JP5238909B2 - Light-shielding sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element - Google Patents

Abstract

The purpose of the present invention is to provide: a light-shielding sealing agent for a liquid crystal display element, which can exhibit excellent adhesion strength to a substrate even after being exposed to a high-temperature and high-humidity environment; and a top-to-bottom conductive material and a liquid crystal display element, each of which is produced using the light-shielding sealing agent for a liquid crystal display element. The present invention is a light-shielding sealing agent for a liquid crystal display element which is a light-shielding sealing agent for use in a liquid crystal dropping process, comprising a curable resin that contains a curable compound having an unsaturated double bond, a radical polymerization initiator and a light-shielding agent, wherein the curable resin has a hydrogen-binding functional group value of 0.5 × 10-3 to 3.0 × 10-3 mol/g and titanium black is contained as the light-shielding agent.

Description

An object of this invention is to provide the light-shielding sealant for liquid crystal display elements which is excellent in the adhesive strength with respect to a board | substrate, even after being exposed to a high temperature, high humidity environment. Moreover, this invention relates to the vertical conduction material and liquid crystal display element which are manufactured using this light-shielding sealant for liquid crystal display elements.

Conventionally, a liquid crystal display element such as a liquid crystal display cell is formed by forming a cell by facing two transparent substrates with electrodes facing each other at a predetermined interval and sealing the periphery with a sealing agent. The liquid crystal was injected from the liquid crystal injection port into the cell, and the liquid crystal injection port was manufactured by a method called a vacuum injection method in which a sealing agent or a sealing agent was sealed.

In the vacuum injection method, first, a seal pattern having a liquid crystal injection port using a thermosetting sealant is formed by screen printing on one of two transparent substrates with electrodes, and prebaked at 60 to 100 ° C. The solvent in the sealant is dried. Next, the two substrates are opposed to each other with the spacer interposed therebetween, aligned and bonded, and hot-pressed at 110 to 220 ° C. for 10 to 90 minutes to adjust the gap near the seal, and then 110 to 220 ° C. in an oven. For 10 to 120 minutes to fully cure the sealant. Next, liquid crystal was injected from the liquid crystal injection port, and finally, the liquid crystal injection port was sealed using a sealing agent to produce a liquid crystal display element.

However, in recent years, the manufacturing method of liquid crystal display elements such as liquid crystal display cells has been started from the above-mentioned vacuum injection method and photo radical resin such as acrylic resin and photo radical polymerization from the viewpoint of shortening tact time and optimizing the amount of liquid crystal used. It is changing to a liquid crystal dropping method called a dripping method using a sealing agent made of a light and heat curable resin composition containing an agent and a thermosetting resin such as an epoxy resin and a thermosetting agent.

In the liquid crystal dropping method, first, a seal pattern is formed on one of the two substrates with electrodes. Next, a liquid crystal micro-droplet is dropped on the entire surface of the substrate frame in an uncured state of the sealant, the other substrate is superposed under vacuum, and after returning to normal pressure, the seal portion is irradiated with ultraviolet rays to be photocurable. The resin is cured (temporary curing step). Thereafter, the thermosetting resin is cured by heating to produce a liquid crystal display element.

By the way, in the present age when mobile devices with various liquid crystal panels such as mobile phones and portable game machines are widespread, downsizing of devices is the most demanded issue. As a technique for miniaturization, there is a narrow frame of the liquid crystal display unit. For example, the position of the seal unit is arranged under the black matrix.

However, since the conventional sealant is transparent or milky white, the light that passes through the sealant cannot be shielded even with a black matrix that should originally suppress light leakage, resulting in a decrease in contrast. It was.

Therefore, a method of providing light shielding properties by adding a light shielding agent or the like to the sealing agent can be considered. For example, Patent Documents 1 to 3 disclose a sealing agent containing a titanium black material, a carbon black material, or other light shielding fine particles as a light shielding component. In particular, among these light shielding agents, a titanium black material having high insulating properties is preferable as the light shielding agent contained in the sealant.

However, when the sealant containing titanium black is exposed to a high-temperature and high-humidity environment, there is a problem that the subsequent adhesive strength is remarkably lowered.

JP 2006-099027 A JP 2005-292801 A WO09 / 128470 pamphlet

An object of this invention is to provide the light-shielding sealant for liquid crystal display elements which is excellent in the adhesive strength with respect to a board | substrate, even after being exposed to a high temperature, high humidity environment. Another object of the present invention is to provide a vertical conduction material and a liquid crystal display element manufactured using the light-shielding sealant for liquid crystal display elements.

The present invention is a curable resin containing a curable compound having an unsaturated double bond, a radical polymerization initiator, and a light shielding sealant for a liquid crystal dropping method containing a light shielding agent, wherein the curable resin is The hydrogen-bonding functional group value is 0.5 × 10 ^{−3 to} 3.0 × 10 ⁻³ mol / g, and is a light-shielding sealant for liquid crystal display elements containing titanium black as the light-shielding agent.
The present invention is described in detail below.

The present inventors, in the liquid crystal display device for shielding sealing agent containing titanium black, a hydrogen bonding functional group value of the curable resin containing a curable compound having an unsaturated double bond, 0.5 × 10 ^{- In the case of 3 to} 3.0 × 10 ⁻³ mol / g, it was found that the decrease in the adhesive strength after the high-temperature and high-humidity treatment can be suppressed, and the present invention has been completed.

The light-shielding sealant for liquid crystal display elements of the present invention (hereinafter also referred to as the light-shielding sealant of the present invention) contains titanium black as a light-shielding agent.
Titanium black is a substance having higher transmittance near the ultraviolet region, particularly for light with a wavelength of 370 to 450 nm, compared to the average transmittance for light with a wavelength of 300 to 800 nm. That is, the above-described titanium black sufficiently shields light having a wavelength in the visible light region, thereby providing the light shielding sealant of the present invention with light shielding properties, while having a property of transmitting light having a wavelength near the ultraviolet region. It is. Therefore, the photo-curing property of the light-shielding sealant of the present invention can be obtained by using a photo-radical polymerization initiator, which will be described later, that can start the reaction with light having a wavelength (370 to 450 nm) that increases the transmittance of the titanium black. Can be further increased. On the other hand, the light shielding agent contained in the light shielding sealant of the present invention is preferably a highly insulating material, and titanium black is also suitable as the highly insulating light shielding agent.
The titanium black preferably has an optical density (OD value) per μm of 3 or more, more preferably 4 or more. The higher the light shielding property of the titanium black, the better. There is no particular upper limit to the OD value of the titanium black, but it is usually 5 or less.

The above-mentioned titanium black exhibits a sufficient effect even if it is not surface-treated, but the surface is treated with an organic component such as a coupling agent, silicon oxide, titanium oxide, germanium oxide, aluminum oxide, oxidized Surface-treated titanium black such as those coated with an inorganic component such as zirconium or magnesium oxide can also be used. Especially, what is processed with the organic component is preferable at the point which can improve insulation more.
In addition, the liquid crystal display element manufactured using the light-shielding sealant of the present invention is a liquid crystal having excellent image display quality with high contrast without light leakage because the light-shielding sealant has sufficient light shielding properties. A display element can be realized.

The titanium black is not particularly limited. Specific examples of commercially available products include “12S”, “13M”, “13M-C”, “13R-N” (all manufactured by Mitsubishi Materials Corporation), “Tilack”. D ”(manufactured by Ako Kasei Co., Ltd.) and the like.

The preferable lower limit of the specific surface area of the titanium black is 13 m ² / g, the preferable upper limit is 30 m ² / g, the more preferable lower limit is 15 m ² / g, and the more preferable upper limit is 25 m ² / g.
The preferable lower limit of the volume resistance of the titanium black is 0.5 Ω · cm, the preferable upper limit is 3 Ω · cm, the more preferable lower limit is 1 Ω · cm, and the more preferable upper limit is 2.5 Ω · cm.

In the light-shielding sealant of the present invention, the primary particle diameter of the light-shielding agent is not particularly limited as long as it is not more than the distance between the substrates of the liquid crystal display element, but the preferred lower limit is 1 nm and the preferred upper limit is 5 μm. When the primary particle diameter of the light-shielding agent is less than 1 nm, the viscosity and thixotropy of the obtained light-shielding sealant are greatly increased, and workability may be deteriorated. When the primary particle diameter of the light-shielding agent exceeds 5 μm, the applicability of the obtained light-shielding sealant to the substrate may be deteriorated. The more preferable lower limit of the primary particle diameter of the light shielding agent is 5 nm, the more preferable upper limit is 200 nm, the still more preferable lower limit is 10 nm, and the still more preferable upper limit is 100 nm.

The content of the light-shielding agent in the light-shielding sealant of the present invention is not particularly limited, but a preferred lower limit is 5% by weight and a preferred upper limit is 80% by weight. If the content of the light shielding agent is less than 5% by weight, sufficient light shielding properties may not be obtained. When the content of the light-shielding agent exceeds 80% by weight, the adhesion of the obtained light-shielding sealant to the substrate and the strength after curing may be lowered, or the drawing property may be lowered. The more preferable lower limit of the content of the light-shielding agent is 10% by weight, the more preferable upper limit is 70% by weight, the still more preferable lower limit is 30% by weight, and the still more preferable upper limit is 60% by weight.

The light shielding sealant of the present invention contains a curable resin.
The curable resin contains a curable compound having an unsaturated double bond. That is, the light-shielding sealant of the present invention contains a curable compound having an unsaturated double bond and a radical polymerization initiator described later, and initiates the reaction by light and / or heat. Specifically, it can be cured by ultraviolet irradiation and / or heating.

The hydrogen bondable functional group value of the curable resin is 0.5 × 10 ^{−3 to} 3.0 × 10 ⁻³ mol / g. When the hydrogen bondable functional group value of the curable resin is less than 0.5 × 10 ⁻³ mol / g, the resin component is easily eluted into the liquid crystal, resulting in liquid crystal contamination. When the hydrogen bondable functional group value of the curable resin exceeds 3.0 × 10 ⁻³ mol / g, the adhesive strength after the high-temperature and high-humidity treatment in the obtained light-shielding sealant is significantly reduced. The preferable lower limit of the hydrogen bonding functional group value of the curable resin is 0.7 × 10 ⁻³ mol / g, the preferable upper limit is 2.5 × 10 ⁻³ mol / g, and the more preferable lower limit is 2.0 × 10 ^{−. 3} mol / g.
In the present specification, the hydrogen bondable functional group value of the curable resin is a value calculated by the following formula when the curable resin is composed of one kind of compound.
Hydrogen bondable functional group value of curable resin = (number of hydrogen bondable functional groups in one molecule of constituent compound) / (molecular weight of constituent compound)

Moreover, when the said curable resin is comprised from the mixture of several resin, the hydrogen bondable functional group value of curable resin is computed as a hydrogen bondable functional group value per unit weight. For example, the curable resin is a compound A (hydrogen bonding functional group value αmol / g), a bg compound B (hydrogen bonding functional group value β mol / g), and a cg compound C (hydrogen bonding functional group value). When composed of γmol / g), the hydrogen bondable functional group value of the curable resin is represented by the following formula.
Hydrogen bonding functional group value of curable resin = (a × α + b × β + c × γ) / (a + b + c)

The hydrogen bonding functional group is not particularly limited as long as it is a functional group or a residue having hydrogen bonding properties, for example, —OH group, —NH ₂ group, —NHR group (R is aromatic or aliphatic). Group hydrocarbons and derivatives thereof), those having a functional group such as —COOH group, —CONH ₂ group, —NHOH group, and —NHCO— bond, —NH— bond, —CONHCO— Examples thereof include those having a residue such as a bond or —NH—NH— bond.

As the compound having a hydrogen bonding functional group, the hydrogen bonding functional group value may be adjusted to the above range by mixing two or more kinds even if the hydrogen bonding functional group value is in the above range alone. Also good. That is, the average value of the hydrogen bonding functional group value of the compound having a hydrogen bonding functional group to be used may be in the above range.

The curable compound having the unsaturated double bond is not limited, and examples thereof include resins having a vinyl group, an allyl group, a cinnamoyl group, a cinnamylidene group, a maleimide group, a (meth) acryloyloxy group, and the like. From the viewpoint of reactivity, a resin having a (meth) acryloyloxy group is preferable, and a resin having 2 to 3 (meth) acryloyloxy groups in the molecule is more preferable.
In the present specification, the “(meth) acryloyloxy group” means “acryloyloxy group or methacryloyloxy group”.

The resin having the (meth) acryloyloxy group is not particularly limited. For example, an ester compound obtained by reacting a compound having a hydroxyl group with (meth) acrylic acid, (meth) acrylic acid and an epoxy compound are reacted. Examples thereof include completely (meth) acryl-modified epoxy resins obtained by the above, urethane (meth) acrylates obtained by reacting isocyanates with (meth) acrylic acid derivatives having a hydroxyl group, and the like.
In the present specification, the “(meth) acryl” means “acryl or methacryl”, and the “(meth) acrylate” means “acrylate or methacrylate”. Further, in the present specification, the “complete (meth) acryl-modified epoxy resin” represents a compound obtained by reacting all epoxy groups in the epoxy resin with (meth) acrylic acid.

