CN109689699A - The manufacturing method of hardening resin composition, image display device and image display device - Google Patents
The manufacturing method of hardening resin composition, image display device and image display device Download PDFInfo
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- CN109689699A CN109689699A CN201780051409.8A CN201780051409A CN109689699A CN 109689699 A CN109689699 A CN 109689699A CN 201780051409 A CN201780051409 A CN 201780051409A CN 109689699 A CN109689699 A CN 109689699A
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- CN
- China
- Prior art keywords
- curable resin
- image display
- resin layer
- methyl
- resin composition
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 85
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 239000000178 monomer Substances 0.000 claims abstract description 55
- 239000003086 colorant Substances 0.000 claims abstract description 37
- 150000001875 compounds Chemical class 0.000 claims abstract description 31
- 230000003287 optical effect Effects 0.000 claims abstract description 27
- 239000002253 acid Substances 0.000 claims abstract description 22
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 21
- 150000004292 cyclic ethers Chemical group 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims description 116
- 239000011347 resin Substances 0.000 claims description 116
- 238000000034 method Methods 0.000 claims description 73
- 239000011521 glass Substances 0.000 claims description 72
- 238000006243 chemical reaction Methods 0.000 claims description 33
- 229920000642 polymer Polymers 0.000 claims description 27
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 24
- 230000008569 process Effects 0.000 claims description 24
- 238000005259 measurement Methods 0.000 claims description 17
- 239000004973 liquid crystal related substance Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 238000005286 illumination Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000007711 solidification Methods 0.000 claims description 8
- 230000008023 solidification Effects 0.000 claims description 8
- 238000012360 testing method Methods 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 139
- -1 methylacryloyl Chemical group 0.000 description 78
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 62
- 239000004615 ingredient Substances 0.000 description 53
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 34
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 24
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 23
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
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- 230000008859 change Effects 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
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- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 3
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 125000005250 alkyl acrylate group Chemical group 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
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- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 2
- STFXXRRQKFUYEU-UHFFFAOYSA-N 16-methylheptadecyl prop-2-enoate Chemical compound CC(C)CCCCCCCCCCCCCCCOC(=O)C=C STFXXRRQKFUYEU-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- USWANRSZMQLWTG-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)butyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOCC1CO1 USWANRSZMQLWTG-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
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- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920013639 polyalphaolefin Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 125000005425 toluyl group Chemical group 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
- C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133325—Assembling processes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
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Abstract
The present invention discloses a kind of hardening resin composition, and containing optical free radical polymerization initiator, monomer component, colorant and photo-acid generator, monomer component includes the monomer rolled into a ball with cyclic ether group and 1 radically polymerizable group.In addition, the present invention discloses a kind of hardening resin composition, containing optical free radical polymerization initiator, monomer component, colorant, photo-acid generator and with the compound of cyclic ether group, monomer component includes the monomer with 1 radically polymerizable group group.
Description
Technical field
The present invention relates to the manufacturing methods of hardening resin composition, image display device and image display device.
Background technique
Image display device used in the information terminals such as smart phone includes the image with picture display face and shows
Frame section portion (comprising liquid crystal display panel, cover-plate glass etc.) and supported, all the time by by image displaying part
With frame section it is Nian Jie with pressure-sensitive adhesive band, fixed manufacture.As the pressure-sensitive adhesive band, in order to prevent from image displaying part with
The photogenic image quality decline of leakage between frame section, usually using pressure-sensitive adhesive band (such as the patent of the black with light-proofness
Document 1).
Existing technical literature
Patent document
Patent document 1: No. 5658072 bulletins of Japanese Patent No.
Summary of the invention
Subject to be solved by the invention
In recent years, in image display device, narrowization of ornamental portion and light shield layer around picture display face is being pushed away
Into the frame section for the image displaying part being supported to them is also promoting narrowization.Therefore there are image displaying part and frame section
Bond area narrowization tendency.For coping with the microfabrication and pressure of the pressure-sensitive adhesive band of the bond area of narrowization
The fitting of quick splicing tape to the bonding site of narrowization is more difficult, therefore worries productivity decline.
The object of the present invention is to provide the curability trees that light shield layer can be used to form when manufacturing image display device
Oil/fat composition, the light-proofness of light leakage of the light shield layer with inhibition between image displaying part and frame section, and even if
It can be also effectively formed in narrow region.
Means for solving the problems
One aspect of the present invention provides a kind of hardening resin composition, contains optical free radical polymerization initiator, list
Body ingredient, colorant and photo-acid generator, monomer component include the list rolled into a ball with cyclic ether group and 1 radically polymerizable group
Body.
Another aspect of the present invention provides a kind of hardening resin composition, contains optical free radical polymerization initiator, list
Body ingredient, colorant, photo-acid generator and the compound with cyclic ether group, monomer component include to have 1 free radical polymerization
The monomer of property group.
Hardening resin composition according to the present invention passes through image displaying part or the frame section painting in image display device
Cloth composition and the curable resin layer for forming frame-shaped show image to after curable resin layer irradiation active energy beam
Show that portion is bonded this easy method with frame section, there is the shading for inhibiting the light leakage between image displaying part and frame section
Property, light shield layer can be effectively formed even if narrow region.
For the reasons why playing said effect, the inventors of the present invention consider as follows.Hardening resin composition of the invention is logical
Crossing has above-mentioned composition, after the optical free radical polymerization rolled into a ball based on radically polymerizable group generates polymer chain, Neng Goujin
The curing reaction of the curable resin layer of cationoid reaction of the row based on cyclic ether group.The inventors of the present invention think: being prolonged by this
Solidification late, the curable resin layer with light-proofness can have both the bullet for being suitable for being bonded by the irradiation of active energy beam
Property modulus and fitting after abundant curing degree, be capable of forming and available be able to suppress drop impact for fine bonding plane
And it constitutes removing caused by screen resilience of component (such as flexible printed circuit board (FPC)) etc. of image display device and floats viscous
Relay and the excellent light shield layer of anti-light leakage.
Above-mentioned hardening resin composition can also contain polymer.When hardening resin composition contains polymer,
Irradiation active energy beam after curable resin layer can be easy have make image displaying part be easy to be bonded with frame section it is pressure-sensitive
Cementability.
Above-mentioned hardening resin composition can be the solidification that pressure-sensitive adhesive is shown when irradiating active energy beam
Property resin combination.
The pressure-sensitive bonding force of above-mentioned hardening resin composition found out with following methods can be 10N/cm2More than.
Width 25mm, length 75mm, thickness 1mm the first glass baseplate on be coated with hardening resin composition, according to
Width 0.6mm, length 25mm, film is arranged in the length direction of the curable resin layer mode orthogonal with the long side of the first glass baseplate
Thick 50 μm of curable resin layer, to curable resin layer with 3000mW/cm2Exposure intensity illumination wavelength be 365nm light,
So that total exposure reaches 5000mJ/cm2, irradiated on the curable resin layer within 1 minute in light, according to the first glass base
The long side of material configures width 25mm, length 75mm, thickness with the mode that the long side of the second glass baseplate is aligned in terms of vertical direction
The second glass baseplate of 1mm applies the load 10 seconds of 1N and makes its fitting, obtains measurement sample.It is being bonded within an hour,
Test when measurement removes the first glass baseplate for measuring sample with the second glass baseplate one another along opposite longitudinal direction
Power, the test force is Nian Jie as pressure-sensitive with value obtained by the contact area of the second glass baseplate divided by curable resin layer
Power.
The length-width ratio of above-mentioned hardening resin composition found out with following methods can be 0.4 or more.
Width 25mm, length 75mm, thickness 1mm the first glass baseplate on be coated with hardening resin composition, according to
Width 0.6mm, length 25mm, film is arranged in the length direction of the curable resin layer mode orthogonal with the long side of the first glass baseplate
Thick 50 μm of curable resin layer, to curable resin layer with 3000mW/cm2Exposure intensity illumination wavelength be 365nm light,
So that total exposure reaches 5000mJ/cm2, irradiated on the curable resin layer within 1 minute in light, according to the first glass base
The long side of material configures width 25mm, length 75mm, thickness with the mode that the long side of the second glass baseplate is aligned in terms of vertical direction
The second glass baseplate of 1mm applies the load 10 seconds of 1N and makes its fitting, obtains measurement sample.Will measure in sample with
When the width of the curable resin layer of second glass baseplate contact is set as B (unit: mm), using B/0.6 as length-width ratio.
Hardening resin composition of the invention may be used as light shield layer and form purposes.In other words, the present invention relates to solidifications
Property resin combination the application for being used to form light shield layer, the hardening resin composition contain optical free radical polymerization cause
Agent, monomer component, colorant and photo-acid generator, monomer component include to have cyclic ether group and 1 radically polymerizable group group
Monomer.Moreover, it relates to the application for being used to form light shield layer of hardening resin composition, the curable resin group
It closes object and contains optical free radical polymerization initiator, monomer component, colorant, photo-acid generator and the compound with cyclic ether group,
Monomer component includes the monomer with 1 radically polymerizable group group.Moreover, it relates to which hardening resin composition is consolidated
The application as light shield layer of compound, the hardening resin composition contain optical free radical polymerization initiator, monomer component,
Toner and photo-acid generator, monomer component include the monomer rolled into a ball with cyclic ether group and 1 radically polymerizable group.In addition, this
Invention is related to the application as light shield layer of the solidfied material of hardening resin composition, and the hardening resin composition contains light
Radical polymerization initiator, monomer component, colorant, photo-acid generator and the compound with cyclic ether group, monomer component packet
Containing the monomer with 1 radically polymerizable group group.
Another aspect of the present invention provides a kind of image display device, has: image displaying part, and including has figure
As the liquid crystal display panel of display surface and the cover member with the light transmission department opposite with picture display face；Frame section, setting exist
Around image displaying part, and support image displaying part；And light shield layer, it is formed between frame section and image displaying part,
Wherein, light shield layer is the solidfied material of the curable resin layer of the hardening resin composition comprising aforementioned present invention.
Another aspect of the present invention provides a kind of method for manufacturing image display device, and described image display device has:
Image displaying part includes liquid crystal display panel with picture display face and with the light transmission department opposite with picture display face
Cover member；Frame section is arranged in around image displaying part, and supports image displaying part；And light shield layer, it is formed in
Between frame section and image displaying part, the method successively has: being coated with aforementioned present invention in image displaying part or frame section
Hardening resin composition and the process for forming the curable resin layer of frame-shaped；By irradiating active-energy to curable resin layer
Ray and the process for carrying out the curing reaction of curable resin layer；And it clips curable resin layer and makes image displaying part and frame
The process of frame portion fitting, wherein above-mentioned light shield layer is the above-mentioned curable resin layer for having carried out curing reaction.
The manufacturing method of image display device according to the present invention can efficiently manufacture the image for having following light shield layer
Display device, the light shield layer can sufficiently inhibit between image displaying part and frame section even if narrow region
Light leakage.
In the above-mentioned methods, above-mentioned curable resin layer when being bonded above-mentioned image displaying part with said frame portion can be with
With pressure-sensitive adhesive.
In the above-mentioned methods, above-mentioned image can be made to show in such a way that length-width ratio shown in following formula is 0.4 or more
Portion is bonded with said frame portion.
Length-width ratio=B '/A '
[in formula, A ' indicates the solidification for being coated on the above-mentioned frame-shaped of one of above-mentioned image displaying part and said frame portion
Width of the property resin layer in predetermined portion；B ' indicates the above-mentioned curability tree after above-mentioned image displaying part is bonded with said frame portion
The width that rouge layer is contacted in above-mentioned predetermined portion with the other of above-mentioned image displaying part and said frame portion.]
The above method can be also equipped with: after the process for being bonded image displaying part with frame section, further progress is solid
The process of the curing reaction of the property changed resin layer.Light shield layer can be bonded image displaying part and frame with higher bonding force as a result,
Frame portion, the available image display device for having the more excellent light shield layer of leakproof photosensitiveness.
The effect of invention
According to an aspect of the present invention, can provide can be used to form light shield layer when manufacturing image display device
Hardening resin composition, the light shield layer have the light-proofness for inhibiting the light leakage between image displaying part and frame section,
And it can be effectively formed even if narrow region.
Detailed description of the invention
Fig. 1 is the figure for the method for illustrating to measure the pressure-sensitive bonding force of curable resin layer.
Fig. 2 is the figure for illustrating the method for length-width ratio when measuring the fitting of curable resin layer.
Fig. 3 is the cross-sectional view for showing an embodiment of image display device.
Fig. 4 is the perspective view for showing an embodiment of method for manufacture image display device.
Fig. 5 is the perspective view for showing an embodiment of method for manufacture image display device.
Fig. 6 is the perspective view for showing an embodiment of method for manufacture image display device.
Fig. 7 is the perspective view for showing an embodiment of method for manufacture image display device.
Fig. 8 is the perspective view for showing the method for measurement bonding force.
Fig. 9 is the perspective view for showing the method for measurement bonding force.
Figure 10 is the perspective view for showing the method for evaluation light-proofness.
Specific embodiment
Hereinafter, the embodiment that according to circumstances the present invention will be described in detail while referring to attached drawing.It is same or equivalent in attached drawing
Part marks identical symbol, and the repetitive description thereof will be omitted sometimes.Positional relationships are as long as no special declaration up and down etc., then
Based on positional relationship shown in figure.The dimensional ratios of attached drawing are not limited to the ratio of diagram.
In the present specification, " (methyl) acrylate " refers to " acrylate " and corresponding " methacrylic acid
Ester ".Similarly, " (methyl) acrylic compounds " refer to " acrylic compounds " and corresponding " methacrylic ", " (methyl) third
Enoyl- " refers to " acryloyl group " and corresponding " methylacryloyl ".
First hardening resin composition of present embodiment can be containing optical free radical polymerization initiator (hereinafter also referred to
" (A) ingredient "), monomer component (hereinafter also referred to " (B) ingredient "), colorant (hereinafter also referred to " (C) ingredient ") and photic production
Sour agent (hereinafter also referred to " (D) ingredient "), and monomer component may include with cyclic ether group and 1 radically polymerizable group group
Monomer (hereinafter also referred to " (B1) ingredient ").
Second hardening resin composition of present embodiment can containing optical free radical polymerization initiator, monomer component,
Colorant, photo-acid generator and the compound (hereinafter also referred to " (E) ingredient ") with cyclic ether group, and monomer component can wrap
Containing the monomer (hereinafter also referred to " (B2) ingredient ") with 1 radically polymerizable group group.In present embodiment, (E) ingredient is
Compound without radically polymerizable group group.
(A) ingredient: optical free radical polymerization initiator
Optical free radical polymerization initiator be by irradiate active energy beam generate free free radical and promote monomer at
The ingredient of the curing reaction (polymerization reaction) based on free radical polymerization divided.Here, active energy beam can selected from ultraviolet light,
Electron beam, alpha ray, β ray etc..
As the specific example of optical free radical polymerization initiator, can enumerate: benzophenone, N, tetramethyl -4 N ' -, 4 '-two
Aminobenzophenone (Michler's keton), N, tetraethyl -4 N-, 4 '-diaminobenzophenones, methoxyl group -4 4-, 4 '-dimethylaminos
Benzophenone, Alpha-hydroxy isobutyl group benzophenone, 2- ethyl hydrazine, tert-butyl anthraquinone, Isosorbide-5-Nitrae-dimethyl anthraquinone, 1- chloroanthraquinone, 2,3-
Dichloroanthraquinone, 3- chloro-2-methyl anthraquinone, 1,2- benzo anthraquinone, 2- phenyl anthraquinone, 1,4-naphthoquinone, 9,10- phenanthrenequione, thioxanthones, 2-
The aromatic ketones compounds such as clopenthixal ketone, 2,2- dimethoxy -1,2- diphenylethane -1- ketone, 2,2- diethoxy acetophenone；
The benzoins compound such as benzoin, methylbenzoin, ethyl benzoin；Benzoin methylether, benzoin ethyl ether, benzoin isobutyl
The benzoin ethers compounds such as ether, benzoin phenylate；The benzils compound such as benzil, benzil dimethyl ketal；β-(acridine-
9- yl) ester compounds such as (methyl) acrylic acid；The acridines such as 9- phenylacridine, 9- pyridyl group acridine, 1,7-, bis- acridine and heptane
Close object；2- (Chloro-O-Phenyl) -4,5- diphenyl-imidazole dimer, 2- (Chloro-O-Phenyl) -4,5- bis- (m-methoxyphenyl) imidazoles
Dimer, 2- (o-fluorophenyl) -4,5- diphenyl-imidazole dimer, 2- (o-methoxyphenyl) -4,5- diphenyl-imidazole dimerization
Body, 2- (p-methoxyphenyl) -4,5- diphenyl-imidazole dimer, 2,4- bis- (p-methoxyphenyl) -5- phenylimidazole dimerization
Body, 2- (2,4- Dimethoxyphenyl) -4,5- diphenyl-imidazole dimer, 2- (to methyl mercapto phenyl) -4,5- diphenyl miaow
2,4, the 5- triarylimidazoles dimer such as azoles dimer；2- benzyl -2- dimethylamino -1- (4- morphlinophenyl) -1- butanone,
The alkyl phenones based compounds such as 2- methyl-1-[4- (methyl mercapto) phenyl]-2- morpholino-1- propane；1- hydroxycyclohexylphenyl
Ketone, 2- hydroxy-2-methyl -1- phenyl-propan -1- ketone, 1- [4- (2- hydroxyl-oxethyl)-phenyl] -2- hydroxy-2-methyl -1-
Propane -1- ketone, 2- hydroxyl -1- { 4- [4- (2- hydroxy-2-methyl-propiono)-benzyl] phenyl } -2- methyl-propan -1- ketone,
Alpha-hydroxies alkyl phenones based compounds such as oligomeric { 2- hydroxy-2-methyl -1- [4- (1- methyl ethylene) phenyl] acetone }；Phenyl
Glyoxalic acid methylester；Bis- (2,4,6- trimethylbenzoyl)-phenyl phosphine oxides, bis- (2,6- Dimethoxybenzoyls) -2,4,
The phosphine oxides based compounds such as 4- trimethyl-pentyl phosphine oxide, 2,4,6- trimethylbenzoy-dipheny phosphine oxides.Light is free
Base polymerization initiator can be used alone, and can also be used in combination of two or more.It is solid from curability, reactivity and surface
It, can be from aromatic ketone compound, Alpha-hydroxy alkyl phenones based compound and phenylglyoxalates methyl esters from the perspective of the property changed
Select optical free radical polymerization initiator.
Optical free radical polymerization initiator can be by irradiate active energy beam generate free free radical and alkali (such as
Secondary amino group, tertiary amino) both compound.As the specific example of this kind of optical free radical polymerization initiator, can enumerate: (4-
Morpholino benzoyl) -1- benzyl -1- dimethylaminopropanecompounds (" Irgacure369 ", BASF JAPAN corporation), 4- (first
Sulfenyl benzoyl)-1- methyl-1-morpholino ethane (" Irgacure907 ", BASF JAPAN corporation), 2- (dimethylamino
Base) -2- [(4- aminomethyl phenyl) methyl] -1- [4- (4- morpholinyl) phenyl] -1- butanone (" Irgacure379 ", BASF JAPAN
Corporation) etc. alpha-aminoacetophenones compound；" CGI-325 ", " Irgacure OXE01 ", " Irgacure OXE02 " (more than
For BASF JAPAN corporation), " N-1919 ", the oxime ester compounds such as " NCI-831 " (the above are ADEKA corporations).These it
In, it can choose alpha-aminoacetophenone compound.
