WO2018038221A1 - Curable resin composition, image display device and manufacturing method of image display device - Google Patents
Curable resin composition, image display device and manufacturing method of image display device Download PDFInfo
- Publication number
- WO2018038221A1 WO2018038221A1 PCT/JP2017/030386 JP2017030386W WO2018038221A1 WO 2018038221 A1 WO2018038221 A1 WO 2018038221A1 JP 2017030386 W JP2017030386 W JP 2017030386W WO 2018038221 A1 WO2018038221 A1 WO 2018038221A1
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- WO
- WIPO (PCT)
- Prior art keywords
- curable resin
- image display
- resin layer
- resin composition
- glass substrate
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 title claims description 18
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- 150000001875 compounds Chemical class 0.000 claims abstract description 31
- 150000004292 cyclic ethers Chemical group 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims description 110
- 239000011347 resin Substances 0.000 claims description 110
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- 238000000034 method Methods 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 49
- 238000006243 chemical reaction Methods 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 24
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- 229920000642 polymer Polymers 0.000 claims description 17
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- 238000005259 measurement Methods 0.000 claims description 14
- 238000012360 testing method Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 5
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- 239000003505 polymerization initiator Substances 0.000 abstract description 9
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- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
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- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
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- 125000000590 4-methylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 2
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- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- KOPQZJAYZFAPBC-UHFFFAOYSA-N propanoyl propaneperoxoate Chemical compound CCC(=O)OOC(=O)CC KOPQZJAYZFAPBC-UHFFFAOYSA-N 0.000 description 1
- YPVDWEHVCUBACK-UHFFFAOYSA-N propoxycarbonyloxy propyl carbonate Chemical compound CCCOC(=O)OOC(=O)OCCC YPVDWEHVCUBACK-UHFFFAOYSA-N 0.000 description 1
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- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
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- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
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- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L33/04—Homopolymers or copolymers of esters
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
Definitions
- the present invention relates to a curable resin composition, an image display device, and a method for manufacturing the image display device.
- An image display device used in an information terminal such as a smart phone has an image display unit (including a liquid crystal panel, a cover glass, etc.) having an image display surface and a frame unit that supports the image display unit.
- the image display unit and the frame unit are manufactured by bonding and fixing with a pressure-sensitive adhesive tape.
- a pressure-sensitive adhesive tape a black pressure-sensitive adhesive tape having a light shielding property is generally used in order to prevent deterioration of image quality due to light leakage from between the image display portion and the frame portion (for example, patents). Reference 1).
- the present invention forms a light-shielding layer that has a light-shielding property that suppresses light leakage between the image display part and the frame part, and can be efficiently formed even in a narrow region. It aims at providing the curable resin composition which can be used in order to do.
- One aspect of the present invention includes a radical photopolymerization initiator, a monomer component, a colorant, and a photoacid generator, and the monomer component includes one radical polymerizable group and a cyclic ether.
- a curable resin composition containing a monomer having a group is provided.
- Another aspect of the present invention includes a radical photopolymerization initiator, a monomer component, a colorant, a photoacid generator, and a compound having a cyclic ether group.
- a curable resin composition containing a monomer having one radical polymerizable group.
- the composition is applied to the image display portion or the frame portion of the image display device to form a frame-like curable resin layer, and active against this curable resin layer.
- the energy beam After irradiating the energy beam, it is a small area with a light shielding property that suppresses light leakage between the image display unit and the frame unit by a simple method of bonding the image display unit and the frame unit.
- the light shielding layer can be formed efficiently.
- the present inventors consider the reason why the above effect is achieved as follows. Since the curable resin composition according to the present invention has the above-described configuration, the curing reaction of the curable resin layer by the cation reaction of the cyclic ether group is performed following the generation of the polymer chain by the photo radical polymerization of the radical polymerizable group. Can be advanced. By such delayed curing, the light-curing curable resin layer can achieve both an elastic modulus suitable for bonding by irradiation with active energy rays and a sufficient curing rate after bonding, and a fine adhesive surface.
- the curable resin composition may further contain a polymer.
- the curable resin composition contains a polymer
- the curable resin layer after being irradiated with active energy rays has pressure-sensitive adhesiveness that makes it easy to bond the image display portion and the frame portion. Can be easily done.
- the curable resin composition can exhibit pressure-sensitive adhesiveness when irradiated with active energy rays.
- the curable resin composition may have a pressure-sensitive adhesive force determined by the following method of 10 N / cm 2 or more.
- a curable resin composition is applied onto a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and a curable resin layer having a width of 0.6 mm, a length of 25 mm, and a film thickness of 50 ⁇ m is applied to the curable resin layer.
- the second glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm on the curable resin layer within 1 minute from the light irradiation, the long side of the first glass substrate and the second glass substrate It arrange
- test force when the first glass substrate and the second glass substrate of the measurement sample are peeled in the opposite long side directions is measured, and this test force is set to be curable.
- the value divided by the contact area between the resin layer and the second glass substrate is defined as the pressure-sensitive adhesive force.
- the curable resin composition may have an aspect ratio of 0.4 or more obtained by the following method.
- a curable resin composition is applied onto a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and a curable resin layer having a width of 0.6 mm, a length of 25 mm, and a film thickness of 50 ⁇ m is applied to the curable resin layer.
- the second glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm on the curable resin layer within 1 minute from the light irradiation, the long side of the first glass substrate and the second glass substrate It arrange
- B unit: mm
- B / 0.6 is the aspect ratio.
- the curable resin composition according to the present invention can be used for forming a light shielding layer.
- the present invention includes a radical photopolymerization initiator, a monomer component, a colorant, and a photoacid generator, and the monomer component includes one radical polymerizable group and a cyclic ether.
- the present invention relates to an application of a curable resin composition containing a monomer having a group to form a light shielding layer.
- the present invention also includes a radical photopolymerization initiator, a monomer component, a colorant, a photoacid generator, and a compound having a cyclic ether group, and the monomer component is a single component.
- the present invention relates to an application of a curable resin composition containing a monomer having a radical polymerizable group for forming a light shielding layer.
- the present invention also includes a radical photopolymerization initiator, a monomer component, a colorant, and a photoacid generator.
- the monomer component includes one radical polymerizable group and a cyclic ether group.
- the present invention relates to an application of a cured product of a curable resin composition containing a monomer having a light shielding layer.
- the present invention also includes a radical photopolymerization initiator, a monomer component, a colorant, a photoacid generator, and a compound having a cyclic ether group, and the monomer component is a single component.
- the present invention relates to application of a cured product of a curable resin composition containing a monomer having a radical polymerizable group as a light shielding layer.
- Another aspect of the present invention supports a liquid crystal panel having an image display surface, an image display portion having a cover member having a light transmission portion facing the image display surface, and an image display portion provided around the image display portion. And a light shielding layer formed between the frame portion and the image display unit, wherein the light shielding layer is made of the curable resin composition according to the present invention.
- an image display device which is a cured product of a layer.
- Another aspect of the present invention supports a liquid crystal panel having an image display surface, an image display portion having a cover member having a light transmission portion facing the image display surface, and an image display portion provided around the image display portion. And a light-shielding layer formed between the frame portion and the image display portion, and the image display portion or the frame portion is provided with the curability according to the present invention.
- an image display device including a light-shielding layer that can sufficiently suppress light leakage from between the image display unit and the frame unit, even in a narrow region, is efficient. Can be manufactured well.
- the curable resin layer when the image display portion and the frame portion are bonded to each other can have pressure-sensitive adhesiveness.
- the image display unit and the frame unit may be bonded so that an aspect ratio represented by the following formula is 0.4 or more.
- Aspect ratio B '/ A'
- a ′ represents a width at a predetermined portion of the frame-shaped curable resin layer applied to one of the image display unit and the frame unit
- B ′ represents the image display unit and the image display unit.
- variety which is in contact with the other of the said image display part and the said frame part in the said predetermined part of the said curable resin layer after the said frame part is bonded together is shown.
- the above method may further include a step of further proceeding a curing reaction of the curable resin layer after the step of bonding the image display unit and the frame unit.
- the image display unit and the frame unit can be bonded to each other with a higher adhesion of the light shielding layer, and an image display device including a light shielding layer excellent in light leakage prevention can be obtained.
- the light-shielding property that suppresses light leakage from between the image display unit and the frame unit is formed, and even a narrow region is efficiently formed
- the curable resin composition which can be used in order to form the light shielding layer which can be provided can be provided.
- (meth) acrylate means “acrylate” and “methacrylate” corresponding thereto.
- (meth) acryl means “acryl” and “methacryl” corresponding thereto, and “(meth) acryloyl” means “acryloyl” and corresponding “methacryloyl”.
- the first curable resin composition of the present embodiment includes a radical photopolymerization initiator (hereinafter also referred to as “(A) component”) and a monomer component (hereinafter also referred to as “(B) component”).
- a colorant hereinafter also referred to as “component (C)”
- component (D) a photoacid generator
- the monomer component is a single radical polymerization.
- component (B1) a monomer having a functional group and a cyclic ether group
- the second curable resin composition of the present embodiment comprises a radical photopolymerization initiator, a monomer component, a colorant, a photoacid generator, and a compound having a cyclic ether group (hereinafter referred to as “(E) And the monomer component may include a monomer having one radical polymerizable group (hereinafter, also referred to as “component (B2)”).
- component (B2) a monomer having one radical polymerizable group
- component (E) component is a compound which does not have a radically polymerizable group.
- the photoradical polymerization initiator is a component that generates a free radical by irradiation with active energy rays and accelerates a curing reaction (polymerization reaction) by radical polymerization of the monomer component.
- the active energy rays can be selected from ultraviolet rays, electron rays, ⁇ rays, ⁇ rays and the like.
- photo radical polymerization initiator examples include benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N-tetraethyl-4,4′-diaminobenzophenone, 4-methoxy- 4,4′-dimethylaminobenzophenone, ⁇ -hydroxyisobutylphenone, 2-ethylanthraquinone, tert-butylanthraquinone, 1,4-dimethylanthraquinone, 1-chloroanthraquinone, 2,3-dichloroanthraquinone, 3-chloro-2- Methyl anthraquinone, 1,2-benzoanthraquinone, 2-phenylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, thioxanthone, 2-chlorothioxanthone
- a radical photopolymerization initiator may be used individually by 1 type, and may be used in combination of 2 or more type. From the viewpoint of curability, reactivity, and surface curability, a radical photopolymerization initiator may be selected from aromatic ketone compounds, ⁇ -hydroxyalkylphenone compounds, and phenylglyoxylic acid methyl esters.
- the photo radical polymerization initiator may be a compound that generates both a free radical and a base (for example, a secondary amino group or a tertiary amino group) by irradiation with active energy rays.
- a free radical and a base for example, a secondary amino group or a tertiary amino group
- photo radical polymerization initiators include (4-morpholinobenzoyl) -1-benzyl-1-dimethylaminopropane (“Irgacure 369”, manufactured by BASF Japan Ltd.), 4- (methylthiobenzoyl) -1 -Methyl-1-morpholinoethane ("Irgacure 907", manufactured by BASF Japan Ltd.), 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] ⁇ -aminoacetophenone compounds such as -1-butanone (“Irgacure 3
- the content of the radical photopolymerization initiator in the curable resin composition is the total amount of the curable resin composition from the viewpoint of pressure-sensitive adhesiveness, reliability, and curability, and from the viewpoint of efficiently promoting the curing reaction.
- 2 mass% or more, 4 mass% or more, or 6 mass% or more may be sufficient, and 14 mass% or less, 12 mass% or less, or 10 mass% or less may be sufficient.
- (B) Component Monomer Component (B1)
- the radical polymerizable group of the component includes (meth) acryloyl group, vinyl group, ethynyl group, isopropenyl group, vinyl ether group and vinyl thioether group.
- the component (B1) examples include glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate glycidyl ether, propylene oxide (PO) modified bisphenol A diglycidyl ether di Acrylate, novolac partial epoxy acrylate, acrylic acid adduct of bisphenol A diglycidyl ether, 3-oxetanylmethyl (meth) acrylate, 3-methyl-3-oxetanylmethyl (meth) acrylate, 3-ethyl-3-oxetanylmethyl (meth) ) Acrylate, 3-butyl-3-oxetanylmethyl (meth) acrylate, and 3-hexyl-3-oxetanylmethyl (meth) acrylate.
- the component (B1) may be allyl glycidyl ether.
- a component can be used individually by 1 type or in combination of 2 or more types.
- the content of the component (B1) is from the viewpoint of reactivity, from the viewpoint of improving the adhesive force, and from the viewpoint of stability when the curable resin composition is a solution, with respect to the total amount of the curable resin composition, It may be 0.1 mass% or more, 1 mass% or more, or 3 mass% or more, or 15 mass% or less, 10 mass% or less, or 5 mass% or less.
- Component includes a monofunctional monomer having one radical polymerizable group.
- examples of the radical polymerizable group possessed by the component (B2) include a (meth) acryloyl group, a vinyl group, an ethynyl group, an isopropenyl group, a vinyl ether group, and a vinyl thioether group.
- the monofunctional monomer may be a compound having a (meth) acryloyl group.
- the monofunctional monomer having a (meth) acryloyl group may be an alkyl (meth) acrylate, and the carbon number of the alkyl group in that case is 4 from the viewpoint of imparting flexibility to the curable resin composition. As described above, it may be 6 or more, or 8 or more, and may be 20 or less, 18 or less, or 16 or less.
- the alkyl group of the alkyl (meth) acrylate may have a substituent such as a hydroxyl group.
- the monofunctional monomer having a (meth) acryloyl group include n-butyl (meth) acrylate, tert-butyl (meth) acrylate, isobutyl (meth) acrylate, n-pentyl (meth) acrylate, n- Octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, n-hexyl (meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) Alkyl (meth) acrylates such as acrylate; 2-hydroxyethyl (meth) acrylate, 1-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate
- (Meth) acrylates such as dimethyl (meth) acrylamide, isopropyl (meth) acrylamide, dimethylaminopropyl (meth) acrylamide; hydroxyl-containing (meth) acrylamides such as hydroxyethyl (meth) acrylamide; diethylene glycol, triethylene Polyethylene glycol mono (meth) acrylate such as glycol; dipropylene glycol mono (meth) acrylate, tripropylene glycol mono (meth) acrylate Polypropylene glycol mono (meth) acrylates such as dibutylene glycol mono (meth) acrylate and tributylene glycol mono (meth) acrylate; morpholine group-containing (meth) acrylates such as acryloylmorpholine; Examples include cyclopentanyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acryl
- monofunctional monomers are dicyclopentanyl (meth) acrylate and dicyclopentenyl (meth) acrylate. And a compound selected from isobornyl (meth) acrylate, or a compound selected from dicyclopentenyl (meth) acrylate and isobornyl (meth) acrylate.
- a component may be used individually by 1 type, and may be used in combination of 2 or more type.
- the component (B) can contain one or more components (B2) in addition to the component (B1).
- the component (B2) is a compound other than the component (B1).
- the content of the component (B2) is from the viewpoint of obtaining a curable resin composition having an appropriate viscosity, from the viewpoint of adjusting the curing shrinkage and the elastic modulus of the cured product, and from the viewpoint of solubility of the colorant. 10 mass% or more, 15 mass% or more, or 20 mass% or more may be sufficient with respect to the total amount of a thing, and 80 mass% or less, 70 mass% or less, or 60 mass% or less may be sufficient.
- the content of the component (B2) is 10% by mass or more, a curable resin composition having an appropriate viscosity that contributes to good coatability is easily obtained, and the solubility of the colorant tends to be improved.
- the content of the component (B2) is 80% by mass or less, the curing shrinkage rate tends to be low. When the curing shrinkage rate is low, it is possible to suppress a decrease in adhesive force due to stress.
- the monomer component (B) may further contain a polyfunctional monomer having two or more radical polymerizable groups.
- content of a polyfunctional monomer may be 5 mass% or less with respect to the total amount of a monomer component ((B) component).
- Colorant is a component that colors the curable resin composition and the light-shielding layer and imparts appropriate light-shielding properties to the formed light-shielding layer, and there is no particular limitation on the hue of the colorant. Although colorants with various hues can be used, the colorants typically exhibit a black color.
- the colorant can include, for example, a dye and / or a pigment. From the viewpoint of obtaining a uniform curable resin composition, a colorant that dissolves in the monomer component may be selected.
- the colorant is dissolved in the monomer component.
- the average visible light transmittance of the colorant may be 50% or less, 45% or less, or 40% or less.
- the average transmittance of visible light refers to the average transmittance of light having a wavelength of 400 to 700 nm.
- the average visible light transmittance is obtained by measuring the light transmittance of a colorant solution composed of 100 parts by mass of a solvent in which the colorant is dissolved and 0.1 part by mass of the colorant with a spectrocolorimeter (for example, manufactured by Konica Minolta, Inc.). “CM-3700A”) can be measured every 1 nm in the range of 400 to 700 nm, an average value of the obtained measurement values can be obtained, and the average transmittance can be obtained.
- the dissolution of the colorant in the solvent can be confirmed by the same method as that described above for “the colorant dissolves in the monomer component”.
- the light transmittance (hereinafter also referred to as “irradiation transmittance”) of the colorant at the peak wavelength of the light (active energy ray) irradiated to advance the curing reaction is 10% of the average visible light transmittance. As mentioned above, it may be 20% or more, 30% or more higher.
- the irradiation light transmittance may be 60% or more, 65% or more, or 70% or more.
- the irradiation light transmittance of the colorant is determined by the light (active energy ray) irradiated to advance the curing reaction of the colorant solution consisting of 100 parts by mass of the solvent in which the colorant is dissolved and 0.1 part by mass of the colorant.
- the light transmittance of the colorant at the peak wavelength of) can be determined by a method of measuring the decomposition wavelength under the condition of 1 nm.
- a visible ultraviolet spectrophotometer for example, “UV-2400PC” manufactured by Shimadzu Corporation
- the measurement range is set to 300 to 780 nm, for example.
- the colorant may include, for example, at least one selected from the group consisting of phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, aniline black, perylene black, and fluoran.
- the content of the colorant is 0.1% by mass or more, 0.3% by mass or more, or 0.5% by mass or more with respect to the total amount of the curable resin composition from the viewpoint of obtaining an effect of shielding visible light. It may be 10 mass% or less, 7.5 mass% or less, or 5 mass% or less.
- component (D) a compound that generates one or more acidic substances that can function as a curing catalyst for an ionic reaction by changing the molecular structure or cleaving the molecule by irradiation with active energy rays can be used.
- the component (D) can function as a curing catalyst for the cationic reaction of the components (B1) and (E).
- component (D) examples include onium salt compounds, sulfone compounds, sulfonic acid ester compounds, sulfonimide compounds, disulfonyldiazomethane compounds, disulfonylmethane compounds, oxime sulfonate compounds, hydrazine sulfonate compounds, triazine compounds, nitrobenzyl compounds, Organic halides and disulfone can be mentioned.
- photoacid generators examples include trade names “Syracure UVI-6970”, “Syracure UVI-6974”, “Syracure UVI-6990”, “Syracure UVI-950” (above, Union Carbide, USA) "Irgacure 250”, “Irgacure 261”, “Irgacure 264”, “Irgacure 270”, “Irgacure 290” (manufactured by BASF), "CG-24-61” (Ciba Geigy), “Adekaoptomer” “SP-150”, “Adekaoptomer SP-151”, “Adekaoptomer SP-170”, “Adekaoptomer SP-171” (manufactured by ADEKA Corporation), “DAICAT II” (Daicel Corporation) ), “UVAC1590”, “UVAC1591” (above, Daicel-Cite) (CI Co., Ltd.), “CI-2064”, “CI-2539
- a component can be used individually by 1 type or in combination of 2 or more types.
- the content of the component (D) is 2% by mass or more based on the total amount of the curable resin composition, from the viewpoints of pressure-sensitive adhesiveness, reliability, and curability, and from the viewpoint of efficiently accelerating the curing reaction. 4 mass% or more, or 6 mass% or more may be sufficient, and 14 mass% or less, 12 mass% or less, or 10 mass% or less may be sufficient.
- Examples of the component (E) contained in the second curable resin composition of the present embodiment include compounds having an epoxy group and / or an oxetane group. Specific examples of these compounds include glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, stearyl glycidyl ether, lauryl glycidyl ether, butoxy polyethylene glycol glycidyl ether, phenol polyethylene glycol glycidyl ether, phenyl glycidyl ether, p-methylphenyl Monofunctional epoxy compounds such as glycidyl ether, p-ethylphenyl glycidyl ether, p-sec-butylphenyl glycidyl ether, p-tert-butylphenyl glycidyl ether; bisphenol A diglycidyl ether, bisphenol F diglycidyl
- a component can be used individually by 1 type or in combination of 2 or more types.
- Content of (E) component in the 2nd curable resin composition of this embodiment is a viewpoint of stability when a reactive viewpoint, the viewpoint which improves adhesive force, and a curable resin composition is a solution. From 1% by mass to 5% by mass or 10% by mass or more based on the total amount of the curable resin composition, 70% by mass or less, 50% by mass or less, or 30% by mass or less. There may be.
- the 1st curable resin composition of this embodiment can further contain (E) component.
- the content of the component (E) may be 0.1% by mass or more, 1% by mass or more, or 3% by mass or more based on the total amount of the curable resin composition from the viewpoint of curability. From the viewpoint of storage stability, it may be 15% by mass or less, 10% by mass or more, or 5% by mass or less based on the total amount of the curable resin composition.
- the curable resin composition according to this embodiment may further contain a polymer (hereinafter also referred to as “component (F)”).
- the polymer contained in the curable resin composition may be an oligomer.
- the “oligomer” means a polymer having a weight average molecular weight of 1 ⁇ 10 4 or more.
- a weight average molecular weight means the value of standard polystyrene conversion measured by gel permeation chromatography.
- the “polymer” as the component (F) is a component excluding the components (A) to (E) described above.
- polymer examples include butadiene rubber, isoprene rubber, silicon rubber, styrene butadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, ethylene propylene rubber, urethane rubber, acrylic rubber, chlorosulfonated polyethylene rubber, fluorine rubber, Liquid or solid materials of various rubbers such as hydrogenated nitrile rubber and epichlorohydrin rubber; poly ⁇ -olefins such as polybutene; hydrogenated ⁇ -olefin oligomers such as hydrogenated polybutene; polyvinyl oligomers such as atactic polypropylene; biphenyl and tri Aromatic oligomers such as phenyl; Hydrogenated polyene oligomers such as hydrogenated liquid polybutadiene; Paraffinic oligomers such as paraffin oil and chlorinated paraffin oil; Cycloparaffinic oligomers such as naphthene oil; A polyester-based
- the (meth) acrylic acid polymer is a polymer containing one or more monomer units derived from a monomer having one (meth) acryloyl group.
- the (meth) acrylic acid-based polymer is a compound having two or more (meth) acryloyl groups, a polymerizable compound not having a (meth) acryloyl group (for example, acrylonitrile, As a comonomer, a compound having one polymerizable unsaturated bond such as styrene, vinyl acetate, ethylene or propylene, or a compound having two or more polymerizable unsaturated bonds such as divinylbenzene in the molecule) May be included.
- the monomer constituting the (meth) acrylic acid polymer include (meth) acrylic acid; (meth) acrylic acid amide; methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) Alkyl (meth) acrylates such as acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, n-lauryl (meth) acrylate, stearyl (meth) acrylate, etc.
- (Meth) acrylates having aromatic rings such as benzyl (meth) acrylate and phenoxyethyl (meth) acrylate; butoxyethylene glycol (meth) acrylate, butoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (Meth) acrylates having an alkoxy group such as acryl (meth) acrylate; cycloaliphatic such as cyclohexyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate (Meth) acrylate having a group; (meth) acrylate having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate; tetraethylene glycol monomethyl ether ( (Meth) acrylate)
- the (meth) acrylic acid polymer may be a homopolymer or copolymer containing these monomers as monomer units.
- the (meth) acrylic acid polymer may be a homopolymer or a copolymer containing a monofunctional monomer having one (meth) acryloyl group as a monomer unit.
- the (meth) acrylic acid polymer may contain a (meth) acrylate having an alkyl group as a monomer unit, or a (meth) acrylate having an alkyl group having 4 to 18 carbon atoms as a monomer unit. May be included.
- the proportion of the (meth) acrylate having an alkyl group contained as a monomer unit per molecule of the (meth) acrylic acid polymer is 5% by mass or more based on the mass of the (meth) acrylic acid polymer. 10 mass% or more may be sufficient, and 95 mass% or less and 90 mass% or less may be sufficient.
- the proportion of the alkyl group-containing (meth) acrylate is within the above range, the adhesion of the cured curable resin layer (light-shielding layer) to an adherend such as glass, plastic, polarizing plate or polycarbonate is improved. Tend.
- the (meth) acrylic acid polymer has a polar group such as a hydroxyl group, a morpholino group, an amino group, a carboxyl group, a cyano group, a carbonyl group, or a nitro group from the viewpoint of improving the pressure-sensitive adhesiveness with a base material such as plastic. It may be a copolymer containing the (meth) acrylate as a monomer unit.
- the weight average molecular weight of the (meth) acrylic acid polymer (oligomer) may be 1 ⁇ 10 4 to 1 ⁇ 10 7 .
- the weight average molecular weight is within the above range, it is particularly easy to obtain a pressure-sensitive adhesive force that does not cause peeling on a substrate or the like under a high temperature (for example, 80 ° C. or higher) and high humidity (for example, 90% or higher) environment. be able to.
- a curable resin composition having a viscosity suitable for coating and good workability.
- (Meth) acrylic acid polymer can be prepared using a known polymerization method such as solution polymerization, emulsion polymerization, suspension polymerization, bulk polymerization and the like.
- a compound that generates a radical by heat may be used as a polymerization initiator in these polymerization methods.
- a compound that generates a radical by heat include benzoyl peroxide, tert-butyl perbenzoate, cumene hydroperoxide, diisopropyl peroxydicarbonate, di-n-propyl peroxydicarbonate, di (2-ethoxyethyl) peroxydicarbonate, Organic peroxides such as tert-butylperoxyneodecanoate, t-butylperoxypivalate, (3,5,5-trimethylhexanoyl) peroxide, dipropionyl peroxide, diacetyl peroxide, didodecyl peroxide 2,2′-azobisisobutyronitrile, 2,2′-azobis (2-methylbutyronitrile), 1,1′-azobis (cyclohexane-1-carbonitrile), 2.2′-azobis ( 2,4
- the content of the component (F) may be 1% by mass or more, 5% by mass or more, 10% by mass or more, 90% by mass or less, 80% by mass or less, based on the total amount of the curable resin composition. It may be 70% by mass or less.
- a curable resin composition having a viscosity suitable for coating and good workability is easily obtained.
- the pressure-sensitive adhesiveness to the adherend such as glass, plastic, polarizing plate and polycarbonate of the cured resin layer after light irradiation tends to be particularly good.
- the curable resin composition may contain a gelling agent such as 1,2-hydroxystearic acid or a thixotropic agent instead of or together with the polymer.
- a gelling agent such as 1,2-hydroxystearic acid or a thixotropic agent instead of or together with the polymer.
- the curable resin composition may further contain other additives as necessary.
- other additives include adhesion improving agents such as silane coupling agents, thermal polymerization initiators, antioxidants, chain transfer agents, stabilizers, and photosensitizers.
- the curable resin composition may not substantially contain an organic solvent from the viewpoint of moisture and heat resistance reliability and from the viewpoint of suppressing the generation of bubbles in the cured product.
- the “organic solvent” means an organic compound that does not have a radical polymerizable group, is liquid at 25 ° C., and has a boiling point of 250 ° C. or less at atmospheric pressure.
- substantially free of an organic solvent means that it does not contain an intentionally added organic solvent, and an embodiment in which a trace amount of an organic solvent is present in the curable resin composition. Do not exclude.
- the content of the organic solvent in the curable resin composition is 1.0 ⁇ 10 3 ppm or less, 5.0 ⁇ 10 2 ppm or less, or 1 with respect to the total amount of the curable resin composition. It may be 0.0 ⁇ 10 2 ppm or less.
- the curable resin composition may not contain any organic solvent.
- the viscosity of the curable resin composition at a temperature in at least a part of the range of 25 ° C. to 70 ° C. is 10 mPa ⁇ s or more, 4.0 ⁇ 10 2 mPa ⁇ s or more, 5.0 ⁇ It may be 10 2 mPa ⁇ s or more, 1.0 ⁇ 10 3 mPa ⁇ s or more, 2.0 ⁇ 10 3 mPa ⁇ s or more, or 3.0 ⁇ 10 3 mPa ⁇ s or more, 5.0 ⁇ 10 4 mPa ⁇ s or less, 2.0 ⁇ 10 4 mPa ⁇ s or less, 1.5 ⁇ 10 4 mPa ⁇ s or less, 1.25 ⁇ 10 4 mPa ⁇ s or less, or 1.0 ⁇ 10 4 mPa ⁇ s It may be the following.
- the viscosity at 25 ° C. is a value measured based on JIS Z 8803, and specifically, a value measured using a B-type viscometer (for example, BL2 manufactured by Toki Sangyo Co., Ltd.). Calibration of the B-type viscometer can be performed based on JIS Z 8809-JS14000.
- the viscosity at a temperature exceeding 25 ° C. can be measured according to the method for measuring the viscosity at 25 ° C.
- the curable resin composition can exhibit pressure-sensitive adhesiveness when irradiated with active energy rays.
- the curable resin composition preferably has a pressure-sensitive adhesive strength of 10 N / cm 2 or more, more preferably 20 N / cm 2 or more, and further preferably 40 N / cm 2 or more.
- the pressure-sensitive adhesive force is measured by the following method and conditions.
- a curable resin composition is applied onto a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and a curable resin layer having a width of 0.6 mm, a length of 25 mm, and a film thickness of 50 ⁇ m is applied to the curable resin layer.
- the second glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm on the curable resin layer within 1 minute from the light irradiation, the long side of the first glass substrate and the second glass substrate It arrange
- the test force when the first glass substrate and the second glass substrate of the measurement sample are peeled in the opposite long side directions is measured, and this test force is set to be curable.
- the value divided by the contact area between the resin layer and the second glass substrate is defined as the pressure-sensitive adhesive force.
- 101 indicates a first glass substrate
- 102 indicates a second glass substrate
- 103 indicates a curable resin layer
- D indicates a peeling direction.
- the curable resin composition preferably has a resin characteristic such that the aspect ratio after bonding of the curable resin layer to be formed is high.
- a specific aspect ratio value is preferably 0.4 or more, more preferably 0.6 or more, and still more preferably 0.8 or more. When the aspect ratio is 0.4 or more, wettability is easily secured, and adhesion to the member is easily obtained.
- the aspect ratio value is measured by the following method and conditions.
