JP5191799B2 - ハンダ付け用基板搬送治具 - Google Patents
ハンダ付け用基板搬送治具 Download PDFInfo
- Publication number
- JP5191799B2 JP5191799B2 JP2008132827A JP2008132827A JP5191799B2 JP 5191799 B2 JP5191799 B2 JP 5191799B2 JP 2008132827 A JP2008132827 A JP 2008132827A JP 2008132827 A JP2008132827 A JP 2008132827A JP 5191799 B2 JP5191799 B2 JP 5191799B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- terminal
- soldering
- light source
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
- B23K37/0443—Jigs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/047—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
2 回路基板
3 下パレット
4,4’ 上パレット
5〜10 部品
5〜7 コネクタハウジング(着色樹脂部品)
9,10 リレー(着色樹脂部品)
12 ピン状の端子(端子)
13 挟持端子(端子)
14 バスバー部
16 光源
17〜21 覆い部(光源を遮る部分)
22〜24,24’開口
22a〜c,23a〜c,24a〜b,24’a〜b 端面
Claims (6)
- 上下のパレットの間に回路基板と各部品とを保持するように構成され、該回路基板上の着色樹脂部品に対向して上パレットに予備加熱用の光源を遮る部分が形成され、該着色樹脂部品を除く回路基板側に対向して該上パレットに、該光源を照射させる複数の開口が設けられ、該回路基板にハンダ接続される端子の回路基板接続部が該着色樹脂部品の近傍において該光源を遮る部分で覆われ、該端子の本体部が該回路基板接続部から離れた一の該開口に対向し、該一の開口からの照射光で該端子の本体部が加熱されることを特徴とするハンダ付け用基板搬送治具。
- 前記着色樹脂部品であるコネクタハウジングから導出された端子に対向して他の前記開口が設けられたことを特徴とする請求項1記載のハンダ付け用基板搬送治具。
- 電気部品接続用の前記端子の本体部に対向して前記一の開口が設けられ、該端子の本体部と一体のバスバー部の前記回路基端接続部が前記回路基板にハンダ接続されることを特徴とする請求項1記載のハンダ付け用基板搬送治具。
- 前記着色樹脂部品であるコネクタハウジングから導出された端子に対向して他の前記開口が設けられ、複数の前記端子の前記バスバー部のうちの幾つかに対向して該他の開口が設けられたことを特徴とする請求項3記載のハンダ付け用基板搬送治具。
- 少なくとも前記開口内の端面が前記光源からの光を前記回路基板側に向けて斜め下方に反射する材料で形成されたことを特徴とする請求項1〜4の何れかに記載のハンダ付け用基板搬送治具。
- 前記上パレット全体が光を反射する材料で形成されたことを特徴とする請求項5記載のハンダ付け用基板搬送治具。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008132827A JP5191799B2 (ja) | 2008-05-21 | 2008-05-21 | ハンダ付け用基板搬送治具 |
US12/453,407 US20090289039A1 (en) | 2008-05-21 | 2009-05-11 | Circuit board conveying and soldering apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008132827A JP5191799B2 (ja) | 2008-05-21 | 2008-05-21 | ハンダ付け用基板搬送治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009283594A JP2009283594A (ja) | 2009-12-03 |
JP5191799B2 true JP5191799B2 (ja) | 2013-05-08 |
Family
ID=41341314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008132827A Expired - Fee Related JP5191799B2 (ja) | 2008-05-21 | 2008-05-21 | ハンダ付け用基板搬送治具 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090289039A1 (ja) |
JP (1) | JP5191799B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201414559A (zh) * | 2012-10-08 | 2014-04-16 | Power Mate Technology Co Ltd | 金屬外罩與板體之焊接方法 |
EP3276655A1 (en) * | 2016-07-26 | 2018-01-31 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Method and system for bonding a chip to a substrate |
CN111465245B (zh) * | 2020-03-31 | 2021-04-23 | 广东电网有限责任公司 | 一种终端保护装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54134745U (ja) * | 1978-03-09 | 1979-09-19 | ||
JPS6181697A (ja) * | 1984-09-28 | 1986-04-25 | 石井 銀弥 | プリント基板のはんだ付け方法 |
JPH0693544B2 (ja) * | 1985-12-20 | 1994-11-16 | 松下電器産業株式会社 | 電子部品の半田付け装置 |
US5433368A (en) * | 1992-11-10 | 1995-07-18 | Spigarelli; Donald J. | Soldering system |
JP4407202B2 (ja) * | 2003-08-22 | 2010-02-03 | パナソニック株式会社 | 加工装置及び加工方法とこれを用いた生産設備 |
JP4191109B2 (ja) * | 2004-07-22 | 2008-12-03 | パナソニック株式会社 | リフロー半田付け装置及び方法、並びに基板保持板 |
SG155779A1 (en) * | 2008-03-10 | 2009-10-29 | Micron Technology Inc | Apparatus and methods of forming wire bonds |
-
2008
- 2008-05-21 JP JP2008132827A patent/JP5191799B2/ja not_active Expired - Fee Related
-
2009
- 2009-05-11 US US12/453,407 patent/US20090289039A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2009283594A (ja) | 2009-12-03 |
US20090289039A1 (en) | 2009-11-26 |
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