JP5253836B2 - Packaging method of semiconductor device - Google Patents

Description

  The present invention relates to a manufacturing technique of a semiconductor device, and more particularly to a technique effective when applied to a taping packing method for packing a semiconductor device on a carrier tape.

  In general, when a tape is wound around a tape reel, vibration is generated in an open portion of the tape wound around the tape reels. If the winding is performed while the tape is vibrating, the winding state of the tape is disturbed. Therefore, a guide roller or the like is provided in the tape transport mechanism to suppress the vibration of the tape.

For example, in Japanese Patent Application Laid-Open No. 2005-116093 (Patent Document 1), a displacement amount with respect to the width direction of a magnetic tape is detected by a tape displacement detection means, and the displacement amount is output as an output signal. There is described a method of transporting a magnetic tape in which the position in the width direction of the magnetic tape is corrected by moving the magnetic tape to the opposite side to the displacement by the same amount as the displacement.
Japanese Patent Laid-Open No. 2005-116093

  When shipping the product (semiconductor device), the inventor uses a taping package that houses the semiconductor device in a recess of the embossed carrier tape. In a taping device that taps and packages a semiconductor device, a taping rail that is a fixed rail matched to the shape of the embossed carrier tape is used.

  However, according to the study by the present inventors, it has been found that taping packaging has various technical problems described below.

  That is, in order to tap and package a small semiconductor device (semiconductor package), for example, a small semiconductor device having a vertical and horizontal dimension of 1 mm or less, not only the positioning accuracy of the semiconductor device is improved, but also the accuracy of the carrier tape as a packing member is improved. Good positioning is required. In the conventional fixed type rail, the clearance in the tape width direction of the carrier tape, for example, the sandwiching between the fixed block and the shim plate is narrowed to fix the tape width direction of the carrier tape. However, in this case, if there is a variation in the tape width direction of the carrier tape (for example, variation within a dimensional tolerance), a sliding resistance is generated in the tape feeding direction, and the carrier tape is not sent to a fixed position. However, the semiconductor device is not stored in the recess of the carrier tape, and the semiconductor device may be stored on the carrier tape, or the semiconductor device may be damaged. In particular, the width of the carrier tape is determined to be 8 ± 0.1 mm based on the standard of JEITA (Japan Electronics and Information Technology Industries Association), and the tolerance error is large. Therefore, when the guide rail is prepared for the widest width, when the carrier tape with the narrowest width is transported, misalignment occurs in the width direction during the tape feeding operation, resulting in storage trouble of the semiconductor device. Will occur. When such a storage trouble of the semiconductor device occurs, it is necessary to stop the taping device and remove the semiconductor device or readjust the component clearance, and the operation rate of the taping device is reduced. The production efficiency of taping packaging is reduced.

  An object of the present invention is to provide a technique capable of improving the operation rate of a taping device for taping and packing a semiconductor device and improving the production efficiency of taping packing.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  An embodiment of the invention disclosed in the present application will be briefly described as follows.

  This embodiment is a semiconductor device packaging method in which a carrier tape is transported along a taping rail and the semiconductor devices are sequentially stored in a plurality of recesses provided in the tape feeding direction of the carrier tape. The adjustment piece is fixed to the taping rail on one side in the tape width direction perpendicular to the tape feed direction, and the taping rail at the position facing the adjustment piece on the other side in the tape width direction perpendicular to the tape feed direction has springiness. A presser foot is provided. A part of the presser having a spring property comes into contact with one side surface of the carrier tape and can move following the shape of the one side surface of the carrier tape.

  Among the inventions disclosed in the present application, the effects obtained by one embodiment will be briefly described as follows.

  Since the trouble of storing the semiconductor device in the carrier tape is reduced, the operation rate of the taping device for taping and packing the semiconductor device is improved, so that the production efficiency of the taping packing can be improved.

  In the present embodiment, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), unless otherwise specified, the number is clearly limited to a specific number in principle. It is not limited to a specific number, and may be a specific number or more. Further, in the present embodiment, the constituent elements (including element steps and the like) are not necessarily essential unless particularly specified and apparently essential in principle. Yes. Similarly, in this embodiment, when referring to the shape, positional relationship, etc. of the component, etc., the shape, etc. substantially, unless otherwise specified, or otherwise considered in principle. It shall include those that are approximate or similar to. The same applies to the above numerical values and ranges.