For the content of the optical free radical polymerization initiator in hardening resin composition, from pressure-sensitive adhesive, reliably
The viewpoint of property and curability and from the perspective of effectively facilitating curing reaction, the total amount relative to hardening resin composition
It can be 2 mass % or more, 4 mass % or more or 6 mass % or more；Can for 14 mass % or less, 12 mass % or less or
10 mass % or less.
(B) ingredient: monomer component
As radically polymerizable group group possessed by (B1) ingredient, (methyl) acryloyl group, vinyl, acetylene can be enumerated
Base, isopropenyl, vinyl ether and divinyl sulfide base.As (B1) ingredient, it can be mentioned, for example: (methyl) glycidyl
Ester, (methyl) acrylic acid 3,4- epoxycyclohexanecarboxylate, (methyl) acrylic acid 4- hydroxybutyl glycidol ether, propylene oxide
(PO) modified bisphenol A diglycidyl ether diacrylate, novolaks PART EPOXY acrylate, bisphenol-A 2-glycidyl
The acrylic acid adduct of ether, (methyl) acrylic acid 3- oxetanylmethoxy methyl esters, (methyl) acrylic acid 3- methyl -3- oxetanylmethoxy
Methyl esters, (methyl) acrylic acid 3- ethyl -3- oxetanylmethoxy methyl esters, (methyl) acrylic acid 3- butyl -3- oxetanylmethoxy methyl esters,
(methyl) acrylic acid 3- hexyl -3- oxetanylmethoxy methyl esters.(B1) ingredient can be allyl glycidyl ether.
(B1) ingredient can be used alone, or be used in combination of two or more.
For the content of (B1) ingredient, from reactive viewpoint, the viewpoint of raising bonding force and curable resin combination
Object be solution when stability from the perspective of, relative to hardening resin composition total amount can for 0.1 mass % or more,
1 mass % or more or 3 mass % or more；It can be 15 mass % or less, 10 mass % or less or 5 mass % or less.
As (B2) ingredient, the monofunctional monomer with 1 radically polymerizable group group can be enumerated.As (B2) ingredient institute
The radically polymerizable group group having, can enumerate (methyl) acryloyl group, vinyl, acetenyl, isopropenyl, vinyl ether and
Divinyl sulfide base.Monofunctional monomer can be the compound with (methyl) acryloyl group.
Monofunctional monomer with (methyl) acryloyl group can be (methyl) alkyl acrylate, just alkyl at this time
It can be 4 or more, 6 or more or 8 or more from the viewpoint of assigning flexibility to hardening resin composition for carbon number；It can
Think 20 or less, 18 or less or 16 or less.The alkyl of (methyl) alkyl acrylate can have the substituent groups such as hydroxyl.
As the specific example of the monofunctional monomer with (methyl) acryloyl group, can enumerate: the positive fourth of (methyl) acrylic acid
Ester, (methyl) tert-butyl acrylate, (methyl) isobutyl acrylate, (methyl) acrylic acid n-pentyl ester, (methyl) acrylic acid are just pungent
Ester, (methyl) Isooctyl acrylate monomer, (methyl) 2-EHA, (methyl) isodecyl acrylate, (methyl) acrylic acid
(methyl) third such as just own ester, (methyl) stearyl acrylate, (methyl) lauryl acrylate, (methyl) tridecyl acrylate
Olefin(e) acid Arrcostab；(methyl) acrylic acid 2- hydroxy methacrylate, (methyl) acrylic acid 1- hydroxy methacrylate, (methyl) acrylic acid 2- hydroxyl third
Ester, (methyl) acrylic acid 3- hydroxy propyl ester, (methyl) acrylic acid 1- hydroxy propyl ester, (methyl) acrylic acid 4- hydroxybutyl, (first
Base) hydroxyls such as acrylic acid 3- hydroxybutyl, (methyl) acrylic acid 2- hydroxybutyl, (methyl) acrylic acid 1- hydroxybutyl
(methyl) alkyl acrylate；Dimethyl (methyl) acrylamide, isopropyl (methyl) acrylamide, dimethylaminopropyl
(methyl) acrylamide etc. (methyl) acrylamide；(methyl) acryloyl of the hydroxyls such as hydroxyethyl (methyl) acrylamide
Amine；List (methyl) acrylate of the polyethylene glycol such as diethylene glycol, triethylene glycol；Dipropylene glycol list (methyl) acrylate, three
The (methyl) acrylic acid 2- hydroxy methacrylates such as propylene glycol list (methyl) acrylate；Dibutylene glycol list (methyl) acrylate, three
Butanediol list (methyl) acrylate etc. polytetramethylene glycols list (methyl) acrylate；(the first containing morpholinyl such as acryloyl morpholine
Base) acrylate；(methyl) dicyclopentanyl acrylate, (methyl) acrylic acid dicyclopentenyl oxygroup ethyl ester, two ring of methacrylic acid
Amylene oxygroup ethyl ester, (methyl) isobornyl acrylate.These compounds can be used alone, can also be by two or more combinations
It uses.From the viewpoint of the dissolubility of dyestuff, bonding force, moisture-proof thermal reliability and pressure-sensitive adhesive after solidifying, simple function
Monomer can be containing selected from (methyl) dicyclopentanyl acrylate, (methyl) acrylic acid dicyclopentenyl ester and the different ice of (methyl) acrylic acid
Compound in piece ester or the chemical combination in (methyl) acrylic acid dicyclopentenyl ester and (methyl) isobornyl acrylate
Object.
(B2) ingredient can be used alone, and can also be used in combination of two or more.
In first hardening resin composition of present embodiment, (B) ingredient, can be in addition to containing other than (B1) ingredient
Contain a kind or more (B2) ingredient.It should be noted that in the first hardening resin composition of present embodiment, (B2) at
It point is the compound other than (B1) ingredient.
Viewpoint, adjustment for the content of (B2) ingredient, from the hardening resin composition for obtaining that there is proper viscosity
From the perspective of the viewpoint of the elasticity modulus of cure shrinkage and solidfied material and the dissolubility of colorant, relative to curability
The total amount of resin combination can be 10 mass % or more, 15 mass % or more or 20 mass % or more；It can be 80 mass %
Below, 70 mass % or less or 60 mass % or less.When the content of (B2) ingredient is 10 mass % or more, being easy to get has
Facilitate the hardening resin composition of the proper viscosity of good coating, and has the tendency that the dissolubility of colorant improves.
When the content of (B2) ingredient is 80 mass % or less, has the tendency that cure shrinkage reduction.It, can be with when cure shrinkage is low
Bonding force caused by stress is inhibited to decline.
(B) polyfunctional monomer that the monomer component of ingredient can be rolled into a ball also comprising the radically polymerizable group with 2 or more.
In this case, the content of polyfunctional monomer can be 5 mass % or less relative to the total amount of monomer component ((B) ingredient).
(C) ingredient: colorant
Colorant is to assign suitable shading by hardening resin composition and light shield layer coloring, to being formed by light shield layer
The ingredient of property.The tone of colorant is not particularly limited, and the colorant with various tones, colorant typical case can be used
It is down in black.Colorant can for example contain dyestuff and/or pigment.Go out from the viewpoint for obtaining uniform hardening resin composition
Hair, can choose the colorant for being dissolved in monomer component.
Colorant is dissolved in monomer component this point can be confirmed by the following method.It is added in the beaker of 50mL
Monomer component 10mL (25 DEG C of temperature) and colorant 10mg (solid component quality) is stirred 1 minute with glass bar.Then, in mesh
When the solids of colorant being not confirmed depending under, it is determined as that the colorant is dissolved in monomer component.
From the viewpoint of light-proofness, the average transmittance of the visible light of colorant can be 50% or less, 45% or less
Or 40% or less.Here, the average transmittance of visible light refers to the average transmittance of the light of 400~700nm of wavelength.Visible light
Average transmittance can be measured by following methods: use spectral photometric colour measuring meter (such as Co., Ltd.'s Konica Minolta system
" CM-3700A "), it is measured every 1nm by 100 mass parts of solvent of dissolved colorants and coloring in the range of 400~700nm
The light transmission for the colourant solution that 0.1 mass parts of agent are constituted finds out the average value of obtained each measured value as average saturating
Penetrate rate.Colorant be dissolved in solvent this point can by with above-mentioned " colorant is dissolved in monomer component " identical method come
Confirmation.
Light transmission of the colorant in the spike strong point of the light (active energy beam) irradiated to carry out curing reaction
(hereinafter also referred to " irradiation transmissivity ") can higher than the average transmittance of visible light 10% or more, 20% or more, 30% or more.
Irradiating light transmission can be 60% or more, 65% or more or 70% or more.By using with high irradiation light transmission
Colorant, it can be ensured that sufficient light-proofness, and the curing reaction polymerizeing based on optical free radical is effectively performed.Colorant
Irradiation light transmission can determine by the following method: decompose wavelength be 1nm under conditions of, measure by dissolved colorants
The colourant solution that 100 mass parts of solvent and 0.1 mass parts of colorant are constituted is (living in the light irradiated to carry out curing reaction
Property energy-ray) spike strong point colorant light transmission.As measurement device, UV, visible light spectrophotometric can be used
It counts (such as Shimadzu Scisakusho Ltd's system " UV-2400PC ").Measurement range is for example set as 300~780nm.
