure bonding process on the delivered printed circuit board 4. Further, the main pressure bonding base 65a is moved in the Y direction and the Y base 62a is moved in the X direction so that the main pressure bonding chuck 66a is returned to the position where the printed circuit board 4 is delivered from the holding portion 38 of the PP device 30.

  The sandwiching section 38 of the PP device 30 is sequentially transferred from the printed circuit board 4 on which the pre-bonding has been completed to the Y base 62a of the main-bonding conveying section 12, and on the return path, the printed circuit board 4 is taken out from the tray 20 and the ACF placing table 41 or 42 is placed. The printed circuit board 4 is transferred. The ACF mounts 41 and 42 are in a standby state with the printed circuit board 4 held, and when the clamping unit 38 of the PP device 30 transfers the printed circuit board 4 to the Y base 62a, the next printed circuit board 4 is mounted. 53. In FIG. 1, the clamping unit 38 of the PP device 30 transfers the printed circuit board 4 on which the ACF temporary press-bonding has been completed in the ACF head 52 to the Y base 62 a. Transfer to the table 53. After transferring the printed circuit board 4 to the Y base 62 a, the PP device 30 takes out the printed circuit board 4 from the tray 20 and transfers the printed circuit board 4 to the ACF mounting table 42. Then, after the temporary pressure bonding of the printed circuit board 4 of the ACF head 51 is completed, a series of operations such as transferring the printed circuit board 4 to the Y base 62a is repeated.

  Therefore, in consideration of the transfer time of the printed circuit board 4, if the predetermined time difference is given to the temporary pressure bonding of the two ACF heads 51 and 52, the transfer time and the temporary pressure bonding time can be overlapped. The printed circuit board 4 can be supplied to the main pressure bonding device 13 one after another.

  The above is the operation for assembling the printed circuit board 4 to the liquid crystal cell 2. Since the frame table 10 includes a coupling element of the frame table 10 a and one pre-processing unit 11, one printed board 4 is supplied to the liquid crystal cell 2. Accordingly, since a plurality of printed circuit boards 4 cannot be assembled to the liquid crystal cell 2 at the same time, the throughput is low. For example, since a single printed circuit board 4 is assembled on the source side in a small-sized liquid crystal display, it is possible to cope with it by providing only one pre-processing unit 11 as shown in FIG. Further, even in a large-sized liquid crystal display, one pre-processing unit 11 may be able to cope with it on the gate side. In this case, a production line using the frame stand 10 of FIG. 1 is constructed.

  On the other hand, a plurality of printed boards 4 are assembled on the source side of a large liquid crystal display, and depending on the screen size, a plurality of printed boards 4 are also assembled on the gate side. In order to cope with the production of this liquid crystal display, the throughput of the apparatus for assembling the printed circuit boards 4 for each sheet is greatly reduced.

  In the present invention, as shown in FIG. 1, the frame table 10 is a coupling element between the frame table 10a and the preprocessing unit 11, and a new preprocessing unit 11 is added to the frame table 10b. Is possible. As described above, since the pretreatment unit 11 is provided with the fitting hole, the position adjustment can be performed with high accuracy by fitting the fitting hole to the positioning pin 71. The sensor 72 detects that the preprocessing unit 11 has been installed.

  FIG. 2 shows a state in which the pretreatment unit 11 is also installed on the frame mounting table 10b. In FIG. 2, the pretreatment unit installed on the frame mounting base 10a is designated as 11a, and a is added to the reference numerals of the mechanisms provided in the pretreatment unit 11a. In addition, the preprocessing unit installed on the frame mounting table 10b is denoted as 11b, and b is added to the reference numerals of the mechanisms provided in the preprocessing unit 11b. The preprocessing unit 11a is installed as a basic unit as shown in FIG. 1, and the preprocessing unit 11b is configured as an expansion unit that can be added or added as appropriate as shown in FIG. Can be installed on the frame mounting table 10, and two printed circuit boards 4 can be assembled to the liquid crystal cell 2 at the same time.