  In the drawings used in the present embodiment, hatching may be added even in a plan view for easy understanding of the drawings. In all the drawings for explaining the embodiments, components having the same function are denoted by the same reference numerals in principle, and repeated description thereof is omitted. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  A taping packing method for packing a semiconductor device according to an embodiment of the present invention on a carrier tape will be described with reference to FIGS. FIG. 1 is a block diagram of the taping device, FIGS. 2A, 2B and 2C are plan views of the main part of the carrier tape, and a cross-sectional view of the main part taken along the line AA 'in FIG. FIG. 3 is a cross-sectional view of the main part taken along line BB ′ of FIG. 1A, FIG. 3 is a view of the cross-section of the main part taken along line CC ′ of FIG. FIG. 5B is a top view of the main part in which the semiconductor device is housed in the recess of the carrier tape, and a cross-sectional view of the main part taken along the line DD ′ of FIG. FIG. 6 is a schematic enlarged view of a part of the positioning portion of the carrier tape provided in the taping device, FIG. 7 is a diagram showing various shapes of the positioning presser of the carrier tape provided in the taping device, and FIG. Cross-section of the main part at line EE It is a view seen from the feed direction of the Yariatepu.

  As shown in FIG. 1, the taping device 1 includes a carrier tape supply reel 3 that supplies a carrier tape 2 and a complete tape take-up reel 4 that winds up the carrier tape 2, and is completed from the carrier tape supply reel 3. Between the tape take-up reel 4, a transport mechanism for feeding the carrier tape 2 in a predetermined direction along the transport path is provided. This transport mechanism mainly includes a first tape feed roller 5 installed on the carrier tape supply reel 3 side, a taping rail 6, and a second tape feed roller 7 installed on the finished tape take-up reel 4 side. Is done. The distance between the first tape feed roller 5 and the second tape feed roller 7 is, for example, about 250 to 300 mm.

  Further, the taping rail 6 includes a device storage portion 6 a for storing the semiconductor device in the recess of the carrier tape 2, an appearance inspection portion 6 b for inspecting the appearance of the semiconductor device stored in the recess of the carrier tape 2, and the recess of the carrier tape 2. A cover tape mounting portion 6c for placing the cover tape 8 on the carrier tape 2 and a cover tape thermocompression bonding portion 6d for attaching the cover tape 8 to the carrier tape 2 by thermocompression bonding.

  First, the carrier tape 2 is sent from the carrier tape supply reel 3 to the taping rail 6. As shown in FIGS. 2A, 2B, and 2C, the carrier tape 2 has one semiconductor device when the tape feeding direction is a row and the direction orthogonal to the row (tape width direction) is a row. The recesses 2a to be housed are arranged in one row and multiple columns. Here, the depressions 2a are arranged in one row and a plurality of columns on the carrier tape 2, but the present invention is not limited to this. For example, the depressions 2a may be arranged in two rows and a plurality of columns. The carrier tape 2 is made of polypropylene, for example, and has a thickness of, for example, 0.2 mm and a width of, for example, 8 ± 0.1 mm. Further, the dimension of the recess 2a of the carrier tape 2 in the tape feeding direction is, for example, 0.42 ± 0.05 mm, and the dimension in the tape width direction is, for example, 0.72 ± 0.05 mm.

  Next, the semiconductor device (semiconductor package) 10 is stored in the recess 2 a of the carrier tape 2 using the suction collet 9 in the device storage portion 6 a. As shown in FIG. 3, the taping rail 6 has a recess 6e formed in accordance with the shape of the carrier tape 2, and the function of fixing the semiconductor device 10 to the recess 2a of the carrier tape 2 at the bottom of the recess 6e. There is provided a magnet 6f having A taping rail cover 20 is stuck on the taping rail 6 so as to cover the carrier tape 2 and the semiconductor device 10. By sticking the taping rail cover 20, the semiconductor device 10 housed in the recess 2a of the carrier tape 2 can be held so as not to jump out.

  As shown in FIGS. 4A and 4B, the semiconductor element mounted on the semiconductor device 10 is, for example, a diode, and more specifically, a first lead 10a that is a chip mounting portion and a first lead 10a. A second lead 10b provided next to the semiconductor chip 10c mounted on the first lead 10a is included. The semiconductor chip 10c has a main surface on which an electrode to be an anode is formed, and a back surface on the opposite side of the main surface, on which an electrode to be a cathode is formed. The semiconductor chip is mounted on the first lead 10a so that the back surface of the semiconductor chip faces the surface of the first lead 10a. The main surface of the semiconductor chip 10c is electrically connected to the second lead 10b via a wire 10d that is a conductive member. Further, a resin body 10e for sealing the semiconductor chip 10c and the wire 10d is formed so as to expose the back surfaces of the first lead 10a and the second lead 10b.

  The dimensions (length (L1) × width (L2) × thickness) of the semiconductor device 10 are, for example, 0.62 ± 0.02 mm × 0.32 ± 0.03 mm × 0.30 ± 0.03 mm. Therefore, the space (L3) between the recess 2a of the carrier tape 2 and the semiconductor device 10 accommodated in the recess 2a is about 0.05 mm. For this reason, the device storage portion 6a is required to position the carrier tape 2 with high accuracy. Therefore, the taping device 1 according to the embodiment of the present invention is provided with a pressing member for positioning the carrier tape 2 which is composed of an adjustment piece and a pressing member having a spring property in the device storage portion 6a.