Colorant can for example contain selected from phthalocyanine blue, phthalocyanine green, iodine is green, diazonium is yellow, in nigrosine, black and fluorane
It is at least one kind of.
For the content of colorant, from the viewpoint of obtaining the effect of masking visible light, relative to curable resin
The total amount of composition can be 0.1 mass % or more, 0.3 mass % or more or 0.5 mass % or more；Can for 10 mass % with
Under, 7.5 mass % or less or 5 mass % or less.
(D) ingredient can be used makes molecular structure change or molecule cracking, generation can by irradiating active energy beam
The compound for a kind or more the acidic materials that curing catalysts as ionic reaction work.(D) ingredient can be used as above-mentioned
(B1) curing catalysts of the cationoid reaction of ingredient and (E) ingredient work.
As (D) ingredient, it can be mentioned, for example salt compound, sulphones, sulfonate compound, sulfimide chemical combination
Object, disulfonyl diazomethane compound, disulfonyl methylmethane compound, oxime sulfonate compound, hydrazine sulfonate compound,
Triaizine compounds, nitrobenzyl compounds, organic halogenation species, two sulfones.The example of commercially available product as photo-acid generator can arrange
Lift: trade name " Cyracure UVI-6970 ", " Cyracure UVI-6974 ", " Cyracure UVI-6990 ",
" Cyracure UVI-950 " (the above are U.S.'s Union Carbide corporations), " Irgacure250 ",
" Irgacure261 ", " Irgacure264 ", " Irgacure270 ", " Irgacure290 " (the above are BASF AG's systems),
" CG-24-61 " (Ciba-geigy corporation), " Adeka Optomer SP-150 ", " Adeka Optomer SP-151 ",
" Adeka Optomer SP-170 ", " Adeka Optomer SP-171 " (the above are ADEKA corporations), " DAICAT II "
(Daicel corporation), " UVAC1590 ", " UVAC1591 " (the above are Daicel Cytec corporations), " CI-2064 ", " CI-
2639”、“CI-2624”、“CI-2481”、“CI-2734”、“CI-2855”、“CI-2823”、“CI-2758”、“CIT-1682”
(the above are Japanese Cao to reach corporation), " PI-2074 " (Rhodia corporation, toluyl cumyl iodine four (pentafluorophenyl group) boron
Hydrochlorate, " FFC509 " (3M corporation), " BBI-102 ", " BBI-101 ", " BBI-103 ", " MPI-103 ", " BDS-105 ",
“TPS-103”、“MDS-103”、“MDS-105”、“MDS-203”、“MDS-205”、“DTS-102”、“DTS-103”、“NAT-
103 ", " NDS-103 ", " BMS-105 ", " TMS-105 " (the above are MIDORI chemical company systems), " CD-1010 ", " CD-
1011 ", " CD-1012 " (the above are U.S.'s Sartomer Company systems), " CPI-100P ", " CPI-101A ", " CPI-110P ",
" CPI-110A ", " CPI-210S " (the above are San-Apro corporations), " UVI-6992 ", " UVI-6976 " (the above are Tao Shi
Chemical company's system).
(D) ingredient can be used alone, or be used in combination of two or more.
For the content of (D) ingredient, from the viewpoint of pressure-sensitive adhesive, reliability and curability and it is effectively facilitated
It can be 2 mass % or more, 4 mass % or more relative to the total amount of hardening resin composition from the perspective of curing reaction
Or 6 is more than mass %；It can be 14 mass % or less, 12 mass % or less or 10 mass % or less.
(E) ingredient contained in the second hardening resin composition as present embodiment, it can be mentioned, for example with ring
The compound of oxygroup and/or oxetanylmethoxy.It as the specific example of these compounds, can enumerate: glycidol ether, butyl contracting
The poly- second two of water glycerin ether, 2- hexyl glycidyl ether, stearyl glycidyl ether, lauryl glycidol ether, butoxy
Alcohol glycidol ether, phenol Polyethylene Glycol Bisglycidyl Ether, phenyl glycidyl ether, p-methylphenyl glycidol ether, to second
Base phenyl glycidyl ether, to secondary butyl phenenyl glycidol ether, to monofunctional epoxies such as tert-butyl-phenyl glycidyls
Close object；Bisphenol A diglycidyl ether, Bisphenol F diglycidyl ether, bisphenol-S diglycidyl ether, hydrogenated bisphenol A two shrink sweet
The polyglycidyl ether of the bis-phenols such as oily ether, A Hydrogenated Bisphenol A F diglycidyl ether, hydrogenated bisphenol A D diglycidyl ether；Isosorbide-5-Nitrae-fourth
Hexanediol diglycidyl ether, 1,6- hexanediol diglycidyl ether, T 55, trimethylolpropane tris shrink sweet
The polyglycidyl ether of the polyalcohols such as oily ether, polyethyleneglycol diglycidylether, polypropylene glycol diglycidyl ether；By making 1
Kind or alkylene oxide addition polyether polyol obtained from the aliphatic polyols such as ethylene glycol, propylene glycol, glycerol of more than two kinds
Aliphatic polyglycidyl ether；3,4- epoxycyclohexyl-methyls -3 ', 4 '-epoxycyclohexane carboxylates, 2- (3,4- epoxy hexamethylenes
Base -5,5- spiral shell -3,4- epoxy) hexamethylene-dioxanes, bis- (3,4- epoxycyclohexyl-methyl) adipate esters, bis- (3,4- rings
Oxygen -6- methylcyclohexylmethyl) adipate ester, 3,4- epoxy -6- methylcyclohexyl -3 ', 4 '-epoxies -6 '-hexahydrotoluene carboxylic
Acid esters, di-2-ethylhexylphosphine oxide (3,4- 7-oxa-bicyclo[4.1.0), bicyclopentadiene dicyclic oxide, ethylene glycol two (3,4- epoxycyclohexyls
Methyl) ether, ethylenebis (3,4- epoxycyclohexane carboxylate), lactone-modified 3,4- epoxycyclohexyl-methyl -3 ', 4 '-epoxies
Cyclohexane carboxylate etc. has the multi-functional epoxy compounds such as the compound of 3,4- epoxycyclohexyl；3- ethyl -3- hydroxymethyl
Oxetanes (oxetanes alcohol), 2- ethylhexyl oxetanes, 3- ethyl -3- (2- Ethylhexoxymethyl) oxa-
Cyclobutane, 3- ethyl -3- (dodecyloxy methyl) oxetanes, 3- ethyl -3- (octadecane epoxide methyl) oxa- ring fourth
The simple functions oxa- rings such as alkane, 3- ethyl -3- (phenoxymethyl) oxetanes, 3- ethyl -3- hydroxymethyl oxetane
Butane compound；Bis- ((3- Ethyloxetane -3- base) methoxies of xylylene dioxygen azetidine, 1- butoxy -2,2-
Ylmethyl) butane, 3- ethyl -3 { [(3- Ethyloxetane -3- base) methoxyl group] methyl } oxetanes, 1,1,1- tri-
The multifunctional oxetane compounds such as ((3- Ethyloxetane -3- base) methoxy) propane.(E) ingredient can be
Oligomer with cyclic ether group.
(E) ingredient can be used alone, or be used in combination of two or more.
For the content of (E) ingredient in the second hardening resin composition of present embodiment, from reactive sight
From the perspective of stability when point, the viewpoint for improving bonding force and hardening resin composition are solution, relative to curability
The total amount of resin combination can be 1 mass % or more, 5 mass % or more or 10 mass % or more；Can for 70 mass % with
Under, 50 mass % or less or 30 mass % or less.
First hardening resin composition of present embodiment can also contain (E) ingredient.At this point, containing with regard to (E) ingredient
For amount, from the viewpoint of curability, the total amount relative to hardening resin composition can be 0.1 mass % or more, 1 matter
Measure % or more or 3 mass % or more；From the viewpoint of storage stability, the total amount relative to hardening resin composition can be with
For 15 mass % or less, 10 mass % or more or 5 mass % or less.
The hardening resin composition of present embodiment can also contain polymer (hereinafter also referred to " (F) ingredient ").Gu
Polymer contained in the property changed resin combination can be oligomer.In the present specification, " oligomer " refers to weight average molecular weight
It is 1 × 104Above polymer.When hardening resin composition contains polymer (especially oligomer), after light irradiation
Curable resin layer is easy the pressure-sensitive adhesive with appropriateness.In the present specification, weight average molecular weight, which refers to, passes through gel infiltration
The value of the standard polystyren conversion of chromatography determination.It in the present specification, is in addition to above-mentioned as " polymer " of (F) ingredient
(A)~(E) ingredient other than ingredient.
It as the specific example of polymer (oligomer), can enumerate: butadiene rubber, isoprene rubber, silicon rubber, fourth
Benzene rubber, neoprene, nitrile rubber, butyl rubber, EP rubbers, urethane rubber, acrylic rubber, chlorosulfonation
The liquid object or solids of the various rubber such as polyethylene rubber, fluorubber, hydrogenated nitrile-butadiene rubber, epichlorohydrin rubber；Polybutene etc.
Poly alpha olefin；The hydrogenated oc-olefins oligomer such as hydrogenated polybutene；The polyvinyl systems oligomer such as atactic polypropylene；Biphenyl,
The aromatic systems oligomer such as terphenyl；Hydrogenation of liquid polybutadiene etc. hydrogenates polyenoid system oligomer；Paraffin oil, chlorocosanes etc.
