JP7176231B2 - Electronic component packages and electronic component storage cases - Google Patents

Description

The present invention relates to an electronic component package and an electronic component storage case.

As a case for storing and carrying electronic components, for example, an electronic component storage case provided with a large number of recesses is used (eg, Patent Document 1).

JP-A-2002-264991

However, if the case is transported with the electronic components stored in the electronic component storage case, the electronic components may move within the case. Due to the movement of the electronic parts during transportation, there are cases where the electronic parts are not properly taken out of the case and mounted on the board or the like.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component package and an electronic component storage case in which movement of electronic components within the case is suppressed.

In order to achieve the above object, an electronic component package according to one aspect of the present invention has a first main surface and a second main surface which are a pair of main surfaces, and a plurality of storage recesses are formed in the first main surface. and an electronic component storage case having a magnetized magnetic field forming layer on the bottom surface of the storage recess or on the second main surface side of the bottom surface, and a magnetic body stored in the storage recess. and an electronic component.

Further, an electronic component storage case according to one aspect of the present invention has a first main surface and a second main surface which are a pair of main surfaces, a plurality of storage recesses are provided in the first main surface, and the A magnetized magnetic field forming layer is provided on the bottom surface of the storage recess or on the second main surface side of the bottom surface.

According to the electronic component package and storage case described above, the magnetic field formed by the magnetic field forming layer is used to hold the electronic component accommodated in the storage recess formed in the first main surface in a state of being attracted to the bottom surface. be done. Therefore, movement of the electronic component within the electronic component storage case can be suppressed.

Here, the electronic component package may have a sealing tape that seals the storage recess.

Further, the magnetic field forming layer may be provided on the second main surface at a position corresponding to the bottom surface of the storage recess.

Further, a part of the bottom surface of the storage recess may be made of the magnetic field forming layer.

According to the present invention, an electronic component package and an electronic component storage case are provided in which movement of electronic components within the case is suppressed.

It is a figure explaining schematic structure of an electronic component package. It is a figure explaining the manufacturing method of an electronic component package. It is a figure explaining the opening method of an electronic component package. It is a figure explaining the modification of an electronic component package. It is a figure explaining the modification of an electronic component storage case.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted.

FIG. 1 is a cross-sectional view showing an electronic component package according to one embodiment of the present invention. As shown in FIG. 1, an electronic component package 1 contains electronic components 3 such as active components, passive components, and mechanical components in a storage case 2 (electronic component storage case). It is sealed with the sealing tape 4 in the housed state.

The storage case 2 is a so-called tape-shaped case, and storage recesses 20 are arranged in a line at a predetermined pitch. The storage case 2 has a first principal surface 21 and a second principal surface 22 which are a pair of principal surfaces. That is, the storage recess 20 is formed as a recess having an opening on the first main surface 21 side. In the storage case shown in FIG. 1, unevenness derived from the recessed shape of the storage recess 20 is provided on the second main surface 22 side, but the second main surface 22 may be flat.

Further, the storage case 2 includes a magnetic field forming layer 31 formed of a magnetized magnetic film or the like, and a support layer 32 laminated on the magnetic field forming layer 31 . The magnetic field forming layer 31 is provided on the second main surface 22 side of the storage case 2 . Further, the magnetic field forming layer 31 is provided so as to form the entire surface of the second main surface 22 having unevenness. Further, the support layer 32 is provided on the first main surface 21 side. In the case of the storage case 2 , the support layer 32 forms the entire inner surface of the storage recess 20 provided on the first main surface 21 side. Therefore, only the support layer 32 is exposed in the first main surface 21 of the storage case 2 and inside the storage recess 20 .

A known magnetic material can be used for the magnetic field forming layer 31 . The magnetic field forming layer 31 constitutes the storage case 2 in a magnetized state. The magnetization direction of the magnetic field forming layer 31 is not particularly limited. Moreover, although the material constituting the support layer 32 is not particularly limited, for example, plastic, paper, or the like can be used. Moreover, the supporting layer 32 is preferably made of a material that does not block the magnetic field formed by the magnetic field forming layer 31 . As will be described later, when the storage case 2 is transported in a rolled state, a tape-shaped case can be wound into a roll as the magnetic field forming layer 31 and the support layer 32 constituting the storage case 2 . While possible, a material having flexibility to such an extent that deformation of the storage recess 20 is suppressed is used.