  As shown in FIG. 5, an adjustment piece 11 made of a metal block is provided on the taping rail 6 on one side in the tape width direction, and the adjustment piece 11 is fixed by a screw 12. The length of the adjustment piece 11 along the tape feeding direction is, for example, about 10 mm. Further, the taping rail 6 at a position facing the adjustment piece 11 on the other side in the tape width direction is provided with a presser having a spring property. The presser having a spring property is a plate-like spring 13 made of, for example, spring steel, and a part of the plate-like spring 13 is in point contact with one side surface of the carrier tape 2, and one side surface of the carrier tape 2. Flexible movement that follows the shape of the Spring steel is a steel of carbon-type, silicon-manganese-type, manganese-chromium-type, chromium-vanadium-type, etc., and is provided with spring properties. Another part of the plate-like spring 13 is fixed to the metal block 14 with a set screw 15.

  As shown in FIG. 6, even if there is a variation in the tape width direction of the carrier tape 2 due to, for example, a variation within a dimensional tolerance (± 0.1 mm), the plate-like spring 13 is one of the carrier tapes 2. Since it moves flexibly following the shape of the side surface, the sliding resistance in the tape feeding direction can be kept small. Further, the portion of the plate-like spring 13 that comes into contact with the carrier tape 2 is a curved surface having a predetermined radius of curvature, thereby reducing the contact area with the carrier tape 2. The plate-like spring 13 has a thickness (d) of 0.2 mm, for example, and a width of 3.0 mm, for example. When the contact area between the plate-like spring 13 and the carrier tape 2 is increased, a load is applied to the carrier tape 2 and sliding resistance is generated in the tape feeding direction, so that the carrier tape 2 cannot be fed to a fixed position. Since the contact area between the spring 13 and the carrier tape 2 is reduced, the sliding resistance in the tape feeding direction can be kept small.

  FIGS. 7A, 7B, and 7C show other examples of a presser having a spring property. The press shown in FIG. 7A is a plate-like spring 16 made of spring steel, and a portion of the plate-like spring 16 that contacts one side surface of the carrier tape 2 is bent so that the portion becomes a flat surface. Yes. The press shown in FIG. 7B is a plate-like spring 17 made of spring steel, and a portion of the plate-like spring 17 that contacts one side surface of the carrier tape 2 is chamfered and rounded. . The press shown in FIG. 7C is obtained by attaching a spring 18b to a metal block 18a, and a portion of the metal block 18a that contacts one side surface of the carrier tape 2 is a curved surface. In addition, as an example of the holding | suppressing which gave spring property, it is not limited to the said shape, and it cannot be overemphasized that it can change variously in the range which does not deviate from the summary.

  Thus, even if there is a fluctuation in the width of the carrier tape 2 by sandwiching the tape width direction of the carrier tape 2 with the adjusting piece 11 and the press having springiness as a press for positioning the carrier tape 2, Since the sliding resistance in the tape feeding direction can be kept small, the carrier tape 2 can be accurately moved to a fixed position. As a result, for example, the storage trouble of the semiconductor device 10 such as the semiconductor device 10 riding on or being damaged on the carrier tape 2 is reduced, so that the number of times the taping device 1 is stopped is reduced and the operating rate is improved. As a result, the production efficiency of taping packaging is improved.

  Next, in the appearance inspection unit 6b, the appearance inspection of the semiconductor device 10 accommodated in the recess 2a of the carrier tape 2 is performed using the appearance inspection device 19. Although not shown, the appearance inspection device 19 includes a light source that irradiates light to the semiconductor device 10, a camera that captures light reflected from the semiconductor device 10, an image processing device, and the like. The appearance inspection section 6b is also provided with a control piece 11 for positioning the carrier tape 2 and a presser with springiness as a press for positioning the carrier tape 2.

  Next, as shown in FIG. 8, after the cover tape 8 covering the recess 2a of the carrier tape 2 is placed on the carrier tape 2 in the cover tape mounting portion 6c, the carrier tape 2 The cover tape 8 is bonded together by thermocompression bonding, and the semiconductor device 10 is packed in the carrier tape 2.

  Next, the carrier tape 2 is wound around the finished tape take-up reel 4. Thereafter, the finished tape take-up reel 4 is shipped in a state of being stored in, for example, a moisture-proof bag.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  For example, in the above-described embodiment, the embodiment in which the present invention is applied to the carrier tape positioning of the taping device that packs the semiconductor device on the carrier tape has been described. However, the present invention can also be applied to, for example, a magnetic tape winding device. .