  Therefore, by simply adding the preprocessing unit 11b to the frame mounting table 10b, the previously used preprocessing unit 11a can be diverted as it is, and throughput can be improved. By the way, the frame table 10 is a table for installing the pretreatment units 11a and 11b, and transports the printed circuit board 4 from the pretreatment unit 11a or 11b installed on the frame table 10 to the main pressure bonding device 13. As a means, a main crimping conveyance unit 12 is provided.

  The main press-carrying transport unit 12 serving as the transport means is fixedly arranged corresponding to the maximum number of pre-processing units 11 that can be installed on the frame table 10. In particular, an X base 61 and an X rail 63 as X axis guide means, and a Y base 62 and a Y rail 64 as Y axis guide means are fixedly arranged. In the example of FIGS. 1 and 2, two preprocessing units 11 a and 11 b can be installed on the frame mounting table 10. Therefore, two Y bases 62a and 62b (and Y rails 64a and 64b provided thereon) are provided regardless of whether the number of preprocessing units 11 is one or two. The entire length of the X base 61 and the X rail 63 is provided so that the X base 61 and the X rail 63 can be transferred from both the pretreatment units 11a and 11b.

  The main pressure bonding base 65 and the main pressure bonding chuck 66 mounted on the Y base 62 serve as a printed board conveyance mechanism for conveying the printed board 4. Since this printed circuit board transport mechanism can be easily attached and detached, it is not necessary to provide it corresponding to the maximum number of pretreatment units 11 that can be added, and it may be removed. Alternatively, only the main crimping base 65 may be mounted in advance according to the maximum number that can be added, and may be mounted according to the number of pretreatment units 11 that use only the main crimping chuck 66. In the example of FIG. 1, two main crimping bases 65 are mounted, only one main crimping chuck 66 is mounted (the number of installed pretreatment units 11), and the rest are later. I try to wear it. In other words, the printed circuit board transport mechanism is fixedly installed with the maximum number of the pretreatment units 11 that can be added, so that even if the pretreatment units 11 are added later, it can be easily handled. .

  As described above, the operation control of the variable mounting mechanism 1 is performed by a program stored in the control device 100. The program stored in the control device 100 determines the control mode of the preprocessing unit when performing initial setting (before the start of the assembly process of the printed circuit board 4). FIG. The flow is shown. First, a mode (1 mode) that exhibits the function of controlling one preprocessing unit 11 is selected, or a mode (2 mode) that exhibits the function of controlling the two preprocessing units 11a and 11b. Is selected (step S1). This is determined based on whether or not the unit 2 is present, and this determination can be made depending on whether or not the sensor 72 is detected. 3A and 3B, the preprocessing unit 11a is the unit 1, and the preprocessing unit 11b is the unit 2.

  As shown in FIG. 1, when the sensor 72 of the frame mounting table 10a detects the installation of the preprocessing unit 11, and the sensor 72 of the frame mounting table 10b does not detect the installation of the preprocessing unit 11, a signal to that effect is sent. The program is input to the control device 100, and the program is set to select and execute one mode (step S2). On the other hand, when the sensor 72 of the frame mounting table 10a detects the installation of the preprocessing unit 11a and the sensor 72 of the frame mounting table 10b detects the installation of the preprocessing unit 11b, the program selects and executes the two modes. (Step S3). Thus, the program mode is automatically selected based on the installation status of the preprocessing unit 11.