The ester compound obtained by reacting the above (meth) acrylic acid with a compound having a hydroxyl group is not particularly limited, and examples of monofunctional compounds include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meta ) Acrylate, 4-hydroxybutyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, isooctyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) ) Acrylate, isobornyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-methoxyethyl (meth) acrylate, methoxyethylene glycol (meth) acrylate, 2-ethoxyethyl (meth) acrylate, Lahydrofurfuryl (meth) acrylate, benzyl (meth) acrylate, ethyl carbitol (meth) acrylate, phenoxyethyl (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, methoxy polyethylene glycol (meta ) Acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, 1H, 1H, 5H-octafluoropentyl (meth) acrylate, imide (meth) ) Acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, cyclo Xyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isononyl (meth) acrylate, isomyristyl (meth) acrylate, 2-butoxyethyl (meth) acrylate, 2-phenoxyethyl (meth) ) Acrylate, bicyclopentenyl (meth) acrylate, isodecyl (meth) acrylate, diethylaminoethyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, 2- (meth) acryloyloxyethyl succinic acid, 2- (meth) acryloyl Roxyethyl hexahydrophthalic acid, 2- (meth) acryloyloxyethyl 2-hydroxypropyl phthalate, glycidyl (meth) acrylate, 2- (meth) acryloyloxyethyl phosphate, etc. The

Examples of the bifunctional compound include 1,4-butanediol di (meth) acrylate, 1,3-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, and 1,9. -Nonanediol di (meth) acrylate, 1,10-decanediol di (meth) acrylate, 2-n-butyl-2-ethyl-1,3-propanediol di (meth) acrylate, dipropylene glycol di (meth) Acrylate, tripropylene glycol di (meth) acrylate, polypropylene glycol (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, Lopylene oxide-added bisphenol A di (meth) acrylate, ethylene oxide-added bisphenol A di (meth) acrylate, ethylene oxide-added bisphenol F di (meth) acrylate, dimethylol dicyclopentadienyl di (meth) acrylate, 1,3-butylene glycol Di (meth) acrylate, neopentyl glycol di (meth) acrylate, ethylene oxide modified isocyanuric acid di (meth) acrylate, 2-hydroxy-3- (meth) acryloyloxypropyl (meth) acrylate, carbonate diol di (meth) acrylate , Polyether diol di (meth) acrylate, polyester diol di (meth) acrylate, polycaprolactone diol di (meth) acrylate, polybutadiene di Ruji (meth) acrylate, tricyclodecane dimethanol diacrylate, and the like.

Examples of the tri- or higher functional group include pentaerythritol tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, propylene oxide-added trimethylolpropane tri (meth) acrylate, and ethylene oxide-added trimethylolpropane tri (meth). Acrylate, caprolactone-modified trimethylolpropane tri (meth) acrylate, ethylene oxide-added isocyanuric acid tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, Pentaerythritol tetra (meth) acrylate, glycerin tri (meth) acrylate, propylene oxide-added glycerin Li (meth) acrylate, tris (meth) acryloyloxyethyl phosphate, and the like.

The complete (meth) acryl-modified epoxy resin obtained by reacting the (meth) acrylic acid and the epoxy compound is not particularly limited. For example, an epoxy resin and (meth) acrylic acid can be converted into a basic catalyst according to a conventional method. And the like obtained by reacting in the presence of.

The epoxy compound used as a raw material for synthesizing the complete (meth) acryl-modified epoxy resin is not particularly limited. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, 2,2′- Diallyl bisphenol A type epoxy resin, hydrogenated bisphenol type epoxy resin, propylene oxide added bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy resin, sulfide type epoxy resin, diphenyl ether type epoxy resin, dicyclopentadiene type epoxy resin, Naphthalene type epoxy resin, phenol novolac type epoxy resin, orthocresol novolac type epoxy resin, dicyclopentadiene novolac type epoxy resin, biphenyl novolac type epoxy resin Carboxymethyl resins, naphthalene phenol novolac-type epoxy resin, glycidyl amine type epoxy resin, alkyl polyol type epoxy resin, rubber-modified epoxy resins, glycidyl ester compounds.

As what is marketed among the said bisphenol A type epoxy resins, Epicoat 828EL, Epicoat 1004 (all are the Mitsubishi Chemical company make), Epiklon 850-S (made by DIC company), etc. are mentioned, for example.
As what is marketed among the said bisphenol F type epoxy resins, Epicoat 806, Epicoat 4004 (all are Mitsubishi Chemical Corporation make) etc. are mentioned, for example.
As what is marketed among the said bisphenol S-type epoxy resins, Epicron EXA1514 (made by DIC Corporation) etc. are mentioned, for example.
As what is marketed among the said 2,2'- diallyl bisphenol A type epoxy resins, RE-810NM (made by Nippon Kayaku Co., Ltd.) etc. are mentioned, for example.
As what is marketed among the said hydrogenated bisphenol type | mold epoxy resins, Epicron EXA7015 (made by DIC Corporation) etc. are mentioned, for example.
As what is marketed among the said propylene oxide addition bisphenol A type epoxy resins, EP-4000S (made by ADEKA) etc. are mentioned, for example.
As what is marketed among the said resorcinol type epoxy resins, EX-201 (made by Nagase ChemteX Corporation) etc. are mentioned, for example.
As what is marketed among the said biphenyl type epoxy resins, Epicoat YX-4000H (made by Mitsubishi Chemical Corporation) etc. are mentioned, for example.
As what is marketed among the said sulfide type epoxy resins, YSLV-50TE (made by Nippon Steel Chemical Co., Ltd.) etc. are mentioned, for example.
As what is marketed among the said diphenyl ether type epoxy resins, YSLV-80DE (made by Nippon Steel Chemical Co., Ltd.) etc. are mentioned, for example.
As what is marketed among the said dicyclopentadiene type epoxy resins, EP-4088S (made by ADEKA) etc. are mentioned, for example.
As what is marketed among the said naphthalene type | mold epoxy resins, Epicron HP4032, Epicron EXA-4700 (all are the products made from DIC) etc. are mentioned, for example.
As what is marketed among the said phenol novolak-type epoxy resins, Epicron N-770 (made by DIC Corporation) etc. are mentioned, for example.
As what is marketed among the said ortho cresol novolak-type epoxy resins, Epicron N-670-EXP-S (made by DIC) etc. are mentioned, for example.
As what is marketed among the said dicyclopentadiene novolak-type epoxy resins, epiclone HP7200 (made by DIC) etc. are mentioned, for example.
As what is marketed among the said biphenyl novolak-type epoxy resins, NC-3000P (made by Nippon Kayaku Co., Ltd.) etc. are mentioned, for example.
As what is marketed among the said naphthalene phenol novolak-type epoxy resins, ESN-165S (made by Nippon Steel Chemical Co., Ltd.) etc. are mentioned, for example.
As what is marketed among the said glycidylamine type epoxy resins, Epicoat 630 (made by Mitsubishi Chemical Corporation), Epicron 430 (made by DIC Corporation), TETRAD-X (made by Mitsubishi Gas Chemical Co., Inc.) etc. are mentioned, for example.
Examples of commercially available alkyl polyol type epoxy resins include ZX-1542 (manufactured by Nippon Steel Chemical Co., Ltd.), Epicron 726 (manufactured by DIC Corporation), Epolite 80MFA (manufactured by Kyoeisha Chemical Co., Ltd.), Denacol EX- 611 (manufactured by Nagase ChemteX Corporation).
Examples of commercially available rubber-modified epoxy resins include YR-450, YR-207 (all manufactured by Nippon Steel Chemical Co., Ltd.), Epolide PB (manufactured by Daicel Corporation), and the like.
As what is marketed among the said glycidyl ester compounds, Denacol EX-147 (made by Nagase ChemteX Corporation) etc. is mentioned, for example.
Other commercially available epoxy resins include, for example, YDC-1312, YSLV-80XY, YSLV-90CR (all manufactured by Nippon Steel Chemical Co., Ltd.), XAC4151 (manufactured by Asahi Kasei Co., Ltd.), Epicoat 1031, and Epicoat. 1032 (all manufactured by Mitsubishi Chemical Corporation), EXA-7120 (manufactured by DIC Corporation), TEPIC (manufactured by Nissan Chemical Industries, Ltd.) and the like.

