JP5489447B2 - Photocurable resin composition having light-shielding property and adhesiveness and cured product thereof - Google Patents
Photocurable resin composition having light-shielding property and adhesiveness and cured product thereof Download PDFInfo
- Publication number
- JP5489447B2 JP5489447B2 JP2008302390A JP2008302390A JP5489447B2 JP 5489447 B2 JP5489447 B2 JP 5489447B2 JP 2008302390 A JP2008302390 A JP 2008302390A JP 2008302390 A JP2008302390 A JP 2008302390A JP 5489447 B2 JP5489447 B2 JP 5489447B2
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- JP
- Japan
- Prior art keywords
- component
- resin composition
- photocurable resin
- parts
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims description 93
- 229920005989 resin Polymers 0.000 claims description 51
- 239000011347 resin Substances 0.000 claims description 51
- 230000003287 optical effect Effects 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 239000000049 pigment Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 7
- 150000002148 esters Chemical class 0.000 claims description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 239000003208 petroleum Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 150000003505 terpenes Chemical class 0.000 claims description 4
- 235000007586 terpenes Nutrition 0.000 claims description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 description 20
- -1 acrylate compound Chemical class 0.000 description 18
- 239000004973 liquid crystal related substance Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 13
- 238000002834 transmittance Methods 0.000 description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 11
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 9
- 238000001723 curing Methods 0.000 description 9
- 239000003999 initiator Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000004925 Acrylic resin Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 239000012965 benzophenone Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 229920000515 polycarbonate Polymers 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- 229920005862 polyol Polymers 0.000 description 6
- 150000003077 polyols Chemical class 0.000 description 6
- 239000008096 xylene Substances 0.000 description 6
- 150000002484 inorganic compounds Chemical class 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 150000002894 organic compounds Chemical group 0.000 description 5
- 229920001692 polycarbonate urethane Polymers 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 238000007718 adhesive strength test Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 4
- 238000000016 photochemical curing Methods 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007719 peel strength test Methods 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229930194542 Keto Natural products 0.000 description 2
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000006230 acetylene black Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000005331 crown glasses (windows) Substances 0.000 description 2
- GVPWHKZIJBODOX-UHFFFAOYSA-N dibenzyl disulfide Chemical compound C=1C=CC=CC=1CSSCC1=CC=CC=C1 GVPWHKZIJBODOX-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
- 239000003273 ketjen black Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 238000001579 optical reflectometry Methods 0.000 description 2
- 239000012860 organic pigment Substances 0.000 description 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 2
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 2
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- UHUKCWCIQZILRP-UHFFFAOYSA-N (1-hydroxy-3-methylpentyl) prop-2-enoate Chemical compound CCC(C)CC(O)OC(=O)C=C UHUKCWCIQZILRP-UHFFFAOYSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- VMHYWKBKHMYRNF-UHFFFAOYSA-N (2-chlorophenyl)-phenylmethanone Chemical compound ClC1=CC=CC=C1C(=O)C1=CC=CC=C1 VMHYWKBKHMYRNF-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- ATIAIEWDRRJGSL-UHFFFAOYSA-N 1,3-bis(2-hydroxyethyl)-5,5-dimethylimidazolidine-2,4-dione Chemical compound CC1(C)N(CCO)C(=O)N(CCO)C1=O ATIAIEWDRRJGSL-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- UHLWGJNVYHBNBV-UHFFFAOYSA-N 1-(1-hydroxypropan-2-yloxy)-3-methoxypropan-2-ol;prop-2-enoic acid Chemical compound OC(=O)C=C.COCC(O)COC(C)CO UHLWGJNVYHBNBV-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- HUDYANRNMZDQGA-UHFFFAOYSA-N 1-[4-(dimethylamino)phenyl]ethanone Chemical compound CN(C)C1=CC=C(C(C)=O)C=C1 HUDYANRNMZDQGA-UHFFFAOYSA-N 0.000 description 1
- ONCICIKBSHQJTB-UHFFFAOYSA-N 1-[4-(dimethylamino)phenyl]propan-1-one Chemical compound CCC(=O)C1=CC=C(N(C)C)C=C1 ONCICIKBSHQJTB-UHFFFAOYSA-N 0.000 description 1
- OBNIRVVPHSLTEP-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(O)COCCO OBNIRVVPHSLTEP-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- PTJDGKYFJYEAOK-UHFFFAOYSA-N 2-butoxyethyl prop-2-enoate Chemical compound CCCCOCCOC(=O)C=C PTJDGKYFJYEAOK-UHFFFAOYSA-N 0.000 description 1
- FWWXYLGCHHIKNY-UHFFFAOYSA-N 2-ethoxyethyl prop-2-enoate Chemical compound CCOCCOC(=O)C=C FWWXYLGCHHIKNY-UHFFFAOYSA-N 0.000 description 1
- TZLVUWBGUNVFES-UHFFFAOYSA-N 2-ethyl-5-methylpyrazol-3-amine Chemical compound CCN1N=C(C)C=C1N TZLVUWBGUNVFES-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- IXPWKHNDQICVPZ-UHFFFAOYSA-N 2-methylhex-1-en-3-yne Chemical compound CCC#CC(C)=C IXPWKHNDQICVPZ-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 1
- RRXFVFZYPPCDAW-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-ylmethoxymethyl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1COCC1CC2OC2CC1 RRXFVFZYPPCDAW-UHFFFAOYSA-N 0.000 description 1
- HYYPKCMPDGCDHE-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1CC1CC2OC2CC1 HYYPKCMPDGCDHE-UHFFFAOYSA-N 0.000 description 1
- OEIZUSDQPOLYGQ-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-yloxy)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1OC1CCC2OC2C1 OEIZUSDQPOLYGQ-UHFFFAOYSA-N 0.000 description 1
- BGNGWHSBYQYVRX-UHFFFAOYSA-N 4-(dimethylamino)benzaldehyde Chemical compound CN(C)C1=CC=C(C=O)C=C1 BGNGWHSBYQYVRX-UHFFFAOYSA-N 0.000 description 1
- IMDQDSLAUVKLAO-UHFFFAOYSA-N 4-[2-(4-carboxy-7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]-7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound C1CC2OC2CC1(C(O)=O)CCC1(C(=O)O)CC2OC2CC1 IMDQDSLAUVKLAO-UHFFFAOYSA-N 0.000 description 1
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-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
Description
本発明は、硬化後に遮光性と粘着性を有する光硬化性樹脂組成物に関する。本発明の光硬化性樹脂組成物は、光学機器、特に液晶ディスプレイのシール剤として、液晶パネル等の光学材料部品の固定や、バックライトの光漏れ防止、外光の進入防止用に好適に用いられる。 The present invention relates to a photocurable resin composition having light shielding properties and adhesiveness after curing. The photocurable resin composition of the present invention is suitably used as a sealant for optical devices, particularly for liquid crystal displays, for fixing optical material components such as liquid crystal panels, for preventing light leakage from backlights, and for preventing external light from entering. It is done.
近年、液晶ディスプレイ等のディスプレイや光学レンズ、光ピックアップ、センサー等の電子光学機器の高性能化に伴い、高感度を実現・維持するために、部材や固定樹脂層を通過する外部からの透過光や内部からの漏れ光、隙間からの漏れ光による損失を低下させることが必要不可欠となっている。図1に、従来の液晶ディスプレイの模式図を示す。特に、固定樹脂層のように接着性又は粘着性・強度・耐久性・耐湿性等種々の特性が求められる部分では、同一の樹脂でこれらの特性と遮光を両立することが必要である。 In recent years, with the improvement in performance of electronic optical devices such as liquid crystal displays, optical lenses, optical pickups, and sensors, transmitted light from the outside that passes through members and fixed resin layers in order to achieve and maintain high sensitivity. It is indispensable to reduce the loss due to light leaked from the inside and light leaked from the gap. FIG. 1 shows a schematic diagram of a conventional liquid crystal display. In particular, in a portion where various properties such as adhesiveness, tackiness, strength, durability, and moisture resistance are required, such as a fixed resin layer, it is necessary to achieve both these properties and light shielding with the same resin.
上記の要求を達成するために、ベース樹脂の光硬化性樹脂の硬化物とそれに添加する化合物との間の屈折率差を利用することにより、光によって効果的に硬化し、そのため厚い膜厚の樹脂でも硬化が可能で、得られる硬化樹脂の光透過率が低い、光硬化性樹脂組成物が報告されている(特許文献1)。 In order to achieve the above requirements, by utilizing the refractive index difference between the cured product of the photo-curable resin of the base resin and the compound added to it, it is effectively cured by light, and thus has a thick film thickness. A photocurable resin composition that can be cured even with a resin and has a low light transmittance of the resulting cured resin has been reported (Patent Document 1).
また、現状では、未硬化の粘着性フィルムを枠状に打ち抜き加工して、ガラス基板に貼り合わせた後、フィルムを硬化させる方法が、一般的に使用されている。 At present, a method is generally used in which an uncured adhesive film is punched into a frame shape and bonded to a glass substrate, and then the film is cured.
光硬化性樹脂組成物を、液晶ディスプレイのシール剤等として使用する場合には、基板等の上に光硬化性樹脂組成物を枠状に形成した後、光硬化性樹脂を硬化させ、被着物(液晶パネル)を光硬化性樹脂組成物で接着する工程が実施される。ここで、特許文献1記載の光硬化性樹脂組成物を、液晶ディスプレイのシール剤等として使用するためには、光硬化性樹脂組成物に熱硬化性樹脂を配合させ、光硬化後の光硬化性樹脂組成物に接着性を付与させることが求められる。従って、光硬化の工程に加えて、熱硬化の工程が必要となり、この熱硬化の工程には、長時間を要する。また、液晶ディスプレイの部品には、約70℃で変形するものが含まれる場合があり、この場合には、光硬化性樹脂組成物の熱硬化工程で、液晶ディスプレイの部品が変形してしまう、という問題がある。
When the photocurable resin composition is used as a sealing agent for a liquid crystal display, the photocurable resin composition is formed in a frame shape on a substrate or the like, and then the photocurable resin is cured to adhere. A step of adhering the (liquid crystal panel) with the photocurable resin composition is performed. Here, in order to use the photocurable resin composition described in
また、枠状に加工した粘着性フィルムを用いる方法では、フィルムの打ち抜き幅は、約0.5mmが限界であり、高密度実装化に限界があること、また、打ち抜き後に使用しないフィルム部分が発生するため、材料歩留りが低い、という問題がある。 In addition, in the method using an adhesive film processed into a frame shape, the punching width of the film is limited to about 0.5 mm, and there is a limit to high-density mounting, and there is a film part that is not used after punching. Therefore, there is a problem that the material yield is low.
