JP2010037649A - 有機物蒸着装置 - Google Patents
有機物蒸着装置 Download PDFInfo
- Publication number
- JP2010037649A JP2010037649A JP2009017070A JP2009017070A JP2010037649A JP 2010037649 A JP2010037649 A JP 2010037649A JP 2009017070 A JP2009017070 A JP 2009017070A JP 2009017070 A JP2009017070 A JP 2009017070A JP 2010037649 A JP2010037649 A JP 2010037649A
- Authority
- JP
- Japan
- Prior art keywords
- vapor deposition
- deposition source
- auxiliary
- plate
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 161
- 239000005416 organic matter Substances 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000012546 transfer Methods 0.000 claims abstract description 10
- 239000000126 substance Substances 0.000 claims description 28
- 230000008021 deposition Effects 0.000 claims description 25
- 239000011368 organic material Substances 0.000 claims description 19
- 238000001704 evaporation Methods 0.000 claims description 8
- 238000012937 correction Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 description 17
- 239000010409 thin film Substances 0.000 description 10
- 206010037660 Pyrexia Diseases 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/548—Controlling the composition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
【解決手段】チャンバ内の一側に配置され、基板を保持する基板保持部と、チャンバ内の他側に配置されたレールと、レールに沿って移動し、レールと交差する方向に移動する第1プレートおよび第2プレートを備える移送部と、第1プレート上に配置され、基板に蒸着させる有機物を収容するとともに蒸発させる第1蒸着源および第1補助蒸着源と、第2プレート上に配置され、基板に蒸着させる有機物を収容するとともに蒸発させる第2蒸着源および第2補助蒸着源と、を備える。第1蒸着源および第2蒸着源にそれぞれ収容した有機物がなくなると、第1蒸着源および第1補助蒸着源の位置と、第2蒸着源および第2補助蒸着源の位置とがそれぞれ変更され、第1補助蒸着源および第2補助蒸着源にそれぞれ収容した有機物を蒸発させて基板に蒸着させる。
【選択図】図1a
Description
20 基板保持部、
22 基板、
30 マスク、
40 レール、
50 移送部、
51 本体、
52a 第1プレート、
52b 第2プレート、
53 ガイドレール、
55 センサ、
60a るつぼ、
60b ヒータ部、
60c 保温部、
62a 第1蒸着源、
62b 第2蒸着源、
64a 第1補助蒸着源、
64b 第2補助蒸着源。
Claims (8)
- チャンバと、
前記チャンバ内の一側に配置され、基板を保持する基板保持部と、
前記チャンバ内の他側に配置されたレールと、
前記レールに沿って移動し、前記レールと交差する方向に移動する第1プレートおよび第2プレートを備える移送部と、
前記第1プレート上に配置され、前記基板に蒸着させる有機物を収容するとともに蒸発させる第1蒸着源および第1補助蒸着源と、
前記第2プレート上に配置され、前記基板に蒸着させる有機物を収容するとともに蒸発させる第2蒸着源および第2補助蒸着源と、を備え、
前記第1プレートが移動することによって前記第1蒸着源および前記第1補助蒸着源の位置が変更され、前記第2プレートが移動することによって前記第2蒸着源および前記第2補助蒸着源の位置が変更されることを特徴とする有機物蒸着装置。 - 前記第1蒸着源および前記第2蒸着源にそれぞれ収容した前記有機物がなくなると、前記第1プレートおよび前記第2プレートが移動し、前記第1蒸着源および前記第1補助蒸着源の位置と、前記第2蒸着源および前記第2補助蒸着源の位置とがそれぞれ変更され、前記第1補助蒸着源および前記第2補助蒸着源にそれぞれ収容した前記有機物を蒸発させて前記基板に蒸着させることを特徴とする請求項1に記載の有機物蒸着装置。
- 前記移送部は、前記レールの上部に配置され、前記レールと交差する方向に設けられたガイドレールを備える本体と、
前記レールに沿って前記本体を移動させる第1駆動部と、
前記ガイドレール上に配置される前記第1プレートおよび前記第2プレートと、
前記ガイドレールに沿って前記第1プレートおよび前記第2プレートを移動させる第2駆動部と、を備えることを特徴とする請求項1または請求項2に記載の有機物蒸着装置。 - 前記第1蒸着源、前記第1補助蒸着源、前記第2蒸着源、および前記第2補助蒸着源のそれぞれは、
前記有機物が収容されるるつぼと、
前記有機物を加熱するために前記るつぼの外側に設けられるヒータ部と、
前記ヒータ部の外側に設けられる保温部と、を備えることを特徴とする請求項1〜3のいずれか1項に記載の有機物蒸着装置。 - 前記第1蒸着源および前記第2蒸着源が互いに隣接するように配置され、前記第1蒸着源の外側に前記第1補助蒸着源が配置され、前記第2蒸着源の外側に前記第2補助蒸着源が配置されることを特徴とする請求項1〜4のいずれか1項に記載の有機物蒸着装置。
- 前記第1蒸着源、前記第1補助蒸着源、前記第2蒸着源、および前記第2補助蒸着源がそれぞれ複数個配置されることを特徴とする請求項1〜5のいずれか1項に記載の有機物蒸着装置。
- 前記第1蒸着源、前記第1補助蒸着源、前記第2蒸着源、および前記第2補助蒸着源から前記有機物が蒸発する経路に設けられ、前記有機物の蒸着厚さを感知するための複数のセンサをさらに備えることを特徴とする請求項1〜6のいずれか1項に記載の有機物蒸着装置。
- 前記第1蒸着源、前記第1補助蒸着源、前記第2蒸着源、および前記第2補助蒸着源から前記有機物が蒸発する経路に設けられ、前記有機物を均一に蒸発させるための補正板をさらに備えることを特徴とする請求項1〜7のいずれか1項に記載の有機物蒸着装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080075503A KR20100013808A (ko) | 2008-08-01 | 2008-08-01 | 유기물 증착 장치 |
KR10-2008-0075503 | 2008-08-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010037649A true JP2010037649A (ja) | 2010-02-18 |
JP5244635B2 JP5244635B2 (ja) | 2013-07-24 |
Family
ID=42010489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009017070A Active JP5244635B2 (ja) | 2008-08-01 | 2009-01-28 | 有機物蒸着装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5244635B2 (ja) |