The size of the storage case 2 is determined based on the size of the electronic components 3 to be accommodated. In particular, the shape, area (size in plan view) and depth of the storage recess 20 are determined based on the electronic component 3 . Any shape, area, and depth may be used as long as the electronic component 3 can be accommodated and the movement of the electronic component 3 (in particular, horizontal movement) within the accommodation recess 20 can be suppressed to some extent. The size of the storage case 2 is also determined based on the size of the storage recesses 20 and the pitch between adjacent storage recesses 20 .

Also, the size (thickness) of the magnetic field forming layer 31 and the supporting layer 32 can be changed as appropriate. The magnetic field forming layer 31 is not particularly limited in its size and the like, as long as it can form a magnetic field in the storage recess 20 to the extent that the electronic component 3 can be held in the storage recess 20 as will be described later.

The electronic component 3 is an electronic component that is housed in the housing recess 20 of the housing case 2 . The type of the electronic component 3 is not particularly limited, and examples thereof include a capacitor and an inductance. At least a part of the electronic component 3 contains a magnetic material. For example, when the electronic component 3 is a thin film capacitor, the electrode layer may be made of a magnetic material such as Ni (nickel), an alloy containing Ni as a main component and Pt (platinum) or the like added, or an alloy containing Fe (iron) or the like. consists of

The sealing tape 4 is a tape that closes the opening of the storage recess 20 of the storage case 2 and seals the storage recess 20 . As the sealing tape 4, an adhesive tape or the like containing a known adhesive material can be used. The sealing tape 4 seals the storage recess 20 by being attached to the first main surface 21 of the storage case 2 . In addition, although the sealing tape 4 is configured as a tape that integrally seals the plurality of storage recesses 20 , it may be configured to individually seal the storage recesses 20 .

In the electronic component package 1 , the storage recess 20 is sealed with the sealing tape 4 while the electronic component 3 is stored in the storage recess 20 of the storage case 2 . The electronic component 3 housed in the housing recess 20 is attracted to the bottom surface 20 a side of the housing recess 20 under the influence of the magnetic field formed by the magnetic field forming layer 31 and fixed.

Next, a method for manufacturing the electronic component package 1 will be described with reference to FIG. First, as shown in FIG. 2A, a material having a shape corresponding to the support layer 32 is prepared. This material can be obtained by, for example, pressing a material that will become the support layer 32 . A magnetic field forming layer 31 is attached to the back surface (the surface on the side closer to the second main surface 22, the surface on the side opposite to the surface on the side that becomes the first main surface 21 in which the storage recess 20 is formed). By attaching, as shown in FIG. 2(C), the storage case 2 can be obtained.

Alternatively, as shown in FIG. 2(B), a material is prepared in which a layer 32' to be the support layer 32 is adhered on the layer 31' to be the magnetic field forming layer 31, and press work is performed to correspond to the storage recess 20. By forming the concave portion, the storage case 2 can be obtained as shown in FIG. 2(C).

Note that the magnetic field forming layer 31 is magnetized before forming the storage case 2 .

Next, as shown in FIG. 2D, the electronic component 3 is housed in the housing recess 20 of the housing case 2 . The electronic component 3 is influenced by the magnetic field generated by the magnetic field forming layer 31 and is attracted to and held by the bottom surface 20 a of the storage recess 20 . After that, the storage recess 20 is sealed by attaching the sealing tape 4 to the first main surface 21 of the storage case 2 . As a result, the electronic component package 1 shown in FIG. 2(E) (and FIG. 1) is obtained.

The electronic component package 1 can be transported, for example, in a rolled state with the second main surface 22 facing inside.

Next, a method of opening the electronic component package 1 and taking out the electronic component 3 will be described with reference to FIG. FIG. 4 is a schematic configuration diagram of a take-out device 40 (tape feeder device) for unsealing the electronic component package 1 and taking out the electronic components 3. As shown in FIG.