また、枠状に加工したフィルムを用いる方法では、加工後のフィルムのハンドリングに手間がかかる、さらに、フィルムの貼り合わせ工程は、機械化が困難であるため、現状では、人間が手作業でフィルムの貼り合わせを行っており、生産ラインの自動化が難しい、という課題がある。 In addition, in the method using a film processed into a frame shape, it takes time to handle the processed film. Further, since the film laminating process is difficult to mechanize, at present, human beings manually handle the film. There is a problem that it is difficult to automate the production line because they are pasted together.
本発明者らは、鋭意検討した結果、光硬化性樹脂組成物を、光硬化後に粘着性を有するものにすることにより、液晶ディスプレイのシール剤等として使用するときに、上記課題を達成できることを見出し、本発明を完成させた。 As a result of intensive studies, the present inventors have found that the above-mentioned problems can be achieved when the photocurable resin composition has adhesiveness after photocuring and is used as a sealing agent for liquid crystal displays. The headline and the present invention were completed.
すなわち、本発明の目的は、光によって効果的に硬化し、そのため厚い膜厚でも硬化が可能で、硬化後に、光透過率が低く、粘着性を有し、かつ強度・耐久性・耐湿性等の種々の特性にも優れる光硬化性樹脂組成物を提供することである。 That is, the object of the present invention is to cure effectively by light, so that even a thick film can be cured, and after curing, the light transmittance is low, the adhesiveness, and the strength, durability, moisture resistance, etc. It is providing the photocurable resin composition which is excellent also in these various characteristics.
第1の本発明は、
(A)光硬化性樹脂、(B)粘着性付与剤、(C)該(A)成分及び(B)成分の硬化物の屈折率との差が0.01以上となる屈折率を有し、該(A)成分及び(B)成分に対して非相溶性で分散性を有する化合物並びに(D)黒色顔料を含む光硬化性樹脂組成物に関する。
The first aspect of the present invention is
(A) Photocurable resin, (B) Tackifier, (C) Refractive index having a difference between the refractive index of the cured product of component (A) and component (B) is 0.01 or more The present invention relates to a photocurable resin composition comprising a compound that is incompatible and dispersible with the component (A) and the component (B), and (D) a black pigment.
第2の本発明は、(C)成分が、酸化アルミニウム粉末及び酸化チタン粉末からなる群より選択される、光硬化性樹脂組成物に関する。 2nd this invention relates to the photocurable resin composition in which (C) component is selected from the group which consists of an aluminum oxide powder and a titanium oxide powder.
第3の本発明は、(D)成分が、炭素粉末である、光硬化性樹脂組成物に関する。 3rd this invention relates to the photocurable resin composition whose (D) component is carbon powder.
第4の本発明は、(B)成分が、アクリル系、シリコーン系、マレイミド系、ロジンエステル系、テルペン系、ゴム系、又は芳香族水添石油系粘着付与剤である、光硬化性樹脂組成物に関する。 The fourth aspect of the present invention is a photocurable resin composition, wherein the component (B) is an acrylic, silicone, maleimide, rosin ester, terpene, rubber, or aromatic hydrogenated petroleum tackifier. Related to things.
第5の本発明は、(A)成分が、アクリル変性樹脂又はエポキシ樹脂である、光硬化性樹脂組成物に関する。 5th this invention relates to the photocurable resin composition whose (A) component is an acrylic modified resin or an epoxy resin.
第6の本発明は、(A)成分100重量部に対して、(B)成分が20〜170重量部、(C)成分が0.2〜80重量部及び(D)成分が0.1〜35重量部である、光硬化性樹脂組成物に関する。 In the sixth aspect of the present invention, the component (B) is 20 to 170 parts by weight, the component (C) is 0.2 to 80 parts by weight, and the component (D) is 0.1 parts per 100 parts by weight of the component (A). It is related with the photocurable resin composition which is -35 weight part.
第7の本発明は、さらに、光重合開始剤を含む、光硬化性樹脂組成物に関する。 The seventh invention further relates to a photocurable resin composition containing a photopolymerization initiator.
第8の本発明は、上記の光硬化性樹脂組成物の硬化物に関する。 The eighth aspect of the present invention relates to a cured product of the above-described photocurable resin composition.
第9の本発明は、上記の硬化物を含む、光学機器部材に関する。 The ninth aspect of the present invention relates to an optical device member including the above cured product.
第10の本発明は、上記の光学機器部材を含む、光学機器に関する。 A tenth aspect of the present invention relates to an optical apparatus including the above-described optical apparatus member.
本発明の電子光学機器部材の概念を図2に示す。 The concept of the electro-optical device member of the present invention is shown in FIG.
本発明の光硬化性樹脂組成物は、光で効率よく硬化するので厚膜硬化が可能であり、得られる硬化物は、内外からの光透過性が低く、すなわち遮光性が高く、粘着性に優れ、かつ強度・耐久性・耐湿性等の種々の特性にも優れている。また、光硬化性樹脂組成物は、印刷やディスペンス等ができるため、光硬化性樹脂組成物の使用率が高い上に、ファインラインの形成が容易で、さらに、生産ラインの自動化が可能であるので、生産性を大きく向上できる。 The photocurable resin composition of the present invention can be cured with a thick film because it is efficiently cured with light, and the resulting cured product has low light transmittance from the inside and outside, that is, has high light shielding properties and is adhesive. Excellent and various properties such as strength, durability and moisture resistance. In addition, since the photocurable resin composition can be printed, dispensed, etc., the usage rate of the photocurable resin composition is high, the fine line can be easily formed, and the production line can be automated. Therefore, productivity can be greatly improved.
これらのため、本発明の光硬化性樹脂組成物は、光学機器、特に液晶ディスプレイのシール剤として適している。 For these reasons, the photocurable resin composition of the present invention is suitable as a sealant for optical devices, particularly liquid crystal displays.
以下に、本発明を詳細に説明する。 The present invention is described in detail below.
本発明の光硬化性樹脂組成物は、(A)光硬化性樹脂、(B)粘着性付与剤、(C)該(A)成分及び(B)成分の硬化物の屈折率との差が0.01以上となる屈折率を有し、該(A)成分及び(B)成分に対して非相溶性で分散性を有する化合物並びに(D)黒色顔料を含むことを特徴とする。本発明においては、(C)成分と(D)成分を組み合わせることで、(C)成分の光反射性を利用して厚膜硬化と遮光、(D)成分による光吸収で遮光を実現している点が特徴である。 The photocurable resin composition of the present invention has a difference between (A) a photocurable resin, (B) a tackifier, (C) the refractive index of the cured product of the component (A) and the component (B). It contains a compound having a refractive index of 0.01 or more, incompatible with (A) component and (B) component and dispersibility, and (D) black pigment. In the present invention, by combining the (C) component and the (D) component, the light reflectivity of the (C) component is utilized to realize thick film curing and light shielding, and light shielding by the light absorption by the (D) component is realized. This is a feature.
本発明における(A)成分は、(B)成分とともにいわゆるベース樹脂を形成し、光硬化性樹脂組成物を硬化した硬化物においても連続相を形成し得る。 (A) component in this invention forms what is called a base resin with (B) component, and can also form a continuous phase also in the hardened | cured material which hardened | cured the photocurable resin composition.
本発明における光硬化性樹脂は、可視光、紫外線等の光によって硬化する樹脂であれば特に限定されず、例えば、(メタ)アクリル樹脂、ウレタンアクリレート樹脂及びポリエステルアクリレート樹脂等のアクリル変性樹脂;エポキシ樹脂;オキセタン樹脂が挙げられる。光硬化性樹脂としては、好ましくは、アクリル変性樹脂及びエポキシ樹脂が挙げられる。 The photocurable resin in the present invention is not particularly limited as long as it is a resin that is cured by light such as visible light and ultraviolet light. For example, acrylic modified resins such as (meth) acrylic resin, urethane acrylate resin, and polyester acrylate resin; epoxy Resin; Oxetane resin is mentioned. As a photocurable resin, Preferably, an acrylic modified resin and an epoxy resin are mentioned.
