CN215622952U

CN215622952U - Quick filling device for semiconductor chip braider

Info

Publication number: CN215622952U
Application number: CN202122114714.3U
Authority: CN
Inventors: 陈娇凤; 陈有鸿
Original assignee: Shenzhen Kaichuang Semiconductor Equipment Co ltd
Current assignee: Shenzhen Kaichuang Semiconductor Equipment Co ltd
Priority date: 2021-09-03
Filing date: 2021-09-03
Publication date: 2022-01-25
Anticipated expiration: 2031-09-03

Abstract

The utility model discloses a quick filling device for a semiconductor chip braider, which comprises a rotating mechanism and a braiding mechanism, wherein the rotating mechanism is provided with a rotating disk and pneumatic suction nozzles, and the pneumatic suction nozzles are uniformly arranged on the rotating edge; the braiding mechanism comprises a guide rail main body, one surface of the guide rail main body facing the rotating mechanism is provided with a groove for containing a braid, the groove transversely extends to two ends of the guide rail main body, one side of the groove is provided with a positioning mechanism, the positioning mechanism is provided with a plurality of groups of rollers, and the rollers are provided with fixing bulges buckled with the braiding holes; lead to at the filling in-process, braid hole block fit in fixed arch, and the coiling stage braid is when the skew appears, and braid hole and fixed arch offset hold, and then make the accurate spacing to braid filling position, and reach the effect of filling fast.

Description

Quick filling device for semiconductor chip braider

Technical Field

The utility model belongs to the field of braid filling, and particularly relates to a quick filling device for a semiconductor chip braider.

Background

With the continuous upgrading, thinning and high integration of electronic installed parts, electronic elements are converted from the past plug-in type to the patch type to save the installation space of a circuit board and expand the functions of the installed parts, and after the semiconductor chip is approved by the academic world as a material in the twentieth century, the material property of the semiconductor chip which has the conductive performance at normal temperature between a conductor and a semiconductor is taken as an important material in various industrial fields; the utility model of the braider enables chips made of semiconductors to be rapidly produced, and the chips of the semiconductors are packaged by the turntable, so that the braider is convenient to transport and carry out subsequent processing.

Among the prior art, reciprocating motion carries out the heat-seal processing about the braider often adopts, reciprocating motion shakes the influence about producing the braid during heat-seal processing, the braid draw the uneven condition of atress to appear easily in-process, lead to the braid to shift, and then lead to the chip installation dislocation, greatly influence production efficiency, adopt to apply compact structure at entry port and discharge port usually and carry out the bradyseism and handle, however, compact structure arranges the relative both ends of heat-seal mechanism in, the middle condition that can't keep accurate filling still can appear filling the position, consequently, need a packing plant for semiconductor braider urgently, when adaptation is produced fast now, and can guarantee the accuracy of filling the position.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the technology, the utility model provides the quick filling device for the semiconductor chip braider, the positioning mechanism is added in the groove and provided with the fixing bulge, the braid holes are clamped on the fixing bulge in the filling process, and the braid holes are propped against the fixing bulge when the braid deviates in the winding stage, so that the accurate limit of the filling position of the braid is realized, and the quick filling effect is achieved.

In order to achieve the purpose, the utility model provides a quick filling device for a semiconductor chip braider, which comprises a rotating mechanism and a braiding mechanism, wherein the rotating mechanism is provided with a rotating disk and pneumatic suction nozzles, and the pneumatic suction nozzles are uniformly arranged on the rotating edge; the braiding mechanism comprises a guide rail main body, one surface of the guide rail main body, facing the rotating mechanism, is provided with a groove used for containing a braid, the groove transversely extends to two ends of the guide rail main body, one side of the outer wall of the groove is provided with a positioning mechanism, the positioning mechanism comprises a plurality of groups of rollers, the wheel surface of each roller is provided with a fixing bulge buckled with the braiding holes, and each roller is movably connected with one side of the outer wall of the groove.

Preferably, an inner cavity is formed in one side of the outer wall of the groove, and the roller is movably connected and contained in the inner cavity.

Preferably, the groove is provided with an induction mechanism, and the induction mechanism is detachably attached to the upper end of the groove; the induction mechanism comprises a positioning block and an induction block.

Preferably, the positioning block is provided with a concave part, the concave depth of the concave part is greater than the protruding length of the convex part, and a fitting hole is formed at the joint.

Preferably, the upper end of the groove is provided with a cover plate which is detachably connected; the cover plate is attached to one side adjacent to the induction mechanism.

Preferably, the side of the fixing protrusion is provided with a fixing opening.

Preferably, a height positioning block is arranged on one side of the guide rail main body facing the rotating mechanism and located right above the assembling hole, and the height positioning block abuts against the pneumatic suction nozzle.