  The present invention can be applied to a carrier tape positioning mechanism of a taping device that packs a semiconductor device on a carrier tape.

It is a lineblock diagram of a taping device by one embodiment of the present invention. (A), (b), and (c) are the principal part top views of the carrier tape by one Embodiment of this invention, respectively, A principal part sectional drawing in the AA 'line of the figure (a), and the figure (a) It is principal part sectional drawing in the BB 'line of (). It is the figure which looked at the principal part cross section in the CC 'line | wire of FIG. 1 by one Embodiment of this invention from the feed direction side of the carrier tape. (A) And (b) is the principal part top view by which the semiconductor device was accommodated in the hollow of the carrier tape by one Embodiment of this invention, respectively, and the principal part sectional drawing in the DD 'line of the figure (a). is there. It is a schematic plan view of the positioning part of the carrier tape with which the taping apparatus by one embodiment of this invention is equipped. It is the schematic diagram which expanded a part of positioning part of the carrier tape with which a taping apparatus is equipped. It is a figure which shows the various shapes of the positioning press of the carrier tape with which the taping apparatus by one embodiment of this invention is equipped. It is the figure which looked at the principal part cross section in the EE 'line | wire of FIG. 1 by one Embodiment of this invention from the feed direction side of the carrier tape.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Taping apparatus 2 Carrier tape 2a hollow 3 Carrier tape supply reel 4 Completed tape take-up reel 5 First tape feed roller 6 Taping rail 6a Device storage part 6b Appearance inspection part 6c Cover tape mounting part 6d Cover tape thermocompression bonding part 6e Depression 6f Magnet 7 Second tape feed roller 8 Cover tape 9 Adsorption collet 10 Semiconductor device (semiconductor package)
10a 1st lead 10b 2nd lead 10c Semiconductor chip 10d Wire 10e Resin body 11 Adjustment piece 12 Screw 13 Plate spring 14 Metal block 15 Set screw 16, 17 Plate spring 18a Metal block 18b Spring 19 Appearance inspection device 20 Taping Rail cover

Claims (6)

A semiconductor device packaging method comprising the following steps:
(A) in a state of being accommodated in a taping rail having a second recess the combined tape to the shape of the tape having a first recess, along the taping rail, the step of conveying the tape;
(B) After the step (a), in the device storage section provided in the taping rail , storing the semiconductor device in the first recess of the tape;
here,
In the device storage portion of the taping rail, an adjustment piece fixed to one side in the tape width direction orthogonal to the tape feeding direction and a position facing the adjustment piece on the other side in the tape width direction are fixed. And a presser with springiness is provided,
The opening width in the tape width direction of the second recess of the taping rail is wider than the width of the tape,
In the step (b), the tape is sandwiched between the adjustment piece and the presser, and a part of the presser is in point contact with one side surface of the tape, thereby positioning the tape in the tape width direction. after, you accommodating the semiconductor device wherein the first recess of said tape. The packaging method for a semiconductor device according to claim 1 ,
The planar shape of the semiconductor device is a quadrangle,
The dimension in plan view of the semiconductor device is 0.62 ± 0.02 mm × 0.32 ± 0.03 mm,
The planar shape of the first recess of the tape is a quadrangle,
The semiconductor device packaging method, wherein a dimension of the first depression of the tape in a plan view is 0.72 ± 0.05 mm × 0.42 ± 0.05 mm. The method for packing a semiconductor device according to claim 2 ,
In the step (b), a semiconductor device packaging method using an adsorption collet. The packaging method for a semiconductor device according to claim 1,
(C) after the step (b), further including a step of performing an appearance inspection of the semiconductor device housed in the first recess of the tape in an appearance inspection section provided on the taping rail;
In the appearance inspection unit, an image processing apparatus that acquires and inspects an image of the semiconductor device stored in the first depression of the tape;
A second adjustment piece fixed to one side in the tape width direction, and a second adjustment piece fixed to a position facing the second adjustment piece on the other side in the tape width direction, and having a spring property There are 2 pressers,
In the step (c), the tape is sandwiched between the second adjustment piece and the second presser, and a part of the presser is in point contact with one side surface of the tape, whereby the tape width direction A packaging method of a semiconductor device, wherein after the tape is positioned, an appearance inspection of the semiconductor device is performed . The method of packing a semiconductor device according to claim 4,
(D) After the step (c), the semiconductor further includes a step of attaching a cover tape covering the semiconductor device housed in the first depression of the tape to the tape by thermocompression bonding. How to pack the device. The packaging method for a semiconductor device according to claim 1,
A packaging method for a semiconductor device, wherein a taping rail cover that covers the tape and the semiconductor device is installed on a part of the taping rail.

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