アクリル変性樹脂は、アクリロイル基もしくはメタクリロイル基を有する単官能性および多官能性の(メタ)アクリレート化合物と定義され、例えば、メチルアクリレート、エチルアクリレート、n−プロピルアクリレート、n−ブチルアクリレート、t−ブチルアクリレート、イソブチルアクリレート、エチルヘキシルアクリレート、イソデシルアクリレート、n−ヘキシルアクリレート、ステアリルアクリレート、ラウリルアクリレート、トリデシルアクリレート、エトキシエチルアクリレート、メトキシエチルアクリレート、グリシジルアクリレート、ブトキシエチルアクリレート、2−ヒドロキシエチルアクリレート、2−ヒドロキシプロピルアクリレート、2−メトキシエチルアクリレート、2−エトキシエトキシエチルアクリレート、メトキシジエチレングリコールアクリレート、エトキシジエチレングリコールアクリレート、メトキシジプロピレングリコールアクリレート、オクタフルオロペンチルアクリレート、N,N−ジメチルアミノエチルアクリレート、N,N−ジエチルアミノエチルアクリレート、アリルアクリレート、1,3−ブタンジオールアクリレート、1,4−ブタンジオールアクリレート、アクリロイルモルフォリン、1,6−ヘキサンジオールアクリレート、ポリエチレングリコールジアクリレート、ジエチレングリコールジアクリレート、ネオペンチルグリコールジアクリレート、トリエチレングリコールジアクリレート、トリプロピレングリコールジアクリレート、ヒドロキシピバリン酸エステル、ネオペンチルグリコールジアクリレート、トリメチロールプロパンジアクリレート、1,3−ビス(ヒドロキシエチル)−5、5−ジメチルヒダントイン、3−メチルペンタンジオールアクリレート、α,ω−ジアクリルビスジエチレングリコールフタレート、トリメチロールプロパントリアクリレート、ペンタエリトリットアクリレート、ペンタエリトリットヘキサアクリレート、ジペンタエリトリットモノヒドロキシペンタアクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、トリヒドロキシエチルイソシアヌレートのトリ(メタ)アクリレート、ジペンタエリスリトールヘキサアクリレート、及びこれらのEO及び/又はPO付加物、α,ω−テトラアリルビストリメチロールプロパンテトラヒドロフタレート、2−ヒドロキシエチルアクリロイルフォスフェート、トリメチロールプロパントリメタクリレート、エチレングリコールジ(メタ)アクリレート、テトラエチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、1,4−ブタンジオールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、ネオペンチルグリコールジメタクリレート、ジアクリロキシエチルフォスフェート、N−ビニルピロリドン及びこれらの光反応性官能基を有するオリゴマーが例示できる。オリゴマーとしては、ポリエーテル骨格、ポリカーボネート骨格又はポリエステル骨格を有する(メタ)アクリレート化合物が挙げられる。市販されている製品としては、根上工業株式会社製のポリカーボネート系アクリレート(製品名:UN5500)、ポリエステル系アクリレート(製品名:UN7700)、日本合成化学工業株式会社製のポリエーテル系アクリレート(製品名:UV3700B)等が挙げられる。上記のアクリル変性樹脂のうち、(A)成分として特に好ましいのは、ポリカーボネート系アクリレートである。 The acrylic-modified resin is defined as a monofunctional and polyfunctional (meth) acrylate compound having an acryloyl group or a methacryloyl group. For example, methyl acrylate, ethyl acrylate, n-propyl acrylate, n-butyl acrylate, t-butyl Acrylate, isobutyl acrylate, ethyl hexyl acrylate, isodecyl acrylate, n-hexyl acrylate, stearyl acrylate, lauryl acrylate, tridecyl acrylate, ethoxyethyl acrylate, methoxyethyl acrylate, glycidyl acrylate, butoxyethyl acrylate, 2-hydroxyethyl acrylate, 2- Hydroxypropyl acrylate, 2-methoxyethyl acrylate, 2-ethoxyethoxyethyl acrylate Methoxydiethylene glycol acrylate, ethoxydiethylene glycol acrylate, methoxydipropylene glycol acrylate, octafluoropentyl acrylate, N, N-dimethylaminoethyl acrylate, N, N-diethylaminoethyl acrylate, allyl acrylate, 1,3-butanediol acrylate, 1 , 4-butanediol acrylate, acryloyl morpholine, 1,6-hexanediol acrylate, polyethylene glycol diacrylate, diethylene glycol diacrylate, neopentyl glycol diacrylate, triethylene glycol diacrylate, tripropylene glycol diacrylate, hydroxypivalate ester Neopentyl glycol diacrylate Trimethylolpropane diacrylate, 1,3-bis (hydroxyethyl) -5,5-dimethylhydantoin, 3-methylpentanediol acrylate, α, ω-diacrylbisdiethylene glycol phthalate, trimethylolpropane triacrylate, pentaerythritol acrylate Pentaerythritol hexaacrylate, dipentaerythritol monohydroxypentaacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, tri (meth) acrylate of trihydroxyethyl isocyanurate, dipentaerythritol hexaacrylate, and their EO and / or Or PO adduct, α, ω-tetraallylbistrimethylolpropane tetrahydrophthalate, 2-hydroxy ester Ruacryloyl phosphate, trimethylolpropane trimethacrylate, ethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1, Examples thereof include 6-hexanediol di (meth) acrylate, neopentylglycol dimethacrylate, diacryloxyethyl phosphate, N-vinylpyrrolidone and oligomers having these photoreactive functional groups. Examples of the oligomer include (meth) acrylate compounds having a polyether skeleton, a polycarbonate skeleton, or a polyester skeleton. Commercially available products include polycarbonate acrylate (product name: UN5500) manufactured by Negami Kogyo Co., Ltd., polyester acrylate (product name: UN7700), and polyether acrylate (product name: Nippon Synthetic Chemical Industry Co., Ltd.). UV3700B) and the like. Of the above acrylic-modified resins, polycarbonate acrylate is particularly preferable as the component (A).
エポキシ樹脂は、エポキシ基を1個以上有する分子構造を有する化合物と定義され、例えば、ビフェノール、ビスフェノールA、水添ビスフェノールA、ビスフェノールF、ビスフェノールAD、ビスフェノールS、テトラメチルビスフェノールA、テトラメチルビスフェノールF、テトラクロロビスフェノールA、テトラブロモビスフェノールA等のビスフェノール類のジグリシジルエーテル類、フェノールノボラック、クレゾールノボラック、ブロム化フェノールノボラック、オルトクレゾールノボラック等のノボラック樹脂のポリグリシジルエーテル類、エチレングリコール、ポリエチレングリコール、ポリプロピレングリコール、ブタンジオール、1,6−ヘキサンジオール、ネオペンチルグリコール、トリメチロールプロパン、1,4−シクロヘキサンジメタノール、ビスフェノールAのエチレンオキサイド付加物、ビスフェノールAのプロピレンオキサイド付加物等のアルキレングリコール類のジグリシジルエーテル類、ヘキサヒドロフタル酸のグリシジルエステルやダイマー酸のジグリシジルエステル等のグリシジルエステル類、3,4−エポキシシクロヘキシルメチル−3’,4’−エポキシシクロヘキサンカルボキシレート、3,4−エポキシシクロヘキシルエチル−3’,4’−エポキシシクロヘキサンカルボキシレート、3,4−エポキシ−6−メチルシクロヘキシル−3’,4’−エポキシ−6’−メチルシクロヘキサンカルボキシレート、ビニルシクロヘキセンジオキサイド、3,4−エポキシ−4−メチルシクロヘキシル−2−プロピレンオキサイド、2−(3,4−エポキシシクロヘキシル−5,5−スピロ−3,4−エポキシ)シクロヘキサン−m−ジオキサン、ビス(3,4−エポキシシクロヘキシル)アジペート、ビス(3,4−エポキシシクロヘキシルメチル)アジペート、ラクトン変性3,4−エポキシシクロヘキシルメチル−3’,4’−エポキシシクロヘキサンカルボキシレート、メチレンビス(3,4−エポキシシクロヘキサン)、エチレンビス(3,4−エポキシシクロヘキサンカルボキシレート)、ジシクロペンタジエンジエポキシド、ビス(3,4−エポキシシクロヘキシル)エーテル、ビス(3,4−エポキシシクロヘキシルメチル)エーテル、テトラ(3,4−エポキシシクロヘキシルメチル)ブタンテトラカルボキシレート、ビス(3,4−エポキシシクロヘキシルメチル)−4,5−エポキシテトラヒドロフタレート、ビス(3,4−エポキシシクロヘキシル)ジエチルシロキサン等の脂環式エポキシ化合物及びこれらの光反応性官能基を有するオリゴマーが例示できる。上記のエポキシ樹脂のうち、(A)成分として特に好ましいのは、ビスフェノールAである。エポキシ樹脂は、アクリル変性樹脂と併用が可能である。
The epoxy resin is defined as a compound having a molecular structure having one or more epoxy groups, for example, biphenol, bisphenol A, hydrogenated bisphenol A, bisphenol F, bisphenol AD, bisphenol S, tetramethylbisphenol A, tetramethylbisphenol F. Diglycidyl ethers of bisphenols such as tetrachlorobisphenol A and tetrabromobisphenol A, polyglycidyl ethers of novolac resins such as phenol novolak, cresol novolak, brominated phenol novolak, orthocresol novolak, ethylene glycol, polyethylene glycol, Polypropylene glycol, butanediol, 1,6-hexanediol, neopentyl glycol, trimethylolpropane, 1 Diglycidyl ethers of alkylene glycols such as 4-cyclohexanedimethanol, ethylene oxide adduct of bisphenol A, propylene oxide adduct of bisphenol A, glycidyl esters such as glycidyl ester of hexahydrophthalic acid and diglycidyl ester of
本発明における(A)成分は、硬化後の屈折率により特に限定されるものではなく、任意の屈折率を有する硬化物を与える光硬化性樹脂が使用可能である。本発明において、(A)成分は、上記の樹脂から、使用する部位において求められる性能を考慮して1種又は2種以上の混合物として選択される。 (A) component in this invention is not specifically limited by the refractive index after hardening, The photocurable resin which gives the hardened | cured material which has arbitrary refractive indexes can be used. In the present invention, the component (A) is selected from the above resins as one or a mixture of two or more in consideration of the performance required at the site to be used.
本発明における(B)成分は、(A)成分とともにベース樹脂を形成する。(B)成分は、粘着性付与剤であり、硬化後の光硬化性樹脂組成物に粘着性を付与する。(B)成分としては、アクリル系、シリコーン系、マレイミド系、ロジンエステル系、テルペン系、ゴム系、芳香族石油系などの粘着性付与剤が挙げられ、耐熱性、相溶性の観点から、アクリル系、ロジンエステル系、テルペン系、芳香族水添石油系が好ましい。市販されている製品としては、式(1): The component (B) in the present invention forms a base resin together with the component (A). Component (B) is a tackifier and imparts tackiness to the cured photocurable resin composition. Examples of the component (B) include tackifiers such as acrylic, silicone, maleimide, rosin ester, terpene, rubber and aromatic petroleum. From the viewpoint of heat resistance and compatibility, acrylic Type, rosin ester type, terpene type and aromatic hydrogenated petroleum type are preferred. Commercially available products include formula (1):
で表されるフドー株式会社製ポリオールタイプキシレン樹脂(変性品)(K140)等が挙げられる。 A polyol type xylene resin (modified product) (K140) manufactured by Fudo Co., Ltd.
本発明の光硬化性樹脂組成物は、(B)成分の1つ又はこれらの2以上の組み合わせを含み得る。 The photocurable resin composition of the present invention may contain one of the components (B) or a combination of two or more thereof.
(A)成分及び(B)成分の硬化物の屈折率は、(A)成分及び(B)成分の混合物を硬化し、その混合物についてアッベ屈折計(アタゴ株式会社製)を使用しD線により測定する。 The refractive index of the cured product of the component (A) and the component (B) is obtained by curing a mixture of the component (A) and the component (B), and using the Abbe refractometer (manufactured by Atago Co., Ltd.) for the mixture by the D line. taking measurement.
本発明における(C)成分は、(A)成分及び(B)成分の硬化物の屈折率との差が0.01以上となる屈折率を有し、(A)成分及び(B)成分に対して非相溶性で分散性を有する化合物であり、(A)成分及び(B)成分の硬化物の屈折率、及び(A)成分及び(B)成分に対する非相溶性、分散性によって選択される。(C)成分は、(A)成分及び(B)成分の硬化物の屈折率よりも0.01以上大きい屈折率を有する化合物(高屈折率化合物)並びに(A)成分及び(B)成分の硬化物の屈折率よりも0.01以上小さい屈折率を有する化合物(低屈折率化合物)に大別される。(C)成分は、有機化合物又は無機化合物である。 The component (C) in the present invention has a refractive index such that the difference between the refractive index of the cured product of the component (A) and the component (B) is 0.01 or more, and the component (A) and the component (B) It is a compound that is incompatible and dispersible with respect to the refractive index of the cured product of component (A) and component (B), and incompatibility and dispersibility with respect to component (A) and component (B). The The component (C) is composed of a compound (high refractive index compound) having a refractive index larger by 0.01 or more than the refractive index of the cured product of the components (A) and (B), and the components (A) and (B). It is roughly classified into compounds having a refractive index smaller than the refractive index of the cured product by 0.01 or more (low refractive index compounds). (C) A component is an organic compound or an inorganic compound.