  Next, a case where the preprocessing unit 11 is controlled by a program when the assembly process of the printed circuit board 4 is performed will be described. FIG. 3B shows a flow when the assembly process program is executed in two modes. First, it is determined which operation of the preprocessing units 11a and 11b is to be executed (step S11). If the command is related to the operation of the unit 1, the preprocessing unit 11a is operated (step S12). On the other hand, if the instruction is related to the operation of the unit 2, it is determined whether or not there is a preprocessing unit 11b (step S13), and if the preprocessing unit 11b is not installed, an abnormality of the apparatus is detected ( Step S14). Whether or not the pre-processing unit 11b is installed is determined based on a signal from the sensor 72. And when it determines with the pre-processing unit 11b being installed, control which performs operation | movement of the pre-processing unit 11b is performed (step S15).

  Therefore, the function of the program can be switched according to the number of pre-processing units installed on the frame mounting table 10, and the process is automatically switched by the detection of the sensor 72. Thereby, even if the preprocessing unit 11 is added later, an appropriate program corresponding to the number of units is automatically selected, so that the preprocessing unit 11 can be easily added.

  In the above description, the expansion of the preprocessing unit has been described. However, the variable mounting mechanism of the flat display module assembly apparatus of the present invention arranges the frame table as a coupling element between the frame table and the preprocessing unit. The pre-processing unit can be removed. For example, even if the pretreatment units 11a and 11b are installed as shown in FIG. 2, one (or both) of the pretreatment units 11a and 11b can be removed. By making the pretreatment unit removable in this way, the maintainability is dramatically improved.

  When the pre-processing unit 11 and the main pressure bonding apparatus 13 are continuously operated, the parallelism required when performing the temporary pressure bonding or the main pressure bonding decreases with time. In the main pressure bonding and the temporary pressure bonding, a pressure bonding blade (pressure bonding means) is pressed against the printed circuit board 4, and this pressure bonding blade is required to have a very high degree of parallelism. Therefore, maintenance for adjusting the parallelism of the crimping blades must be performed periodically. In addition, other mechanisms need to be regularly maintained. However, since the pretreatment unit 11 is relatively large and occupies a wide space, if two pretreatment units 11 are installed on the frame mounting table 10, the maintainability is deteriorated.

  In the variable mounting mechanism of the flat display module assembling apparatus according to the present invention, the preprocessing unit 11 can be removed. For example, if the preprocessing unit 11b is removed, the frame mounting table 10b becomes an open space. For this reason, since the worker can enter and leave the space of the frame mounting table 10b, the maintenance of the pretreatment unit 11a can be easily performed.

  Next, another example of assembly of the printed circuit board 4 will be described with reference to FIGS. 4 and 5. FIG. 4 shows an example in which one printed circuit board 4 is assembled to the source side of the liquid crystal cell 2 although two pre-processing units 11 a and 11 b are arranged on the frame mounting table 10. In this example, the main crimping chuck 66a of the Y base 62a conveys the printed circuit board 4 from the preprocessing unit 11a to the main crimping apparatus 13, and the main crimping chuck 66b of the Y base 62b receives the printed circuit board 4 from the preprocessing unit 11b. This is supplied to the main crimping device 13. Accordingly, the printed circuit board 4 that has been pre-processed by the pre-processing unit 11 a and the printed circuit board 4 that has been pre-processed by the pre-processing unit 11 b can be alternately supplied to the main pressure bonding device 13. Thereby, compared with the case where only one pre-processing unit 11 is installed, the printed circuit board 4 can be supplied to the main pressure bonding device 13 at a speed approximately doubled, and the throughput can be greatly improved. Although the screen size of the liquid crystal display is relatively small, it is suitable for constructing a corresponding production line when high-speed production is required.

  FIG. 5 shows a case where the printed circuit board 4 having a long width is assembled. The printed circuit board 4 has various sizes, and the printed circuit board 4 shown in FIG. 5 has a length approximately twice that of the printed circuit board 4 shown in FIG. In this case, the printed circuit board 4 cannot be gripped by the ACF stands 41 and 42 alone, or the gripping state becomes extremely unstable. Therefore, as shown in FIG. 5, one printed circuit board 4 is gripped by the cooperation of the two ACF placing tables 41 and 42. The clamping unit 38 of the PP device 30 transfers the printed circuit board 4 to the ACF mounting tables 41 and 42, and the two ACF mounting tables 41 and 42 operate in cooperation with each other so that the printed circuit board 4 is attached to the ACF device 50. Transfer.