Paraffin series oligomer；The naphthene series oligomer such as naphthenic oil；It can be by having the compound of hydroxyl in two ends and in two ends
The transesterification or polycondensation reaction of compound with ester group or carboxyl and the Polyester oligomer manufactured；It can be by having in two ends
The polyurethanes system for having polyethers, polycarbonate or the polyester of hydroxyl and the polymerization reaction of polyisocyanates and manufacturing is oligomeric
Object；(methyl) acrylic acid series polymeric compounds.Among these, from the viewpoint of pressure-sensitive adhesive, preferably (methyl) acrylic acid series is poly-
Close object.
(methyl) acrylic acid series polymeric compounds are containing one kind or two or more from the list with 1 (methyl) acryloyl group
The polymer of the monomeric unit of body.In the range of significantly not damaging effect of the present invention, (methyl) acrylic acid series polymeric compounds can be with
Comprising with 2 or more (methyl) acryloyl groups compound, without (methyl) acryloyl group polymerizable compound (such as
Acrylonitrile, styrene, vinyl acetate, ethylene, propylene etc. have the compound of 1 polyunsaturated bond, two in the molecule
Vinyl benzene etc. is in the molecule with the compound of 2 or more polyunsaturated bonds) as comonomer.
The specific example of monomer as composition (methyl) acrylic acid series polymeric compounds, can enumerate: (methyl) acrylic acid；(first
Base) acrylamide；(methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) n-butyl acrylate, (methyl) acrylic acid
Isobutyl ester, (methyl) tert-butyl acrylate, (methyl) 2-EHA, (methyl) isodecyl acrylate, (methyl) third
(methyl) alkyl acrylates such as the positive lauryl of olefin(e) acid, (methyl) stearyl acrylate；(methyl) benzyl acrylate, (methyl) third
Olefin(e) acid phenoxy ethyl etc. has (methyl) acrylate of aromatic rings；Butoxy ethylene glycol (methyl) acrylate, butoxy
Diethylene glycol (methyl) acrylate, methoxy triethylene (methyl) acrylate etc. have (methyl) acrylic acid of alkoxy
Ester；(methyl) cyclohexyl acrylate, (methyl) tetrahydrofurfuryl acrylate, (methyl) isobornyl acrylate, (methyl) acrylic acid
Two ring pentyl esters etc. have (methyl) acrylate of ester ring type group；(methyl) acrylic acid 2- hydroxy methacrylate, (methyl) acrylic acid
3- hydroxy propyl ester, (methyl) acrylic acid 4- hydroxybutyl etc. have (methyl) acrylate of hydroxyl；Tetraethylene glycol monomethyl ether (first
Base) acrylate, six glycol monoethyl ethers (methyl) acrylate, eight glycol monoethyl ethers (methyl) acrylate, nine second two
Alcohol methyl ether (methyl) acrylate etc. poly glycol monomethyl ethers (methyl) acrylate；Seven propylene glycol monomethyl ethers (methyl) acrylic acid
The polypropylene glycols such as ester monomethyl ether (methyl) acrylate；Polyethylene glycol ether (the first such as tetraethylene glycol ether (methyl) acrylate
Base) acrylate；Tetraethylene glycol list (methyl) acrylate, six ethylene glycol list (methyl) acrylate, eight propylene glycol list (first
Base) acrylate, the polyester oligomer with (methyl) acryloyl group, the urethane polymerization with (methyl) acryloyl group
Object, polyethyleneglycol (methyl) acrylate, polyethylene glycol two (methyl) acrylate, polypropylene glycol list (methyl) acrylic acid
Ester, the butadiene polymer with (methyl) acryloyl group, has (methyl) acryloyl at polypropylene glycol two (methyl) acrylate
The isoprene copolymer etc. of base.(methyl) acrylic acid series polymeric compounds can be to contain homopolymerization of these monomers as monomeric unit
Object or copolymer.(methyl) acrylic acid series polymeric compounds can be to include that the monofunctional monomer with 1 (methyl) acryloyl group is made
For the homopolymer or copolymer of monomeric unit.(methyl) acrylic acid series polymeric compounds may include (methyl) acrylic acid with alkyl
Ester also may include (methyl) acrylate of the alkyl with carbon number 4~18 as monomeric unit as monomeric unit.
(the first with alkyl in (methyl) acrylic acid series polymeric compounds of every 1 molecule, including as monomeric unit
Base) acrylate ratio relative to (methyl) acrylic acid series polymeric compounds quality can for 5 mass % or more, 10 mass % with
On；It can be 95 mass % or less, 90 mass % or less.When the ratio of (methyl) acrylate with alkyl is in above range
When interior, there is the curable resin layer (light shield layer) after solidifying for the close of the adherends such as glass, plastics, polarization plates, polycarbonate
The tendency that conjunction property improves.
From the viewpoint of improving with the pressure-sensitive adhesive of the substrates such as plastics, (methyl) acrylic acid series polymeric compounds can be packet
Containing with hydroxyl, morpholinyl, amino, carboxyl, cyano, carbonyl, nitro isopolarity group (methyl) acrylate as monomer
The copolymer of unit.
The weight average molecular weight of (methyl) acrylic acid series polymeric compounds (oligomer) can be 1 × 104~1 × 107.When dividing equally again
When son is measured within the above range, it can be particularly easy to obtain in high temperature (such as 80 DEG C or more), high humidity (such as 90% or more)
In the environment of the pressure-sensitive adhesive power peeling-off not with substrate etc..In addition, being easy to get with viscosity, the processing for being suitable for coating
The good hardening resin composition of property.
(methyl) acrylic acid series polymeric compounds can be used known to polymerisation in solution, emulsion polymerization, suspension polymerisation, bulk polymerization etc.
Polymerization prepare.
As the polymerization initiator in these polymerizations, the compound generated free radicals by heat can be used.Make
It for its specific example, can enumerate: benzoyl peroxide, peroxidized t-butyl perbenzoate, cumyl hydroperoxide, two carbon of peroxidating
Sour diisopropyl ester, peroxy dicarbonate di-n-propyl ester, dicetyl peroxydicarbonate two (2- ethoxy ethyl ester), the tertiary fourth of peroxidating neodecanoic acid
Ester, tert-Butyl peroxypivalate, peroxidating 3,5,5- trimethyl acetyl, dipropyonyl peroxide, diacetyl peroxide, two (ten
Dialkyl group) organic peroxides such as peroxide；2,2 '-azobis isobutyronitriles, 2,2 '-azos bis- (2- methylbutyronitriles), 1,1 '-
Azo bis- (hexamethylene -1- formonitrile HCNs), 2,2 '-azos bis- (2,4- methyl pentane nitriles), bis- (2, the 4- dimethyl -4- first of 2,2 '-azos
Oxygroup valeronitrile), bis- (2 Methylpropionic acid) dimethyl esters of 2,2 '-azos, 4,4 '-azos bis- (4- cyanopentanoic acids), 2,2 '-azos it is double
The azo compounds such as (2- hydroxymethyl propionitrile), 2,2 '-azos bis- [2- (imidazoline -2- base) propane].
(F) content of ingredient relative to hardening resin composition total amount can for 1 mass % or more, 5 mass % with
Upper, 10 mass % or more；It can be 90 mass % or less, 80 mass % or less, 70 mass % or less.When the content of polymer exists
When in above range, it is easy to get with the viscosity and the good hardening resin composition of processability for being suitable for coating.Separately
Outside, the curing resin layer after having light irradiation becomes the pressure-sensitive adhesive of the adherends such as glass, plastics, polarization plates, polycarbonate
Obtain particularly good tendency.
Hardening resin composition can replace polymer or contain 1 together with polymer, 2-hydroxystearic acid isogel
Agent, thixotropic agent.
Hardening resin composition, which can according to need, also contains other additives.As other additives, example can be enumerated
Such as silane coupling agent is bonded improver, thermal polymerization, antioxidant, chain-transferring agent, stabilizer, photosensitizer.
From the viewpoint of the viewpoint of moisture-proof thermal reliability and inhibiting to generate bubble in solidfied material, hardening resin composition
Organic solvent can be substantially free of.In the present specification, " organic solvent " refers to without radically polymerizable group group, 25
DEG C when be liquid and boiling point under atmospheric pressure is 250 DEG C of organic compounds below.In the present specification, it " is substantially free of
Organic solvent " is free from the meaning of the organic solvent specially added, however not excluded that there are micro in hardening resin composition
The scheme of organic solvent.Specifically, the content of the organic solvent in hardening resin composition is relative to curable resin group
The total amount for closing object can be 1.0 × 103Ppm or less, 5.0 × 102Ppm or less or 1.0 × 102Ppm or less.Curable resin group
Organic solvent can be entirely free of by closing object.
From the viewpoint of processability, the temperature of at least part range of the hardening resin composition in 25 DEG C~70 DEG C
Viscosity under degree can be 10mPas or more, 4.0 × 102MPas or more, 5.0 × 102MPas or more, 1.0 ×
103MPas or more, 2.0 × 103MPas or more or 3.0 × 103MPas or more；It can be 5.0 × 104MPas or less,
2.0×104MPas or less, 1.5 × 104MPas or less, 1.25 × 104MPas or less or 1.0 × 104MPas or less.
Viscosity at 25 DEG C is the value measured based on JIS Z 8803, specifically, for using Brookfield viscometer, (such as eastern machine industry is public
Department system, BL2) measurement value.The correction of Brookfield viscometer can be carried out based on JIS Z 8809-JS14000.Temperature more than 25 DEG C
Viscosity under degree can be measured based on the measuring method of the viscosity at 25 DEG C.
Hardening resin composition can show pressure-sensitive adhesive in illuminated active energy beam.