- a curable resin composition is applied onto a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and a curable resin layer having a width of 0.6 mm, a length of 25 mm, and a film thickness of 50 ⁇ m is applied to the curable resin layer.
- the second glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm on the curable resin layer within 1 minute from the light irradiation, the long side of the first glass substrate and the second glass substrate It arrange
- B / 0.6 is the aspect ratio.
- reference numeral 104 denotes a first glass substrate
- 106 denotes a second glass substrate
- 105 denotes a curable resin layer
- A denotes 0.6 (width of the curable resin layer).
- the curable resin composition of the present embodiment has a light shielding property that suppresses light leakage from between the image display unit and the frame unit and is efficient even in a narrow region in manufacturing an image display device. It can be used to form a light-shielding layer that can be formed on the substrate.
- an image display device including a light-shielding layer formed from a curable resin composition and a manufacturing method thereof will be described.
- FIG. 3 is a cross-sectional view showing an embodiment of the image display device.
- the image display apparatus 100 shown in FIG. 3 supplies light to the liquid crystal panel 41 and the image display unit 1 including the liquid crystal panel 41 having the image display surface 41S, the cover member 20, and the light-transmitting pressure-sensitive adhesive layer 42.
- the cover member 20 includes a cover glass 21 having a light transmission portion 25 facing the image display surface 41S, and a frame portion 22 provided on the peripheral portion of the main surface of the cover glass 21 on the image display surface 41S side.
- the light transmissive pressure sensitive adhesive layer 42 is bonded between the liquid crystal panel 41 and the cover member 20 while being interposed.
- the light-transmissive pressure-sensitive adhesive layer 42 is generally sometimes referred to as OCA (Optical clear adhesive).
- the backlight unit 43 includes a light source 45 and an optical sheet unit 46 for supplying light from the light source 45 to the liquid crystal panel 41.
- the frame unit 5 includes a resin frame 51 provided around the liquid crystal panel 41 and the backlight unit 43, a backlight frame 52 that houses the backlight unit 43 outside the resin frame 51, and a backlight frame 52. And a housing frame 53.
- the resin frame 51 supports the image display unit 1 by adhering to the peripheral portion of the liquid crystal panel 41 and the frame portion 22 of the cover member 20 with the light shielding layer 3 interposed therebetween.
- the backlight frame 52 supports the image display unit 1 by adhering to the frame unit 22 with the light shielding layer 3 interposed therebetween.
- the housing frame 53 supports the image display unit 1 by adhering to the frame unit 22 with the light shielding layer 3 interposed.
- the light shielding layer 3 has four light shielding layers 3, which are provided between the liquid crystal panel 41 or the cover member 20 (frame portion 22) and the frame portion 5, respectively.
- the light shielding layer 3 can have such a light transmittance that light leakage from the backlight unit 43 is substantially invisible.
- the average light transmittance at 400 to 700 nm of the light shielding layer 3 may be less than 10%.
- This average light transmittance may be, for example, a value measured under the condition of irradiating light in the thickness direction of the light shielding layer 3.
- the light-shielding layer 3 may form a closed frame-like body that completely surrounds the periphery of the backlight unit 43, and surrounds a part of the periphery of the backlight unit 43 as long as light leakage can be sufficiently suppressed.
- An open frame-like body may be formed.
- the light shielding layer 3 between at least one selected from the resin frame 51, the backlight frame 52, and the housing frame 53 and the image display unit 1 is coated with a curable resin composition and active energy rays. It can be formed by a method including irradiation.
- a part of the light shielding layer of the image display device may be formed of a pressure sensitive adhesive tape.
- the width W of each light shielding layer 3 in a direction perpendicular to the direction in which the light shielding layer 3 extends may be 0.5 mm or less.
- the width W is narrow, an image display device having a narrower frame portion and excellent design can be obtained.
- the lower limit of the width W is not particularly limited, but may be about 0.2 mm.
- the members constituting the image display unit 1 and the frame unit 5 can be appropriately selected from those normally employed in the field of image display devices.
- the optical sheet unit 46 of the backlight unit 43 generally includes a lens sheet, a diffusion sheet, a light guide plate, a reflection sheet, and the like.
- the configuration of the optical sheet image display device is not limited to the configuration of FIG. 3, and the number and shape of the frames, the portion where the light shielding layer is provided, and the like can be changed as appropriate.
- the frame portion 22 may not be provided, and the peripheral portion of the cover glass 21 and the frame portion 5 may be bonded with the light shielding layer 3 interposed.
- FIGS. 4 and 5 are perspective views showing an embodiment of a method for manufacturing an image display device.
- the method shown in FIGS. 4 and 5 applies a curable resin composition to a predetermined portion (periphery portion of the main surface on the back side) of the image display unit 1 (for example, a cover member) to form a frame-like curable property.
- a step of forming the resin layer 3A (FIG. 4) and a step of proceeding the curing reaction of the curable resin layer 3A by irradiating the curable resin layer 3A with the active energy ray h ⁇ (FIG. 4B).
- the light shielding layer 3 is formed by the progress of the curing reaction in the curable resin layer 3A.
- FIGS. 6 and 7 are also perspective views showing an embodiment of a method for manufacturing an image display device.
- the frame-shaped curable resin layer 3A is formed by applying the curable resin composition to the frame portion 5.
- the other points are the same as the method of FIGS.
- the curable resin composition of this embodiment mentioned above is apply
- a curable resin layer can be efficiently formed in a narrow region.
- the curable resin composition can be applied efficiently and with high accuracy by a method of discharging a liquid curable resin composition from the opening.
- the active energy ray h ⁇ is irradiated to the curable resin layer 3A to advance the curing reaction of the curable resin layer 3A.
- a curing reaction mainly by a radical polymerization reaction proceeds immediately after irradiation with active energy rays. Due to the progress of the curing reaction, appropriate pressure-sensitive adhesiveness can be imparted to the curable resin layer 3A.
- the photoacid generator contained in the curable resin layer 3A usually generates an acid by the action of active energy rays, but the cation reaction catalyzed by the acid proceeds at a relatively slower reaction rate than the radical polymerization reaction. To do. Therefore, it can be said that the curable resin layer 3A is semi-cured by radical polymerization reaction at the stage of irradiation with active energy rays.
- the storage elastic modulus at 25 ° C. of the curable resin layer at the time of bonding is 10,000 to 500,000 Pa. It is preferably 30000-250,000 Pa, more preferably 50000-200000 Pa.
- a ′ indicates the width of a predetermined part of the frame-shaped curable resin layer 3A applied to the image display unit 1, and B ′ is after the image display unit 1 and the frame unit 5 are bonded together.
- part of 3 A of curable resin layers is shown.
- a ′ and B ′ indicate widths at the same positions as A and B shown in FIG.
- the widths of A ′ and B ′ are, for example, that the predetermined part is a direction in which the curable resin layer 3A extends from the curable resin layer 3A before and after the image display unit 1 and the frame unit 5 are bonded to each other.
- the line width where the curable resin layer 3A before bonding and the image display unit 1 are in contact is A ′, the curable resin layer 3A after bonding, and The line width in contact with the frame portion 5 is B ′.
- connect is A '
- the line width where the curable resin layer 3A and the image display unit 1 are in contact is B ′.
- the curing reaction of the curable resin layer 3 ⁇ / b> A may be further cured in the state of a laminate having the image display unit 1 and the frame unit 5 and bonded together.
- the curing reaction that proceeds after the bonding may be referred to as “delayed curing”.
- Delay hardening can be advanced over 12 hours in the environment of 10 degreeC or more, 15 degreeC or more, or 20 degreeC or more, for example.
- the temperature of the environment for causing delayed curing may be 80 ° C. or less. While the delayed curing is proceeding, other necessary steps such as a step of further processing the image display device and / or a step of inspecting the image display device may be performed.
- the delayed curing may be radical polymerization, but more typically is a curing reaction by a cationic reaction having a slower reaction rate than radical polymerization. Delayed curing proceeds by the cationic reaction of the cyclic ether group of the component (B1) or component (E) contained in the curable resin layer 3A. This cationic reaction can be promoted by the acid generated from the photoacid generator.
- the curable resin layer 3A that is, the light shielding layer 3) after delayed curing can bond the cover member and the image display unit with higher adhesive force.
- Photoradical polymerization initiator Photoradical polymerization initiator that generates a base
- IRG-907 manufactured by BASF Japan, IRGACURE-907, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one
- B Monomer component
- B1 Compound having one radical polymerizable group and a cyclic ether group 4HBAGE (manufactured by Nippon Kasei Co., Ltd., 4HBAGE, 4-hydroxybutyl acrylate glycidyl ether)
- B2 Monofunctional monomer having one radical polymerizable group: NOAA (manufactured by Osaka Organic Chemical Industry Co., Ltd., NOAA, n-octyl acrylate) ⁇
- IBXA Korean Organic Chemical Industry Co., Ltd., NOAA, n-octyl acrylate
- oligomer (a copolymer of 2-ethylhexyl acrylate and 2-hydroxyethyl acrylate) was synthesized by the following procedure. Charge 2-ethylhexyl acrylate (90.0 g), 2-hydroxyethyl acrylate (10.0 g), methyl ethyl ketone (30.0 g), and ethyl acetate (170.0 g) into a container and purge with nitrogen at a flow rate of 100 mL / min. While heating, from normal temperature (25 ° C.) to 65 ° C. After reaching 65 ° C., azobisisobutyronitrile (0.3 g) was added, and kept at this temperature for 8 hours.
- isostearyl acrylate (100.0 g) was added, and the solvent methyl ethyl ketone and ethyl acetate were distilled off, whereby a copolymer of 2-ethylhexyl acrylate and 2-hydroxyethyl acrylate (weight average molecular weight 600,000) was obtained.
- An isostearyl acrylate solution (heating residue 50%) was obtained.
- Adhesive strength (initial, after delayed curing) 8 and 9 are schematic views showing a method for measuring the adhesive force. As shown in FIG. 8, two curable resins facing each other on the glass base 60 by applying a curable resin composition to both ends of the center of a strip-shaped glass base 60 of 25 cm ⁇ 75 cm ⁇ 0.1 cm. Layer 3A (height 0.05 mm, width 0.4 to 0.6 mm, length 30 to 40 mm) was formed.
- Irradiation to the formed curable resin layer 3A using an ultraviolet irradiation device made by Eye Graphics Co., Ltd., US5-X0401, light source used: made by Eye Graphics Co., Ltd., metal halide lamp M04-L41
- the curing reaction of the curable resin layer 3A was partially advanced by irradiating with ultraviolet rays so that the intensity was 400 mW / cm 2 and the total irradiation amount was 2000 mJ / cm 2 .
- the irradiation output was measured with an illuminance meter (“UIT-250” manufactured by USHIO INC.).
- the glass base 60 and another strip-shaped glass base 61 are connected to the glass base 60 while interposing the curable resin layer 3 ⁇ / b> A after ultraviolet irradiation.
- bonding was performed while applying a load of 5 kgf.
- the both ends 61E of the glass base 61 of the obtained glass joined body were fixed in a state where the glass base 61 was horizontal with respect to the ground and the glass base 60 was positioned below the glass base 61. In that state, a load was applied vertically downward (in the direction of arrow F) to the glass base 60, and the load was increased until the glass base 60 was peeled off.
- the test force (load) at the time when the glass base 60 is peeled off is measured, and the value obtained by dividing the test force by the adhesion area between the curable resin layer 3A (or the light shielding layer 3) and the glass base 61 is defined as the adhesive force. Recorded.
- a curable resin composition (1 mL) was dropped on the surface 62S of the soda glass 62 inside the guide 65 and stretched with a glass rod to form a curable resin layer.
- Irradiation intensity with respect to the formed curable resin layer using an ultraviolet irradiation device (Igraphics Co., Ltd., US5-X0401, use light source: Eyegraphics Co., Ltd., metal halide lamp M04-L41) total dose at 400 mW / cm 2 is irradiated such that the 2000 mJ / cm 2, was allowed to proceed a curing reaction of the curable resin layer.
- the irradiation output was measured with an illuminance meter (“UIT-250” manufactured by USHIO INC.).
- the thickness of the curable resin layer after light irradiation was 150 ⁇ m.
- the light transmittance of the curable resin layer after light irradiation at a wavelength of 400 to 700 nm was measured using a visible ultraviolet spectrophotometer (“UV-2400PC” manufactured by Shimadzu Corporation). Based on the average light transmittance at 400 to 700 nm, the light shielding property was evaluated according to the following criteria.
- Table 1 shows the evaluation results of the adhesive strength and the light shielding property regarding each curable tree composition.
- a light shielding layer having sufficient light shielding properties can be easily formed in a narrow region by a method of applying a curable resin composition. Furthermore, the formed light shielding layer expressed high adhesive force.
- the light-shielding layer has a light-shielding property that suppresses light leakage from between the image display unit and the frame unit, and can be efficiently formed even in a narrow region.
- the curable resin composition which can be used in order to form can be provided.
- the adhesive force that can suppress a drop impact and peeling due to a repulsive force of a member (for example, a flexible wiring board (FPC)) constituting the image display device can be suppressed.
- the manufacturing method of the image display apparatus provided with the light shielding layer excellent in the prevention property of light leakage obtained can be provided. These are useful for industrial manufacture of information terminals such as smart phones, touchpads, personal computers, and televisions.
- SYMBOLS 1 ... Image display part, 3 ... Light-shielding layer, 5 ... Frame part, 3A ... Curable resin layer, 20 ... Cover member, 21 ... Cover glass, 22 ... Frame part, 41 ... Liquid crystal panel, 41S ... Image display surface, 42 DESCRIPTION OF SYMBOLS ... Light-transmitting pressure sensitive adhesive layer, 43 ... Backlight part, 45 ... Light source, 46 ... Optical sheet part, 51 ... Resin frame, 52 ... Backlight frame, 53 ... Housing frame, 60, 61 ... Glass base, 61E ... Both ends of the glass base 61, 62 ... soda glass, 62S ... surface of the soda glass 62, 65 ... guide, 100 ... image display device, W ... width of the light shielding layer.
Abstract
Description
幅25mm、長さ75mm、厚み1mmの第1のガラス基材上に硬化性樹脂組成物を塗布して、幅0.6mm、長さ25mm、膜厚50μmの硬化性樹脂層を硬化性樹脂層の長さ方向が第1のガラス基材の長辺と直交するように設け、硬化性樹脂層に、照射強度3000mW/cm2で総照射量が5000mJ/cm2になるように波長365nmの光を照射し、光照射から1分間以内の硬化性樹脂層上に幅25mm、長さ75mm、厚み1mmの第2のガラス基材を、第1のガラス基材の長辺と第2のガラス基材の長辺とが鉛直方向から見て揃うように配置し、1Nの荷重を10秒間かけて貼り合わせて測定サンプルを得る。貼り合わせから1時間以内に、測定サンプルの第1のガラス基材及び第2のガラス基材を互いに反対の長辺方向に引き剥がしたときの試験力を測定し、この試験力を、硬化性樹脂層と第2のガラス基材との接触面積で割った値を感圧性接着力とする。 The curable resin composition may have a pressure-sensitive adhesive force determined by the following method of 10 N / cm 2 or more.
A curable resin composition is applied onto a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and a curable resin layer having a width of 0.6 mm, a length of 25 mm, and a film thickness of 50 μm is applied to the curable resin layer. length direction arranged so as to be perpendicular to the long side of the first glass substrate, the curable resin layer, irradiation intensity 3000 mW / total dose in cm 2 of wavelength 365nm to be 5000 mJ / cm 2 light The second glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm on the curable resin layer within 1 minute from the light irradiation, the long side of the first glass substrate and the second glass substrate It arrange | positions so that it may align with the long side of a material seeing from a perpendicular direction, and a 1N load is bonded over 10 seconds, and a measurement sample is obtained. Within one hour after bonding, the test force when the first glass substrate and the second glass substrate of the measurement sample are peeled in the opposite long side directions is measured, and this test force is set to be curable. The value divided by the contact area between the resin layer and the second glass substrate is defined as the pressure-sensitive adhesive force.
幅25mm、長さ75mm、厚み1mmの第1のガラス基材上に硬化性樹脂組成物を塗布して、幅0.6mm、長さ25mm、膜厚50μmの硬化性樹脂層を硬化性樹脂層の長さ方向が第1のガラス基材の長辺と直交するように設け、硬化性樹脂層に、照射強度3000mW/cm2で総照射量が5000mJ/cm2になるように波長365nmの光を照射し、光照射から1分間以内の硬化性樹脂層上に幅25mm、長さ75mm、厚み1mmの第2のガラス基材を、第1のガラス基材の長辺と第2のガラス基材の長辺とが鉛直方向から見て揃うように配置し、1Nの荷重を10秒間かけて貼り合わせて測定サンプルを得る。測定サンプルにおける第2のガラス基材と接触している硬化性樹脂層の幅をB(単位:mm)としたときに、B/0.6をアスペクト比とする。 The curable resin composition may have an aspect ratio of 0.4 or more obtained by the following method.
A curable resin composition is applied onto a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and a curable resin layer having a width of 0.6 mm, a length of 25 mm, and a film thickness of 50 μm is applied to the curable resin layer. length direction arranged so as to be perpendicular to the long side of the first glass substrate, the curable resin layer, irradiation intensity 3000 mW / total dose in cm 2 of wavelength 365nm to be 5000 mJ / cm 2 light The second glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm on the curable resin layer within 1 minute from the light irradiation, the long side of the first glass substrate and the second glass substrate It arrange | positions so that it may align with the long side of a material seeing from a perpendicular direction, and a 1N load is bonded over 10 seconds, and a measurement sample is obtained. When the width of the curable resin layer in contact with the second glass substrate in the measurement sample is B (unit: mm), B / 0.6 is the aspect ratio.
アスペクト比=B’/A’
[式中、A’は、上記画像表示部及び上記フレーム部のうちの一方に塗布された上記枠状の硬化性樹脂層の所定の部位における幅を示し、B’は、上記画像表示部と上記フレーム部とが貼り合わされた後の上記硬化性樹脂層の上記所定の部位における上記画像表示部及び上記フレーム部のうちの他方と接触している幅を示す。] In the above method, the image display unit and the frame unit may be bonded so that an aspect ratio represented by the following formula is 0.4 or more.
Aspect ratio = B '/ A'
[In the formula, A ′ represents a width at a predetermined portion of the frame-shaped curable resin layer applied to one of the image display unit and the frame unit, and B ′ represents the image display unit and the image display unit. The width | variety which is in contact with the other of the said image display part and the said frame part in the said predetermined part of the said curable resin layer after the said frame part is bonded together is shown. ]
光ラジカル重合開始剤は、活性エネルギー線の照射により遊離ラジカルを発生させ、単量体成分のラジカル重合による硬化反応(重合反応)を促進させる成分である。ここで活性エネルギー線は、紫外線、電子線、α線、β線等から選ぶことができる。 (A) Component: Photoradical Polymerization Initiator The photoradical polymerization initiator is a component that generates a free radical by irradiation with active energy rays and accelerates a curing reaction (polymerization reaction) by radical polymerization of the monomer component. Here, the active energy rays can be selected from ultraviolet rays, electron rays, α rays, β rays and the like.
(B1)成分が有するラジカル重合性基としては、(メタ)アクリロイル基、ビニル基、エチニル基、イソプロペニル基、ビニルエーテル基及びビニルチオエーテル基が挙げられる。(B1)成分としては、例えば、グリシジル(メタ)アクリレート、3,4-エポキシシクロヘキシルメチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレートグリシジルエーテル、プロピレンオキシド(PO)変性ビスフェノールAジグリシジルエーテルジアクリレート、ノボラック部分エポキシアクリレート、ビスフェノールAジグリシジルエーテルのアクリル酸付加物、3-オキセタニルメチル(メタ)アクリレート、3-メチル-3-オキセタニルメチル(メタ)アクリレート、3-エチル-3-オキセタニルメチル(メタ)アクリレート、3-ブチル-3-オキセタニルメチル(メタ)アクリレート、3-ヘキシル-3-オキセタニルメチル(メタ)アクリレートが挙げられる。(B1)成分は、アリルグリシジルエーテルであってもよい。 (B) Component: Monomer Component (B1) The radical polymerizable group of the component includes (meth) acryloyl group, vinyl group, ethynyl group, isopropenyl group, vinyl ether group and vinyl thioether group. Examples of the component (B1) include glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate glycidyl ether, propylene oxide (PO) modified bisphenol A diglycidyl ether di Acrylate, novolac partial epoxy acrylate, acrylic acid adduct of bisphenol A diglycidyl ether, 3-oxetanylmethyl (meth) acrylate, 3-methyl-3-oxetanylmethyl (meth) acrylate, 3-ethyl-3-oxetanylmethyl (meth) ) Acrylate, 3-butyl-3-oxetanylmethyl (meth) acrylate, and 3-hexyl-3-oxetanylmethyl (meth) acrylate. The component (B1) may be allyl glycidyl ether.
着色剤は、硬化性樹脂組成物及び遮光層を着色して、形成される遮光層に適切な遮光性を付与する成分である、着色剤の色相に特に制限はなく、様々な色相を持つ着色剤を用いることができるが、着色剤は典型的には黒色を呈する。着色剤は、例えば、染料、及び/又は顔料を含むことができる。均一な硬化性樹脂組成物を得る観点から、単量体成分に溶解する着色剤を選択してもよい。 (C) Component: Colorant The colorant is a component that colors the curable resin composition and the light-shielding layer and imparts appropriate light-shielding properties to the formed light-shielding layer, and there is no particular limitation on the hue of the colorant. Although colorants with various hues can be used, the colorants typically exhibit a black color. The colorant can include, for example, a dye and / or a pigment. From the viewpoint of obtaining a uniform curable resin composition, a colorant that dissolves in the monomer component may be selected.
幅25mm、長さ75mm、厚み1mmの第1のガラス基材上に硬化性樹脂組成物を塗布して、幅0.6mm、長さ25mm、膜厚50μmの硬化性樹脂層を硬化性樹脂層の長さ方向が第1のガラス基材の長辺と直交するように設け、硬化性樹脂層に、照射強度3000mW/cm2で総照射量が5000mJ/cm2になるように波長365nmの光を照射し、光照射から1分間以内の硬化性樹脂層上に幅25mm、長さ75mm、厚み1mmの第2のガラス基材を、第1のガラス基材の長辺と第2のガラス基材の長辺とが鉛直方向から見て揃うように配置し、1Nの荷重を10秒間かけて貼り合わせて測定サンプルを得る(図1)。貼り合わせから1時間以内に、測定サンプルの第1のガラス基材及び第2のガラス基材を互いに反対の長辺方向に引き剥がしたときの試験力を測定し、この試験力を、硬化性樹脂層と第2のガラス基材との接触面積で割った値を感圧性接着力とする。なお、図1中、101は第1のガラス基材を示し、102は第2のガラス基材を示し、103は硬化性樹脂層を示し、Dは引き剥がす方向を示す。 (Measurement method of pressure-sensitive adhesive force)
A curable resin composition is applied onto a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and a curable resin layer having a width of 0.6 mm, a length of 25 mm, and a film thickness of 50 μm is applied to the curable resin layer. length direction arranged so as to be perpendicular to the long side of the first glass substrate, the curable resin layer, irradiation intensity 3000 mW / total dose in cm 2 of wavelength 365nm to be 5000 mJ / cm 2 light The second glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm on the curable resin layer within 1 minute from the light irradiation, the long side of the first glass substrate and the second glass substrate It arrange | positions so that it may align with the long side of a material seeing from a perpendicular direction, and a 1N load is bonded over 10 second, and a measurement sample is obtained (FIG. 1). Within one hour after bonding, the test force when the first glass substrate and the second glass substrate of the measurement sample are peeled in the opposite long side directions is measured, and this test force is set to be curable. The value divided by the contact area between the resin layer and the second glass substrate is defined as the pressure-sensitive adhesive force. In FIG. 1, 101 indicates a first glass substrate, 102 indicates a second glass substrate, 103 indicates a curable resin layer, and D indicates a peeling direction.
幅25mm、長さ75mm、厚み1mmの第1のガラス基材上に硬化性樹脂組成物を塗布して、幅0.6mm、長さ25mm、膜厚50μmの硬化性樹脂層を硬化性樹脂層の長さ方向が第1のガラス基材の長辺と直交するように設け、硬化性樹脂層に、照射強度3000mW/cm2で総照射量が5000mJ/cm2になるように波長365nmの光を照射し、光照射から1分間以内の硬化性樹脂層上に幅25mm、長さ75mm、厚み1mmの第2のガラス基材を、第1のガラス基材の長辺と第2のガラス基材の長辺とが鉛直方向から見て揃うように配置し、1Nの荷重を10秒間かけて貼り合わせて測定サンプルを得る(図2の(a)及び(b))。測定サンプルにおける第2のガラス基材と接触している硬化性樹脂層の幅をB(単位:mm)としたときに、B/0.6をアスペクト比とする。なお、図2中、104は第1のガラス基材を示し、106は第2のガラス基材を示し、105は硬化性樹脂層を示し、Aは0.6(硬化性樹脂層の幅)を示す。 (Aspect ratio measurement method)
A curable resin composition is applied onto a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and a curable resin layer having a width of 0.6 mm, a length of 25 mm, and a film thickness of 50 μm is applied to the curable resin layer. length direction arranged so as to be perpendicular to the long side of the first glass substrate, the curable resin layer, irradiation intensity 3000 mW / total dose in cm 2 of wavelength 365nm to be 5000 mJ / cm 2 light The second glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm on the curable resin layer within 1 minute from the light irradiation, the long side of the first glass substrate and the second glass substrate It arrange | positions so that it may align with the long side of a material seeing from a perpendicular direction, and a 1N load is bonded over 10 second, and a measurement sample is obtained ((a) and (b) of FIG. 2). When the width of the curable resin layer in contact with the second glass substrate in the measurement sample is B (unit: mm), B / 0.6 is the aspect ratio. In FIG. 2,
図4に示すように、画像表示部1の主面の周縁部に、上述した本実施形態の硬化性樹脂組成物を塗布し、枠状の硬化性樹脂層3Aを形成する。塗布の手段を調整することにより、狭小な領域に効率的に硬化性樹脂層を形成することができる。例えば、液状の硬化性樹脂組成物を開口から吐出させる方法により、硬化性樹脂組成物を効率的且つ高い精度で塗布することができる。 Process (I) (Coating process)
As shown in FIG. 4, the curable resin composition of this embodiment mentioned above is apply | coated to the peripheral part of the main surface of the
その後、硬化性樹脂層3Aに活性エネルギー線hνを照射して、硬化性樹脂層3Aの硬化反応を進行させる。硬化性樹脂層3Aでは、活性エネルギー線の照射の直後に、主としてラジカル重合反応による硬化反応が進行する。この硬化反応の進行により、硬化性樹脂層3Aに適切な感圧接着性を付与することができる。硬化性樹脂層3Aに含まれる光酸発生剤は、通常、活性エネルギー線の作用によって酸を発生させるが、酸に触媒されるカチオン反応は、ラジカル重合反応よりも相対的に遅い反応速度で進行する。したがって、活性エネルギー線の照射の段階で、硬化性樹脂層3Aがラジカル重合反応によって半硬化するということもできる。 Process (II) (active energy ray irradiation process)
Thereafter, the active energy ray hν is irradiated to the
図5の(a)に示すように、活性エネルギー線が照射され、感圧接着性を有する硬化性樹脂層3Aを介在させながら、画像表示部1と、フレーム部5とを貼り合わせる。必要により、硬化性樹脂層3Aを加熱しながら画像表示部1と、フレーム部5とを貼り合わせてもよい。 Process (III) (bonding process)
As shown in FIG. 5 (a), the
アスペクト比=B’/A’
式中、A’は、画像表示部1に塗布された枠状の硬化性樹脂層3Aの所定の部位における幅を示し、B’は、画像表示部1とフレーム部5とが貼り合わされた後の硬化性樹脂層3Aの所定の部位におけるフレーム部5と接触している幅を示す。ここで、A’及びB’は、図2に示したA及びBと同様の位置における幅を示す。 In the bonding process, it is preferable to bond the
Aspect ratio = B '/ A'
In the formula, A ′ indicates the width of a predetermined part of the frame-shaped
図5の(b)に示すように、画像表示部1とフレーム部5とを有しこれらが貼り合わされた積層体の状態で、硬化性樹脂層3Aの硬化反応を更に硬化させてもよい。本明細書において、貼り合わせの後で進行する硬化反応のことを「遅延硬化」ということがある。遅延硬化は、例えば、10℃以上、15℃以上、又は20℃以上の環境下で12時間以上かけて進行させることができる。遅延硬化を進行させるための環境の温度は、80℃以下であってもよい。遅延硬化を進行させる間に、画像表示装置を更に加工する工程、及び/又は画像表示装置を検査する工程等の、他の必要な工程を行ってもよい。 Process (IV) (Curing process)
As shown in FIG. 5B, the curing reaction of the
(A)光ラジカル重合開始剤
光ラジカル重合開始剤(塩基を発生させる光ラジカル重合開始剤):
・IRG-907(BASFジャパン株式会社製、IRGACURE-907、2-メチル-1-(4-メチルチオフェニル)-2-モルフォリノプロパン-1-オン)
(B)単量体成分
(B1)1個のラジカル重合性基と環状エーテル基とを有する化合物
・4HBAGE(日本化成株式会社製、4HBAGE、4-ヒドロキシブチルアクリレートグリシジルエーテル)
(B2)1個のラジカル重合性基を有する単官能単量体
・NOAA(大阪有機化学工業株式会社製、NOAA、n-オクチルアクリレート)
・IBXA(共栄社化学株式会社製、ライトアクリレートIB-XA、イソボルニルアクリレート)
・HPA(大阪有機化学工業株式会社製、HPA、ヒドロキシプロピルアクリレート)
(C)着色剤
・elixa Black850(オリエント化学工業株式会社製、黒色染料)
(D)光酸発生剤
・CPI-210S(サンアプロ株式会社製、CPI-210S、トリアリールスルホニウム塩系光酸発生剤) Raw material of curable resin composition (A) Photoradical polymerization initiator Photoradical polymerization initiator (photoradical polymerization initiator that generates a base):
IRG-907 (manufactured by BASF Japan, IRGACURE-907, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one)
(B) Monomer component (B1) Compound having one radical polymerizable group and a cyclic ether group 4HBAGE (manufactured by Nippon Kasei Co., Ltd., 4HBAGE, 4-hydroxybutyl acrylate glycidyl ether)
(B2) Monofunctional monomer having one radical polymerizable group: NOAA (manufactured by Osaka Organic Chemical Industry Co., Ltd., NOAA, n-octyl acrylate)
・ IBXA (Kyoeisha Chemical Co., Ltd., light acrylate IB-XA, isobornyl acrylate)
・ HPA (Osaka Organic Chemical Co., Ltd., HPA, hydroxypropyl acrylate)
(C) Colorant / elexa Black850 (Orient Chemical Co., Ltd., black dye)
(D) Photoacid generator / CPI-210S (manufactured by Sun Apro Co., Ltd., CPI-210S, triarylsulfonium salt photoacid generator)
下記手順により、オリゴマー(2-エチルヘキシルアクリレートと2-ヒドロキシエチルアクリレートのコポリマー)を合成した。
容器に2-エチルヘキシルアクリレート(90.0g)、2-ヒドロキシエチルアクリレート(10.0g)、メチルエチルケトン(30.0g)、及び酢酸エチル(170.0g)を投入し、100mL/分の流量で窒素置換しながら、常温(25℃)から65℃まで加熱した。65℃に到達後、アゾビスイソブチロニトリル(0.3g)を添加し、この温度を保ちながら8時間保温した。
続いて、イソステアリルアクリレート(100.0g)を添加し、溶媒のメチルエチルケトン及び酢酸エチルを溜去することにより、2-エチルヘキシルアクリレートと2-ヒドロキシエチルアクリレートの共重合体(重量平均分子量600,000)のイソステアリルアクリレート溶液(加熱残分50%)を得た。 (F) Polymer (oligomer)
An oligomer (a copolymer of 2-ethylhexyl acrylate and 2-hydroxyethyl acrylate) was synthesized by the following procedure.