  The crimping blades provided in the ACF heads 51 and 52 of the ACF device 50 have a length capable of crimping the entire length of the printed circuit board 4 shown in FIG. It does not have a length that can be crimped. On the other hand, even if the ACF is temporarily pressure-bonded to the printed circuit board 4 by the ACF heads 51 and 52, the intermediate portion cannot be temporarily pressure-bonded. Therefore, the ACF heads 51 and 52 are moved in the X direction along the ACF head rail 55 on the ACF head base 54 and the temporary crimping is performed again for the portion where the temporary crimping is not performed. As a result, the ACF can be temporarily bonded to the long printed circuit board 4.

  By providing the two ACF placing tables 41 and 42 and the two ACF heads 51 and 52 in the pretreatment unit 11, it is possible to perform pretreatment by temporarily pressing the printed circuit boards 4 of various sizes. become. In the present embodiment, the case where the liquid crystal cell 2, the printed circuit board 4, and the TCP 3 are connected has been described. However, the chip is directly mounted on the liquid crystal cell 2, and the liquid crystal cell 2 and the printed circuit board are formed using a film substrate. Needless to say, the present invention can also be applied to the case of connecting to 4.

It is a top view at the time of installing one pre-processing unit in a frame stand. It is a top view at the time of installing two pre-processing units in a frame stand. It is a flowchart of the control which a control part performs. It is a figure explaining the case where two printed circuit boards are assembled | attached alternately. It is a figure explaining the case where a printed circuit board with a long width is assembled.

Explanation of symbols

2 Liquid crystal cell 3 TCP
DESCRIPTION OF SYMBOLS 4 Printed circuit board 10 Frame stand 11 Pre-processing unit 12 This crimping conveyance part 13 This crimping apparatus 20 Tray 30 PP apparatus 38 Holding | grip part 41, 42 ACF stand 43, 44 Grip claw 50 ACF apparatus 51, 52 ACF head 61 X base 62 Y base 71 Positioning pin 72 Sensor 100 Control device

Claims (6)

A variable mounting mechanism for a flat display module assembling apparatus for assembling a flat display module,
A pre-processing unit that performs pre-processing on a printed circuit board assembled on a glass substrate;
A frame stage on which a plurality of the pretreatment units can be installed;
A coupling element for coupling the frame stand and the pre-processing unit;
When the assembly process of the printed circuit board is performed, the preprocessing unit is controlled by a program, and the function of the program is switched according to the number of preprocessing units installed on the frame table. A variable mounting mechanism for a flat display module assembling apparatus, characterized in that it is possible.   The variable mounting mechanism of the flat display module assembling apparatus according to claim 1, wherein the coupling element includes a positioning mechanism.   The variable mounting mechanism of the flat display module assembling apparatus according to claim 1, wherein the coupling element includes a sensor that detects the presence or absence of the preprocessing unit.   The variable mounting mechanism of the flat display module assembling apparatus according to any one of claims 1 to 3, wherein the pretreatment unit includes a temporary pressure bonding mechanism for the anisotropic conductive film. A main processing unit for assembling the printed circuit board on which the anisotropic conductive film is temporarily bonded by the temporary pressing mechanism to the glass substrate by main pressing;
A conveying means that extends to the frame stage on which a plurality of the pretreatment units can be installed, and conveys the printed circuit board from the pretreatment unit to the main treatment unit;
The variable mounting mechanism of the flat display module assembling apparatus according to claim 4, further comprising:   An apparatus for manufacturing a flat display comprising the variable mounting mechanism of the flat display module assembling apparatus according to any one of claims 1 to 5.

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