JP5180439B2 - Ultraviolet light irradiation apparatus and irradiation method, substrate manufacturing apparatus and substrate manufacturing method - Google Patents

Description

  The present invention relates to an ultraviolet light irradiation apparatus and an irradiation method, a substrate manufacturing apparatus, and a substrate manufacturing method for irradiating and curing a sealing agent obtained by bonding two substrates together with ultraviolet light.

  In a manufacturing process of a flat display panel or the like typified by a liquid crystal display panel, a bonding operation is performed in which two substrates are opposed to each other at a predetermined interval, liquid crystal is sealed between the substrates and bonded together with a sealant.

  In the bonding operation, the sealing agent is applied in a frame shape to one of the two substrates, and a predetermined amount of the liquid crystal is supplied dropwise to a portion corresponding to the inside of the sealing agent frame of the substrate or the other substrate. To do.

  Next, the two substrates are held on the upper holding table and the lower holding table, and are opposed to each other at a predetermined interval in the vertical direction. In this state, the horizontal directions X and Y of these substrates and the rotation direction These substrates are bonded together after positioning in the θ direction. When the two substrates are bonded together, the sealing agent is cured and bonded to manufacture the substrates so that the positioning accuracy of these substrates is not impaired.

There is an ultraviolet light curing type sealant, and when two substrates are bonded together using such a sealant, as described in Patent Document 1, the entire surface of the substrate is uniformly applied by an ultraviolet light lamp. The sealant is cured by irradiating with UV light.
Japanese Patent Laid-Open No. 8-101395

The prior art has the following problems.
(1) A metal halide lamp used as an ultraviolet lamp cannot be re-lighted immediately after it is turned off, and requires at least several minutes for re-lighting. For this reason, even when there is no substrate, the metal halide lamp is lit and wasteful energy is consumed.

  (2) Metal halide lamps generate a great deal of heat along with ultraviolet light. It is inevitable that this heat reaches the liquid crystal sealing portion in contact with the sealant, and the liquid crystal may be altered when heated by the irradiation heat of ultraviolet light, and the circuit formed on the substrate may be damaged by heating. Therefore, it is necessary to cool the liquid crystal encapsulating portion in order to prevent these problems, and an increase in the size of the device and an increase in energy cost for cooling accompanying the addition of the cooling device occur.

  (3) Since the entire surface of the substrate is irradiated with an ultraviolet light lamp, it is possible to irradiate even the liquid crystal encapsulating part without a sealant, and the effective use efficiency of energy is reduced. This necessitates cooling to prevent deterioration of the enclosure.

  An object of the present invention is to eliminate wasteful energy consumption when ultraviolet light is applied to a sealant obtained by bonding two substrates and cured.

The ultraviolet light irradiation apparatus according to the present invention is an ultraviolet light irradiation apparatus that irradiates and cures ultraviolet light on a sealing agent provided between two substrates.
A plurality of light emitting diodes for irradiating ultraviolet light, an ultraviolet light irradiating means arranged in a matrix ,
A control device that selects and turns on a light emitting diode that irradiates ultraviolet light toward the sealant provided between the two substrates from among a plurality of light emitting diodes constituting the irradiation means; ,
The pitch between the light emitting diodes is determined so that the combined illuminance on the sealant between the adjacent light emitting diodes is equal to or greater than the minimum illuminance necessary for curing the sealant.

An ultraviolet light irradiation method according to the present invention is an ultraviolet light irradiation method in which a sealing agent provided between two substrates is irradiated with ultraviolet light and cured.
While irradiating the sealing agent with ultraviolet light by ultraviolet light irradiation means comprising a plurality of light emitting diodes that irradiate ultraviolet light, the substrate and the ultraviolet light irradiation means are relatively set in advance. It is characterized by rocking with a moving stroke .