The preferred pressure-sensitive bonding force of hardening resin composition is 10N/cm2More than, more preferably 20N/cm2More than, into one
Step is preferably 40N/cm2More than.The measurement of pressure-sensitive bonding force is carried out according to following method and condition.
(measuring method of pressure-sensitive bonding force)
Width 25mm, length 75mm, thickness 1mm the first glass baseplate on be coated with hardening resin composition, according to
Width 0.6mm, length 25mm, film is arranged in the length direction of the curable resin layer mode orthogonal with the long side of the first glass baseplate
Thick 50 μm of curable resin layer, to curable resin layer with 3000mW/cm2Exposure intensity illumination wavelength be 365nm light,
So that total exposure is 5000mJ/cm2, irradiated on the curable resin layer within 1 minute in light, according to the first glass baseplate
Long side configure width 25mm, length 75mm, thickness 1mm with the mode that the long side of the second glass baseplate is aligned in terms of vertical direction
The second glass baseplate, apply the load 10 seconds of 1N and make its fitting, obtain measurement sample (Fig. 1).Be bonded 1 hour it
Interior, when measurement removes the first glass baseplate for measuring sample with the second glass baseplate one another along opposite longitudinal direction examination
Power is tested, the test force is Nian Jie as pressure-sensitive with value obtained by the contact area of the second glass baseplate divided by curable resin layer
Power.It should be noted that 101 indicate the first glass baseplate, and 102 indicate the second glass baseplate, and 103 indicate curability tree in Fig. 1
Rouge layer, D indicate peeling direction.
In addition, hardening resin composition preferably has resin as following from the viewpoint of the wetability of resin
Characteristic: the length-width ratio after being formed by the fitting of curable resin layer is got higher.As the value of specific length-width ratio, preferably 0.4
More than, more preferably 0.6 or more, further preferably 0.8 or more.When length-width ratio is 0.4 or more, becoming easy ensures to soak
Property, it becomes easy to obtain the cementability for component.It should be noted that the measurement of the value of length-width ratio according to following method and
Condition carries out.
(measuring method of length-width ratio)
Width 25mm, length 75mm, thickness 1mm the first glass baseplate on be coated with hardening resin composition, according to
Width 0.6mm, length 25mm, film is arranged in the length direction of the curable resin layer mode orthogonal with the long side of the first glass baseplate
Thick 50 μm of curable resin layer, to curable resin layer with 3000mW/cm2Exposure intensity illumination wavelength be 365nm light,
So that total exposure is 5000mJ/cm2, irradiated on the curable resin layer within 1 minute in light, according to the first glass baseplate
Long side configure width 25mm, length 75mm, thickness 1mm with the mode that the long side of the second glass baseplate is aligned in terms of vertical direction
The second glass baseplate, apply the load 10 seconds of 1N and make its fitting, obtain measurement sample ((a) of Fig. 2 and (b)).It will survey
When the width of the curable resin layer contacted with the second glass baseplate in random sample product is set as B (unit: mm), using B/0.6 as
Length-width ratio.It should be noted that 104 indicate the first glass baseplate, and 106 indicate the second glass baseplate, and 105 indicate solid in Fig. 2
The property changed resin layer, A indicate 0.6 (width of curable resin layer).
The hardening resin composition of present embodiment can be used to form light shield layer when manufacturing image display device, institute
Stating light shield layer has the light-proofness for inhibiting the light leakage between image displaying part and frame section, and even if in narrow region
It can be effectively formed.
Then, illustrate have the image display device of the light shield layer formed by hardening resin composition and its manufacturer
Method.
Fig. 3 is the cross-sectional view for showing an embodiment of image display device.Image display device 100 shown in Fig. 3
Have: the figure being made of liquid crystal display panel 41, cover member 20 and transmitance pressure-sensitive adhesive layer 42 with picture display face 41S
As display unit 1；The back light part 43 of light is supplied to liquid crystal display panel 41；It supports image displaying part 1 and accommodates liquid crystal display panel 41 and backlight
The frame section 5 in portion 43；And it is formed in the light shield layer 3 between frame section 5 and image displaying part 1.Cover member 20, which includes, to be had
The cover-plate glass 21 of the light transmission department 25 opposite with picture display face 41S；And the picture display face of cover-plate glass 21 is set
Frame portion 22 on the periphery of the interarea of the side 41S.Transmitance pressure-sensitive adhesive layer 42 is clipped in liquid crystal display panel 41 and cover member
It is engaged between 20 and by them.In general, transmitance pressure-sensitive adhesive layer 42 is sometimes referred to as OCA (Optical clear
Adhesive, optically clear adhesive).Back light part 43 includes light source 45 and for supplying the light of light source 45 to liquid crystal display panel
41 optical sheet portion 46.
Frame section 5 includes the resinous framework 51 being set to around liquid crystal display panel 41 and back light part 43；In resinous framework 51
Outside and accommodate back light part 43 backlight frame 52；And the case frame 53 of receiving backlight frame 52.Resinous framework 51 is logical
It crosses and clips light shield layer 3 and Nian Jie with the frame portion 22 of the periphery of liquid crystal display panel 41 and cover member 20 support image displaying part
1.Backlight frame 52 is Nian Jie with frame portion 22 by clip light shield layer 3 and to support image displaying part 1.Case frame 53 passes through folder
Light shield layer 3 and Nian Jie with frame portion 22 support image displaying part 1.
The image display device 100 of Fig. 3 has 4 light shield layers 3, they are separately positioned on liquid crystal display panel 41 or cover member
Between 20 (frame portions 22) and frame section 5.Light shield layer 3, which can have, to be reached the light leakage from back light part 43 cannot substantially to distinguish
The transmitance of the degree of knowledge.Specifically, average light transmission rate of the light shield layer 3 in 400~700nm can be less than 10%.It should
Average light transmission rate for example can be the value measured under conditions of along the thickness direction irradiation light of light shield layer 3.
Light shield layer 3 can form the closing box-shaped body that will be surrounded completely around back light part 43, can also be can sufficiently press down
The range of light leakage processed forms the opening box-shaped body for surrounding a part around back light part 43.Packet can be passed through as described later
It includes coating hardening resin composition and irradiates the method for active energy beam and be located to be formed selected from resinous framework 51, backlight frame
The light shield layer 3 between at least 1 and image displaying part 1 in frame 52 and case frame 53.It is hidden possessed by image display device
A part of photosphere can use pressure-sensitive adhesive and bring to be formed.
Width W of each light shield layer 3 on the direction vertical with the extending direction of light shield layer 3 can be 0.5mm or less.Work as width
When degree W is narrow, the available image display device excellent with narrower frame portion and design.The lower limit of width W is without spy
It does not limit, can be 0.2mm or so.
What each component of composition image displaying part 1 and frame section 5 can be generallyd use from the field of image display device
It is suitable for selection in component.The optical sheet portion 46 of back light part 43 generally includes lens, diffusion disk, light guide plate, reflector plate etc..Optics
The composition of piece class image display device is not limited to the composition of Fig. 3, and the quantity and shape of frame, the position that light shield layer is arranged etc. can be with
It is suitable for change.For example, frame portion 22 can be not provided with, but the periphery of cover-plate glass 21 and frame section 5 is made to clip light shield layer 3
It is bonded.
Fig. 4 and Fig. 5 is the perspective view for showing an embodiment of method for manufacture image display device.Fig. 4 and Fig. 5 institute
The method shown successively has: in the prescribed portion (periphery of the interarea of back side) of image displaying part 1 (such as cover member)
Coating hardening resin composition and form the process (Fig. 4) of the curable resin layer 3A of frame-shaped；By to curable resin layer
3A irradiation active energy beam hv and carry out the process ((b) of Fig. 4) of the curing reaction of curable resin layer 3A；And clip into
Gone curing reaction curable resin layer 3A and the process (Fig. 5) that is bonded image displaying part 1 with frame section 5.By solid
Curing reaction is carried out in the property changed resin layer 3A, to form light shield layer 3.
Fig. 6 and Fig. 7 is also the perspective view for showing an embodiment of method for manufacture image display device.In this method
In the case where, hardening resin composition is coated on frame section 5 and forms the curable resin layer 3A of frame-shaped.Other aspects with
The method of Fig. 4 and Fig. 5 is identical.
Hereinafter, the method for the image display device 100 of manufacture Fig. 3 is described in more detail by taking the method for Fig. 4 and Fig. 5 as an example
Embodiment.
Process (I) (working procedure of coating)
As shown in figure 4, the periphery in the interarea of image displaying part 1 is coated with the curable resin group of above-mentioned present embodiment
Object is closed, the curable resin layer 3A of frame-shaped is formed.By adjusting the means of coating, can be effectively formed in narrow region solid
The property changed resin layer.For example, by the method for the hardening resin composition from opening discharge liquid, it can be accurately and efficiently
It is coated with hardening resin composition.
Process (II) (active energy beam irradiation process)
Then, active energy beam hv is irradiated to curable resin layer 3A, to carry out the solidification of curable resin layer 3A
Reaction.In curable resin layer 3A, carry out being based primarily upon consolidating for Raolical polymerizable immediately after irradiating active energy beam
Change reaction.By the progress of the curing reaction, suitable pressure-sensitive adhesive can be assigned to curable resin layer 3A.Curability tree
Photo-acid generator contained in rouge layer 3A would generally due to active energy beam effect and generate acid, but it is acid catalysed sun from
Son reaction is compared with Raolical polymerizable with the progress of relatively slow reaction speed.Therefore, in irradiation active energy beam
Stage, curable resin layer 3A can also pass through Raolical polymerizable semi-solid preparation.
Process (III) (bonding process)
As shown in (a) of Fig. 5, illuminated active energy beam is clipped and the curable resin layer with pressure-sensitive adhesive
3A, and image displaying part 1 is bonded with frame section 5.It as needed, can also be while being heating and curing property resin layer 3A by figure
As display unit 1 is bonded with frame section 5.