本発明で使用できる(A)成分及び(B)成分の硬化物(ベース樹脂ともいう)と屈折率が0.01以上異なる(C)成分としての無機化合物には、例えばZnO、TiO2(酸化チタン)、CeO2、Sb2 O5、SnO2 、ITO、Y2 O3、La2 O3、ZrO2、Al2 O3(酸化アルミニウム)、シリカ、オパール、ガラス、ホワイトカーボンが包含され、好ましくは、屈折率が1.60以上のAl2 O3、TiO2、ZrO2が挙げられる。市販されている製品としては、株式会社アドマテックス製アルミナフィラー(製品名:AO−902H)等が挙げられる。ここで、Al2 O3、TiO2は、光反射性に優れるので、特に好ましい。無機化合物は、その表面を種々の無機・有機化合物によって被覆されていてもよい。また、無機化合物の形状は、球状、針状、板状等の任意の形状であってよく、その粒子径も限定されないが、粒子径が小さいほうがより好ましい。粒子径は、好ましくは0.1〜100μm、より好ましくは0.1〜10μm、特に0.1〜1μmである。
Examples of the inorganic compound as the component (C) having a refractive index different by 0.01 or more from the cured product (also referred to as base resin) of the component (A) and the component (B) that can be used in the present invention include ZnO, TiO 2 (oxidation). titanium), CeO 2, Sb 2 O 5,
本発明で使用できるベース樹脂と屈折率が0.01以上異なる(C)成分としての有機化合物は、液状又は固体のモノマー、オリゴマー又はポリマー化合物のいずれであってもよく、また、熱可塑性樹脂、熱硬化性樹脂、光硬化性樹脂のいずれであっても問題はないが、ベース樹脂である光硬化性樹脂に対して、非相溶性でありかつ分散性が良好なものでなければならない。例えば、(メタ)アクリル樹脂、ウレタンアクリレート樹脂、ポリエステルアクリレート樹脂、エポキシ樹脂、オキセタン樹脂、ポリスチレン等のスチロール系樹脂、ポリエチレンテレフタレート、ポリビニルカルバゾール、ビスフェノールAのポリカーボネート、ポリ塩化ビニル、ポリテトラブロモビスフェノールAグリシジルエーテル、ポリビスフェノールSグリシジルエーテル、ポリビニルピリジン、チオウレタン樹脂、チオエポキシ樹脂、フッ素含有(メタ)アクリレート類、フッ化アルキレンエーテル・オリゴマー類(平均分子量:4000以下)の一官能および二官能以上の多官能(メタ)アクリレート類、シリコン含有(メタ)アクリレート類、ポリエチレンやポリテトラフルオロエチレンといった結晶性高分子が包含される。また、有機化合物が固形である場合、その形状は、球状、針状、板状等の任意の形状であってよく、その粒子径も限定されないが、粒子径が小さいほうが好ましい。その粒子径は、好ましくは0.1〜100μm、より好ましくは0.1〜10μm、特に0.1〜1μmである。有機化合物が液状である場合、該化合物は、光硬化性樹脂に分散させる。分散粒子の粒子径は、好ましくは0.1〜100μm、より好ましくは0.1〜10μm、特に0.1〜1μmである。 The organic compound as the component (C) having a refractive index different by 0.01 or more from the base resin that can be used in the present invention may be a liquid or solid monomer, oligomer, or polymer compound, and may be a thermoplastic resin, There is no problem whether it is a thermosetting resin or a photocurable resin, but it must be incompatible with the photocurable resin that is the base resin and has good dispersibility. For example, (meth) acrylic resin, urethane acrylate resin, polyester acrylate resin, epoxy resin, oxetane resin, polystyrene resin such as polystyrene, polyethylene terephthalate, polyvinyl carbazole, polycarbonate of bisphenol A, polyvinyl chloride, polytetrabromobisphenol A glycidyl Ether, polybisphenol S glycidyl ether, polyvinyl pyridine, thiourethane resin, thioepoxy resin, fluorine-containing (meth) acrylates, fluorinated alkylene ether oligomers (average molecular weight: 4000 or less) monofunctional and bifunctional or more polyfunctional Crystalline polymers such as (meth) acrylates, silicon-containing (meth) acrylates, polyethylene and polytetrafluoroethylene are included.When the organic compound is solid, the shape thereof may be any shape such as a spherical shape, a needle shape, or a plate shape, and the particle size is not limited, but a smaller particle size is preferable. The particle diameter is preferably 0.1 to 100 μm, more preferably 0.1 to 10 μm, and particularly 0.1 to 1 μm. When the organic compound is in a liquid state, the compound is dispersed in a photocurable resin. The particle diameter of the dispersed particles is preferably 0.1 to 100 μm, more preferably 0.1 to 10 μm, and particularly 0.1 to 1 μm.
本発明において(C)成分として使用し得る化合物の幾つかについて、その屈折率を以下に例示する。
ZnO(屈折率1.90)、TiO2 (屈折率2.3〜2.7)、CeO2 (屈折率1.95)、Sb2 O5 (屈折率1.71)、SnO2 、ITO(屈折率1.95)、Y2 O3 (屈折率1.87)、La2 O3 (屈折率1.95)、ZrO2 (屈折率2.05)、Al2 O3 (屈折率1.6〜1.8)、メラミン樹脂(1.6)、ナイロン(1.53)、ポリスチレン(1.6)、ポリエチレン(1.53)、ポリテトラフルオロエチレン(1.35)、メタクリル酸メチル樹脂(1.49)、塩化ビニル樹脂(1.54)、シリコーン油(1.4)。
The refractive index of some of the compounds that can be used as the component (C) in the present invention is exemplified below.
ZnO (refractive index 1.90), TiO 2 (refractive index 2.3 to 2.7), CeO 2 (refractive index 1.95), Sb 2 O 5 (refractive index 1.71), SnO 2 , ITO ( Refractive index 1.95), Y 2 O 3 (refractive index 1.87), La 2 O 3 (refractive index 1.95), ZrO 2 (refractive index 2.05), Al 2 O 3 (
本発明において、(C)成分の屈折率と(A)成分及び(B)成分の硬化物の屈折率の差は、好ましくは0.05以上、より好ましくは0.1以上、特に好ましくは0.15以上である。 In the present invention, the difference between the refractive index of the component (C) and the refractive index of the cured product of the components (A) and (B) is preferably 0.05 or more, more preferably 0.1 or more, particularly preferably 0. .15 or more.
本発明の光硬化性樹脂組成物は、(C)成分として、有機及び無機の高屈折率化合物並びに有機及び無機の低屈折率化合物の1つ又はこれらの2以上の組み合わせを含み得る。 The photocurable resin composition of the present invention may contain one or a combination of two or more of organic and inorganic high refractive index compounds and organic and inorganic low refractive index compounds as the component (C).
(A)成分及び(B)成分に対して「非相溶性」であるとは、(C)成分が(A)成分及び(B)成分の混合物と均一に混和しないことを意味し、(A)成分及び(B)成分に対して「分散性」であるとは、(C)成分と(A)成分及び(B)成分の混合物とが撹拌直後に二層に分離しないこと意味する。 "Incompatible" with the component (A) and the component (B) means that the component (C) is not uniformly mixed with the mixture of the component (A) and the component (B). "Dispersible" with respect to the component (B) and the component (B) means that the component (C) and the mixture of the component (A) and the component (B) do not separate into two layers immediately after stirring.
本発明における(D)成分は、黒色顔料であり、光硬化性樹脂組成物に遮光性を付与する。(D)成分は、光硬化性樹脂組成物の加工性を維持するために、少量の添加で遮光性を付与するものが好ましい。(D)としては、無機又は有機顔料が挙げられる。無機顔料としては、炭素粉末、アイボリーブラック、マルスブラック、ピーチブラック、ランプブラック、銅、鉄、クロム、マンガン、コバルトなどを含有した無機系ブラック、チタンブラックなどが挙げられる。炭素粉末であることが好ましく、カーボンブラック、アセチレンブラック、ケッチェンブラック、カーボンナノチューブ、天然黒鉛粉末、人造黒鉛粉末等がより好ましく、少量の添加で硬化後の光硬化性樹脂組成物に遮光性を付与する観点から、カーボンブラック、アセチレンブラック、ケッチェンブラックが特に好ましい。有機顔料としては、アニリンブラック、ペリレンブラックが上げられ、ペリレンブラックが好ましい。市販されている製品としては、日弘ビックス株式会社製黒色顔料(製品名:NBD−0744)等が挙げられる。 (D) component in this invention is a black pigment, and provides light-shielding property to a photocurable resin composition. In order to maintain the workability of the photocurable resin composition, the component (D) is preferably one that imparts light-shielding properties with a small amount of addition. (D) includes inorganic or organic pigments. Examples of the inorganic pigment include carbon powder, ivory black, mars black, peach black, lamp black, inorganic black containing titanium, copper, iron, chromium, manganese, cobalt, and the like. It is preferably a carbon powder, more preferably carbon black, acetylene black, ketjen black, carbon nanotube, natural graphite powder, artificial graphite powder, and the like. From the viewpoint of imparting, carbon black, acetylene black, and ketjen black are particularly preferable. Examples of the organic pigment include aniline black and perylene black, and perylene black is preferable. Examples of commercially available products include black pigments (product name: NBD-0744) manufactured by Nihongo Bix Corporation .
本発明の光硬化性樹脂組成物は、(D)成分の1つ又はこれらの2以上の組み合わせを含み得る。 The photocurable resin composition of the present invention may contain one of the components (D) or a combination of two or more thereof.
本発明の光硬化性樹脂組成物は、(A)成分100重量部に対して、(B)成分が20〜170重量部、(C)成分が0.2〜80重量部並びに(D)成分が0.1〜35重量部であり得る。 In the photocurable resin composition of the present invention, the component (B) is 20 to 170 parts by weight, the component (C) is 0.2 to 80 parts by weight and the component (D) with respect to 100 parts by weight of the component (A). May be 0.1 to 35 parts by weight.
本発明の光硬化性樹脂組成物において、(B)成分は、(A)成分100重量部に対して、30〜150重量部が好ましく、50〜120重量部がより好ましい。 In the photocurable resin composition of the present invention, the component (B) is preferably 30 to 150 parts by weight and more preferably 50 to 120 parts by weight with respect to 100 parts by weight of the component (A).
本発明の光硬化性樹脂組成物において、(C)成分は、(A)成分100重量部に対して、1〜50重量部が好ましく、5〜40重量部がより好ましく、8〜30重量部が特に好ましい。 In the photocurable resin composition of the present invention, the component (C) is preferably 1 to 50 parts by weight, more preferably 5 to 40 parts by weight, and 8 to 30 parts by weight with respect to 100 parts by weight of the component (A). Is particularly preferred.