KR (1) | KR20100013808A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012112036A (ja) * | 2010-11-04 | 2012-06-14 | Canon Inc | 成膜装置及び成膜方法 |
CN112867808A (zh) * | 2018-10-24 | 2021-05-28 | 应用材料公司 | 用于替换坩埚的蒸发沉积系统 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101662606B1 (ko) * | 2010-05-11 | 2016-10-05 | 엘지디스플레이 주식회사 | 유기박막 증착장치 및 이를 이용한 유기전계발광소자의 제조방법 |
KR101450598B1 (ko) * | 2012-01-04 | 2014-10-15 | 에스엔유 프리시젼 주식회사 | 연속박막증착장치 |
KR101335684B1 (ko) * | 2012-08-07 | 2013-12-03 | 한국전기연구원 | 초전도 테이프 선재의 증착 장치 |
KR102175820B1 (ko) * | 2013-09-12 | 2020-11-09 | 삼성디스플레이 주식회사 | 증착원 반송 장치 |
KR101499019B1 (ko) * | 2014-08-05 | 2015-03-05 | (주)브이앤아이솔루션 | Oled 증착기 소스 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004035964A (ja) * | 2002-07-04 | 2004-02-05 | Tokki Corp | 蒸着装置 |
JP2004353030A (ja) * | 2003-05-28 | 2004-12-16 | Tokki Corp | 蒸着装置 |
JP2007070687A (ja) * | 2005-09-06 | 2007-03-22 | Semiconductor Energy Lab Co Ltd | 成膜装置 |
-
2008
- 2008-08-01 KR KR1020080075503A patent/KR20100013808A/ko not_active Application Discontinuation
-
2009
- 2009-01-28 JP JP2009017070A patent/JP5244635B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004035964A (ja) * | 2002-07-04 | 2004-02-05 | Tokki Corp | 蒸着装置 |
JP2004353030A (ja) * | 2003-05-28 | 2004-12-16 | Tokki Corp | 蒸着装置 |
JP2007070687A (ja) * | 2005-09-06 | 2007-03-22 | Semiconductor Energy Lab Co Ltd | 成膜装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012112036A (ja) * | 2010-11-04 | 2012-06-14 | Canon Inc | 成膜装置及び成膜方法 |
CN112867808A (zh) * | 2018-10-24 | 2021-05-28 | 应用材料公司 | 用于替换坩埚的蒸发沉积系统 |
Also Published As
Publication number | Publication date |
---|---|
JP5244635B2 (ja) | 2013-07-24 |
KR20100013808A (ko) | 2010-02-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5244635B2 (ja) | 有機物蒸着装置 | |
JP4767000B2 (ja) | 真空蒸着装置 | |
KR100823508B1 (ko) | 증발원 및 이를 구비한 증착 장치 | |
KR100645719B1 (ko) | 물질증착용 증착원 및 이를 구비한 증착장치 | |
JP5282038B2 (ja) | 蒸着装置 | |
US9593408B2 (en) | Thin film deposition apparatus including deposition blade | |
KR101254335B1 (ko) | 금속판 벨트 증발원을 이용한 선형 유기소자 양산장비 | |
US8802200B2 (en) | Method and apparatus for cleaning organic deposition materials | |
KR100826743B1 (ko) | 유기 박막의 제조장치 | |
KR20060080481A (ko) | 물질증착용 증착원 및 이를 구비한 증착시스템 | |
KR20070105595A (ko) | 유기박막 증착장치 | |
JP2011127217A (ja) | 線形蒸発源及びそれを用いた蒸着装置 | |
KR101406199B1 (ko) | 증착장치 | |
TW200904998A (en) | Deposition source, deposition apparatus, and forming method of organic film | |
US9174250B2 (en) | Method and apparatus for cleaning organic deposition materials | |
TW201305365A (zh) | 沉積源及包含其之沉積裝置 | |
KR20070038640A (ko) | 하향식 열적 유도 증착에 의한 선형의 대면적 유기소자양산장비 | |
KR101983009B1 (ko) | 증발원 및 이를 구비한 진공 증착 장치 | |
JP2006200040A (ja) | 加熱容器支持台及びそれを備えた蒸着装置 | |
KR20060013735A (ko) | 유기 el소자의 연속 증착용 연속 도가니 교환 장치 | |
KR100762698B1 (ko) | 박막 증착장치 | |
KR102641720B1 (ko) | 증착용 각도제한판 및 이를 포함하는 증착장치 | |
JP2003317948A (ja) | 蒸発源及びこれを用いた薄膜形成装置 | |
JP2007305439A (ja) | 有機電界発光表示装置の製造方法 | |
KR20070109408A (ko) | 박막 증착장치 및 이를 이용한 박막 증착방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111122 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120222 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20120912 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121107 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121127 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130226 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130319 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130408 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160412 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5244635 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |