JPH06191574A - Package carrying tray - Google Patents

Abstract

PURPOSE:To prevent a package in a tray from shifting during transportation by housing a magnet or an electromagnet in a part for mounting an IC or an LSI. CONSTITUTION:In a tray used for carrying IC or LSI packages, a magnet 1 is put into a part of a tray close to a leadframe of a package 2. The magnet 1 has intensity such that it may not shift even if the tray is shaken strongly, and a commonly used plastic magnet or the like may be used. Or, when an electromagnet is used, a conductor from a coil of the electromagnet is connected to a power source via a switch, and the switch is turned ON when the package is mounted to fix the package 2. Thus, occurrence of bending or floating of leads during transportation of the package 2 can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing process, and more particularly to the transportation of IC and LSI package products.

[0002]

2. Description of the Related Art Conventionally, a tray has been used to transport a finished product of an IC or LSI package to an inspection process or a packing process. Normally, such trays are made of hard plastic, etc., and as shown in Fig. 4, grooves and protrusions are provided according to the dimensions of the product to prevent the package from moving or shifting within the tray. It is supposed to do. Then, dozens of such trays are usually piled up and down and placed on a trolley or the like for transportation between processes.

[0003]

When the trays are stacked and used for transporting between steps after the packages are put in the tray and moved or lifted, the lead portions of the packages ride on the protrusions of the tray. Sometimes, the lead was bent. Also, when picking up or placing the package from the tray, it sometimes bumped into the grooves or protrusions and bent the leads.

In recent years, mainly in LSI logic products, the number of pins and the pitch thereof have been narrowed down, and therefore, problems such as slight bending of leads and buoyancy in outer shape have become a problem. . It is an object of the present invention to provide a tray that can more reliably fix products such as IC and LSI packages in order to solve the above problems.

[0005]

The present invention is an IC or LSI.
If the lead frame of is made of a magnetic material such as 42 alloy, a magnet is built in the part where the package comes into contact when the tray is made, and the magnetic lead frame material in the package attracts, causing the package in the tray to shift. To prevent.

[0006]

According to the present invention, since products such as IC and LSI packages are magnetically fixed to the tray, it is possible to prevent defects such as lead bending and floating during transportation.

[0007]

EXAMPLES The present invention will be described based on examples. Example 1 As shown in FIG. 1, the magnet 1 was sandwiched and adhered to the portion of the tray adjacent to the lead frame of the package 2. The magnet 1 may be strong enough not to be displaced even when the tray is strongly shaken. Even the plastic magnets that are commonly used on a daily basis can achieve the purpose.

Example 2 As shown in FIG. 2, when a tray was made of hard plastic, ferrite particles as magnetic particles were mixed with a plastic raw material to manufacture the tray by an injection molding method. The magnetic fine particles are not limited to ferrite, and may be powder of ordinary permanent magnet.

Further, it is not necessary to mix the magnetic fine particles with the entire tray, and a plastic raw material containing a high concentration of the magnetic fine particles may be injected only into the portion where the package 2 contacts. Example 3 As shown in FIG. 3, an electromagnet is inserted in a portion where the package comes into contact, and the conductor wire 4 from the coil of the electromagnet 3 is connected to a power source (not shown) via a switch. When the package is mounted on the tray and the power is turned on, magnetism works and the package is fixed. When removing the package from the tray, the fixing can be released by turning off the power.

[0010]

According to the present invention, the rate of occurrence of lead bending and floating during the transportation of a package is reduced from 2% to 0.2%.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing an embodiment of the present invention.

FIG. 3 is an explanatory diagram showing an embodiment of the present invention.

FIG. 4 is an overall explanatory view of a normal tray

[Explanation of symbols]

 1 magnet 2 package 3 electromagnet 4 conductor

Claims (1)

[Claims] 1. A tray for transporting an IC or LSI package, characterized in that a magnet or an electromagnet is built in a portion where the IC or LSI package is mounted.