本発明の光硬化性樹脂組成物において、(D)成分は、(A)成分100重量部に対して、0.1〜20重量部が好ましく、0.1〜10重量部がより好ましく、0.14〜0.7重量部が特に好ましい。 In the photocurable resin composition of the present invention, the component (D) is preferably 0.1 to 20 parts by weight, more preferably 0.1 to 10 parts by weight, based on 100 parts by weight of the component (A). .14 to 0.7 parts by weight is particularly preferred.
本発明の光硬化性樹脂組成物は、印刷性、ディスペンス性の観点から、5,000〜200,000mPa・sの粘度が好ましく、10,000〜80,000mPa・sの粘度がさらに好ましい。ここで、光硬化性樹脂組成物の粘度は、東機産業製 RE-10U型粘度計を用い、コーンプレート型ローターで、室温の条件で測定する。 The photocurable resin composition of the present invention preferably has a viscosity of 5,000 to 200,000 mPa · s, and more preferably 10,000 to 80,000 mPa · s, from the viewpoints of printability and dispenseability. Here, the viscosity of the photocurable resin composition is measured using a RE-10U viscometer manufactured by Toki Sangyo Co., Ltd. under a room temperature condition with a cone plate rotor.
本発明の光硬化性樹脂組成物は、さらに、光重合開始剤を含み得る。光重合開始剤として、一般的に市販されているラジカルもしくはカチオン系開始剤が包含され、例えば、カルボニル基系:ベンゾフェノン、ジアセチル、ベンジル、ベンゾイン、ω−ブロモアセトフェノン、クロロアセトン、アセトフェノン、2,2−ジエトキシアセトフェノン、2,2−ジメトキシ−2−フェニルアセトン、p−ジメチルアミノアセトフェノン、p−ジメチルアミノプロピオフェノン、2−クロロベンゾフェノン、p,p’−ビスジエチルアミノベンゾフェノン、ミヒラーケトン、ベンゾインメチルエーテル、ベンゾインイソブチルエーテル、ベンゾイン−n−ブチルエーテル、ベンジルジメチルケタール、1−ヒドロキシシクロヘキシルフェニルケトン、2−ヒドロキシ−2−メチル−1−オン、1−(4−イソプロピルフェニル)−2−ヒドロキシ−2−メチルプロパン−1−オン、メチルベンゾイルホルメート、2,2−ジエトキシアセトフェノン、4−N,N’−ジメチルアセトフェノン類;スルフィド系:ジフェニルジスルフィド、ジベンジルジスルフィド;キノン系:ベンゾキノン、アントラキノン;アゾ系:アゾビスイソブチロニトリル、2,2’−アゾビスプロパンを例示できる。市販されている製品としては、チバジャパン株式会社製1−ヒドロキシシクロヘキシルフェニルケトン(製品名:IRGACURE 184)、1−ヒドロキシシクロヘキシルフェニルケトン50部とベンゾフェノン50部の共融混合物(製品名:IRGACURE 500)等が挙げられる。光重合開始剤は、一般的に使用される量、例えば、(A)成分の光硬化性樹脂100重量部に対して1〜10重量部の量で使用することができる。照射光は可視光線、紫外線、放射線、電子線のいずれであってもよいが、硬化後の粘着性の観点から紫外線が好ましい。 The photocurable resin composition of the present invention may further contain a photopolymerization initiator. Examples of the photopolymerization initiator include generally commercially available radical or cationic initiators. For example, carbonyl group systems: benzophenone, diacetyl, benzyl, benzoin, ω-bromoacetophenone, chloroacetone, acetophenone, 2,2 -Diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetone, p-dimethylaminoacetophenone, p-dimethylaminopropiophenone, 2-chlorobenzophenone, p, p'-bisdiethylaminobenzophenone, Michler's ketone, benzoin methyl ether, Benzoin isobutyl ether, benzoin-n-butyl ether, benzyl dimethyl ketal, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-one, 1- (4-isopropyl Phenyl) -2-hydroxy-2-methylpropan-1-one, methylbenzoylformate, 2,2-diethoxyacetophenone, 4-N, N′-dimethylacetophenones; sulfide systems: diphenyl disulfide, dibenzyl disulfide; Examples include quinone series: benzoquinone, anthraquinone; azo series: azobisisobutyronitrile, 2,2′-azobispropane. Commercially available products include 1-hydroxycyclohexyl phenyl ketone (product name: IRGACURE 184) manufactured by Ciba Japan Co., Ltd., and a eutectic mixture of 50 parts of 1-hydroxycyclohexyl phenyl ketone and 50 parts of benzophenone (product name: IRGACURE 500). Etc. A photoinitiator can be used in the quantity generally used, for example, the quantity of 1-10 weight part with respect to 100 weight part of photocurable resin of (A) component. Irradiation light may be visible light, ultraviolet light, radiation, or electron beam, but ultraviolet light is preferable from the viewpoint of adhesiveness after curing.
また、本発明の光硬化性樹脂組成物は、硬化後の粘着性を向上させるために、本発明の効果を損なわない範囲で、気泡を含むことができる。 Moreover, in order to improve the adhesiveness after hardening, the photocurable resin composition of this invention can contain a bubble in the range which does not impair the effect of this invention.
本発明の光硬化性樹脂組成物は、印刷性の改善等の目的で溶媒を含むことができるが、環境への配慮、及び光硬化性樹脂組成物の使用率の観点から無溶媒で使用することも好ましい。 The photocurable resin composition of the present invention may contain a solvent for the purpose of improving printability, but is used without a solvent from the viewpoint of environmental considerations and the usage rate of the photocurable resin composition. It is also preferable.
本発明の光硬化性樹脂組成物は、目的に応じて、さらに、その他の公知の添加剤、例えば、酸化防止剤、紫外線吸収剤、光安定剤、シランカップリング剤、熱重合禁止剤、レベリング剤、界面活性剤、着色剤、保存安定剤、可塑剤、滑剤、フィラー、老化防止剤、濡れ性改良剤、離型剤等を添加することができる。 Depending on the purpose, the photocurable resin composition of the present invention may further include other known additives such as antioxidants, ultraviolet absorbers, light stabilizers, silane coupling agents, thermal polymerization inhibitors, and leveling. Agents, surfactants, colorants, storage stabilizers, plasticizers, lubricants, fillers, anti-aging agents, wettability improvers, mold release agents, and the like can be added.
本発明の光硬化性樹脂組成物は、前記各成分を常法により混合して製造することができる。各成分の添加の順番は特に限定されない。高屈折率又は低屈折率化合物が液状である場合には、該化合物を光硬化性樹脂に細かい粒径で分散させることが好ましい。 The photocurable resin composition of the present invention can be produced by mixing the above components by a conventional method. The order of adding each component is not particularly limited. When the high refractive index or low refractive index compound is liquid, it is preferable to disperse the compound in a photocurable resin with a fine particle size.
本発明の光硬化性樹脂組成物は、スクリーン印刷機やディスペンサー等の当業者に公知の方法で、印刷、ディスペンスすることができ、容易にファインラインを形成することができる。ファインラインの線幅は、好ましくは1000μm以下で、より好ましくは700μm以下で、特に好ましくは600μm以下である。また、遮光性、粘着性、シール性の観点から、ファインラインの線幅は、好ましくは500μm以上で、より好ましくは600μm以上である。 The photocurable resin composition of the present invention can be printed and dispensed by methods known to those skilled in the art, such as a screen printing machine and a dispenser, and can easily form fine lines. The line width of the fine line is preferably 1000 μm or less, more preferably 700 μm or less, and particularly preferably 600 μm or less. Further, from the viewpoint of light shielding properties, adhesiveness, and sealing properties, the fine line width is preferably 500 μm or more, and more preferably 600 μm or more.
本発明の光硬化性樹脂組成物は、可視光、紫外線等の光により効果的に硬化することができ、広い範囲の膜厚、例えば0.5μm以上の範囲の膜厚において硬化が可能である。光硬化の条件は、樹脂組成物の組成や膜厚等によって変化し得るが、例えば、成分(A):アクリル樹脂、成分(B):アクリル系粘着付与剤、成分(C):アルミナ、成分(D):カーボンブラック、膜厚:100μmの場合、紫外線照射量は1000mJ/cm2以上である。 The photocurable resin composition of the present invention can be effectively cured by light such as visible light and ultraviolet light, and can be cured in a wide range of film thickness, for example, in a range of 0.5 μm or more. . The photocuring conditions may vary depending on the composition and film thickness of the resin composition. For example, component (A): acrylic resin, component (B): acrylic tackifier, component (C): alumina, component (D): Carbon black, when the film thickness is 100 μm, the ultraviolet irradiation amount is 1000 mJ / cm 2 or more.
本発明は、光硬化性樹脂組成物の硬化物を含む。この硬化物は、遮光性と粘着性を有するものであって、かつ強度・耐久性・耐湿性等種々の特性に優れているので、固定(封止)用樹脂と遮光用樹脂の特性を同時に満足する。本発明の硬化物は、30μm〜150μmの範囲の膜厚において、300〜800nmにおける光透過率を1%以下、例えば0.5%以下、好ましくは、0.1%以下、特に0.05%以下、さらには0.01%以下とすることができる。 The present invention includes a cured product of the photocurable resin composition. This cured product has light-shielding properties and adhesiveness, and has excellent properties such as strength, durability, and moisture resistance. Satisfied. The cured product of the present invention has a light transmittance at 300 to 800 nm of 1% or less, for example 0.5% or less, preferably 0.1% or less, particularly 0.05% in a film thickness in the range of 30 μm to 150 μm. Hereinafter, it can be further 0.01% or less.
本発明において、「粘着性を有する」とは、被着体が硬化後の光硬化性樹脂組成物と接触したときに、被着体に対する濡れを可能とする粘性、及び貼り付いた後、被着体から剥がれにくいという弾性の両方を有する状態を意味する。 In the present invention, “having adhesiveness” means that the adherend adheres to the photocurable resin composition after curing, the viscosity that allows the adherend to wet, and the adherend after being attached. It means a state having both elasticity that it is difficult to peel off from the body.
本発明は、上記の硬化物を含む光学機器部材も含む。光学機器部材としては、例えば液晶パネル、センサー、光ピック、光学レンズ、LEDが挙げられる。本発明は、特に液晶パネルに適している。 The present invention also includes an optical device member containing the above cured product. Examples of the optical device member include a liquid crystal panel, a sensor, an optical pick, an optical lens, and an LED. The present invention is particularly suitable for a liquid crystal panel.