Specifically, the complete (meth) acryl-modified epoxy resin obtained by reacting the (meth) acrylic acid with an epoxy compound is, for example, a resorcinol type epoxy resin (manufactured by Nagase ChemteX Corporation, “EX-201”). 360 parts by weight, 2 parts by weight of p-methoxyphenol as a polymerization inhibitor, 2 parts by weight of triethylamine as a reaction catalyst, and 210 parts by weight of acrylic acid were refluxed and stirred at 90 ° C. while feeding air, and reacted for 5 hours. A completely acrylic-modified resorcinol type epoxy resin can be obtained.

Among the above-mentioned completely (meth) acryl-modified epoxy resins, for example, EBECRYL860, EBECRYL3200, EBECRYL3201, EBECRYL3412, EBECRYL3600, EBECRYL3700, EBECRYL3701, EBECRYL3702, EBECRYL3702, EBECRYL3702, EA-1010, EA-1020, EA-5323, EA-5520, EA-CHD, EMA-1020 (all manufactured by Shin-Nakamura Chemical Co., Ltd.), Epoxy ester M-600A, Epoxy ester 40EM, Epoxy ester 70 PA, epoxy ester 200 PA, epoxy ester 8 MFA, Epoxy ester 3002M, Epoxy ester 3002A, Epoxy ester 1600A, Epoxy ester 3000M, Epoxy ester 3000A, Epoxy ester 200EA, Epoxy ester 400EA (all manufactured by Kyoeisha Chemical Co., Ltd.), Denacol acrylate DA-141, Denacol acrylate DA- 314, Denacol acrylate DA-911 (all manufactured by Nagase ChemteX Corporation) and the like.

The urethane (meth) acrylate obtained by reacting the isocyanate with a (meth) acrylic acid derivative having a hydroxyl group is, for example, a (meth) acrylic acid derivative having a hydroxyl group with respect to 1 equivalent of a compound having two isocyanate groups. Two equivalents can be obtained by reacting in the presence of a catalytic amount of a tin-based compound.

Isocyanate that is a raw material of urethane (meth) acrylate obtained by reacting a hydroxyl group-containing (meth) acrylic acid derivative with the isocyanate is not particularly limited. For example, isophorone diisocyanate, 2,4-tolylene diisocyanate, 2, 6-tolylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, diphenylmethane-4,4′-diisocyanate (MDI), hydrogenated MDI, polymeric MDI, 1,5-naphthalene diisocyanate, norbornane diisocyanate, tolidine diisocyanate, xylylene Range Iocyanate (XDI), Hydrogenated XDI, Lysine Diisocyanate, Triphenylmethane Triisocyanate, Tris (Isocyanate Phenyl) Thioff Sufeto, tetramethyl xylene diisocyanate, 1,6,10- undecene country isocyanate.

Examples of the isocyanate used as a raw material for the urethane (meth) acrylate obtained by reacting the isocyanate with a (meth) acrylic acid derivative having a hydroxyl group include, for example, ethylene glycol, glycerin, sorbitol, trimethylolpropane, (poly) Chain-extended isocyanate compounds obtained by reaction of polyols such as propylene glycol, carbonate diol, polyether diol, polyester diol, polycaprolactone diol and excess isocyanate can also be used.

The (meth) acrylic acid derivative having a hydroxyl group, which is a raw material for urethane (meth) acrylate obtained by reacting the isocyanate with a (meth) acrylic acid derivative having a hydroxyl group, is not particularly limited. For example, 2-hydroxyethyl Commercial products such as (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, ethylene glycol, propylene glycol, 1,3-propanediol, Mono (meth) acrylates of divalent alcohols such as 1,3-butanediol, 1,4-butanediol and polyethylene glycol, mono (meth) acrylates of trivalent alcohols such as trimethylolethane, trimethylolpropane and glycerin or Di (meth) acrylate, epoxy (meth) acrylates such as bisphenol A type epoxy (meth) acrylate.

Specifically, the urethane (meth) acrylate obtained by reacting the isocyanate with a hydroxyl group-containing (meth) acrylic acid derivative is, for example, 134 parts by weight of trimethylolpropane, 0.2 part by weight of BHT as a polymerization inhibitor, As reaction catalysts, 0.01 parts by weight of dibutyltin dilaurate and 666 parts by weight of isophorone diisocyanate were added and reacted at 60 ° C. with stirring under reflux for 2 hours. Next, 51 parts by weight of 2-hydroxyethyl acrylate was added and air was fed. It can be obtained by stirring at 90 ° C. under reflux and reacting for 2 hours.

Examples of commercially available urethane (meth) acrylates include M-1100, M-1200, M-1210, and M-1600 (all manufactured by Toagosei Co., Ltd.), Evekril 230, Evekril 270, and Evekril 4858. , Evecril 8402, Evekril 8804, Evekril 8803, Evekrill 8807, Evekrill 9260, Evekrill 1290, Evekril 5129, Evekril 4842, Evekril 4827, Evekril 4800, Evekril 6700, Evekril 220, Evekryt Rytec Resin UN-9000H, Art Resin UN-9000A, Art Resin UN-7100, Art Resin UN-1255, Art Resin UN-330, Art Resin UN-33 0HB, Art Resin UN-1200TPK, Art Resin SH-500B (all manufactured by Negami Kogyo Co., Ltd.), U-122P, U-108A, U-340P, U-4HA, U-6HA, U-324A, U-15HA, UA-5201P, UA-W2A, U-1084A, U-6LPA, U-2HA, U-2PHA, UA-4100, UA-7100, UA-4200, UA-4400, UA-340P, U-3HA, UA- 7200, U-2061BA, U-10H, U-122A, U-340A, U-108, U-6H, UA-4000 (all manufactured by Shin-Nakamura Chemical Co., Ltd.), AH-600, AT-600, UA- 306H, AI-600, UA-101T, UA-101I, UA-306T, UA-306I, and the like.