In the pick-up device 40 , the electronic component package 1 wound into a roll is attached to the unwinding roller 41 of the device, and the storage case 2 is wound up by the winding roller 42 . At this time, by using the guide roller 43 and winding the sealing tape 4 with a seal winding roller 44 different from the winding roller 42 , the sealing tape 4 is attached to the storage case 2 at the mounting position of the guide roller 43 . stripped from On the winding roller 42 side of the guide roller 43, the storage recess 20 of the storage case 2 is opened, so the electronic component 3 is taken out at this stage. The electronic component 3 taken out is mounted on a board or the like. Although the method of taking out the electronic component 3 is not particularly limited, for example, suction using a nozzle or the like can be used. At the stage of taking out the electronic component 3, the electronic component 3 is fixed to the bottom part of the storage recess 20 by magnetic force, but when the suction force by the nozzle becomes larger than the magnetic force, the electronic component 3 can be taken out.

As described above, in the electronic component package 1 and the storage case 2 according to the present embodiment, the bottom portion of the storage recess 20 formed in the first main surface 21 is affected by the magnetic field formed by the magnetic field forming layer 31. The electronic component 3 is attracted by the Since the electronic component 3 is fixed to the bottom of the storage recess 20 while being attracted by the magnetic force of the magnetic field forming layer 31, the electronic component 3 is damaged during transportation of the electronic component package 1 containing the electronic component 3. In addition, it is possible to prevent the electronic component 3 from jumping out when the electronic component package 1 is opened.

In conventional electronic component storage cases, investigations have been made on the shape of the case and the like in order to prevent the electronic components from being damaged in the storage recess. However, no attention has been paid to the protruding electronic components when the package is unsealed, especially when the sealing tape is removed. If the electronic component is small in weight (e.g., several grams) or thin (e.g., several millimeters), such as a thin film capacitor, the electronic component frequently pops out when the sealing tape is removed. can occur in It is considered that this is because the electronic component moves under the influence of static electricity accompanying the peeling of the sealing tape, and adheres to the adhesive surface of the sealing tape or the like. Such a phenomenon may occur frequently especially when electronic components are lightweight and small. In many cases, the work of mounting the electronic component 3 on the board is performed mechanically. Efficiency and yield can also be affected. In addition, if the thickness of the electronic component is small, there is a possibility that vibration may cause a collision within the housing recess.

On the other hand, in the storage case 2 and the electronic component package 1 described above, the electronic component 3 can be fixed to the bottom surface 20a of the storage recess 20 using magnetic force. It is possible to prevent the electronic component 3 from jumping out. Further, when the electronic component package 1 is transported, the movement of the electronic component 3 within the storage recess 20 is restricted by the magnetic force, so that the electronic component 3 can be prevented from being damaged. Thus, according to the storage case 2 and the electronic component package 1 described above, it is possible to suppress the movement of electronic components within the case.

Next, a storage case and an electronic component package according to a modification will be described with reference to FIG.

FIG. 4A is a diagram illustrating an electronic component package 11 and a storage case 12 according to the first modification. In the electronic component package 11 according to the first modification, compared with the electronic component package 1, the bottom surface 20a of the storage recess 20 of the storage case 12 is formed of the magnetic field forming layer 31, and the storage case 12 is The difference is that the second main surface 22 is a flat surface.

In the electronic component package 11 , the storage case 12 has a supporting layer 32 laminated on a flat magnetic field forming layer 31 . The supporting layer 32 constitutes only the side surface of the storage recess 20 , and the bottom surface 20 a of the storage recess 20 is formed by the magnetic field forming layer 31 . That is, the support layer 32 has a planar shape corresponding to the tape-shaped storage case 12 , but has through holes in portions corresponding to the storage recesses 20 . By laminating such a support layer 32 on the magnetic field forming layer 31 having a planar shape corresponding to the tape-shaped storage case 12, a storage case in which the storage recess 20 is formed on the first main surface 21 side is formed. A case 12 is formed.

Thus, even when the arrangement of the magnetic field forming layer 31 and the support layer 32 and the shape of the storage case 12 are changed, when the electronic component 3 is housed in the storage recess 20 of the storage case 12, the magnetic force can be used to fix the electronic component 3 to the bottom surface 20a of the housing recess 20, the electronic component 3 can be prevented from popping out when the electronic component package 11 is opened. Also, when the electronic component package 11 is transported, the movement of the electronic component 3 within the storage recess 20 is restricted by the magnetic force, so that the electronic component 3 can be prevented from being damaged. In this way, in the storage case 12 and the electronic component package 11 as well, movement of electronic components within the case can be suppressed.

