JP5185338B2 - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP5185338B2
JP5185338B2 JP2010178962A JP2010178962A JP5185338B2 JP 5185338 B2 JP5185338 B2 JP 5185338B2 JP 2010178962 A JP2010178962 A JP 2010178962A JP 2010178962 A JP2010178962 A JP 2010178962A JP 5185338 B2 JP5185338 B2 JP 5185338B2
Authority
JP
Japan
Prior art keywords
electrode
emitting device
light emitting
light
extraction electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010178962A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010251807A5 (enExample
JP2010251807A (ja
Inventor
吉昭 杉崎
英毅 柴田
正行 石川
英男 田村
哲郎 小松
章弘 小島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2010178962A priority Critical patent/JP5185338B2/ja
Publication of JP2010251807A publication Critical patent/JP2010251807A/ja
Publication of JP2010251807A5 publication Critical patent/JP2010251807A5/ja
Application granted granted Critical
Publication of JP5185338B2 publication Critical patent/JP5185338B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2010178962A 2010-08-09 2010-08-09 発光装置 Active JP5185338B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010178962A JP5185338B2 (ja) 2010-08-09 2010-08-09 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010178962A JP5185338B2 (ja) 2010-08-09 2010-08-09 発光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2008316752A Division JP4724222B2 (ja) 2008-12-12 2008-12-12 発光装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013002814A Division JP5462378B2 (ja) 2013-01-10 2013-01-10 半導体発光装置、発光装置、半導体発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2010251807A JP2010251807A (ja) 2010-11-04
JP2010251807A5 JP2010251807A5 (enExample) 2012-08-30
JP5185338B2 true JP5185338B2 (ja) 2013-04-17

Family

ID=43313701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010178962A Active JP5185338B2 (ja) 2010-08-09 2010-08-09 発光装置

Country Status (1)

Country Link
JP (1) JP5185338B2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5603793B2 (ja) 2011-02-09 2014-10-08 株式会社東芝 半導体発光装置
JP5603813B2 (ja) * 2011-03-15 2014-10-08 株式会社東芝 半導体発光装置及び発光装置
JP5680472B2 (ja) * 2011-04-22 2015-03-04 シチズンホールディングス株式会社 半導体発光装置の製造方法
JP5848562B2 (ja) * 2011-09-21 2016-01-27 シチズン電子株式会社 半導体発光装置及びその製造方法。
JP5698633B2 (ja) * 2011-09-21 2015-04-08 株式会社東芝 半導体発光装置、発光モジュール、および半導体発光装置の製造方法
US10276758B2 (en) * 2012-03-19 2019-04-30 Lumileds Llc Singulaton of light emitting devices before and after application of phosphor
JP5684751B2 (ja) 2012-03-23 2015-03-18 株式会社東芝 半導体発光素子及びその製造方法
JP5710532B2 (ja) 2012-03-26 2015-04-30 株式会社東芝 半導体発光装置及びその製造方法
US20150187887A1 (en) * 2012-07-04 2015-07-02 Dowa Electronics Materials Co., Ltd. Iii nitride semiconductor device and method of manufacturing the same
US9543465B2 (en) 2014-05-20 2017-01-10 Nichia Corporation Method for manufacturing light emitting device
JP6318991B2 (ja) * 2014-08-30 2018-05-09 日亜化学工業株式会社 発光装置の製造方法
JP2016171188A (ja) 2015-03-12 2016-09-23 株式会社東芝 半導体発光装置とその製造方法
WO2018117361A1 (ko) * 2016-12-23 2018-06-28 주식회사 루멘스 마이크로 엘이디 모듈 및 그 제조방법
KR102657114B1 (ko) * 2017-02-10 2024-04-15 주식회사 루멘스 마이크로 엘이디 모듈 및 그 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000244012A (ja) * 1998-12-22 2000-09-08 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体素子の製造方法
JP2005216917A (ja) * 2004-01-27 2005-08-11 Seiko Epson Corp 光源装置及びプロジェクタ
WO2006035664A1 (ja) * 2004-09-27 2006-04-06 Matsushita Electric Industrial Co., Ltd. 半導体発光素子、その製造方法及びその実装方法、並びに発光装置
KR100658970B1 (ko) * 2006-01-09 2006-12-19 주식회사 메디아나전자 복합 파장의 광을 발생시키는 발광 다이오드 소자

Also Published As

Publication number Publication date
JP2010251807A (ja) 2010-11-04

Similar Documents

Publication Publication Date Title
JP4724222B2 (ja) 発光装置の製造方法
JP5185338B2 (ja) 発光装置
JP2011199193A (ja) 発光装置及びその製造方法
JP5680472B2 (ja) 半導体発光装置の製造方法
JP5462217B2 (ja) 発光装置の製造方法
US9490398B2 (en) Manufacturing method of light emitting device in a flip-chip configuration with reduced package size
US20150303355A1 (en) Semiconductor light emitting device and method for manufacturing same
JP6273945B2 (ja) 発光装置
JP2014112669A (ja) 半導体発光装置及びその製造方法
CN106537616A (zh) 发光装置
KR102185099B1 (ko) 돔을 가진 칩 규모 발광 디바이스 패키지
JP5462378B2 (ja) 半導体発光装置、発光装置、半導体発光装置の製造方法
JP2013507011A (ja) 変換素子を介したオプトエレクトロニクス半導体コンポーネントの接続方法およびオプトエレクトロニクス半導体コンポーネント
JP6034456B2 (ja) 半導体発光装置及び発光装置
JP5919753B2 (ja) 発光装置および発光装置の製造方法
JP5827700B2 (ja) 半導体発光装置及び発光装置
JP4756110B2 (ja) 発光装置の製造方法
KR101490799B1 (ko) 웨이퍼레벨 패키지 구조체, 이를 이용한 led 및 이의 제조방법
HK1162083A (en) Method for manufacturing light emitting device and light emitting device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100809

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120709

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20120709

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20120809

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120813

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121012

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121220

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130117

R151 Written notification of patent or utility model registration

Ref document number: 5185338

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160125

Year of fee payment: 3

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250