In addition to the curable compound having an unsaturated double bond, the curable resin may contain another resin such as a resin having an epoxy group.

The resin having the epoxy group is not particularly limited, and examples thereof include an epoxy compound that is a raw material for synthesizing the complete (meth) acryl-modified epoxy resin and a partial (meth) acryl-modified epoxy resin.
In the present specification, the partial (meth) acryl-modified epoxy resin means a resin having one or more epoxy groups and (meth) acryloyloxy groups in one molecule, for example, two or more epoxy resins. It can be obtained by reacting an epoxy group of a part of the resin having a group with (meth) acrylic acid.

The partial (meth) acryl-modified epoxy resin can be obtained, for example, by reacting an epoxy resin and (meth) acrylic acid in the presence of a basic catalyst according to a conventional method. Specifically, for example, 190 g of phenol novolac type epoxy resin N-770 (manufactured by DIC) is dissolved in 500 mL of toluene, 0.1 g of triphenylphosphine is added to this solution to obtain a uniform solution, and acrylic acid is added to this solution. 35 g of the mixture was added dropwise under reflux stirring for 2 hours, followed by further refluxing stirring for 6 hours. Next, by removing toluene, 50 mol% of the epoxy group reacted with (meth) acrylic acid, partially acryl-modified phenol novolak. Type epoxy resin can be obtained (in this case 50% partially acrylated).

Examples of the commercially available partial (meth) acryl-modified epoxy resin include UVACURE 1561 (manufactured by Daicel Cytec).

Among the resins having an epoxy group, a resin having no (meth) acryloyloxy group as a reactive functional group and having only an epoxy group (hereinafter also referred to as a resin having only an epoxy group) is a cause of liquid crystal contamination. Therefore, it is preferable not to mix, but for the purpose of improving adhesiveness, it may be added within a range that does not affect liquid crystal contamination.
The content of the resin having only the epoxy group is preferably 10% by weight with respect to 100 parts by weight of the entire curable resin. When the content of the resin having only the epoxy group exceeds 10% by weight, the obtained light-shielding sealant for liquid crystal display elements may cause liquid crystal contamination.

When the resin having the (meth) acryloyloxy group and the resin having the epoxy group are blended as the curable resin, the ratio of the (meth) acryloyloxy group and the epoxy group of the curable resin is a molar ratio. It is preferable to blend a resin having a (meth) acryloyloxy group and a resin having an epoxy group so as to be 50:50 to 95: 5. If the ratio of the (meth) acryloyloxy group is less than 50%, a large amount of uncured epoxy resin component may be present even if radical polymerization by the radical polymerization initiator described later is completed, and the liquid crystal may be contaminated. When the ratio of the (meth) acryloyloxy group exceeds 95%, the effect of improving the adhesive strength may not be sufficiently obtained.

The light-shielding sealant of the present invention contains a radical polymerization initiator. The radical polymerization initiator is one that generates radicals by external stimulation such as ultraviolet irradiation or heating, and the light-shielding sealant for a liquid crystal display element of the present invention is a photo radical polymerization initiator that generates radicals by ultraviolet irradiation, and / or Alternatively, it contains a thermal radical polymerization initiator that generates radicals by heating.

The light-shielding sealant of the present invention preferably contains a thermal radical polymerization initiator. When the light-shielding sealant of the present invention contains the above thermal radical polymerization initiator, the liquid crystal display device to be manufactured can be reliably cured by heat even if there is a seal portion in a place where no light is irradiated by a black matrix or the like. Since it is possible, the occurrence of liquid crystal contamination is extremely low.

The above thermal radical polymerization initiator has a preferred lower limit of 10 hours half-life temperature of 50 ° C. and a preferred upper limit of 90 ° C. When the 10-hour half-life temperature of the thermal radical polymerization initiator is less than 50 ° C., the storage stability of the obtained light-shielding sealant for liquid crystal display elements may be deteriorated. When the 10-hour half-life temperature of the thermal radical polymerization initiator exceeds 90 ° C., it takes a long time to cure the light-shielding sealant for liquid crystal display elements of the present invention, which may affect panel productivity. is there.
In the present specification, the 10-hour half-life temperature refers to the concentration of the thermal radical polymerization initiator before the reaction when the thermal decomposition reaction is carried out at a constant temperature for 10 hours in the presence of an inert gas. It is the temperature at which it halves.

The thermal radical polymerization initiator is not particularly limited, and examples thereof include azo compounds and organic peroxides. Of these, a polymer azo initiator composed of a polymer azo compound is preferable.
In the present specification, the polymer azo initiator means a compound having an azo group and generating a radical capable of curing the curable resin with heat and having a molecular weight of 300 or more.
Moreover, since the said polymeric azo initiator decomposes | disassembles also by normal light irradiation and generate | occur | produces a radical, it can function also as a photoradical polymerization initiator.

The preferable lower limit of the number average molecular weight of the polymeric azo initiator is 1000, and the preferable upper limit is 300,000. When the number average molecular weight of the polymer azo initiator is less than 1000, the polymer azo initiator may adversely affect the liquid crystal. When the number average molecular weight of the polymeric azo initiator exceeds 300,000, mixing with the curable resin may be difficult. The more preferable lower limit of the number average molecular weight of the polymeric azo initiator is 5000, the more preferable upper limit is 100,000, the still more preferable lower limit is 10,000, and the still more preferable upper limit is 90,000.

Examples of the polymer azo initiator include those having a structure in which a plurality of units such as polydimethylsiloxane and polyalkylene oxide are bonded via an azo group.
As a structure in which a plurality of units such as polyalkylene oxide are bonded, those having a polyethylene oxide structure are preferable.
Examples of such a polymer azo initiator include polycondensates of 4,4′-azobis (4-cyanopentanoic acid) and polyalkylene glycol, and 4,4′-azobis (4-cyanopentanoic acid) and terminal. Examples thereof include polycondensates of polydimethylsiloxane having an amino group. Specifically, for example, VPE-0201, VPE-0401, VPE-0601, VPS-0501, VPS-1001 (all manufactured by Wako Pure Chemical Industries, Ltd.) ) And the like.

As the polymer azo initiator, a polymer azo compound represented by the following general formula (I) described in JP-A-2008-50572 and JP-A-2003-12784 is also preferably used. Can do.

In formula (I), R ¹² , R ¹³ , R ²² and R ²³ each independently represents an alkyl group having 1 to 10 carbon atoms or a cyano group, and a and b are each independently a number of 0 to 4 A ¹¹ and A ¹² are polymer chains, and Y ¹¹ and Y ¹² are each independently —CO—O—, —O—CO—, —NH—CO—, —CO—NH—, -O- or -S-.