Charge 2-ethylhexyl acrylate (90.0 g), 2-hydroxyethyl acrylate (10.0 g), methyl ethyl ketone (30.0 g), and ethyl acetate (170.0 g) into a container and purge with nitrogen at a flow rate of 100 mL / min. While heating, from normal temperature (25 ° C.) to 65 ° C. After reaching 65 ° C., azobisisobutyronitrile (0.3 g) was added, and kept at this temperature for 8 hours.
Subsequently, isostearyl acrylate (100.0 g) was added, and the solvent methyl ethyl ketone and ethyl acetate were distilled off, whereby a copolymer of 2-ethylhexyl acrylate and 2-hydroxyethyl acrylate (weight average molecular weight 600,000) was obtained. An isostearyl acrylate solution (heating residue 50%) was obtained.
各原料を表1に示す含有量で混合し、30分間加熱しながら攪拌して、硬化性樹脂組成物を調製した。表1に示される各成分の含有量は、硬化性樹脂組成物の全質量を基準とした含有量(単位:質量%)である。 Preparation of curable resin composition Each raw material was mixed with the content shown in Table 1, and stirred for 30 minutes while heating to prepare a curable resin composition. Content of each component shown by Table 1 is content (unit: mass%) on the basis of the total mass of curable resin composition.
1.接着力(初期、遅延硬化後)
図8及び図9は、接着力の測定方法を示す模式図である。図8に示すように、25cm×75cm×0.1cmの短冊状のガラスベース60の中央の両端部に硬化性樹脂組成物を塗布して、ガラスベース60上で対向する2個の硬化性樹脂層3A(高さ0.05mm、幅0.4~0.6mm、長さ30mm~40mm)を形成した。形成された硬化性樹脂層3Aに対して、紫外線照射装置(アイグラフィックス(株)製、US5-X0401、使用光源:アイグラフィックス(株)製、メタルハライドランプM04-L41)を用いて、照射強度400mW/cm2で総照射量が2000mJ/cm2になるように紫外線を照射して、硬化性樹脂層3Aの硬化反応を部分的に進行させた。照射出力は照度計(ウシオ電機株式会社製「UIT-250」)にて測定した。
8 and 9 are schematic views showing a method for measuring the adhesive force. As shown in FIG. 8, two curable resins facing each other on the
板状のソーダガラス62(フロートガラス、松浪ガラス製「MICRO SLIDE GLASSS9213」、サイズ76×52mm、厚さ1.2~1.5mm、照射光透過率90%)を、アセトンを染み込ませた不織布(旭化成せんい株式会社製「ベンコット」)でよく拭き、これを試験用ガラス基材として用いた。図10に示すように、ソーダガラス62の一方の主面の四片に沿ってテープ(オカモト株式会社製「No.402布テープ」、幅50mm)を貼り付け、枠状のガイド65を形成した。 2. Light shielding property Plate-like soda glass 62 (float glass, Matsunami glass “MICRO SLIDE GLASSS 9213”, size 76 × 52 mm, thickness 1.2 to 1.5 mm, irradiation light transmittance 90%) was impregnated with acetone. It was wiped well with a non-woven fabric ("Bencot" manufactured by Asahi Kasei Fibers Co., Ltd.) and used as a glass substrate for testing. As shown in FIG. 10, a tape (“No. 402 cloth tape” manufactured by Okamoto Co., Ltd., width 50 mm) was attached along four pieces of one main surface of the
A:400~700nmでの平均光透過率が10%未満
F:400~700nmでの平均光透過率が10%以上 The light transmittance of the curable resin layer after light irradiation at a wavelength of 400 to 700 nm was measured using a visible ultraviolet spectrophotometer (“UV-2400PC” manufactured by Shimadzu Corporation). Based on the average light transmittance at 400 to 700 nm, the light shielding property was evaluated according to the following criteria.
A: Average light transmittance at 400 to 700 nm is less than 10% F: Average light transmittance at 400 to 700 nm is 10% or more
Claims (12)
- 光ラジカル重合開始剤と、単量体成分と、着色剤と、光酸発生剤と、を含有し、前記単量体成分が、1個のラジカル重合性基と環状エーテル基とを有する単量体を含む、硬化性樹脂組成物。 A monomer comprising a photo radical polymerization initiator, a monomer component, a colorant, and a photo acid generator, wherein the monomer component has one radical polymerizable group and a cyclic ether group. A curable resin composition comprising a body.
- 光ラジカル重合開始剤と、単量体成分と、着色剤と、光酸発生剤と、環状エーテル基を有する化合物と、を含有し、前記単量体成分が、1個のラジカル重合性基を有する単量体を含む、硬化性樹脂組成物。 A photo radical polymerization initiator, a monomer component, a colorant, a photo acid generator, and a compound having a cyclic ether group, wherein the monomer component has one radical polymerizable group. A curable resin composition comprising a monomer having the same.
- ポリマーを更に含有する、請求項1又は2に記載の硬化性樹脂組成物。 The curable resin composition according to claim 1 or 2, further comprising a polymer.
- 遮光層形成用である、請求項1~3のいずれか一項に記載の硬化性樹脂組成物。 The curable resin composition according to any one of claims 1 to 3, which is used for forming a light shielding layer.
- 活性エネルギー線が照射されると感圧接着性を発現する、請求項1~4のいずれか一項に記載の硬化性樹脂組成物。 The curable resin composition according to any one of claims 1 to 4, which exhibits pressure-sensitive adhesiveness when irradiated with active energy rays.
- 下記の方法で求められる感圧性接着力が10N/cm2以上である、請求項5に記載の硬化性樹脂組成物。
幅25mm、長さ75mm、厚み1mmの第1のガラス基材上に硬化性樹脂組成物を塗布して、幅0.6mm、長さ25mm、膜厚50μmの硬化性樹脂層を硬化性樹脂層の長さ方向が第1のガラス基材の長辺と直交するように設け、硬化性樹脂層に、照射強度3000mW/cm2で総照射量が5000mJ/cm2になるように波長365nmの光を照射し、光照射から1分間以内の硬化性樹脂層上に幅25mm、長さ75mm、厚み1mmの第2のガラス基材を、第1のガラス基材の長辺と第2のガラス基材の長辺とが鉛直方向から見て揃うように配置し、1Nの荷重を10秒間かけて貼り合わせて測定サンプルを得る。貼り合わせから1時間以内に、測定サンプルの第1のガラス基材及び第2のガラス基材を互いに反対の長辺方向に引き剥がしたときの試験力を測定し、この試験力を、硬化性樹脂層と第2のガラス基材との接触面積で割った値を感圧性接着力とする。 The curable resin composition of Claim 5 whose pressure-sensitive adhesive force calculated | required by the following method is 10 N / cm < 2 > or more.
A curable resin composition is applied onto a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and a curable resin layer having a width of 0.6 mm, a length of 25 mm, and a film thickness of 50 μm is applied to the curable resin layer. length direction arranged so as to be perpendicular to the long side of the first glass substrate, the curable resin layer, irradiation intensity 3000 mW / total dose in cm 2 of wavelength 365nm to be 5000 mJ / cm 2 light The second glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm on the curable resin layer within 1 minute from the light irradiation, the long side of the first glass substrate and the second glass substrate It arrange | positions so that it may align with the long side of a material seeing from a perpendicular direction, and a 1N load is bonded over 10 seconds, and a measurement sample is obtained. Within one hour after bonding, the test force when the first glass substrate and the second glass substrate of the measurement sample are peeled in the opposite long side directions is measured, and this test force is set to be curable. The value divided by the contact area between the resin layer and the second glass substrate is defined as the pressure-sensitive adhesive force. - 下記の方法で求められるアスペクト比が0.4以上である、請求項5又は6に記載の硬化性樹脂組成物。
幅25mm、長さ75mm、厚み1mmの第1のガラス基材上に硬化性樹脂組成物を塗布して、幅0.6mm、長さ25mm、膜厚50μmの硬化性樹脂層を硬化性樹脂層の長さ方向が第1のガラス基材の長辺と直交するように設け、硬化性樹脂層に、照射強度3000mW/cm2で総照射量が5000mJ/cm2になるように波長365nmの光を照射し、光照射から1分間以内の硬化性樹脂層上に幅25mm、長さ75mm、厚み1mmの第2のガラス基材を、第1のガラス基材の長辺と第2のガラス基材の長辺とが鉛直方向から見て揃うように配置し、1Nの荷重を10秒間かけて貼り合わせて測定サンプルを得る。測定サンプルにおける第2のガラス基材と接触している硬化性樹脂層の幅をB(単位:mm)としたときに、B/0.6をアスペクト比とする。 The curable resin composition of Claim 5 or 6 whose aspect-ratio calculated | required with the following method is 0.4 or more.
