JP5194042B2 - ヒートシンク及びその製造方法 - Google Patents
ヒートシンク及びその製造方法 Download PDFInfo
- Publication number
- JP5194042B2 JP5194042B2 JP2010057536A JP2010057536A JP5194042B2 JP 5194042 B2 JP5194042 B2 JP 5194042B2 JP 2010057536 A JP2010057536 A JP 2010057536A JP 2010057536 A JP2010057536 A JP 2010057536A JP 5194042 B2 JP5194042 B2 JP 5194042B2
- Authority
- JP
- Japan
- Prior art keywords
- columnar
- substrate
- lid plate
- flange portion
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims description 56
- 238000003825 pressing Methods 0.000 claims description 13
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49366—Sheet joined to sheet
- Y10T29/49368—Sheet joined to sheet with inserted tubes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
12 柱状突起
20 蓋板
21 装着穴
22 固定孔
23 第一貫通孔
30 柱状フィン
31 フランジ部
32 柱体
40 板状フィン
42 第二貫通孔
Claims (4)
- 複数の柱状突起が形成されている基板と、
フランジ部及び前記フランジ部から延伸して形成される柱体からなる複数の柱状フィンと、
前記複数の柱状フィンのフランジ部を収納するための複数の装着穴と、前記装着穴と同心であって且つ前記柱状フィンの柱体を貫かせる貫通孔と、前記複数の柱状突起を挿入させる複数の固定孔と、が形成されている蓋板と、
を備え、
前記固定孔に挿入された前記柱状突起を上下方向から押圧して変形させることによって、前記基板と前記蓋板とは緊密に固定され、且つ前記柱状フィンのフランジ部は前記基板と前記蓋板との間に挟まれた状態で固定されることを特徴とするヒートシンク。 - 前記柱状突起は、前記基板の底面からプレス加工して前記基板に一体に成型され、且つ前記基板の底面には前記柱状突起に対応する複数の凹部が形成されることを特徴とする請求項1に記載のヒートシンク。
- フランジ部及び前記フランジ部から延伸して形成される柱体からなる複数の柱状フィンを提供するステップと、
複数の柱状突起が形成されている基板を提供するステップと、
前記複数の柱状フィンのフランジ部を収納するための複数の装着穴、前記装着穴と同心であって且つ前記柱状フィンの柱体を貫かせる貫通孔及び前記複数の柱状突起を挿入させる複数の固定孔を有し、且つ前記装着穴の深さが前記フランジ部の厚さより小さい蓋板を提供するステップと、
前記複数の柱状フィンのフランジ部がそれぞれ対応する前記装着穴に収納されるまで前記複数の柱状フィンの柱体をそれぞれ対応する貫通孔に貫かせるステップと、
前記基板と前記蓋板とを押圧結合して、前記柱状フィンのフランジ部を前記基板と前記蓋板との間に固定し、且つ前記押圧の力によって前記フランジ部の前記装着穴から突出されている部分が直径方向に沿って延伸して前記装着穴内に緊密に結合されるステップと、
前記蓋板の固定孔に挿入されている前記基板の柱状突起を上下方向から押圧して変形させて前記基板と前記蓋板とを堅固に固定させるステップと、
を含むことを特徴とするヒートインクの製造方法。 - 前記基板と前記蓋板とを押圧結合した後のフランジ部の厚さと前記装着穴の深さとが同じであることを特徴とする請求項3に記載のヒートインクの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910301386.9 | 2009-04-08 | ||
CN200910301386A CN101861073A (zh) | 2009-04-08 | 2009-04-08 | 散热器及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010245516A JP2010245516A (ja) | 2010-10-28 |
JP5194042B2 true JP5194042B2 (ja) | 2013-05-08 |
Family
ID=42933414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010057536A Expired - Fee Related JP5194042B2 (ja) | 2009-04-08 | 2010-03-15 | ヒートシンク及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8341842B2 (ja) |
JP (1) | JP5194042B2 (ja) |
CN (1) | CN101861073A (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201518567U (zh) * | 2009-08-26 | 2010-06-30 | 富准精密工业(深圳)有限公司 | 散热模组 |
US8695687B2 (en) * | 2010-12-10 | 2014-04-15 | Palo Alto Research Center Incorporated | Hybrid pin-fin micro heat pipe heat sink and method of fabrication |