本発明は、さらに、上記の光学機器部材を含む光学機器にも関係する。光学機器としては、例えば、各種ディスプレイ、デジタルカメラ、各種記録メディアプレイヤー等が挙げられ、特に液晶ディスプレイに適している。 The present invention further relates to an optical apparatus including the above-described optical apparatus member. Examples of the optical device include various displays, digital cameras, various recording media players, and the like, and are particularly suitable for liquid crystal displays.
以下に、実施例及び比較例により本発明を詳細に説明するが、本発明はこれら実施例に限定されるものではない。以下において、「部」は重量基準である。 Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples. In the following, “part” is based on weight.
(実施例1〜6及び比較例1)
まず、成分(D)の添加量が及ぼす光硬化性樹脂組成物の深部硬化性への影響を調べるため、実施例1〜6を行った。
(Examples 1-6 and Comparative Example 1)
First, Examples 1-6 were performed in order to investigate the influence of the addition amount of the component (D) on the deep curability of the photocurable resin composition.
(光硬化性樹脂組成物の調製)
(A)成分として、根上工業株式会社製ポリカーボネート系ウレタンアクリレート(製品名:UN−5500、重量平均分子量:約50,000)84部、共栄社化学株式会社製2−ヒドロキシルエチルメタクリレート(製品名:HO)14部、及び共栄社化学株式会社製ラウリルアクリレート(製品名:LA)2部、(B)成分として、フドー株式会社製ポリオールタイプキシレン樹脂(変性品)(K140)84部、(C)成分として、アドマテックス株式会社製アルミナフィラー(製品名:AO−902H、平均粒径:0.7μm、屈折率:1.76)14部、(D)成分として、日弘ビックス株式会社製黒色顔料(製品名:NBD−0744)0.14〜7.0部(表1を参照)、光重合開始剤として、チバジャパン株式会社製1−ヒドロキシシクロヘキシルフェニルケトン50部とベンゾフェノン50部の混合物(製品名:IRGACURE 500)4.2部を混合し、光硬化性樹脂組成物を調製した。比較例1として、(D)成分のみ0部とし、他は実施例1〜6と同様に混合した光硬化性樹脂組成物を調整した。なお、成分(A)及び(B)成分の硬化物の屈折率は1.52であった。
(Preparation of photocurable resin composition)
As the component (A), 84 parts of polycarbonate urethane acrylate (product name: UN-5500, weight average molecular weight: about 50,000) manufactured by Negami Kogyo Co., Ltd., 2-hydroxylethyl methacrylate (product name: HO) manufactured by Kyoeisha Chemical Co., Ltd. ) 14 parts, and 2 parts of lauryl acrylate (product name: LA) manufactured by Kyoeisha Chemical Co., Ltd., as component (B), polyol type xylene resin (modified product) manufactured by Fudou Co., Ltd. (K140) 84 parts, as component (C) , 14 parts by weight, alumina filler (product name: AO-902H, average particle size: 0.7 μm, refractive index: 1.76) manufactured by Admatechs Co., Ltd. Name: NBD-0744) 0.14 to 7.0 parts (see Table 1), as a photopolymerization initiator, Ciba Japan Co., Ltd. 1- Mud alkoxy phenyl ketone 50 parts of benzophenone, 50 parts mixture (product name: IRGACURE 500) 4.2 parts were mixed and a photocurable resin composition was prepared. As Comparative Example 1, only the component (D) was changed to 0 part, and the others were mixed in the same manner as in Examples 1 to 6 to prepare a photocurable resin composition. In addition, the refractive index of the hardened | cured material of a component (A) and (B) component was 1.52.
(光硬化性組成物のチューブへの充填)
図3に示すように、アルミニウム板上に5mm径の紫外線透過性の黒色ポリエチレンチューブを貼り付けた。アルミニウム板上にチューブ高さ1〜2mmとなるように、調製した光硬化性樹脂組成物を黒色チューブの先端まで充填後、黒色チューブを封止しサンプルを作製した。
(Filling tube with photocurable composition)
As shown in FIG. 3, a 5 mm-diameter ultraviolet transparent black polyethylene tube was attached on an aluminum plate. After filling the prepared photocurable resin composition to the tip of the black tube so that the height of the tube was 1 to 2 mm on the aluminum plate, the black tube was sealed to prepare a sample.
(光照射)
作製したサンプルに、アイグラフィックス株式会社製メタルはライドタイプUVランプ(型番:MO3−L31)を用い、株式会社オーク製作所製UVセンサー(型番:UV−35)による測定値が3,000mJ/cm2となるように、UVを照射した。なお、照射は、UVランプに対して平行な(樹脂に対して深さ方向の)UV光しか入らないように行った。
(Light irradiation)
Eye Graphics Co., Ltd. uses a ride type UV lamp (model number: MO3-L31), and the measured value with a UV sensor (model number: UV-35) manufactured by Oak Manufacturing Co., Ltd. is 3,000 mJ / cm. UV was irradiated so that it might be set to 2 . Irradiation was performed so that only UV light parallel to the UV lamp (in the depth direction with respect to the resin) could enter.
(光硬化性組成物の硬化部分の測定)
UV照射後の黒色チューブから硬化した部分の光硬化性組成物を取り出し、硬化した部分の厚さをマイクロメーターで測定した。測定は、n=5で行った。
(Measurement of the cured portion of the photocurable composition)
The cured part of the photocurable composition was taken out from the black tube after UV irradiation, and the thickness of the cured part was measured with a micrometer. The measurement was performed at n = 5.
(結果)
結果を表1に示す。
(result)
The results are shown in Table 1.
表1に示すように、黒色顔料の添加量が、4.2部以下であれば、厚さ110μm以上の光硬化性組成物を硬化できることが実証された。200〜300μmの硬化厚が得られる点から、より好ましい黒色顔料の添加量は、0.14〜0.7部である。 As shown in Table 1, it was demonstrated that a photocurable composition having a thickness of 110 μm or more can be cured if the amount of black pigment added is 4.2 parts or less. From the standpoint of obtaining a cured thickness of 200 to 300 μm, a more preferable addition amount of the black pigment is 0.14 to 0.7 part.
(実施例7)
次に、硬化した光硬化性樹脂組成物の膜厚と遮光性の関係を調べるため、実施例7を行った。
(Example 7)
Next, Example 7 was performed in order to investigate the relationship between the film thickness of the cured photocurable resin composition and the light shielding property.
(光硬化性樹脂組成物の調製)
(A)成分として、根上工業株式会社製ポリカーボネート系ウレタンアクリレート(製品名:UN−5500、重量平均分子量:約50,000)84部、共栄社化学株式会社製2−ヒドロキシルエチルメタクリレート(製品名:HO)14部、及び共栄社化学株式会社製ラウリルアクリレート(製品名LA)2.0部、(B)成分として、フドー株式会社製ポリオールタイプキシレン樹脂(変性品)(K140)84部、(C)成分として、アドマテックス株式会社製アルミナフィラー(製品名:AO−902H、平均粒径:0.7μm、屈折率:1.76)21部、(D)成分として、日弘ビックス株式会社製黒色顔料(製品名:NBD−0744)0.42部、光重合開始剤として、チバジャパン株式会社製1−ヒドロキシシクロヘキシルフェニルケトン50部とベンゾフェノン50部の混合物(製品名:IRGACURE 500)4.2部を混合し光硬化性樹脂組成物を調製した。なお、成分(A)及び(B)成分の硬化物の屈折率は1.52であった。
(Preparation of photocurable resin composition)
As the component (A), 84 parts of polycarbonate urethane acrylate (product name: UN-5500, weight average molecular weight: about 50,000) manufactured by Negami Kogyo Co., Ltd., 2-hydroxylethyl methacrylate (product name: HO) manufactured by Kyoeisha Chemical Co., Ltd. ) 14 parts, Kyoeisha Chemical Co., Ltd. lauryl acrylate (product name LA) 2.0 parts, (B) component, Fudou Co., Ltd. polyol type xylene resin (modified product) (K140) 84 parts, (C) component As an alumina filler (product name: AO-902H, average particle size: 0.7 μm, refractive index: 1.76) 21 parts by Admatechs Co., Ltd. (Product name: NBD-0744) 0.42 parts, 1-hydroxycyclohexacene manufactured by Ciba Japan Co., Ltd. as a photopolymerization initiator Le phenyl ketone 50 parts of benzophenone, 50 parts mixture (product name: IRGACURE 500) 4.2 parts were mixed to prepare a photocurable resin composition. In addition, the refractive index of the hardened | cured material of a component (A) and (B) component was 1.52.
(光硬化性組成物の塗布)
次に、ディスペンサーを用いて、厚さ:1.0mmのクラウンガラス基板上に、幅:1mm、長さ:50mm、厚さ50μm又は100μmで、調製した光硬化性樹脂組成物を塗布し、サンプルを作製した。
(Application of photocurable composition)
Next, the prepared photocurable resin composition was applied to a crown glass substrate having a thickness of 1.0 mm using a dispenser with a width of 1 mm, a length of 50 mm, and a thickness of 50 μm or 100 μm. Was made.
(光照射)
実施例1〜6と同様に、作製したサンプルにUVを照射した。
(Light irradiation)
As in Examples 1 to 6, the prepared samples were irradiated with UV.
(厚さ200、300、500μmの硬化した光硬化性樹脂組成物のサンプルの作製)
膜厚200、300、500μmの硬化した光硬化性樹脂組成物のサンプルは、厚さ100μmでの上記光硬化性組成物の塗布、上記光照射を繰り返すことにより、作製した。
(Preparation of samples of cured photocurable resin compositions having thicknesses of 200, 300, and 500 μm)
Samples of the cured photocurable resin composition having a film thickness of 200, 300, and 500 μm were prepared by repeating the application of the photocurable composition at a thickness of 100 μm and the light irradiation.
(光の透過率の測定)
以上のようにして作製した、膜厚が、50、100、200、300、500μmのサンプルを、日本分光株式会社製紫外可視分光光度計(型番:U−best V−570)と使用して、波長が300nm(紫外線領域)、400nm(紫外線/可視光領域)、500nm(可視光領域)、600nm(可視光領域)、700nm(可視光領域)、800nm(可視光領域/赤外線領域)の光の透過率を測定した。
(Measurement of light transmittance)
Using the samples with the film thicknesses of 50, 100, 200, 300, and 500 μm produced as described above with an ultraviolet-visible spectrophotometer (model number: U-best V-570) manufactured by JASCO Corporation, Wavelengths of 300 nm (ultraviolet region), 400 nm (ultraviolet / visible region), 500 nm (visible region), 600 nm (visible region), 700 nm (visible region), 800 nm (visible region / infrared region) The transmittance was measured.