The substrate manufacturing apparatus according to the present invention is configured to irradiate the sealant with ultraviolet light after bonding two substrates, each having a sealant applied in a rectangular frame shape, to at least one of the substrates. In a substrate manufacturing apparatus for manufacturing a bonded substrate by curing,
The ultraviolet light irradiation device according to any one of claims 1 to 5 is provided.

The substrate manufacturing method according to the present invention includes irradiating the sealing agent with ultraviolet light after bonding the two substrates on which at least one of the sealing agents is applied in a rectangular frame shape through the sealing agent. In a substrate manufacturing method for manufacturing a bonded substrate by curing,
The ultraviolet light irradiation method according to claim 6 or 7 is used.

  According to the present invention, useless energy consumption can be eliminated.

  1 shows an ultraviolet light irradiation apparatus of Example 1, (A) is a front view, (B) is a cross-sectional view taken along line BB of (A), FIG. 2 shows a light emitting diode unit of irradiation means, (A) is a perspective view showing a lattice arrangement, (B) is a perspective view showing a staggered arrangement, FIG. 3 shows a light emitting diode unit and a sealant position detection unit of an irradiation means, (A) is a perspective view, and (B). Is a plan view, FIG. 4 is a schematic diagram showing an example of an illuminometer, FIG. 5 is a schematic diagram showing another example of the illuminometer, FIG. 6 is a schematic diagram showing the relationship between the irradiation distance of the light emitting diode and the illuminance, and FIG. FIG. 8 is a schematic diagram showing a relationship between the lateral position of a light emitting diode and illuminance (illuminance distribution), FIG. 8 is a schematic diagram showing a combined illuminance distribution of adjacent light emitting diodes, and FIG. 9 is a difference in illuminance distribution depending on the irradiation height of the light emitting diode. FIG. 10 is a diagram showing a pulse lighting of a light emitting diode and an excitation energy of an excitation substance. FIG. 11 is a schematic diagram showing a light collecting means using a light emitting diode reflector, FIG. 12 is a schematic view showing a light collecting means using a light emitting diode lens, and FIG. 13 is a schematic diagram showing a rotating means of the irradiation means. 14 and 14 show a modification of the ultraviolet light irradiation device, (A) is a front view, (B) is a sectional view taken along line BB in (A), and FIG. 15 is a sealant position detection unit of irradiation means. FIG. 16 is a plan view showing the light emitting diode unit and the sealant position detection unit of the irradiating means, FIG. 17 is a front view showing the ultraviolet light irradiation apparatus of Example 2, and FIG. 18 is the light emitting diode unit of the irradiating means. 19 is an enlarged view of the main part of the light-emitting diode unit, (A) is a cross-sectional view, (B) is a plan view, FIG. 20 shows a light-emitting diode, (A) is a front view, B) is a side view, (C) is a plan view, 1 is a plan view showing a sealing agent coating pattern on a substrate, FIG. 22 is a cross-sectional view showing a light emitting diode attached / detached state in a light emitting diode unit, FIG. 23 shows a dummy block, (A) is a front view, and (B) is a plan view. 24 shows a light-emitting diode unit corresponding to the substrate of FIG. 21, (A) is a plan view, (B) is a cross-sectional view, FIG. 25 is a cross-sectional view showing a modification of the light-emitting diode unit, and FIG. 27 is a sectional view showing a state in which the mounting base of the light emitting diode unit is separated from the mounting base, FIG. 28 is a plan view showing the light emitting diode unit, and FIG. 29 is a fourth embodiment. FIG. 30 is a front view showing a modification of the ultraviolet light irradiation device, FIG. 31 is a schematic view showing the swinging action of the light emitting diode unit, and FIG. 32 shows adjacent light emitting diodes. FIG. 33 is a schematic diagram showing illuminance unevenness due to adjacent light emitting diodes.

