JP5225171B2 - 撮像装置 - Google Patents

撮像装置 Download PDF

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Publication number
JP5225171B2
JP5225171B2 JP2009079209A JP2009079209A JP5225171B2 JP 5225171 B2 JP5225171 B2 JP 5225171B2 JP 2009079209 A JP2009079209 A JP 2009079209A JP 2009079209 A JP2009079209 A JP 2009079209A JP 5225171 B2 JP5225171 B2 JP 5225171B2
Authority
JP
Japan
Prior art keywords
photoelectric conversion
conversion element
element package
back surface
fixing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009079209A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010233015A5 (enExample
JP2010233015A (ja
Inventor
幸司 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2009079209A priority Critical patent/JP5225171B2/ja
Priority to US12/731,519 priority patent/US8493503B2/en
Priority to CN201010141137.0A priority patent/CN101848326B/zh
Publication of JP2010233015A publication Critical patent/JP2010233015A/ja
Publication of JP2010233015A5 publication Critical patent/JP2010233015A5/ja
Application granted granted Critical
Publication of JP5225171B2 publication Critical patent/JP5225171B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
JP2009079209A 2009-03-27 2009-03-27 撮像装置 Expired - Fee Related JP5225171B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009079209A JP5225171B2 (ja) 2009-03-27 2009-03-27 撮像装置
US12/731,519 US8493503B2 (en) 2009-03-27 2010-03-25 Imaging apparatus
CN201010141137.0A CN101848326B (zh) 2009-03-27 2010-03-25 摄像设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009079209A JP5225171B2 (ja) 2009-03-27 2009-03-27 撮像装置

Publications (3)

Publication Number Publication Date
JP2010233015A JP2010233015A (ja) 2010-10-14
JP2010233015A5 JP2010233015A5 (enExample) 2012-05-17
JP5225171B2 true JP5225171B2 (ja) 2013-07-03

Family

ID=42772769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009079209A Expired - Fee Related JP5225171B2 (ja) 2009-03-27 2009-03-27 撮像装置

Country Status (3)

Country Link
US (1) US8493503B2 (enExample)
JP (1) JP5225171B2 (enExample)
CN (1) CN101848326B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024071013A1 (ja) * 2022-09-27 2024-04-04 富士フイルム株式会社 放熱構造

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8441572B2 (en) * 2008-07-18 2013-05-14 Panasonic Corporation Imaging device
JP2012032704A (ja) * 2010-08-02 2012-02-16 Canon Inc 撮像装置
KR20130127841A (ko) * 2012-05-15 2013-11-25 삼성전자주식회사 촬상장치 및 촬상장치의 제조 방법
JP6588243B2 (ja) * 2015-06-09 2019-10-09 オリンパス株式会社 光電変換素子の冷却構造
DE112016004998T5 (de) 2015-10-30 2018-07-26 Canon Kabushiki Kaisha Elektronische Vorrichtung
DE112016004987T5 (de) 2015-10-30 2018-07-19 Canon Kabushiki Kaisha Elektronische vorrichtung
JP7118853B2 (ja) * 2018-10-16 2022-08-16 キヤノン株式会社 撮像ユニット
US12389094B2 (en) * 2022-09-23 2025-08-12 Apple Inc. Sensor temperature reducer for a sensor shift camera architecture

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6654064B2 (en) * 1997-05-23 2003-11-25 Canon Kabushiki Kaisha Image pickup device incorporating a position defining member
JP4046837B2 (ja) 1998-03-11 2008-02-13 キヤノン株式会社 撮像装置
US6956615B2 (en) * 2000-01-28 2005-10-18 Pentax Corporation Structure for mounting a solid-state imaging device
JP4169938B2 (ja) * 2000-01-28 2008-10-22 Ｈｏｙａ株式会社 固体撮像素子保持ブロックおよび固体撮像素子取り付け構造
JP3613193B2 (ja) * 2001-03-30 2005-01-26 三菱電機株式会社 撮像装置
JP4083521B2 (ja) 2001-10-29 2008-04-30 オリンパス株式会社 撮像装置
JP2006078897A (ja) * 2004-09-10 2006-03-23 Konica Minolta Photo Imaging Inc 撮像装置
JP2006086752A (ja) * 2004-09-15 2006-03-30 Fuji Photo Film Co Ltd 撮像素子一体型レンズ交換式カメラ及び撮像素子一体型交換レンズユニット
JP2006191465A (ja) * 2005-01-07 2006-07-20 Seiko Instruments Inc 電子機器
JP2006295714A (ja) * 2005-04-13 2006-10-26 Olympus Corp 撮像装置
JP2007166006A (ja) * 2005-12-09 2007-06-28 Sony Corp 撮像装置
JP2008219704A (ja) * 2007-03-07 2008-09-18 Olympus Imaging Corp 半導体装置
JP2008271487A (ja) * 2007-03-29 2008-11-06 Olympus Imaging Corp 撮像素子モジュール、撮像素子モジュールを用いたレンズユニット及び携帯用電子機器
JP5291892B2 (ja) 2007-05-01 2013-09-18 オリンパスイメージング株式会社 撮像素子モジュール、撮像素子モジュールを用いたレンズユニット及び携帯用電子機器
CN101369592A (zh) * 2007-08-14 2009-02-18 鸿富锦精密工业（深圳）有限公司 影像感测器
JP4921286B2 (ja) * 2007-08-24 2012-04-25 キヤノン株式会社 撮像装置および光電変換素子パッケージ保持ユニット
TW200951616A (en) * 2008-06-05 2009-12-16 Asia Optical Co Inc Image sensing module
JP4770854B2 (ja) * 2008-03-19 2011-09-14 カシオ計算機株式会社 デジタルカメラ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024071013A1 (ja) * 2022-09-27 2024-04-04 富士フイルム株式会社 放熱構造

Also Published As

Publication number Publication date
US8493503B2 (en) 2013-07-23
JP2010233015A (ja) 2010-10-14
CN101848326B (zh) 2013-01-09
US20100245662A1 (en) 2010-09-30
CN101848326A (zh) 2010-09-29

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