US8700965B2 (en) * | 2011-03-16 | 2014-04-15 | Clearwire Ip Holdings Llc | Apparatus and method for determining number of retransmissions in a wireless system |
USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
CN104266512A (zh) * | 2014-10-15 | 2015-01-07 | 广东美的制冷设备有限公司 | 散热器及其装配方法 |
USD822625S1 (en) * | 2016-04-26 | 2018-07-10 | Showa Denko K.K. | Fin for heat exchanger |
CN107359145A (zh) * | 2017-05-27 | 2017-11-17 | 宁波奇尘电子科技有限公司 | 耐高温散热器及其制造方法 |
JP6555374B1 (ja) * | 2018-03-13 | 2019-08-07 | 日本電気株式会社 | 冷却構造、実装構造 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4733453A (en) * | 1987-01-16 | 1988-03-29 | Pinfin, Inc. | Method of making a multiple-pin heatsink |
JPH0677364A (ja) * | 1992-08-27 | 1994-03-18 | Fujitsu Ltd | 放熱フィン |
US5499450A (en) * | 1994-12-19 | 1996-03-19 | Jacoby; John | Method of manufacturing a multiple pin heatsink device |
JPH09270485A (ja) * | 1996-03-29 | 1997-10-14 | Sankyo Kk | 放熱装置、放熱装置と発熱体の組合体、および放熱装置の製造方法 |
JPH1117078A (ja) * | 1997-06-19 | 1999-01-22 | Sumitomo Precision Prod Co Ltd | 放熱器 |
US6134783A (en) * | 1997-10-29 | 2000-10-24 | Bargman; Ronald D. | Heat sink and process of manufacture |
US5829514A (en) * | 1997-10-29 | 1998-11-03 | Eastman Kodak Company | Bonded cast, pin-finned heat sink and method of manufacture |
TW349194B (en) * | 1997-12-26 | 1999-01-01 | Hon Hai Prec Ind Co Ltd | Heat sink device and process for producing the same |
TW444158B (en) * | 1998-07-08 | 2001-07-01 | Hon Hai Prec Ind Co Ltd | Heat sink device and its manufacture method |
JP2000228595A (ja) * | 1999-02-05 | 2000-08-15 | Mitsubishi Electric Corp | ヒートシンク |
JP2000269671A (ja) * | 1999-03-19 | 2000-09-29 | Toshiba Corp | 電子機器 |
JP3273505B2 (ja) * | 1999-08-18 | 2002-04-08 | 古河電気工業株式会社 | 放熱フィンを備えたヒートシンクおよび放熱フィンの固定方法 |
JP2001110967A (ja) * | 1999-10-07 | 2001-04-20 | Fujikura Ltd | 電子素子の放熱構造 |
US6296048B1 (en) * | 2000-09-08 | 2001-10-02 | Powerwave Technologies, Inc. | Heat sink assembly |
US7117930B2 (en) * | 2002-06-14 | 2006-10-10 | Thermal Corp. | Heat pipe fin stack with extruded base |
CN101048056B (zh) * | 2007-04-30 | 2010-08-25 | 华为技术有限公司 | 散热器及具有散热器的电子设备 |
CN201066983Y (zh) * | 2007-05-24 | 2008-05-28 | 陈世明 | 散热器底座和热导管的紧配结构改良 |
CN101848626B (zh) * | 2009-03-27 | 2013-08-07 | 富准精密工业(深圳)有限公司 | 散热器及其制造方法 |
CN101896053B (zh) * | 2009-05-20 | 2014-08-20 | 富准精密工业(深圳)有限公司 | 散热模组 |
-
2009
- 2009-04-08 CN CN200910301386A patent/CN101861073A/zh active Pending
- 2009-08-07 US US12/537,267 patent/US8341842B2/en active Active
-
2010
- 2010-03-15 JP JP2010057536A patent/JP5194042B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101861073A (zh) | 2010-10-13 |
JP2010245516A (ja) | 2010-10-28 |
US20100258287A1 (en) | 2010-10-14 |
US8341842B2 (en) | 2013-01-01 |
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