Example 1 (FIGS. 1 to 16)
The ultraviolet light irradiation device 10 constituting the substrate manufacturing apparatus irradiates the sealing agent 2 bonded with two glass substrates 1 with ultraviolet light to cure it. For example, four liquid crystal displays can be formed from the two substrates 1 bonded together, and the two substrates 1 are drawn in four rectangular frame shapes according to the number of the liquid crystal displays. The sealing agent 2 applied in this manner is bonded together. A space surrounded by the sealant 2 between the two substrates 1 is filled with liquid crystal 3 and sealed.

  That is, in the substrate manufacturing apparatus, the sealant is applied in a rectangular frame shape to at least one of the substrates by the seal application device. Next, in the liquid crystal dropping device, a necessary amount of liquid crystal is dropped onto a portion corresponding to the inside of the frame of the sealing agent on the substrate on which the sealing agent is applied or the other substrate. Then, one substrate is held by the upper holding table in the substrate bonding apparatus, and the other substrate is held by the lower holding table, and the two substrates are aligned in a state of being opposed to each other at a predetermined interval. After being performed, it is bonded through a sealant. The two substrates 1 bonded together by the sealing agent 2 are supplied to the ultraviolet light irradiation device 10 and the sealing agent 2 is cured by irradiation with ultraviolet light.

  As shown in FIG. 1, the ultraviolet light irradiation apparatus 10 is provided with a stage 13 on a support 12 (or an XY table is acceptable) provided on a base 11, and on the stage 13 as described above, a sealing agent. Two substrates 1 bonded together by 2 are supplied. Loading / unloading of the substrate 1 to / from the stage 13 is performed by a robot arm (not shown). Delivery of the substrate 1 between the robot arm and the stage 13 is performed via a retractable lift pin built in the stage 13.

  The ultraviolet light irradiation device 10 is provided with columns 14 on both the left and right sides of the support 11 and the stage 13 on the base 11, guide rails 15 are provided on the columns 14, and move along the guide rails 15. Left and right height adjusting means 17 are provided on the linear motor 16. The height adjusting means 17 has a vertical drive device 17B having a ball screw mechanism driven by a motor 17A, and has a lift plate 17C that is moved up and down by the vertical drive device 17B. The ultraviolet light irradiation device 10 supports the ultraviolet light irradiation means 20 on the lifting plate 17 </ b> C of the left and right height adjustment means 17 and irradiates the sealing agent 2 of the substrate 1 with ultraviolet light.

  The ultraviolet light irradiation device 10 includes a control device 25, which is connected to the linear motor 16, the motor 17A, the laser displacement meter 18, the irradiation means 20, and the sealant position detection unit 22, and controls them. To do.

  Hereinafter, in the ultraviolet light irradiation apparatus 10, (A) the configuration of the irradiation means 20, (B) the control of the irradiation position of the irradiation means 20, (C) the control of the distance between the irradiation means 20 and the substrate 1, (D) the irradiation means. Each of measurement of illuminance 20, (E) illuminance distribution of the irradiation means 20, (F) pulse lighting of the irradiation means 20, and (G) collection of irradiation light of the irradiation means 20 will be described.

(A) Configuration of irradiation means 20 (FIGS. 1 and 2)
The irradiation means 20 of the ultraviolet light irradiation apparatus 10 includes a light emitting diode unit 21 in which a large number of ultraviolet light emitting diodes 21A (UV-LEDs) are arranged as shown in FIG. The light-emitting diode unit 21 can be configured by arranging light-emitting diodes 21A in a lattice arrangement (FIG. 2A) or staggered arrangement of light-emitting diodes 21A (FIG. 2B).

Therefore, the ultraviolet light irradiation device 10 has the following effects.
(a) By using the ultraviolet light emitting diode 21A as the ultraviolet light irradiation means 20, the rise time of lighting can be instantaneous. Since it can be lit immediately only when it is necessary to illuminate, it is not necessary to use it as a constantly lit state, and wasteful energy consumption can be eliminated.