A curable resin composition is applied onto a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and a curable resin layer having a width of 0.6 mm, a length of 25 mm, and a film thickness of 50 μm is applied to the curable resin layer. length direction arranged so as to be perpendicular to the long side of the first glass substrate, the curable resin layer, irradiation intensity 3000 mW / total dose in cm 2 of wavelength 365nm to be 5000 mJ / cm 2 light The second glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm on the curable resin layer within 1 minute from the light irradiation, the long side of the first glass substrate and the second glass substrate It arrange | positions so that it may align with the long side of a material seeing from a perpendicular direction, and a 1N load is bonded over 10 seconds, and a measurement sample is obtained. When the width of the curable resin layer in contact with the second glass substrate in the measurement sample is B (unit: mm), B / 0.6 is the aspect ratio. - 画像表示面を有する液晶パネル、及び前記画像表示面と対向する光透過部を有するカバー部材を有する画像表示部と、前記画像表示部の周囲に設けられ前記画像表示部を支持するフレーム部と、前記フレーム部と前記画像表示部との間に形成された遮光層と、を備える画像表示装置であって、
前記遮光層が、請求項1~7のいずれか一項に記載の硬化性樹脂組成物からなる硬化性樹脂層の硬化物である、
画像表示装置。 A liquid crystal panel having an image display surface; an image display portion having a cover member having a light transmission portion facing the image display surface; a frame portion provided around the image display portion and supporting the image display portion; An image display device comprising a light shielding layer formed between the frame portion and the image display portion,
The light shielding layer is a cured product of a curable resin layer comprising the curable resin composition according to any one of claims 1 to 7.
Image display device. - 画像表示面を有する液晶パネル、及び前記画像表示面と対向する光透過部を有するカバー部材を有する画像表示部と、前記画像表示部の周囲に設けられ前記画像表示部を支持するフレーム部と、前記フレーム部と前記画像表示部との間に形成された遮光層と、を備える画像表示装置を製造する方法であって、
前記画像表示部又は前記フレーム部に、請求項1~7のいずれか一項に記載の硬化性樹脂組成物を塗布して、枠状の硬化性樹脂層を形成させる工程と、
前記硬化性樹脂層に対して活性エネルギー線を照射することにより、前記硬化性樹脂層の硬化反応を進行させる工程と、
前記硬化性樹脂層を介在させながら前記画像表示部と前記フレーム部とを貼り合わせる工程と、をこの順に備え、
前記遮光層が、硬化反応が進行した前記硬化性樹脂層である、方法。 A liquid crystal panel having an image display surface; an image display portion having a cover member having a light transmission portion facing the image display surface; a frame portion provided around the image display portion and supporting the image display portion; A method of manufacturing an image display device comprising: a light shielding layer formed between the frame portion and the image display portion,
Applying the curable resin composition according to any one of claims 1 to 7 to the image display unit or the frame unit to form a frame-shaped curable resin layer;
Irradiating active energy rays to the curable resin layer to advance a curing reaction of the curable resin layer; and
A step of adhering the image display unit and the frame unit in this order while interposing the curable resin layer,
The method, wherein the light shielding layer is the curable resin layer in which a curing reaction has proceeded. - 前記画像表示部と前記フレーム部とを貼り合わせるときの前記硬化性樹脂層が感圧接着性を有する、請求項9に記載の方法。 The method according to claim 9, wherein the curable resin layer has a pressure-sensitive adhesive property when the image display unit and the frame unit are bonded to each other.
- 下記式で表されるアスペクト比が0.4以上となるように、前記画像表示部と前記フレーム部とを貼り合わせる、請求項9又は10に記載の方法。
アスペクト比=B’/A’
[式中、A’は、前記画像表示部及び前記フレーム部のうちの一方に塗布された前記枠状の硬化性樹脂層の所定の部位における幅を示し、B’は、前記画像表示部と前記フレーム部とが貼り合わされた後の前記硬化性樹脂層の前記所定の部位における前記画像表示部及び前記フレーム部のうちの他方と接触している幅を示す。] The method according to claim 9 or 10, wherein the image display unit and the frame unit are bonded so that an aspect ratio represented by the following formula is 0.4 or more.
Aspect ratio = B '/ A'
[In the formula, A ′ represents a width at a predetermined portion of the frame-shaped curable resin layer applied to one of the image display unit and the frame unit, and B ′ represents the image display unit and The width | variety which has contacted the other of the said image display part and the said frame part in the said predetermined part of the said curable resin layer after the said frame part was bonded together is shown. ] - 前記画像表示部と前記フレーム部とを貼り合わせる前記工程の後、前記硬化性樹脂層の硬化反応を更に進行させる工程を更に備える、請求項9~11のいずれか一項に記載の方法。 The method according to any one of claims 9 to 11, further comprising a step of further proceeding a curing reaction of the curable resin layer after the step of bonding the image display unit and the frame unit.
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KR1020197008419A KR20190045235A (en) | 2016-08-24 | 2017-08-24 | Curable resin composition, image display device, and manufacturing method of image display device |
CN201780051409.8A CN109689699A (en) | 2016-08-24 | 2017-08-24 | The manufacturing method of hardening resin composition, image display device and image display device |
JP2018535763A JPWO2018038221A1 (en) | 2016-08-24 | 2017-08-24 | Curable resin composition, image display device, and method of manufacturing image display device |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018045053A (en) * | 2016-09-13 | 2018-03-22 | パナソニックIpマネジメント株式会社 | Portable information terminal and manufacturing method thereof |
WO2021177079A1 (en) * | 2020-03-02 | 2021-09-10 | 株式会社デンソー | Display device and method for producing display device |
WO2023199845A1 (en) * | 2022-04-15 | 2023-10-19 | 株式会社レゾナック | Heat-curable adhesive composition, layered film, connected structure, and production method therefor |
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---|---|---|---|---|
JP2020164615A (en) * | 2019-03-29 | 2020-10-08 | 日東電工株式会社 | Pressure sensitive adhesive sheet |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10147754A (en) * | 1996-11-20 | 1998-06-02 | Sekisui Chem Co Ltd | Hardenable tacky adhesive sheet and method for bonding member |
JP2000321416A (en) * | 1999-05-10 | 2000-11-24 | Jsr Corp | Radiation sensitive composition for color filter and color filter utilizing the same |
WO2005092981A1 (en) * | 2004-03-26 | 2005-10-06 | Kaneka Corporation | Composition curable by both free-radical photocuring and cationic photocuring |
JP2008013721A (en) * | 2006-07-10 | 2008-01-24 | Kyocera Chemical Corp | Curable resin composition, adhesive for display element, and method for adhesion |
JP2008260879A (en) * | 2007-04-13 | 2008-10-30 | Okura Ind Co Ltd | Active energy ray-curable adhesive composition, polarizing plate using it and its manufacturing method |
JP2010066484A (en) * | 2008-09-10 | 2010-03-25 | Sumitomo Chemical Co Ltd | Polarizing plate, method for manufacturing the same, optical member and liquid crystal display device |
JP2011076058A (en) * | 2009-09-04 | 2011-04-14 | Toyo Ink Mfg Co Ltd | Polarizing plate and photosetting adhesive for forming polarizing plate |
WO2012165259A1 (en) * | 2011-05-31 | 2012-12-06 | 電気化学工業株式会社 | Energy-beam-curable resin composition |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5920030B2 (en) | 1979-10-09 | 1984-05-10 | アキレス株式会社 | Synthetic leather with excellent flexibility and durability |
TW200730553A (en) * | 2006-01-20 | 2007-08-16 | Hitachi Chemical Co Ltd | Resin composition and optical device using hardening thereof |
US8853290B2 (en) * | 2009-06-08 | 2014-10-07 | Sanyo Chemical Industries, Ltd. | Photosensitive composition |
JP2015214681A (en) * | 2014-04-24 | 2015-12-03 | セントラル硝子株式会社 | Curable composition, temporary adhesive material, and method for temporarily adhering member to substrate using the temporary adhesive material |
-
2016
- 2016-08-24 WO PCT/JP2016/074715 patent/WO2018037517A1/en active Application Filing
-
2017
- 2017-08-24 JP JP2018535763A patent/JPWO2018038221A1/en active Pending
- 2017-08-24 TW TW106128814A patent/TW201816053A/en unknown
- 2017-08-24 KR KR1020197008419A patent/KR20190045235A/en unknown
- 2017-08-24 WO PCT/JP2017/030386 patent/WO2018038221A1/en active Application Filing
- 2017-08-24 CN CN201780051409.8A patent/CN109689699A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10147754A (en) * | 1996-11-20 | 1998-06-02 | Sekisui Chem Co Ltd | Hardenable tacky adhesive sheet and method for bonding member |
JP2000321416A (en) * | 1999-05-10 | 2000-11-24 | Jsr Corp | Radiation sensitive composition for color filter and color filter utilizing the same |
WO2005092981A1 (en) * | 2004-03-26 | 2005-10-06 | Kaneka Corporation | Composition curable by both free-radical photocuring and cationic photocuring |
JP2008013721A (en) * | 2006-07-10 | 2008-01-24 | Kyocera Chemical Corp | Curable resin composition, adhesive for display element, and method for adhesion |
JP2008260879A (en) * | 2007-04-13 | 2008-10-30 | Okura Ind Co Ltd | Active energy ray-curable adhesive composition, polarizing plate using it and its manufacturing method |
JP2010066484A (en) * | 2008-09-10 | 2010-03-25 | Sumitomo Chemical Co Ltd | Polarizing plate, method for manufacturing the same, optical member and liquid crystal display device |
JP2011076058A (en) * | 2009-09-04 | 2011-04-14 | Toyo Ink Mfg Co Ltd | Polarizing plate and photosetting adhesive for forming polarizing plate |
WO2012165259A1 (en) * | 2011-05-31 | 2012-12-06 | 電気化学工業株式会社 | Energy-beam-curable resin composition |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018045053A (en) * | 2016-09-13 | 2018-03-22 | パナソニックIpマネジメント株式会社 | Portable information terminal and manufacturing method thereof |
WO2021177079A1 (en) * | 2020-03-02 | 2021-09-10 | 株式会社デンソー | Display device and method for producing display device |
JP2021139957A (en) * | 2020-03-02 | 2021-09-16 | 株式会社デンソー | Display device and manufacturing method for display device |
JP7276198B2 (en) | 2020-03-02 | 2023-05-18 | 株式会社デンソー | Display device and display device manufacturing method |
WO2023199845A1 (en) * | 2022-04-15 | 2023-10-19 | 株式会社レゾナック | Heat-curable adhesive composition, layered film, connected structure, and production method therefor |
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JPWO2018038221A1 (en) | 2019-06-24 |
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