Preferably, one end of the guide rail main body, which is close to the fixed induction mechanism, is provided with a pressing block for pressing the braid.

The utility model has the beneficial effects that: compared with the prior art, the rapid filling device for the semiconductor chip braiding machine provided by the utility model has the advantages that the braiding mechanism comprises the guide rail main body, the surface, facing the rotating mechanism, of the guide rail main body is provided with the groove for containing the braid, one side of the groove is provided with the positioning mechanism, the positioning mechanism is provided with the plurality of groups of rollers, the rollers are provided with the protrusions buckled with the braiding holes, the protrusions are provided with the fixing ports, the braid is contained in the groove when the braiding machine works, the braiding holes are clamped on the fixing protrusions, the braiding holes are abutted against the fixing ports in the winding stage, the accurate limiting of the filling position of the braid is further realized, the accuracy of the filling position is kept, and the rapid filling effect is realized.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a drawing of the taping machine of the present invention

FIG. 3 is a view of the body of the guide rail of the present invention;

FIG. 4 is a diagram of a roller according to the present invention.

The main element symbols are as follows:

1. a rotating structure; 2. a braid structure; 3. a heat-sealing module; 11. rotating the disc; 12. a pneumatic suction nozzle; 21. a guide rail main body; 22. a groove; 23. a positioning mechanism; 24. an induction mechanism; 25. a cover plate; 26. a height positioning block; 27. a compression block; 231. an inner cavity; 232. a roller; 2321. a fixed protrusion; 2322. a fixed port; 241. positioning blocks; 242. an induction block; 243. and (7) assembling holes.

Detailed Description

In order to more clearly describe the present invention, the present invention will be further described with reference to the accompanying drawings.

In order to solve the existing defects, the utility model provides a new quick filling device for a semiconductor chip braider, please refer to fig. 1 to 4, which comprises a rotating mechanism 1 and a braiding mechanism 2, wherein the rotating mechanism 1 is provided with a rotating disk 11 and pneumatic suction nozzles 12, the pneumatic suction nozzles 12 are uniformly arranged on the edge of the rotating disk 11, and chips to be filled are adsorbed and transported to an assembling position through the pneumatic suction nozzles 12; the braiding mechanism 2 comprises a guide rail main body 21, one surface of the guide rail main body 21 facing the rotating mechanism 1 is provided with a groove 22 for containing a braid, the groove 22 transversely extends to two ends of the guide rail main body 21, one side of the groove 22 is provided with an inner cavity 231, a positioning mechanism 23 is contained in the inner cavity 231, one or more motor-driven rollers 232 are arranged on the positioning mechanism 23, and fixing protrusions 2321 buckled with braiding holes are arranged on the rollers 232; the arrangement of the inner cavity 231 can enable the braid and the fixing protrusion 2321 to be clamped on the same plane, the braid can be stably placed in the groove 22, so that the braid cannot incline during traction, the chip mounted in a braid product groove is prevented from falling off, and the fixing protrusion 2321 is provided with the fixing opening 2322; the upper end of the groove 22 is provided with an induction mechanism 24, the induction mechanism 24 is detachably attached to the groove 22, and the induction mechanism 24 comprises a positioning block 241 and an induction block 242; the positioning block 241 is provided with a concave part, the sensing block 242 is provided with a convex part connected with the concave part, the concave depth of the concave part is greater than the convex length of the convex part, and a gap forms an assembly hole 243 when the concave part is connected with the convex part; the upper end of recess 22 is arranged in all laminating of response piece 242 and locating piece 241, adopt the connection of dismantling, be convenient for dismantle maintenance and change response piece 242 and locating piece 241, the pilot hole 243 of concave part and convex part formation, pneumatic suction nozzle 12 adsorbs the chip and transports to pilot hole 243 position, pneumatic suction nozzle 42 places the chip down in the product groove of braid, pneumatic suction nozzle 12 in-process down, locating piece 241 fixes a position pneumatic suction nozzle, and then reach the accurate correct position of arranging the product groove in to the accuracy of chip, response piece 242 is when placing the deviation, report to the police, the record, the parameter output of automatic deviation rectification, it loads to combine the automation of computer algorithm realization to the product. In operation, the unreeling wheel and the reeling wheel at two ends are connected with the braid, the braid hole on the braid is clamped on the fixing protrusion 2321 of the fixing mechanism 23, the reeling wheel and the unreeling wheel release the tension provided by the pneumatic force, the reeling speed of the reeling wheel is adjusted, the feeding module of the braid transfers the chip to the assembling hole 243 through the pneumatic suction nozzle 12 of the rotating mechanism, the positioning block 241 and the induction block 242 sense the installation and positioning of the chip, the chip is normally induced, the chip is filled in the product slot of the braid, the filling quantity reaches a certain time, the heat-sealing module 3 carries out heat sealing on the braid filled with the product, when the heat-sealing module carries out the sealing treatment by the longitudinal reciprocating motion, the contact surface of the fixing opening 2322 of the fixing protrusion 2321 and the braid hole is abutted against in the longitudinal direction, so that the braid is extruded, the braid vibration caused by the reciprocating motion of the heat-sealing module 3 is slowed down, and the braid is deviated, the braid holes are abutted with the fixing holes, so that the braid filling position is limited, the accuracy of the filling position is kept, the effect of quick filling is realized, and the problems in the prior art are solved.