  (b) The light emitting diode 21A does not have heat in the irradiated light as compared with the metal halide lamp, can reduce the distance from the substrate 1, can improve the illuminance with respect to the sealant 2, and can improve the energy utilization efficiency. . In addition, since the encapsulated portion of the liquid crystal 3 in contact with the sealing agent 2 can be prevented from being heated, it is possible to prevent the liquid crystal 3 from being altered by heating and the circuit formed on the substrate from being damaged by heating. .

(B) Control of irradiation position of irradiation means 20 (FIGS. 1 to 3)
The control device 25 is a process in which the irradiation means 20 moves with respect to the substrate 1 on the stage 13 in the X direction along the guide rail 15 by the linear motor 16 (this direction is a direction orthogonal to the width direction of the substrate 1). Then, the irradiation position of the ultraviolet light (position where the sealing agent 2 exists) is specified by the position information of the sealing agent 2 acquired in advance using the sealing agent position detection unit 22 of the irradiation means 20, and the ultraviolet light irradiation position is determined. The light emitting diode 21A of the reached light emitting diode unit 21 is turned on, and the sealing agent 2 is irradiated with ultraviolet light to be cured.

  The timing for acquiring the position information of the sealant 2 by the sealant position detection unit 22 may be any of the following. One is to move the irradiation means 20 in the X direction, acquire in advance the positional information of the sealing agent 2 in the entire glass substrate 1, and then, based on this positional information, the light emitting diode unit that has reached the irradiation position of ultraviolet light The 21 light emitting diodes 21A are controlled to be turned on. As another method, the light emitting diode 21A of the light emitting diode unit 21 is controlled to be turned on based on the position information while the irradiation unit 20 is moved in the X direction and the position information of the sealant 2 is acquired. The position information of the sealant 2 is acquired immediately before irradiation.

  Here, as shown in FIGS. 1 and 3, the sealant position detection unit 22 is provided with laser beams provided on both side edges along the Y direction of the light emitting diode unit 21 (this direction is the width direction of the substrate 1). The irradiation unit 22A and the light receiving unit 22B. As shown in FIG. 1B, the sealant position detection unit 22 is irradiated from the irradiation unit 22A, passes through the upper glass substrate 1 and is reflected by the lower glass substrate 1, and passes through the upper glass substrate 1 again. So that the received light is received by the light receiving unit 22B. The control device 25 detects the presence / absence of the sealant 2 from the difference in the amount of light received due to the presence / absence of the sealant 2 in the optical path between the irradiation unit 22A and the light receiving unit 22B.

  That is, the control device 25 acquires information on the amount of received light transmitted from each light receiving unit 22B in the process of moving the sealant position detection unit 22 from one end of the substrate 1 to the other end in the X direction. And the control apparatus 25 acquires the positional information on the Y direction of the sealing agent 2 from the attachment position of the light reception unit 22B in which the received light quantity showed sealing agent 2 "presence". Further, the position of the sealant 2 in the X direction is determined based on position information obtained by position detection means such as a linear encoder attached to the linear motor 16 when the light receiving unit 22B outputs the amount of received light with the sealant 2 “present”. Get information. The actual measurement information of the sealant 2 is acquired from the X-direction position information and the Y-direction position information of the sealant 2 thus obtained.

  Note that the irradiation unit 22A and the light receiving unit 22B may be provided on a one-to-one basis with each light emitting diode 21A, or a pair may be provided for each irradiation range by a plurality of adjacent light emitting diodes 21A.

  The control device 25 specifies the irradiation position of the ultraviolet light based on the position information of the sealant 2 acquired in advance from the design information of the substrate 1, not based on the above-described actual measurement information using the sealant position detection unit 22. The light emitting diode 21A of the light emitting diode unit 21 may be controlled to be turned on. In this case, it is necessary to correctly grasp the positional deviation from the reference position of the substrate 1 supplied on the stage 13. In order to grasp the positional deviation of the substrate, a known position detecting method for detecting the position of the position recognition mark attached to the substrate or the edge of the substrate, the sealant, etc. using a pattern recognition technique can be used. .