From making difference in height absorbability, pressure-sensitive bonding force (bonding force) and wetability for showing bonding force keep balance
From the perspective of, storage modulus of the curable resin layer at 25 DEG C when fitting is preferably 10000~500000Pa, more preferably
For 30000~250000Pa, further preferably 50000~200000Pa.
In bonding process, preferably the length-width ratio shown in the following formula reach 0.4 or more in the way of by image displaying part 1
It is bonded with frame section 5.Following length-width ratios are more preferably 0.6 or more, further preferably 0.8 or more.
Length-width ratio=B '/A '
In formula, A ' indicates width of the curable resin layer 3A for being coated on the frame-shaped of image displaying part 1 in predetermined portion, B '
Indicate the width that the curable resin layer 3A after image displaying part 1 is bonded with frame section 5 is contacted in predetermined portion with frame section 5.
Here, A and B ' is indicated and the width at A and B same location shown in Fig. 2.
For the width of A ' and B ', for example, when predetermined portion is vertical with the direction extended with curable resin layer 3A
The same face image displaying part 1 is bonded with frame section 5 front and back curable resin layer 3A cutting when section when, fitting
The line width that preceding curable resin layer 3A is contacted with image displaying part 1 be A ', fitting after curable resin layer 3A and frame
The line width that portion 5 contacts is B '.It should be noted that when forming curable resin layer 3A on frame section 5, above-mentioned section
In fitting before the line width that is contacted with frame section 5 of curable resin layer 3A be A ', the curable resin layer 3A after fitting with
The line width that image displaying part 1 contacts is B '.
When length-width ratio (B '/A ') within the above range when, becoming easy ensures wetability, becomes easy to obtain for image
The cementability of display unit 1 or frame section 5.
Process (IV) (curing process)
As shown in (b) of Fig. 5, can with image displaying part 1 and frame section 5 and they be bonded made of laminated body
In the state of further progress curable resin layer 3A curing reaction.In the present specification, consolidate sometimes by what is carried out after fitting
Change reaction and is known as " retardation of curing ".Retardation of curing can for example pass through in 10 DEG C or more, 15 DEG C or more or 20 DEG C or more of environment
It spends 12 hours or more and carries out.Environment temperature for carrying out retardation of curing can be 80 DEG C or less.Carrying out retardation of curing
Period, it is other can to carry out process of process and/or check image display device that image display device is further processed etc.
Necessary process.
Retardation of curing can be free radical polymerization, but more typically based on the curing reaction of cationoid reaction, the sun from
The reaction speed of son reaction is slower than free radical polymerization.Pass through (B1) ingredient contained in curable resin layer 3A or (E) ingredient institute
The cationoid reaction for the cyclic ether group having and carry out retardation of curing.Acid caused by photo-acid generator can promote the cation
Reaction.Curable resin layer 3A (that is, light shield layer 3) after retardation of curing can be with higher bonding force by cover member and image
Display unit bonding.
Embodiment
Hereinafter, enumerating Examples and Comparative Examples further illustrates the present invention.But the present invention is not limited by these examples
It is fixed.
The raw material of hardening resin composition
(A) optical free radical polymerization initiator
Optical free radical polymerization initiator (the optical free radical polymerization initiator for generating alkali):
IRG-907 (BASF JAPAN Co. Ltd. system, IRGACURE-907,2- methyl-1-(4- methyl mercapto phenyl)-
2- morpholino propane -1- ketone)
(B) monomer component
(B1) compound with 1 radically polymerizable group group and cyclic ether group
4HBAGE (Nippon Kasei Chemical Company's system, 4HBAGE, acrylic acid 4- hydroxybutyl glycidol ether)
(B2) monofunctional monomer with 1 radically polymerizable group group
NOAA (Osaka Organic Chemical Industry Co., Ltd.'s system, NOAA, n-octyl)
IBXA (Kyoeisha Chemical Co., Ltd.'s system, Light Acrylate IB-XA, isobornyl acrylate)
HPA (Osaka Organic Chemical Industry Co., Ltd.'s system, HPA, hydroxypropyl acrylate)
(C) colorant
Elixa Black850 (ORIENT chemical industry Co. Ltd. system, black dyes)
(D) photo-acid generator
CPI-210S (San-Apro Co. Ltd. system, CPI-210S, triarylsulfonium salt system photo-acid generator)
(F) polymer (oligomer)
Pass through following step synthesis of oligonucleotides object (copolymer of 2-EHA and acrylic acid 2- hydroxy methacrylate).
2-EHA (90.0g), acrylic acid 2- hydroxy methacrylate (10.0g), methyl ethyl ketone are added in a reservoir
(30.0g) and ethyl acetate (170.0g) carries out nitrogen displacement on one side with 100mL/ minutes flows, on one side from room temperature (25 DEG C)
It is heated to 65 DEG C.After reaching 65 DEG C, adds azobis isobutyronitrile (0.3g), 8 hours are kept the temperature while keeping the temperature.
Then, isostearyl acrylate (100.0g) is added, evaporates solvent methylethylketone and ethyl acetate, thus obtains propylene
The isostearyl acrylate of the copolymer (weight average molecular weight 600000) of sour 2- ethylhexyl and acrylic acid 2- hydroxy methacrylate is molten
Liquid (heating residual component is 50%).
The preparation of hardening resin composition
Each raw material is mixed according to content shown in table 1, is stirred while heating 30 minutes, thus prepares curability tree
Oil/fat composition.The content of each ingredient shown in table 1 be on the basis of the gross mass of hardening resin composition content (unit:
Quality %).
Evaluation method
1. bonding force (after initial stage, retardation of curing)
Fig. 8 and Fig. 9 is the schematic diagram for showing the measuring method of bonding force.As shown in figure 8, in 25cm × 75cm × 0.1cm
Short strip shape glass matrix 60 center both ends be coated with hardening resin composition, formed on glass matrix 60 opposite
2 curable resin layer 3A (height 0.05mm, 0.4~0.6mm of width, length 30mm~40mm).For being formed by solidification
Property resin layer 3A, with ultraviolet lamp, (Eye graphics corporation, uses light source at US5-X0401: Eye
Graphics corporation, metal halide lamp M04-L41), with exposure intensity 400mW/cm2Ultraviolet light is irradiated, so that total irradiation
Amount is 2000mJ/cm2, partially carry out the curing reaction of curable resin layer 3A.Irradiate output illumination photometer (Ushio electricity
Machine Co. Ltd. system " UIT-250 ") it measures.
Then, as shown in figure 9, clipping the curable resin layer 3A after ultraviolet light irradiation and according to the short side of glass matrix 60
The direction parallel with the long side of glass matrix 61, on one side to another glass matrix 61 of glass matrix 60 and short strip shape (25cm ×
75cm × 0.1cm) apply load 5kgf make its fitting on one side.
By the both ends 61E of the glass matrix 61 of obtained glass bonded body according to glass matrix 61 relative to ground be in water
The state that flat and glass matrix 60 is located at 61 downside of glass matrix is fixed.In this state to glass matrix 60 along lead
Histogram applies load to downward (direction of arrow F), and increases load until glass matrix 60 is removed.Measure glass base
Body 60 removes the test force (load) at moment, records the test force divided by curable resin layer 3A (or light shield layer 3) and glass base
It is worth obtained by the bond area of body 61, as bonding force.
Bonding force after measuring initial bond power and retardation of curing by this method, the initial bond power are obtaining glass
Measured within 2 hours after conjugant, the bonding force after the retardation of curing by glass bonded body in 25 DEG C, the interior of 50%RH
It is measured after standing 48 hours.
2. light-proofness
With the soda-lime glass for non-woven fabrics (Asahi Chemical Ind's system " Bemcot ") the sufficiently wiping plate for being soaked with acetone
62 (float glass, Song Lang GLASS corporation " MICRO SLIDE GLASSS9213 ", 76 × 52mm of size, thickness 1.2~
1.5mm, irradiation light transmission 90%), it is used as test with glass baseplate.As shown in Figure 10, along soda-lime glass 62
Four sides of one interarea attach adhesive tape (OKAMOTO Co. Ltd. system " No.402 cloth rubber belt ", width 50mm), to form frame
The guiding piece 65 of shape.
Then, hardening resin composition (1mL) is added dropwise in the surface 62S of the soda-lime glass 62 of the inside of guiding piece 65, uses
Glass bar is unfolded and forms curable resin layer.With ultraviolet lamp, (Eye graphics corporation, makes US5-X0401
With light source: Eye graphics corporation, metal halide lamp M04-L41), with exposure intensity 400mW/cm2To being formed by
Curable resin layer is irradiated, so that total exposure is 2000mJ/cm2, to carry out the curing reaction of curable resin layer.
Irradiation output is measured with illumination photometer (USHIO Electric Co., Ltd system " UIT-250 ").Curable resin layer after light irradiation
With a thickness of 150 μm.
With consolidating after ultraviolet-uisible spectrophotometer (Shimadzu Scisakusho Ltd's system " UV-2400PC ") measurement light irradiation
Light transmission of the property the changed resin layer in 400~700nm of wavelength.Average light transmission rate based on 400~700nm, according to following
Benchmark evaluation light-proofness.
The average light transmission rate of A:400~700nm is less than 10%
The average light transmission rate of F:400~700mn is 10% or more
[table 1]
Table 1 shows the evaluation result of bonding force relevant to each curability resin composition and light-proofness.In embodiments
Confirmation: the method by being coated with hardening resin composition can be readily formed in narrow region with abundant light-proofness
Light shield layer.Moreover, being formed by light shield layer shows high bonding force.