In said general formula (I), as a C1-C10 alkyl group represented by R < ¹² >, R <^13> , R < ²² > and R < ²³ >, for example, methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, isobutyl, amyl, isoamyl, t-amyl, hexyl, cyclohexyl, cyclohexylmethyl, cyclohexylethyl, heptyl, isoheptyl, t-heptyl, n-octyl, isooctyl, t-octyl, 2-ethylhexyl, n-nonyl, n-decyl etc. are mentioned.

In the above general formula (I), the polymer chains represented by A ¹¹ and A ¹² are not particularly limited. For example, polyoxylene chain, polymethylene chain, polyether chain, polyester chain, polysiloxane chain, poly (meth) acrylate Examples thereof include a chain, a polystyrene-vinyl acetate chain, a polyamide chain, a polyimide chain, a polyurethane chain, a polyurea chain, and a polypeptide chain. Among ^{them, Y 11} is ^-O-CO-, preferably compounds ^{Y 12} is ^-CO-O-, the polymer chain represented by ^{A 11} and ^{A 12,} is a polyether chain and a polyester chain Those are more preferred because they are particularly inexpensive and easy to manufacture.

Among the above general formula (I), among the polymer azo compounds in which A ¹¹ and A ¹² are polyether chains, the compound represented by the following general formula (II) has good solubility and the molecular weight of the polymerization initiator. Since control is easy, it is more preferable.

In the formula (II), R ¹² , R ¹³ , R ²² , R ²³ , a and b are the same as those in the general formula (I), and R ¹¹ and R ²¹ each independently have 1 to 24 carbon atoms. Z ¹¹ , Z ¹² , Z ²¹ and Z ²² each independently represent an alkylene group having 1 to 4 carbon atoms, and m, n, s and t are each independently 0 to 1000. The sum of m + n and the sum of s + t are each independently 2 or more.

In the general formula (II), examples of the alkylene group having 1 to 4 carbon atoms represented by Z ¹¹ , Z ¹² , Z ²¹ and Z ²² include methylene, ethylene, trimethylene, propylene, propylidene, isopropylidene, tetra Examples include methylene, butylene, isobutylene, ethylethylene, dimethylethylene and the like.
Examples of the alkyl group having 1 to 24 carbon atoms represented by R ¹¹ and R ²¹ include methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, isobutyl, amyl, isoamyl, t- Examples include amyl, hexyl, cyclohexyl, cyclohexylmethyl, cyclohexylethyl, heptyl, isoheptyl, t-heptyl, n-octyl, isooctyl, t-octyl, 2-ethylhexyl, n-nonyl, n-decyl, lauryl, stearyl, behenyl, etc. It is done. The alkyl group having 1 to 24 carbon atoms represented by R ¹¹ and R ²¹ is preferably one having 1 to 4 carbon atoms because of high reactivity.

Among the polymer azo compounds represented by the general formula (I) in which A ¹¹ and A ¹² are polyester chains, the compound represented by the following general formula (III) has good solubility and excellent water resistance. Therefore, it is preferable.

In the formula (III), R ¹² , R ¹³ , R ²² , R ²³ , a and b are the same as those in the general formula (I), and Z ¹³ and Z ²³ each independently have 1 to 18 carbon atoms. R ³¹ and R ⁴¹ each independently represent a hydrogen atom or an alkyl group having 1 to 24 carbon atoms, and p and u are each independently a number from 1 to 1000.

In the general formula (III), examples of the alkylene group having 1 to 18 carbon atoms represented by Z ¹³ and Z ²³ include methylene, ethylene, trimethylene, propylene, propylidene, isopropylidene, tetramethylene, butylene, and isobutylene. , Ethylethylene, dimethylethylene, pentamethylene, hexamethylene, heptamethylene, octamethylene, 1,4-pentanediyl, decamethylene, undecamethylene, 1,4-undecandiyl, dodecane, 1,11-heptadecandiyl, octa Examples include decamethylene.
^The alkyl group having 1 to 24 carbon atoms represented by ^{R 31} and ^{R 41,} for example, those exemplified as ^{R 11} and ^{R 21} in the general formula (II). The alkyl group having 1 to 24 carbon atoms represented by R ³¹ and R ⁴¹ is preferably one having 1 to 4 carbon atoms because of high reactivity.

In the general formula (III), p and u are preferably 20 to 100 because of high reactivity.

The organic peroxide is not particularly limited, and examples thereof include ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, peroxy ester, diacyl peroxide, and peroxydicarbonate.

Although content of the said thermal radical polymerization initiator in the light-shielding sealing agent of this invention is not specifically limited, A preferable minimum is 0.1 weight part with respect to 100 weight part of said curable resins, and a preferable upper limit is 30 weight part. When the content of the thermal radical polymerization initiator is less than 0.1 part by weight, the obtained light shielding sealant may not sufficiently cure. When the content of the thermal radical polymerization initiator exceeds 30 parts by weight, the viscosity of the obtained light-shielding sealant for liquid crystal display elements is increased, which may adversely affect application workability. The minimum with more preferable content of the said thermal radical polymerization initiator is 0.5 weight part, and a more preferable upper limit is 10 weight part.

The light-shielding sealant of the present invention preferably contains a radical photopolymerization initiator. Since the light-shielding sealant of the present invention contains a titanium black material, the light-radical polymerization initiator contains the light-shielding property and the photo-curing property.

The radical photopolymerization initiator is preferably photosensitive when irradiated with light in a wavelength region of 370 to 450 nm as described above, but light having a wavelength of less than 370 nm or light having a wavelength of more than 450 nm. It may be one that can be exposed to light.

Such photo-radical polymerization initiator is not particularly limited, for example, IRGACURE127, IRGACURE184, IRGACURE369, IRGACURE379, IRGACURE651, IRGACURE784, IRGACURE819, IRGACURE907, IRGACURE1300, IRGACURE1700, IRGACURE1800, IRGACURE1870, IRGACURE2959, IRGACURE4265, IRGACUREOXE01, IRGACUREOXE02, CGI242, LUCIRIN TPO, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether (all manufactured by BASF Japan), ESACURE TPO (manufactured by Lamberti) , Speedure TPO, Speedcure TPO-L (all manufactured by LAMBSON), MICURE TPO (manufactured by MIWON), N-1414 (manufactured by ADEKA), Solvathlon BIPE, Solvathlon BIBE, biimidazole (manufactured by Kurogane Kasei), KAYACURE BP, KAYACURE DETX-S (all manufactured by Nippon Kayaku Co., Ltd.), ESACURE KIP 150 (manufactured by Lamberti), S-121 (manufactured by Shinko Giken Co., Ltd.), Seikol BEE (manufactured by Seiko Chemical Co., Ltd.), KR-02 (light chemical) Etc.).