  Further, in the ultraviolet light irradiation device 10, the above-described actual position information of the sealant 2 using the sealant position detection unit 22 is collated with the design position information of the sealant 2 based on the design information of the substrate 1, If it is compatible, the lighting of the light emitting diode 21A of the light emitting diode unit 21 can be controlled, and if it is not compatible, a difference in the type of the substrate 1 can be warned.

  For example, the design position information of the sealant 2 and the measured position information are collated by applying the sealant 2 application pattern obtained from the design position information (the number of rectangular frames to be applied and formed on the substrate, the short side length of the rectangular frames). And the long side length etc.) and the application pattern of the sealant 2 obtained from the measured position information, whether or not they match, or whether or not the matching level is within a preset allowable value. This can be done by discriminating.

Therefore, the ultraviolet light irradiation device 10 has the following effects.
The position information of the sealing agent 2 provided on the substrate 1 is acquired by actual measurement information or design information, and the irradiation position of the ultraviolet light is specified by the position information. Therefore, since the ultraviolet light is irradiated only to the sealing agent 2 and is prevented from being irradiated to the encapsulating portion of the liquid crystal 3 without the sealing agent 2 as much as possible, the effective use efficiency of energy is improved and the ultraviolet light is irradiated. As a result, heating of the enclosing portion of the liquid crystal 3 is prevented. Thereby, it is possible to prevent deterioration of the liquid crystal 3 due to heating and damage to the circuit formed on the substrate 1.

(C) Control of the distance between the irradiation means 20 and the substrate 1 The irradiation means 20 of the ultraviolet light irradiation apparatus 10 is in the process of moving as described above with respect to the substrate 1 on the stage 13 and the height adjustment means 17 described above. A laser displacement meter 18 is used to keep the distance from the substrate 1 constant.

The laser displacement meter 18 is provided integrally with the light emitting diode unit 21 and includes left and right laser displacement meters 18A and 18B respectively corresponding to both end portions of the substrate 1 on the stage 13. The laser displacement meter 18 is provided so that the position of the laser displacement meter 18 can be adjusted along the longitudinal direction of the light emitting diode unit 21 so that it can cope with the change of the size of the substrate 1 due to product type switching or the like. The laser displacement meter 18 is provided with a laser beam irradiation unit and a light receiving unit, and the laser beam irradiated from the irradiation unit and reflected by the surface of the upper substrate 1 is received by the light receiving unit at the light receiving position at the light receiving unit. Based on this, the distance to the surface of the substrate 1 is measured.
The operation of keeping the distance between the irradiation means 20 and the substrate 1 constant is performed as follows.

  (1) The distance measurement by the laser displacement meter 18 is performed together with the irradiation of the ultraviolet light to the sealing agent 2 of the bonded substrate 1 by the light emitting diode unit 21. That is, while the light emitting diode unit 21 moves from one end to the other end along the X direction of the bonded substrate 1 so as to irradiate the sealing agent 2 with ultraviolet light, distance measurement by the laser displacement meter 18 is performed at predetermined time intervals. To do.

  (2) The measured values of the two laser displacement meters 18A and 18B are sent to the control device 25, respectively. Each time the measurement value is sent, the control device 25 averages the two measurement values and compares them with a preset reference value. If the measured value is different from the reference value as a result of the comparison, the motors 17A of the left and right height adjusting means 17 are controlled so that the measured value matches the reference value. At this time, the two motors 17A are synchronously controlled.

  The measured values of the two laser displacement meters 18A and 18B may be compared with reference values, respectively, and the motors 17A of the left and right height adjusting means 17 may be controlled separately. That is, the motor 17A of the left height adjusting means 17 is controlled based on the measured value of the left laser displacement meter 18A, and the motor 17A of the right height adjusting means 17 is controlled based on the measured value of the right laser displacement meter 18B. To control.