In this embodiment, the upper end of the groove 22 is provided with a cover plate 25 which is detachably connected; the cover plate 25 is adjacent to and attached to the induction block 242, so that the filled chip braid is protected from dust, and the situation that dust is badly sealed in the heat sealing process in the subsequent process is avoided.

In this embodiment, a height positioning block 26 is disposed on one side of the guide rail main body 2 facing the rotating mechanism, and the height positioning block 26 is located at the uppermost portion of the assembling hole 243 and abuts against the pneumatic suction nozzle 12 when being placed on a chip; the height positioning block 26 is arranged at the position with the shortest linear distance of the assembly hole, and positions the pneumatic suction nozzle 12 on the installation height through abutting, so that the stable installation of the chip is ensured.

In this embodiment, a pressing block 27 for pressing the braid is provided at one end of the guide rail main body close to the guide rail main body; the pressing block 27 can provide certain initial tension when winding, and plays a role in pressing the braid in the winding process.

The utility model has the advantages that:

1) during operation braid hole block is in fixed mouthful on the gyro wheel, and when the skew appears in the braid, braid hole and fixed mouthful counterbalance hold, and then make to braid filling position have limiting displacement, keep filling position's accuracy, realize the effect of quick loading

2) The shape of the fixing opening is a wedge with the straight edge at the upper bevel edge and the lower bevel edge, the straight edge can generate a contact surface against the braid hole in the longitudinal heat sealing vibration, the vibration generated in the heat sealing of the braid is relieved, and the bevel edge of the fixing opening enables the braid hole to form a movable space when the braid hole is separated in a rotating mode, so that the braid can be separated more easily and the braid is smoother in the winding process.

The above disclosure is only for a few specific embodiments of the present invention, but the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.

Claims

1. A fast filling device for a semiconductor chip braider comprises a rotating mechanism and a braiding mechanism, wherein the rotating mechanism is provided with a rotating disk and pneumatic suction nozzles, and the pneumatic suction nozzles are uniformly arranged on the rotating edge; the braiding machine is characterized in that the braiding mechanism comprises a guide rail main body, one surface, facing the rotating mechanism, of the guide rail main body is provided with a groove used for containing a braid, the groove transversely extends to two ends of the guide rail main body, one side of the outer wall of the groove is provided with a positioning mechanism, the positioning mechanism comprises a plurality of groups of idler wheels, wheel surfaces of the idler wheels are provided with fixing bulges buckled with the braiding holes, and the idler wheels are movably connected with one side of the outer wall of the groove.

2. The rapid loading device of claim 1 wherein the groove has an inner cavity on one side of the outer wall, and the roller is movably received in the inner cavity.

3. The rapid filling device for the braider of semiconductor chips as claimed in claim 1, wherein an induction mechanism is arranged at one end of the groove facing the rotating mechanism, and the induction mechanism is detachably attached to the upper end of the groove; the induction mechanism comprises a positioning block and an induction block, and the positioning block is connected with the induction block in an adaptive mode.

4. The rapid loading device according to claim 3, wherein the positioning block has a concave portion, the concave depth of the concave portion is greater than the protruding length of the convex portion of the sensing block, and the joint portion forms a fitting hole.

5. The rapid loading device for semiconductor chip taping machine as claimed in claim 1, wherein the fixing projection is provided with a fixing opening at a side thereof.

6. The rapid loading device for a braider of semiconductor chips as defined in claim 1, wherein a detachably connected cover plate is provided at an upper end of the groove; the cover plate is attached to one adjacent side of the induction mechanism.

7. The rapid loading device according to claim 1, wherein a height positioning block is disposed on a side of the guide rail body facing the rotating mechanism, the height positioning block is located directly above the mounting hole, and the height positioning block abuts against the pneumatic suction nozzle.

8. The rapid loading device of claim 1 wherein the end of the body of the track near the sensing mechanism is provided with a compression block for compressing the braid.