Although content of the said radical photopolymerization initiator is not specifically limited, A preferable minimum is 0.1 weight part and a preferable upper limit is 10 weight part with respect to 100 weight part of said curable resins. If the content of the radical photopolymerization initiator is less than 0.1 parts by weight, the photopolymerization may not proceed sufficiently or the reaction may become too slow. When the content of the radical photopolymerization initiator exceeds 10 parts by weight, workability may be deteriorated or the reaction may become uneven. The minimum with more preferable content of radical photopolymerization initiator is 1 weight part, and a more preferable upper limit is 5 weight part.

When the said curable resin contains the resin which has the said epoxy group, it is preferable that the light-shielding sealing agent for liquid crystal display elements of this invention contains a thermosetting agent further.
The said thermosetting agent is not specifically limited, For example, organic acid hydrazide, an imidazole derivative, an amine compound, a polyhydric phenol type compound, an acid anhydride etc. are mentioned. Among these, organic acid hydrazide solid at room temperature is preferably used.
The room temperature solid organic acid hydrazide is not particularly limited, and examples thereof include sebacic acid dihydrazide, isophthalic acid dihydrazide, adipic acid dihydrazide, malonic acid dihydrazide, and the like. Manufactured), Amicure VDH, Amicure VDH-J, Amicure UDH (all manufactured by Ajinomoto Fine Techno Co.), ADH (manufactured by Otsuka Chemical Co., Ltd.) and the like.

Although content of the said thermosetting agent is not specifically limited, A preferable minimum is 1 weight part with respect to 100 weight part of said curable resin, and a preferable upper limit is 50 weight part. When the content of the thermosetting agent is less than 1 part by weight, the effect of containing the thermosetting agent is hardly obtained. When content of the said thermosetting agent exceeds 50 weight part, the viscosity of the light-shielding sealing agent obtained will become high, and applicability | paintability etc. may be impaired. The upper limit with more preferable content of the said thermosetting agent is 30 weight part.

The light-shielding sealant of the present invention preferably contains a filler for the purpose of improving the viscosity, improving the adhesiveness due to the stress dispersion effect, improving the linear expansion coefficient, and further improving the moisture resistance of the cured product.

The filler is not particularly limited. For example, talc, asbestos, silica, diatomaceous earth, smectite, bentonite, calcium carbonate, magnesium carbonate, alumina, montmorillonite, zinc oxide, iron oxide, magnesium oxide, tin oxide, titanium oxide, hydroxide Inorganic fillers such as magnesium, aluminum hydroxide, glass beads, silicon nitride, barium sulfate, gypsum, calcium silicate, sericite activated clay, aluminum nitride, polyester fine particles, polyurethane fine particles, vinyl polymer fine particles, acrylic polymer fine particles, etc. Of organic fillers.

The light shielding sealant of the present invention preferably contains a silane coupling agent. The silane coupling agent mainly has a role as an adhesion assistant for favorably bonding the sealing agent and the substrate.

Although the said silane coupling agent is not specifically limited, For example, (gamma) -aminopropyltrimethoxysilane, (gamma) -mercaptopropyltrimethoxysilane, (gamma) -glycidoxypropyl trimethoxysilane etc. are used suitably.

The light-shielding sealant of the present invention further comprises a reactive diluent for adjusting the viscosity, a thixotropic agent for adjusting thixotropy, a spacer such as polymer beads for adjusting the panel gap, if necessary, 3-P- It may contain a curing accelerator such as chlorophenyl-1,1-dimethylurea, an antifoaming agent, a leveling agent, a polymerization inhibitor, and other additives.

The method for producing the light-shielding sealant of the present invention is not particularly limited. For example, the curable resin, the radical polymerization initiator, the light-shielding agent, and additives that are blended as necessary are conventionally known. The method of mixing by a method is mentioned.

The optical density (OD value) of the cured product obtained by curing the light-shielding sealant of the present invention is preferably 2.0 or more when the thickness of the cured product is 2 to 7 μm. When the OD value of the cured body is less than 2.0, the light shielding property is insufficient, and light leakage occurs in the liquid crystal display element produced by the dropping method, and high contrast may not be obtained. The OD value of the cured body is more preferably 2.5 or more, and further preferably 3.0 or more. The higher the OD value of the cured body, the better. However, if too much light-shielding agent is blended in order to increase the OD value of the cured body, the workability may decrease due to the thickening of the sealing agent, or the drawability may decrease. Therefore, the preferable upper limit of the OD value of the cured body is 5 in order to balance the blending amount of the light shielding agent.

The light-shielding sealant of the present invention produces an adhesive test piece formed by bonding two glass substrates in a cross shape via the light-shielding sealant for liquid crystal display elements of the present invention, and the pressure tester test ( 121 ° C., 100% RH, 0.2 MPa) for 24 hours, the adhesive strength is preferably 30 kgf / cm ² or more. When the adhesive strength at the time of performing the pressure cooker test is less than 30 kgf / cm ² , the obtained liquid crystal display element may be inferior in reliability in a high temperature and high humidity environment.

A vertical conducting material can be produced by blending conductive fine particles with the light-shielding sealant for liquid crystal display elements of the present invention. The vertical conduction material containing the light-shielding sealant for liquid crystal display elements of the present invention and conductive fine particles is also one aspect of the present invention.

The conductive fine particles are not particularly limited, and metal balls, those obtained by forming a conductive metal layer on the surface of resin fine particles, and the like can be used. Among them, the one in which the conductive metal layer is formed on the surface of the resin fine particles is preferable because the conductive connection is possible without damaging the transparent substrate due to the excellent elasticity of the resin fine particles.

The liquid crystal display element manufactured using the light-shielding sealant for liquid crystal display elements of the present invention and / or the vertical conduction material of the present invention is also one aspect of the present invention.

As a method for producing the liquid crystal display element of the present invention, for example, the light-shielding sealant for the liquid crystal display element of the present invention is rectangularly formed on one of two transparent substrates with electrodes such as an ITO thin film by screen printing, dispenser application, or the like. A liquid crystal micro-droplet is applied to the entire surface of the transparent substrate with the light-shielding sealant for the liquid crystal display element of the present invention in an uncured state, and the other transparent substrate is immediately overlaid. And the step of irradiating the seal pattern portion such as the light-shielding sealant for the liquid crystal display element of the present invention with light such as ultraviolet rays to temporarily cure the sealant, and heating the temporarily cured sealant to Examples thereof include a method having a step of curing.

According to the present invention, it is possible to provide a light-shielding sealant for a liquid crystal display element that has excellent adhesion strength to a substrate even after being exposed to a high-temperature and high-humidity environment. Moreover, the vertical conduction material and liquid crystal display element which are manufactured using this light-shielding sealant for liquid crystal display elements can be provided.

In an Example and a comparative example, it is the figure which showed typically the procedure which produces a liquid crystal display element by a liquid crystal dropping system.