(結果)
光硬化性樹脂組成物の膜厚と透過率の関係について、得られた結果を表2に示す。
(result)
Table 2 shows the obtained results regarding the relationship between the film thickness and the transmittance of the photocurable resin composition.
表2の結果から、硬化後の光硬化性樹脂組成物の厚さが100μm以下であると、紫外線又は可視光を透過すること、厚さが200μmであっても可視光領域/赤外線領域光を透過することが実証された。この結果は、硬化前の光硬化性樹脂組成物に対しても同様であると考えられる。一方、厚さが100μm以上では紫外線が透過しないこと、厚さが200μm以上、好ましくは300μm以上あれば、紫外線/可視光領域〜可視光領域/赤外線領域が透過しないこと、又はほぼ透過しないことが実証された。 From the results of Table 2, when the thickness of the cured photocurable resin composition is 100 μm or less, ultraviolet light or visible light is transmitted, and even when the thickness is 200 μm, visible light / infrared light is transmitted. It has been demonstrated to penetrate. This result is considered to be the same for the photocurable resin composition before curing. On the other hand, when the thickness is 100 μm or more, ultraviolet rays do not transmit, and when the thickness is 200 μm or more, preferably 300 μm or more, ultraviolet rays / visible light region to visible light region / infrared light region do not transmit or hardly transmit. Proven.
(光硬化性樹脂組成物の調製)
(A)成分として、根上工業株式会社製ポリカーボネート系ウレタンアクリレート(製品名:UN−5500、重量平均分子量:約50,000)84部、共栄社化学株式会社製2−ヒドロキシルエチルメタクリレート(製品名:HO)10部、及び共栄社化学株式会社製ラウリルアクリレート(製品名:LA)2.0部、(B)成分として、フドー株式会社製ポリオールタイプキシレン樹脂(変性品)(K140)84部、(C)成分として、アドマテックス株式会社製アルミナフィラー(製品名:AO−902H、平均粒径:0.7μm、屈折率:1.76)14部、(D)成分として、日弘ビックス株式会社製黒色顔料(製品名:NBD−0744)0.28部、光重合開始剤として、チバジャパン株式会社製1−ヒドロキシシクロヘキシルフェニルケトン50部とベンゾフェノン50部の混合物(製品名:IRGACURE 500)4.2部を混合し光硬化性樹脂組成物を調製した。比較例2として、(D)成分のみを0部とし、他は実施例8と同様に混合し光硬化性樹脂組成物を調製した。なお、成分(A)及び(B)成分の硬化物の屈折率は1.52であった。
(Preparation of photocurable resin composition)
As the component (A), 84 parts of polycarbonate urethane acrylate (product name: UN-5500, weight average molecular weight: about 50,000) manufactured by Negami Kogyo Co., Ltd., 2-hydroxylethyl methacrylate (product name: HO) manufactured by Kyoeisha Chemical Co., Ltd. ) 10 parts, Kyoeisha Chemical Co., Ltd. lauryl acrylate (product name: LA) 2.0 parts, (B) as component (Budo) polyol type xylene resin (modified product) (K140) 84 parts, (C) As component, alumina filler manufactured by Admatechs Co., Ltd. (product name: AO-902H, average particle size: 0.7 μm, refractive index: 1.76), 14 parts, (D) component, black pigment manufactured by Nihongo Bix Co., Ltd. (Product name: NBD-0744) 0.28 parts, 1-hydroxycyclohexane manufactured by Ciba Japan Co., Ltd. as a photopolymerization initiator Mixture of 50 parts sill phenyl ketone and benzophenone 50 parts (product name: IRGACURE 500) 4.2 parts were mixed to prepare a photocurable resin composition. As Comparative Example 2, only the component (D) was changed to 0 part, and the others were mixed in the same manner as in Example 8 to prepare a photocurable resin composition. In addition, the refractive index of the hardened | cured material of a component (A) and (B) component was 1.52.
(光硬化性組成物の塗布)
次に、ディスペンサーを用いて、厚さ:1.0mmのクラウンガラス基板上に、幅:1mm、長さ:50mm、厚さ100μmで、調製した光硬化性樹脂組成物を塗布し、サンプルを作製した。
(Application of photocurable composition)
Next, using a dispenser, the prepared photocurable resin composition with a width of 1 mm, a length of 50 mm, and a thickness of 100 μm is applied onto a 1.0 mm thick crown glass substrate to produce a sample. did.
(光照射)
実施例1〜6と同様に、作製したサンプルにUVを照射した。
(Light irradiation)
As in Examples 1 to 6, the prepared samples were irradiated with UV.
(厚さ500μmの硬化した光硬化性樹脂組成物のサンプルの作製)
膜厚500μmの硬化した光硬化性樹脂組成物のサンプルは、厚さ100μmでの上記光硬化性組成物の塗布、及び光照射をさらに4回繰り返すことにより、作製した。
(Preparation of a sample of a cured photocurable resin composition having a thickness of 500 μm)
A sample of a cured photocurable resin composition having a thickness of 500 μm was produced by repeating the application of the photocurable composition at a thickness of 100 μm and light irradiation four more times.
(光の透過率の測定)
実施例2と同様にして、透過率を、さらに反射率を測定した。なお、反射率は、日本分光株式会社製紫外可視分光光度計(型番:U−best V−570)を用い、90℃絶対反射法により測定した。
(Measurement of light transmittance)
In the same manner as in Example 2, the transmittance and the reflectance were further measured. The reflectance was measured by an absolute reflection method using a UV-visible spectrophotometer (model number: U-best V-570) manufactured by JASCO Corporation.
光硬化性樹脂組成物における波長と透過率の関係の結果を図4に、光硬化性樹脂組成物における波長と反射率の関係の結果を図5に示す。 FIG. 4 shows the result of the relationship between the wavelength and the transmittance in the photocurable resin composition, and FIG. 5 shows the result of the relationship between the wavelength and the reflectance in the photocurable resin composition.
図4に示すように、成分(D)を添加した実施例8と、成分(D)を添加しない比較例2の透過率に差が存在する。図5に示すように、実施例8の反射率は、比較例2の反射率と比較すると、300nmの波長では約1/2に低下し、350nm以上の波長では比較例2の反射率の約1/5以下に低下することが実証された。 As shown in FIG. 4, there is a difference in transmittance between Example 8 in which component (D) was added and Comparative Example 2 in which component (D) was not added. As shown in FIG. 5, the reflectance of Example 8 is reduced to about ½ at a wavelength of 300 nm as compared with the reflectance of Comparative Example 2, and about the reflectance of Comparative Example 2 at a wavelength of 350 nm or more. It has been demonstrated that it drops to 1/5 or less.
(実施例9〜16)
次に、成分(A)の添加が、硬化した光硬化性樹脂組成物の粘着強度に与える影響を調べるため、実施例9〜16を行った。
(Examples 9 to 16)
Next, Examples 9 to 16 were performed in order to examine the influence of the addition of the component (A) on the adhesive strength of the cured photocurable resin composition.
(光硬化性樹脂組成物の調製)
表3に示すような量で、(A)成分として、根上工業株式会社製ポリカーボネート系ウレタンアクリレート(製品名:UN−5500、重量平均分子量:約50,000)、共栄社化学株式会社製2−ヒドロキシルエチルメタクリレート(製品名:HO)、及び共栄社化学株式会社製ベンジルメタクリレート(製品名:BZ)、(B)成分として、フドー株式会社製ポリオールタイプキシレン樹脂(変性品)(K140)、(C)成分として、アドマテックス株式会社製アルミナフィラー(製品名:AO−902H、平均粒径:0.7μm、屈折率:1.76)、(D)成分として、日弘ビックス株式会社製黒色顔料(製品名:NBD−0744)、光重合開始剤として、チバジャパン株式会社製1−ヒドロキシシクロヘキシルフェニルケトン50部とベンゾフェノン50部の混合物(製品名:IRGACURE 500)を混合し光硬化性樹脂組成物を調製した。なお、成分(A)及び(B)成分の硬化物の屈折率は1.53であった。
(Preparation of photocurable resin composition)
In the amount shown in Table 3, as the component (A), as a component, polycarbonate urethane acrylate (product name: UN-5500, weight average molecular weight: about 50,000) manufactured by Negami Kogyo Co., Ltd., 2-hydroxyl manufactured by Kyoeisha Chemical Co., Ltd. Ethyl methacrylate (product name: HO), benzyl methacrylate (product name: BZ) manufactured by Kyoeisha Chemical Co., Ltd., (B) component, polyol type xylene resin (modified product) (K140), (C) component manufactured by Fudou Co., Ltd. As an alumina filler (product name: AO-902H, average particle diameter: 0.7 μm, refractive index: 1.76) manufactured by Admatechs Co., Ltd. : NBD-0744), as a photopolymerization initiator, 1-hydroxycyclohexyl phenyl keto manufactured by Ciba Japan Co., Ltd. 50 parts of benzophenone, 50 parts mixture (product name: IRGACURE 500) were mixed to prepare a photocurable resin composition. In addition, the refractive index of the hardened | cured material of a component (A) and (B) component was 1.53.
(粘着強度試験サンプルの作製)
調製した光硬化性樹脂組成物を用いて、図6に示すように、長さ:75mm、幅:25mm、厚さ:2.5mmのガラス板上に100μm厚の2枚のスペーサーで画された幅1.5cmの溝に光硬化性樹脂組成物を塗布した(塗布長さ:75mm、塗布幅:15mm、塗布厚:100μm)。2枚のスペーサーを除去後、ガラス板上に塗布された光硬化性樹脂組成物をUV照射により硬化した。厚さ:500μmのポリカーボネート(PC)板を貼り合せて、ピール強度試験のサンプルを作製した。光硬化性樹脂組成物の硬化は、実施例1〜6と同様に行ったが、UV光は、ガラス側から照射した。
(Preparation of adhesive strength test sample)
Using the prepared photocurable resin composition, as shown in FIG. 6, it was defined by two spacers having a thickness of 100 μm on a glass plate having a length of 75 mm, a width of 25 mm, and a thickness of 2.5 mm. The photocurable resin composition was applied to a groove having a width of 1.5 cm (application length: 75 mm, application width: 15 mm, application thickness: 100 μm). After removing the two spacers, the photocurable resin composition applied on the glass plate was cured by UV irradiation. Thickness: A polycarbonate (PC) plate having a thickness of 500 μm was bonded to prepare a sample for a peel strength test. Although hardening of the photocurable resin composition was performed similarly to Examples 1-6, UV light was irradiated from the glass side.
(粘着強度試験)
作製したサンプルに治具を取り付け、島津製作所社製引張り試験機を用い、ピール試験は300mm/分にて、剪断試験は5mm/分で試験を行った。結果を表3に示す。
(Adhesive strength test)
A jig was attached to the prepared sample, and a peel test was performed at 300 mm / min and a shear test was performed at 5 mm / min using a tensile tester manufactured by Shimadzu Corporation. The results are shown in Table 3.