Industrial availability
According to the present invention it is possible to provide the curable resin that can be used to form light shield layer when manufacturing image display device
Composition, the light shield layer have the light-proofness for inhibiting the light leakage between image displaying part and frame section, and even if narrow
Small region can be also effectively formed.In addition, according to the present invention it is possible to providing the image display dress for having following light shield layer
The manufacturing method set, the light shield layer is available to be able to suppress drop impact for fine bonding plane and constitutes image
Removing caused by screen resilience of component (such as flexible printed circuit board (FPC)) of display device etc. and the bonding force floated, and it is anti-
Light leakage is excellent.They are useful in the industry manufacture of the information terminals such as smart phone, Trackpad, personal computer, television set.
Description of symbols
1 ... image displaying part, 3 ... light shield layers, 5 ... frame sections, 3A ... curable resin layer, 20 ... cover members, 21 ...
Cover-plate glass, 22 ... frame portions, 41 ... liquid crystal display panels, 41S ... picture display face, 42 ... transmitance pressure-sensitive adhesive layers, 43 ...
Back light part, 45 ... light sources, 46 ... optical sheet portions, 51 ... resinous frameworks, 52 ... backlight frames, 53 ... case frames, 60,61 ... glass
Glass matrix, the both ends of 61E ... glass matrix 61,62 ... soda-lime glass, the surface of 62S ... soda-lime glass 62,65 ... guiding pieces,
The width of 100 ... image display devices, W ... light shield layer.
Claims (12)
1. a kind of hardening resin composition contains optical free radical polymerization initiator, monomer component, colorant and photic production acid
Agent, the monomer component include the monomer rolled into a ball with cyclic ether group and 1 radically polymerizable group.
2. a kind of hardening resin composition contains optical free radical polymerization initiator, monomer component, colorant, photic production acid
Agent and compound with cyclic ether group, the monomer component include the monomer with 1 radically polymerizable group group.
3. hardening resin composition according to claim 1 or 2, also contains polymer.
4. hardening resin composition described in any one of claim 1 to 3, is used to form light shield layer.
5. hardening resin composition according to any one of claims 1 to 4, wherein in irradiation active energy beam
When show pressure-sensitive adhesive.
6. hardening resin composition according to claim 5, wherein the pressure-sensitive bonding force found out with following methods is
10N/cm2More than,
Width 25mm, length 75mm, thickness 1mm the first glass baseplate on be coated with hardening resin composition, according to solidification
Width 0.6mm, length 25mm, film thickness 50 is arranged in the mode that the length direction of property resin layer is orthogonal with the long side of the first glass baseplate
μm curable resin layer, to curable resin layer with 3000mW/cm2Exposure intensity illumination wavelength be 365nm light so that
Total exposure is 5000mJ/cm2, irradiated on the curable resin layer within 1 minute in light, according to the length of the first glass baseplate
Side and the mode that the long side of the second glass baseplate is aligned in terms of vertical direction configure width 25mm, length 75mm, thickness 1mm
Two glass baseplates apply the load 10 seconds of 1N and make its fitting, obtain measurement sample；It is being bonded within an hour, measurement will survey
Test force when first glass baseplate of random sample product is removed with the second glass baseplate one another along opposite longitudinal direction, by the examination
Power is tested divided by value obtained by the contact area of curable resin layer and the second glass baseplate as pressure-sensitive bonding force.
7. hardening resin composition according to claim 5 or 6, wherein the length-width ratio found out with following methods is 0.4
More than,
Width 25mm, length 75mm, thickness 1mm the first glass baseplate on be coated with hardening resin composition, according to solidification
Width 0.6mm, length 25mm, film thickness 50 is arranged in the mode that the length direction of property resin layer is orthogonal with the long side of the first glass baseplate
μm curable resin layer, to curable resin layer with 3000mW/cm2Exposure intensity illumination wavelength be 365nm light so that
Total exposure is 5000mJ/cm2, irradiated on the curable resin layer within 1 minute in light, according to the length of the first glass baseplate
Side and the mode that the long side of the second glass baseplate is aligned in terms of vertical direction configure width 25mm, length 75mm, thickness 1mm
Two glass baseplates apply the load 10 seconds of 1N and make its fitting, obtain measurement sample；Will measure in sample with the second glass
When the width of the curable resin layer of substrate contact is set as B, using B/0.6 as length-width ratio, wherein the unit of B is mm.
8. a kind of image display device, has:
Image displaying part includes liquid crystal display panel with picture display face and with the light opposite with described image display surface
The cover member of transmissive portions；
Frame section is arranged in around described image display unit, and supports described image display unit；And
Light shield layer is formed between the frame section and described image display unit, wherein
The light shield layer is the curable resin layer comprising hardening resin composition according to any one of claims 1 to 7
Solidfied material.
9. a kind of method for manufacturing image display device, wherein described image display device has:
Image displaying part includes liquid crystal display panel with picture display face and with the light opposite with described image display surface
The cover member of transmissive portions；
Frame section is arranged in around described image display unit, and supports described image display unit；And
Light shield layer is formed between the frame section and described image display unit,
The method successively has:
Curable resin combination according to any one of claims 1 to 7 is coated in described image display unit or the frame section
Object and the process for forming the curable resin layer of frame-shaped；
The curing reaction of the curable resin layer is carried out and irradiating active energy beam to the curable resin layer
Process；And
The process for clipping the curable resin layer and being bonded described image display unit with the frame section, wherein
The light shield layer is the curable resin layer for having carried out curing reaction.
10. described when being bonded described image display unit with the frame section according to the method described in claim 9, wherein
Curable resin layer has pressure-sensitive adhesive.
11. method according to claim 9 or 10, wherein the side for being 0.4 or more according to length-width ratio shown in following formula
Formula is bonded described image display unit with the frame section,
Length-width ratio=B '/A '
In formula, A ' indicates the curable resin for being coated on the frame-shaped of one of described image display unit and the frame section
Width of the layer in predetermined portion；B ' indicates after described image display unit is bonded with the frame section, the curable resin layer
In the width that the predetermined portion is contacted with the other of described image display unit and the frame section.
12. the method according to any one of claim 9~11, is also equipped with: make described image display unit with it is described
After the process of frame section fitting, the process of the curing reaction of curable resin layer described in further progress.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPPCT/JP2016/074715 | 2016-08-24 | ||
| PCT/JP2016/074715 WO2018037517A1 (en) | 2016-08-24 | 2016-08-24 | Curable resin composition, image display device and manufacturing method of image display device |
| PCT/JP2017/030386 WO2018038221A1 (en) | 2016-08-24 | 2017-08-24 | Curable resin composition, image display device and manufacturing method of image display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109689699A true CN109689699A (en) | 2019-04-26 |
Family
ID=61244942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780051409.8A Pending CN109689699A (en) | 2016-08-24 | 2017-08-24 | The manufacturing method of hardening resin composition, image display device and image display device |
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| Country | Link |
|---|---|
| JP (1) | JPWO2018038221A1 (en) |
| KR (1) | KR20190045235A (en) |
| CN (1) | CN109689699A (en) |
| TW (1) | TW201816053A (en) |
| WO (2) | WO2018037517A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6857839B2 (en) * | 2016-09-13 | 2021-04-14 | パナソニックＩｐマネジメント株式会社 | Portable information terminal |
| JP2020164615A (en) * | 2019-03-29 | 2020-10-08 | 日東電工株式会社 | Pressure sensitive adhesive sheet |
| JP7276198B2 (en) * | 2020-03-02 | 2023-05-18 | 株式会社デンソー | Display device and display device manufacturing method |
| JP2023157777A (en) * | 2022-04-15 | 2023-10-26 | 株式会社レゾナック | Thermosetting adhesive composition, layered film, connected structure, and production method therefor |
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- 2016-08-24 WO PCT/JP2016/074715 patent/WO2018037517A1/en active Application Filing
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2017
- 2017-08-24 WO PCT/JP2017/030386 patent/WO2018038221A1/en active Application Filing
- 2017-08-24 CN CN201780051409.8A patent/CN109689699A/en active Pending
- 2017-08-24 TW TW106128814A patent/TW201816053A/en unknown
- 2017-08-24 JP JP2018535763A patent/JPWO2018038221A1/en active Pending
- 2017-08-24 KR KR1020197008419A patent/KR20190045235A/en unknown
Patent Citations (6)
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| CN1938377A (en) * | 2004-03-26 | 2007-03-28 | 株式会社钟化 | Composition curable by both free-radical photocuring and cationic photocuring |
| CN101370836A (en) * | 2006-01-20 | 2009-02-18 | 日立化成工业株式会社 | Resin composition and optical member using cured product of such resin composition |
| CN103176360A (en) * | 2009-06-08 | 2013-06-26 | 三洋化成工业株式会社 | Photosensitive composition |
| CN102012535A (en) * | 2009-09-04 | 2011-04-13 | 东洋油墨制造株式会社 | Polarizing plate and photocurable adhesive for forming polarizing plate |
| CN103562267A (en) * | 2011-05-31 | 2014-02-05 | 电气化学工业株式会社 | Energy-beam-curable resin composition |
| WO2015163201A1 (en) * | 2014-04-24 | 2015-10-29 | セントラル硝子株式会社 | Curable composition, temporary adhesive material, and method for temporarily bonding member using same and substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2018038221A1 (en) | 2019-06-24 |
| WO2018037517A1 (en) | 2018-03-01 |
| KR20190045235A (en) | 2019-05-02 |
| TW201816053A (en) | 2018-05-01 |
| WO2018038221A1 (en) | 2018-03-01 |
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Application publication date: 20190426 |