Hereinafter, embodiments of the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

(Synthesis of fully acrylic-modified epoxy resin)
120 g of resorcinol type epoxy resin (manufactured by Nagase ChemteX Corporation, “EX-201”) was dissolved in 500 mL of toluene, and 0.1 g of triphenylphosphine was added to the solution to obtain a uniform solution. To this solution, 70 g of acrylic acid was added dropwise over 2 hours with stirring under reflux, followed by further stirring under reflux for 8 hours. Next, by removing toluene, a completely acrylic modified resorcinol type epoxy resin (EX-201 modified product) in which all epoxy groups were modified to acrylic groups was obtained.

(Synthesis of partially acrylic-modified epoxy resin)
190 g of phenol novolac type epoxy resin (manufactured by DIC, “N-770”) is dissolved in 500 mL of toluene, 0.1 g of triphenylphosphine is added to obtain a uniform solution, and 35 g of acrylic acid is added to the resulting solution with stirring under reflux. Was added dropwise over 2 hours, followed by further stirring under reflux for 6 hours. Next, partially acrylic modified phenol novolac type epoxy resin (N-770 partially modified product) in which 50 mol% of the epoxy group was modified to acryloyloxy group by removing toluene was obtained.

(Examples 1-17 and Comparative Examples 1-9)
After blending each curable resin according to the blending ratio described in Tables 1 to 3, a thermal radical polymerization initiator and / or a photo radical polymerization initiator was blended. Next, after completely dissolving the thermal radical polymerization initiator and / or the photo radical polymerization initiator, the mixture was stirred using a planetary stirrer (“Shinky Co., Ltd.“ Awatori Netaro ”), and then a light shielding agent, a thermosetting agent, A filler and a silane coupling agent were blended and further stirred with a planetary stirrer. Then, the light-shielding sealant for liquid crystal display elements of an Example and a comparative example was prepared by disperse | distributing uniformly using 3 rolls.

FIG. 1 is a diagram schematically showing a procedure for manufacturing a liquid crystal display element by a liquid crystal dropping method in Examples and Comparative Examples. As shown in FIG. 1, the obtained light-shielding sealant for a liquid crystal display element was applied to a substrate on which a transparent electrode and an alignment film were formed with a dispenser so as to draw a square frame. Subsequently, a fine droplet of liquid crystal (“JC-5004LA” manufactured by Chisso Corporation) is dropped onto the entire surface of the transparent base frame, and a substrate on which another transparent electrode and an alignment film are formed is superposed in a vacuum, and vacuum is applied. After the release, the outer frame seal portion was irradiated with 100 mW / cm ² ultraviolet rays for 30 seconds using a high-pressure mercury lamp. Thereafter, liquid crystal annealing was performed at 120 ° C. for 1 hour, and the light-shielding sealant for liquid crystal display elements was thermally cured to obtain a liquid crystal display element.

<Evaluation>
The following evaluation was performed about the light-shielding sealing agent for liquid crystal display elements and liquid crystal display element which were obtained by the Example and the comparative example. The results are shown in Tables 1-3.

(Adhesive strength)
A very small amount of the obtained light-shielding sealant for a liquid crystal display element is placed on the center of a glass substrate (20 mm × 50 mm × 1.1 mmt), and a glass substrate of the same size is superimposed on the glass substrate so as to form a cross. The sealing agent for liquid crystal display elements was expanded. In this state, 100 mW / cm ² of ultraviolet rays were irradiated for 30 seconds, and then heated at 120 ° C. for 1 hour to obtain an initial adhesion test piece. In addition, a pressure cooker test (121 ° C., 100% RH, 0.2 MPa) was performed for 24 hours on the obtained initial adhesion test piece to obtain an adhesion test piece after high-temperature and high-humidity treatment. With respect to the obtained initial adhesion test piece and the adhesion test piece after the high temperature and high humidity treatment, the adhesive strength (kgf / cm ² ) was measured using a tension gauge.

(Optical density (OD value))
1 g of a silica spacer (Sekisui Chemical Co., Ltd., “Micropearl SI”) having a diameter of 5 μm was added as a spacer to 100 g of the obtained light-shielding sealant for a liquid crystal display device, and mixed and stirred.
Apply the obtained light-shielding sealant for spacer-equipped liquid crystal display elements onto a glass substrate of 20 mm x 20 mm, overlay a glass substrate of the same size on the substrate, apply a load, and crush it to the diameter of the spacer to make the thickness uniform I made it. Next, after irradiating 100 mW / cm ² of ultraviolet rays for 30 seconds using a metal halide lamp, heating was performed at 120 ° C. for 1 hour to obtain an optical test piece. About the obtained optical test piece, the optical density (OD value) was measured using X-rite360T ((nu)) (made by X-rite).

(Display performance of liquid crystal display elements (color unevenness))
About the obtained liquid crystal display element, the color nonuniformity which arose in the liquid crystal around the light-shielding sealant for liquid crystal display elements was observed visually. As a result, “◎” indicates that there is no color unevenness, “◯” indicates that there is almost no color unevenness, “△” indicates that there is slight color unevenness, and “×” indicates that there is considerable color unevenness. ".

As shown in Tables 1 and 2, the adhesive strength after the high-temperature and high-humidity test of the light-shielding sealant obtained in the examples was 30 kgf / cm ² or more, both of which had no practical problem at all. Further, the optical density (OD value) was very high at 3.0 or more, and it had a sufficient light shielding property. Regarding the color unevenness, there was no, almost none, or a slight degree, and there was no problem in practical use at all.

According to the present invention, it is possible to provide a light-shielding sealant for a liquid crystal display element that has excellent adhesion strength to a substrate even after being exposed to a high-temperature and high-humidity environment. Moreover, the vertical conduction material and liquid crystal display element which are manufactured using this light-shielding sealant for liquid crystal display elements can be provided.

Claims (6)

A curable resin containing a curable compound having an unsaturated double bond, a radical polymerization initiator, and a light shielding sealant for a liquid crystal dropping method containing a light shielding agent,
The curable resin has a hydrogen bond functional group value of 0.5 × 10 ^{−3 to} 3.0 × 10 ⁻³ mol / g,
A light-shielding sealant for liquid crystal display elements, comprising titanium black as the light-shielding agent. The light-shielding sealant for a liquid crystal display element according to claim 1, wherein the curable compound having an unsaturated double bond has a (meth) acryloyloxy group. 3. The light-shielding sealant for liquid crystal display elements according to claim 1, wherein the radical polymerization initiator contains a thermal radical polymerization initiator. 3. The liquid crystal display element according to claim 1, wherein the radical polymerization initiator contains a polymeric azo initiator and / or a photo radical polymerization initiator that is sensitive to light in a wavelength region of 370 to 450 nm. Light shielding sealant. 5. A vertical conduction material comprising the light-shielding sealant for liquid crystal display elements according to claim 1, 2, 3, or 4, and conductive fine particles. A liquid crystal display element manufactured using the light-shielding sealant for a liquid crystal display element according to claim 1, 2, 3, or 4, and / or the vertical conduction material according to claim 5.

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