(結果)
ピール試験、剪断試験の結果を表3に示す。
(result)
Table 3 shows the results of the peel test and the shear test.
表3からわかるように、成分(A)の添加量が100重量部で、成分(B)が55〜85重量部において、1.0N/25mm以上のピール強度、2.2MPa以上の剪断強度が得られ、成分(A)の添加量が100部で、成分(B)が60〜85重量部において、1.2N/25mm以上のピール強度、2.9MPa以上の剪断強度が得られることが実証された。 As can be seen from Table 3, when the amount of component (A) added is 100 parts by weight and component (B) is 55 to 85 parts by weight, a peel strength of 1.0 N / 25 mm or more and a shear strength of 2.2 MPa or more are obtained. It is demonstrated that when the amount of component (A) added is 100 parts and component (B) is 60 to 85 parts by weight, a peel strength of 1.2 N / 25 mm or more and a shear strength of 2.9 MPa or more can be obtained. It was done.
(実施例17〜23)
次に、成分(B)の添加が、硬化した光硬化性樹脂組成物の粘着強度に与える影響を調べるため、実施例17〜23を行った。
(Examples 17 to 23)
Next, Examples 17 to 23 were performed in order to examine the influence of the addition of the component (B) on the adhesive strength of the cured photocurable resin composition.
(光硬化性樹脂組成物の調製)
表4に示すような量で、(A)成分として、根上工業株式会社製ポリカーボネート系ウレタンアクリレート(製品名:UN−5500、重量平均分子量:約50,000)、共栄社化学株式会社製2−ヒドロキシルエチルメタクリレート(製品名:HO)、及び共栄社化学株式会社製ベンジルメタクリレート(製品名:BZ)、(B)成分として、フドー株式会社製ポリオールタイプキシレン樹脂(変性品)(K140)、(C)成分として、アドマテックス株式会社製アルミナフィラー(製品名:AO−902H、平均粒径:0.7μm、屈折率:1.76)、(D)成分として、日弘ビックス株式会社製黒色顔料(製品名:NBD−0744)、光重合開始剤として、チバジャパン株式会社製1−ヒドロキシシクロヘキシルフェニルケトン50部とベンゾフェノン50部の混合物(製品名:IRGACURE 500)を混合し光硬化性樹脂組成物を調製した。なお、成分(A)及び(B)成分の硬化物の屈折率は1.53であった。
(Preparation of photocurable resin composition)
In the amount shown in Table 4, as the component (A), as a component, polycarbonate urethane acrylate (product name: UN-5500, weight average molecular weight: about 50,000) manufactured by Negami Kogyo Co., Ltd., 2-hydroxyl manufactured by Kyoeisha Chemical Co., Ltd. Ethyl methacrylate (product name: HO), benzyl methacrylate (product name: BZ) manufactured by Kyoeisha Chemical Co., Ltd., (B) component, polyol type xylene resin (modified product) (K140), (C) component manufactured by Fudou Co., Ltd. As an alumina filler (product name: AO-902H, average particle diameter: 0.7 μm, refractive index: 1.76) manufactured by Admatechs Co., Ltd. : NBD-0744), as a photopolymerization initiator, 1-hydroxycyclohexyl phenyl keto manufactured by Ciba Japan Co., Ltd. 50 parts of benzophenone, 50 parts mixture (product name: IRGACURE 500) were mixed to prepare a photocurable resin composition. In addition, the refractive index of the hardened | cured material of a component (A) and (B) component was 1.53.
(粘着強度試験サンプルの作製、粘着強度試験)
調製した光硬化性樹脂組成物を使用して、実施例9〜16と同様に、サンプルを作製し、ピール強度、剪断強度を測定した。
(Preparation of adhesive strength test sample, adhesive strength test)
Using the prepared photocurable resin composition, a sample was prepared in the same manner as in Examples 9 to 16, and peel strength and shear strength were measured.
(結果)
ピール試験、剪断試験の結果を表4に示す。
(result)
Table 4 shows the results of the peel test and the shear test.
表4からわかるように、成分(A)の添加量が100重量部で、成分(B)の添加量が70〜116部で、1.0N/25mm以上のピール強度、3.7MPa以上の剪断強度が得られ、成分(B)の添加量が70〜101部で、1.6N/25mm以上のピール強度、4.3MPa以上の剪断強度が得られることが実証された。 As can be seen from Table 4, the amount of component (A) added is 100 parts by weight, the amount of component (B) added is 70 to 116 parts, the peel strength is 1.0 N / 25 mm or more, and the shear is 3.7 MPa or more. It was proved that the strength was obtained, and the peel strength of 1.6 N / 25 mm or more and the shear strength of 4.3 MPa or more were obtained when the added amount of the component (B) was 70 to 101 parts.
本発明の光硬化性樹脂組成物は、厚膜硬化が可能であり、硬化後に、光透過性が低く、粘着性を有し、かつ、強度・耐久性・耐湿性等種々の特性に優れている。生産性が大きく向上し、遮光性を必要とする種々の光学機器部材や成形樹脂等の製造用樹脂として適している。 The photocurable resin composition of the present invention is capable of thick film curing, has low light transmittance after curing, has adhesiveness, and is excellent in various properties such as strength, durability, and moisture resistance. Yes. Productivity is greatly improved, and it is suitable as a resin for manufacturing various optical equipment members and molding resins that require light shielding properties.
1 LCDパネル
2 固定(封止)樹脂層
3 基板
4 バックライト
5 遮光性と粘着性を有する硬化後の光硬化性樹脂組成物
6 硬化前の光硬化性樹脂組成物
7 黒色チューブ
8 アルミニウム板
9 ガラス板
10 PC板
A 外部からの透過光
B 内部からの漏れ光(損失光)
C 紫外線
DESCRIPTION OF
C UV
Claims (7)
で表されるポリオール変性キシレン樹脂である請求項1記載の光硬化性樹脂組成物。The photocurable resin composition according to claim 1, which is a polyol-modified xylene resin represented by:
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JP2008302390A JP5489447B2 (en) | 2008-11-27 | 2008-11-27 | Photocurable resin composition having light-shielding property and adhesiveness and cured product thereof |
KR1020117014569A KR20110087341A (en) | 2008-11-27 | 2009-11-18 | Photo-curable resin composition exhibiting light-blocking properties and tackiness, and cured product thereof |
PCT/JP2009/069567 WO2010061763A1 (en) | 2008-11-27 | 2009-11-18 | Photo-curable resin composition exhibiting light-blocking properties and tackiness, and cured product thereof |
CN200980147750.9A CN102227475B (en) | 2008-11-27 | 2009-11-18 | Photo-curable resin composition exhibiting light-blocking properties and tackiness, and cured product thereof |
TW098140365A TWI447159B (en) | 2008-11-27 | 2009-11-26 | A photohardenable resin composition having shading and adhesion, and a hardened product thereof |
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KR (1) | KR20110087341A (en) |
CN (1) | CN102227475B (en) |
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WO (1) | WO2010061763A1 (en) |
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JP5007453B2 (en) * | 2010-06-11 | 2012-08-22 | 株式会社タムラ製作所 | Black curable resin composition |
TWI409555B (en) * | 2011-04-05 | 2013-09-21 | Sekisui Chemical Co Ltd | Liquid crystal display element shading sealant, upper and lower conductive material and liquid crystal display element |
KR101515437B1 (en) * | 2012-12-14 | 2015-04-27 | 금호석유화학 주식회사 | Adhesive composition for liquid crystal device and method of manufacturing the same |
US10294310B2 (en) | 2015-01-21 | 2019-05-21 | Three Bond Co., Ltd. | Photocurable composition |
EP3715949A4 (en) * | 2017-11-20 | 2021-01-27 | Mitsubishi Gas Chemical Company, Inc. | Composition for forming film for lithography, film for lithography, resist pattern forming method, and circuit pattern forming method |
KR102244469B1 (en) * | 2017-12-26 | 2021-04-23 | 삼성에스디아이 주식회사 | Black photosensitive resin composition, black matrix using the same and display device |
JP2021123613A (en) * | 2020-01-31 | 2021-08-30 | 日東電工株式会社 | Pressure sensitive adhesive sheet and adhesive composition |
CN112852121B (en) * | 2020-12-31 | 2023-06-20 | 广东基烁新材料股份有限公司 | Conductive master batch for PET sheet and preparation method and application thereof |
KR20230024749A (en) * | 2021-08-12 | 2023-02-21 | (주)이녹스첨단소재 | Adhesive sheet for display and preparing method of the same |
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US5874143A (en) * | 1996-02-26 | 1999-02-23 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives for use on low energy surfaces |
JP3618192B2 (en) * | 1997-04-08 | 2005-02-09 | リンテック株式会社 | Adhesive sheet |
KR20030007186A (en) * | 2001-07-17 | 2003-01-23 | 미쯔이카가쿠 가부시기가이샤 | Photocationic-curable resin composition and uses thereof |
JP2003096184A (en) * | 2001-07-17 | 2003-04-03 | Mitsui Chemicals Inc | Photocurable resin composition |
JP2003096185A (en) * | 2001-07-17 | 2003-04-03 | Mitsui Chemicals Inc | Photocurable resin composition |
JP2003327951A (en) * | 2002-05-10 | 2003-11-19 | Mitsui Chemicals Inc | Photo-setting resin composition for sealing material |
JP2004300442A (en) * | 2004-04-22 | 2004-10-28 | Lintec Corp | Adhesive sheet and method for manufacturing the same |
JP4668702B2 (en) * | 2005-06-30 | 2011-04-13 | ニッタン株式会社 | Fire detector |
JP5129924B2 (en) * | 2005-10-31 | 2013-01-30 | 協立化学産業株式会社 | Photocurable resin composition having light shielding properties and cured product thereof |
JP5202912B2 (en) * | 2007-09-05 | 2013-06-05 | 協立化学産業株式会社 | Method for obtaining a composite by bonding a light shielding film and an opaque substrate with a photocurable adhesive resin |
JP5718551B2 (en) * | 2008-03-28 | 2015-05-13 | リンテック株式会社 | Pressure-sensitive adhesive composition for plasma display and pressure-sensitive adhesive sheet formed by molding the same |
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CN102227475A (en) | 2011-10-26 |
TW201035214A (en) | 2010-10-01 |
CN102227475B (en) | 2014-01-15 |
JP2010126630A (en) | 2010-06-10 |
WO2010061763A1 (en) | 2010-06-03 |
TWI447159B (en) | 2014-08-01 |
KR20110087341A (en) | 2011-08-02 |
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