FIG. 4B is a diagram illustrating the electronic component package 13 and the storage case 14 according to the second modification. The electronic component package 11 according to the second modification differs from the electronic component package 1 in the arrangement of the magnetic field forming layer 31 .

In the electronic component package 13 , the shape of the support layer 32 of the storage case 14 is substantially the same as that of the storage case 2 . However, the magnetic field forming layer 31 is arranged only on the bottom surface 20 a of the storage recess 20 instead of covering the second main surface 22 of the storage case 14 . That is, the magnetic field forming layer 31 is arranged at the bottom of each of the plurality of storage recesses 20 . Therefore, in the storage case 14 , both the first main surface 21 and the second main surface 22 are formed by the support layer 32 .

As described above, even when the magnetic field forming layer 31 is arranged only in the storage recess 20 , when the electronic component 3 is stored in the storage recess 20 of the storage case 14 , the electronic component is moved by magnetic force. 3 can be fixed to the bottom surface 20a of the housing recess 20, it is possible to prevent the electronic component 3 from jumping out when the electronic component package 13 is opened. Further, when the electronic component package 13 is transported, the movement of the electronic component 3 within the storage recess 20 is restricted by the magnetic force, so that the electronic component 3 can be prevented from being damaged. In this way, in the storage case 14 and the electronic component package 13 as well, movement of electronic components within the case can be suppressed.

FIG. 5 is a plan view of a storage case 15 according to a third modified example. In the above embodiment, the storage case (electronic component storage case) is a tape-shaped case in which a plurality of storage recesses 20 are arranged in a row. The shape of the case itself can be changed as appropriate. The storage case 15 according to the third modification is a so-called tray type, not tape-shaped. Further, in the storage case 15, a plurality of storage recesses 20 are arranged two-dimensionally. Thus, the shape of the storage case 15 and the arrangement (arrangement) of the storage recesses 20 can be changed as appropriate. Of course, the number of storage recesses 20 arranged, the positional relationship between storage recesses 20, the distance between adjacent storage recesses 20, and the like can be changed as appropriate.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made. For example, in an electronic component storage case, a magnetized magnetic field forming layer may be provided on the bottom surface of the storage recess or on the second main surface side of the bottom surface. Therefore, a configuration different from the configuration described in the above embodiment may be used, and for example, a magnetic field forming layer may be formed between the bottom surface of the storage recess and the second main surface.

Further, the size of the magnetic field forming layer provided on the bottom surface of the storage recess or closer to the second main surface than the bottom surface may be smaller than the bottom surface of the storage recess. In the above embodiment, the case where the size of the magnetic field forming layer is the bottom surface of the storage recess or larger than it has been described, but the strength of the magnetic field formed by the magnetic field forming layer is sufficiently large (the electronic component is attracted to the bottom surface of the storage recess). (sufficient magnetic force can be realized to hold the magnetic field), the size of the magnetic field forming layer can be changed accordingly.

DESCRIPTION OF SYMBOLS 1, 11, 13... Electronic component package, 2, 12, 14, 15... Storage case (electronic component storage case), 3... Electronic component, 21... First main surface, 22... Second main surface, 31... Magnetic field formation Layer, 32... support layer.

Claims (3)

It has a first main surface and a second main surface which are a pair of main surfaces, a plurality of storage recesses are provided on the first main surface, and the bottom surface of the storage recesses or on the second main surface side of the bottom surface , an electronic component storage case having a magnetized magnetic field forming layer;
an electronic component containing a magnetic material, which is housed in the housing recess;
has
The electronic component storage case has, on the second main surface side, unevenness derived from the recessed shape of the storage recess,
The electronic component package, wherein the magnetic field forming layer is provided so as to form at least the entire surface of the second main surface having the unevenness . 2. The electronic component package according to claim 1, further comprising a sealing tape that seals said housing recess. Having a first main surface and a second main surface which are a pair of main surfaces,
A plurality of storage recesses are provided on the first main surface,
a magnetic field forming layer that is magnetized on the bottom surface of the storage recess or on the second main surface side of the bottom surface;
Having unevenness derived from the recessed shape of the storage recess on the second main surface side,
The magnetic field forming layer is provided so as to form at least the entire surface of the second main surface having the unevenness .
Electronic parts storage case.

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