JP5244635B2 - 有機物蒸着装置 - Google Patents
有機物蒸着装置 Download PDFInfo
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- JP5244635B2 JP5244635B2 JP2009017070A JP2009017070A JP5244635B2 JP 5244635 B2 JP5244635 B2 JP 5244635B2 JP 2009017070 A JP2009017070 A JP 2009017070A JP 2009017070 A JP2009017070 A JP 2009017070A JP 5244635 B2 JP5244635 B2 JP 5244635B2
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- vapor deposition
- deposition source
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/548—Controlling the composition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
20 基板保持部、
22 基板、
30 マスク、
40 レール、
50 移送部、
51 本体、
52a 第1プレート、
52b 第2プレート、
53 ガイドレール、
55 センサ、
60a るつぼ、
60b ヒータ部、
60c 保温部、
62a 第1蒸着源、
62b 第2蒸着源、
64a 第1補助蒸着源、
64b 第2補助蒸着源。
Claims (8)
- チャンバと、
前記チャンバ内の一側に配置され、基板を保持する基板保持部と、
前記チャンバ内の他側に配置されたレールと、
前記レールと交差する方向に設けられたガイドレールを備えるとともに前記レール上に配置され前記レールに沿って移動可能な本体、および前記本体が備える前記ガイドレール上にそれぞれ配置されており、前記本体が前記レールに沿って移動することにより前記レールに沿って移動し、かつ前記ガイドレールに沿って前記レールと交差する方向にそれぞれ移動可能な第1プレート、第2プレートを備える移送部と、
前記第1プレート上に配置され、前記基板に蒸着させる有機物を収容するとともに蒸発させる第1蒸着源および第1補助蒸着源と、
前記第2プレート上に配置され、前記基板に蒸着させる有機物を収容するとともに蒸発させる第2蒸着源および第2補助蒸着源と、を備え、
前記第1プレートが前記レールおよび前記ガイドレールの少なくとも一方に沿って移動することによって前記第1蒸着源および前記第1補助蒸着源の位置が変更され、前記第2プレートが前記レールおよび前記ガイドレールの少なくとも一方に沿って移動することによって前記第2蒸着源および前記第2補助蒸着源の位置が変更されることを特徴とする有機物蒸着装置。 - 前記第1蒸着源および前記第2蒸着源にそれぞれ収容した前記有機物がなくなると、前記第1プレートが移動することによって前記第1蒸着源の位置と前記第1補助蒸着源の位置とがそれぞれ変更され、前記第2プレートが移動することによって前記第2蒸着源の位置と前記第2補助蒸着源の位置とがそれぞれ変更され、前記第1補助蒸着源および前記第2補助蒸着源にそれぞれ収容した前記有機物を蒸発させて前記基板に蒸着させることを特徴とする請求項1に記載の有機物蒸着装置。
- 前記移送部は、
前記レールに沿って前記本体を移動させる第1駆動部と、
前記ガイドレールに沿って前記第1プレートおよび前記第2プレートを移動させる第2駆動部と、を備えることを特徴とする請求項1または請求項2に記載の有機物蒸着装置。 - 前記第1蒸着源、前記第1補助蒸着源、前記第2蒸着源、および前記第2補助蒸着源のそれぞれは、
前記有機物が収容されるるつぼと、
前記有機物を加熱するために前記るつぼの外側に設けられるヒータ部と、
前記ヒータ部の外側に設けられる保温部と、を備えることを特徴とする請求項1〜3のいずれか1項に記載の有機物蒸着装置。 - 前記第1蒸着源および前記第2蒸着源が互いに隣接するように配置され、前記第1蒸着源の外側に前記第1補助蒸着源が配置され、前記第2蒸着源の外側に前記第2補助蒸着源が配置されることを特徴とする請求項1〜4のいずれか1項に記載の有機物蒸着装置。
- 前記第1蒸着源、前記第1補助蒸着源、前記第2蒸着源、および前記第2補助蒸着源がそれぞれ複数個配置されることを特徴とする請求項1〜5のいずれか1項に記載の有機物蒸着装置。
- 前記第1蒸着源、前記第1補助蒸着源、前記第2蒸着源、および前記第2補助蒸着源から前記有機物が蒸発する経路に設けられ、前記有機物の蒸着厚さを感知するための複数のセンサをさらに備えることを特徴とする請求項1〜6のいずれか1項に記載の有機物蒸着装置。
- 前記第1蒸着源、前記第1補助蒸着源、前記第2蒸着源、および前記第2補助蒸着源から前記有機物が蒸発する経路に設けられ、前記有機物を均一に蒸発させるための補正板をさらに備えることを特徴とする請求項1〜7のいずれか1項に記載の有機物蒸着装置。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080075503A KR20100013808A (ko) | 2008-08-01 | 2008-08-01 | 유기물 증착 장치 |
| KR10-2008-0075503 | 2008-08-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010037649A JP2010037649A (ja) | 2010-02-18 |
| JP5244635B2 true JP5244635B2 (ja) | 2013-07-24 |
Family
ID=42010489
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009017070A Active JP5244635B2 (ja) | 2008-08-01 | 2009-01-28 | 有機物蒸着装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5244635B2 (ja) |
| KR (1) | KR20100013808A (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101662606B1 (ko) * | 2010-05-11 | 2016-10-05 | 엘지디스플레이 주식회사 | 유기박막 증착장치 및 이를 이용한 유기전계발광소자의 제조방법 |
| JP5888919B2 (ja) * | 2010-11-04 | 2016-03-22 | キヤノン株式会社 | 成膜装置及び成膜方法 |
| KR101450598B1 (ko) * | 2012-01-04 | 2014-10-15 | 에스엔유 프리시젼 주식회사 | 연속박막증착장치 |
| KR101335684B1 (ko) * | 2012-08-07 | 2013-12-03 | 한국전기연구원 | 초전도 테이프 선재의 증착 장치 |
| KR102175820B1 (ko) * | 2013-09-12 | 2020-11-09 | 삼성디스플레이 주식회사 | 증착원 반송 장치 |
| KR101499019B1 (ko) * | 2014-08-05 | 2015-03-05 | (주)브이앤아이솔루션 | Oled 증착기 소스 |
| KR20200046463A (ko) * | 2018-10-24 | 2020-05-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 도가니 교체를 위한 증발 증착 시스템 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4286496B2 (ja) * | 2002-07-04 | 2009-07-01 | 株式会社半導体エネルギー研究所 | 蒸着装置及び薄膜作製方法 |
| JP4015064B2 (ja) * | 2003-05-28 | 2007-11-28 | トッキ株式会社 | 蒸着装置 |
| JP4789551B2 (ja) * | 2005-09-06 | 2011-10-12 | 株式会社半導体エネルギー研究所 | 有機el成膜装置 |
-
2008
- 2008-08-01 KR KR1020080075503A patent/KR20100013808A/ko not_active Ceased
-
2009
- 2009-01-28 JP JP2009017070A patent/JP5244635B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010037649A (ja) | 2010-02-18 |
| KR20100013808A (ko) | 2010-02-10 |
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