JP5223679B2 - 接着剤及びこれを用いた接続構造体 - Google Patents

接着剤及びこれを用いた接続構造体 Download PDF

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Publication number
JP5223679B2
JP5223679B2 JP2008546976A JP2008546976A JP5223679B2 JP 5223679 B2 JP5223679 B2 JP 5223679B2 JP 2008546976 A JP2008546976 A JP 2008546976A JP 2008546976 A JP2008546976 A JP 2008546976A JP 5223679 B2 JP5223679 B2 JP 5223679B2
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JP
Japan
Prior art keywords
group
parts
resin
meth
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008546976A
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English (en)
Japanese (ja)
Other versions
JPWO2008065997A1 (ja
Inventor
茂樹 加藤木
直 工藤
弘行 伊澤
敏明 白坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2008546976A priority Critical patent/JP5223679B2/ja
Publication of JPWO2008065997A1 publication Critical patent/JPWO2008065997A1/ja
Application granted granted Critical
Publication of JP5223679B2 publication Critical patent/JP5223679B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP2008546976A 2006-12-01 2007-11-26 接着剤及びこれを用いた接続構造体 Expired - Fee Related JP5223679B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008546976A JP5223679B2 (ja) 2006-12-01 2007-11-26 接着剤及びこれを用いた接続構造体

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2006325559 2006-12-01
JP2006325559 2006-12-01
JP2007234590 2007-09-10
JP2007234590 2007-09-10
JP2008546976A JP5223679B2 (ja) 2006-12-01 2007-11-26 接着剤及びこれを用いた接続構造体
PCT/JP2007/072763 WO2008065997A1 (fr) 2006-12-01 2007-11-26 Adhésif et structure de liaison utilisant celui-ci

Publications (2)

Publication Number Publication Date
JPWO2008065997A1 JPWO2008065997A1 (ja) 2010-03-04
JP5223679B2 true JP5223679B2 (ja) 2013-06-26

Family

ID=39467789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008546976A Expired - Fee Related JP5223679B2 (ja) 2006-12-01 2007-11-26 接着剤及びこれを用いた接続構造体

Country Status (5)

Country Link
JP (1) JP5223679B2 (zh)
KR (1) KR101090577B1 (zh)
CN (1) CN101541903B (zh)
TW (1) TW200846435A (zh)
WO (1) WO2008065997A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5315623B2 (ja) * 2007-03-28 2013-10-16 横浜ゴム株式会社 硬化性樹脂組成物
JP5456475B2 (ja) * 2007-09-05 2014-03-26 日立化成株式会社 接着剤及びそれを用いた接続構造体
JP2009108226A (ja) * 2007-10-31 2009-05-21 Yokohama Rubber Co Ltd:The 硬化性樹脂組成物
CN101608107B (zh) * 2008-06-16 2013-06-05 华东理工大学 粘接剂组合物及含该粘接剂组合物的各向异性导电粘接剂
CN104059547B (zh) * 2008-09-30 2016-08-24 迪睿合电子材料有限公司 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法
JP5577635B2 (ja) * 2008-10-09 2014-08-27 日立化成株式会社 接着剤組成物、回路接続用接着剤及び回路接続体
CN102791820B (zh) * 2010-03-25 2015-04-29 日立化成株式会社 粘接剂组合物及其用途、以及电路部件的连接结构体及其制造方法
JP5891090B2 (ja) * 2012-03-29 2016-03-22 富士フイルム株式会社 インプリント用下層膜組成物およびこれを用いたパターン形成方法
CN102984610A (zh) * 2012-12-08 2013-03-20 张情情 一种音响
JP6127806B2 (ja) * 2013-07-24 2017-05-17 日立化成株式会社 接続材料、接続構造体及びその製造方法
JP2015025028A (ja) * 2013-07-24 2015-02-05 日立化成株式会社 接続材料、これを用いた接続構造体及びその製造方法
GB2518363A (en) * 2013-09-18 2015-03-25 Novalia Ltd Circuit board assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005054140A (ja) * 2003-08-07 2005-03-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024826B2 (ja) * 1979-01-12 1985-06-14 田岡化学工業株式会社 接着方法
JP4158434B2 (ja) * 2001-07-05 2008-10-01 株式会社ブリヂストン 異方性導電フィルム
KR100675412B1 (ko) * 2003-09-09 2007-01-29 다이니폰 인사츠 가부시키가이샤 광학용 시트 및 그 제조방법
JP2005123025A (ja) * 2003-10-16 2005-05-12 Bridgestone Corp 異方性導電フィルム
CN101370892B (zh) * 2006-01-17 2012-06-13 旭化成电子材料株式会社 聚亚胺树脂组合物及金属聚亚胺层压体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005054140A (ja) * 2003-08-07 2005-03-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置

Also Published As

Publication number Publication date
KR101090577B1 (ko) 2011-12-08
KR20090096489A (ko) 2009-09-10
TWI359851B (zh) 2012-03-11
JPWO2008065997A1 (ja) 2010-03-04
CN101541903A (zh) 2009-09-23
CN101541903B (zh) 2013-04-17
WO2008065997A1 (fr) 2008-06-05
TW200846435A (en) 2008-12-01

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