Therefore, the ultraviolet light irradiation device 10 has the following effects.
By relatively moving the irradiating means 20 and the substrate 1, it is possible to irradiate the sealing agent 2 over a wide area of the substrate 1 with ultraviolet light while reducing the number of light emitting diodes 21A provided in the irradiating means 20, and the ultraviolet light. Energy consumption can be reduced. At this time, by keeping the distance between the irradiating means 20 and the substrate 1 constant, the energy of the ultraviolet light irradiated by the irradiating means 20 is evenly applied to the sealant 2 at various locations on the substrate 1 without excess or deficiency. The agent 2 can be uniformly cured, and the effective use efficiency of energy can be improved.

(D) Measurement of illuminance of the irradiation means 20 (FIGS. 1, 4, and 5)
The ultraviolet light irradiation apparatus 10 is provided with an illuminance meter 30 at the X direction end position on the stage 13 so as to be movable in the Y direction, and the illuminance of the light emitting diode 21A constituting the light emitting diode unit 21 of the irradiation means 20 is adjusted. Make measurable. By moving the irradiation means 20 in the X direction and moving the illuminance meter 30 in the Y direction, the illuminance meter 30 is sequentially positioned immediately below each light emitting diode 21A of the light emitting diode unit 21, and the light emitting diodes 21A facing the illuminance meter 30 are sequentially turned on. The illuminance of each light emitting diode 21 </ b> A is measured by the illuminometer 30.

  The control device 25 includes display means such as a monitor 26 for displaying the illuminance measurement result of each light emitting diode 21A by the illuminometer 30. Further, the control device 25 checks whether or not the measured illuminance of each light emitting diode 21A is at an appropriate illuminance based on the illuminance measurement result of each light emitting diode 21A. When the measured illuminance of the light emitting diode 21A is lower than the appropriate illuminance, the amount of power supplied to the light emitting diode 21A is increased, and the illuminance of the light emitting diode 21A is corrected to the appropriate illuminance. Furthermore, the ultraviolet light irradiation device 10 has means for checking the lifetime of each light emitting diode 21A based on the illuminance measurement result of each light emitting diode 21A.

  The means for checking the lifetime of the light emitting diode 21A includes, for example, a storage device that stores in advance the upper limit value of the power supply amount correction range in the control device 25, the power supply amount for each light emitting diode 21A, and the upper limit value. If the power supply amount exceeds the upper limit as a result of comparison by the comparator to be compared and the comparator, the light emitting diode 21A is determined to have a lifetime, and the light emitting diode 21A that has been determined to have a lifetime by this determiner. It can be configured by providing an alarm device that prompts replacement.

  The alarm device is a display means such as a monitor, and a layout diagram corresponding to the arrangement of the light emitting diodes shown in FIGS. 2A and 2B is displayed, and the arrangement position of the light emitting diode 21A determined to have a lifetime blinks. When configured to display, it is preferable that the position of the light emitting diode 21A determined to have a lifetime can be visually grasped.

  Here, the upper limit value of the correctable range of the power supply amount is a value determined by multiplying the power supply amount that can be safely given to the light emitting diode 21A by the safety factor. For example, when power is supplied beyond this, This is a value that causes a risk of damage to the light emitting diode 21A.

  Further, instead of automatically performing the above-described life check, the monitor 26 displays the illuminometer measurement result of each light emitting diode 21A and the power supply amount to each light emitting diode 21A at the time of the illuminance measurement as information on the power supply amount. Based on the display contents, the operator can check the life of the light emitting diode 21A.

Therefore, the ultraviolet light irradiation device 10 has the following effects.
Since the illuminance of the light emitting diode 21A of the irradiating means 20 is measured by the illuminance meter 30, it is automatically checked whether or not the measured illuminance of the light emitting diode 21A is at an appropriate illuminance, and the light emitting diode is based on the check result. The illuminance of the light emitting diode 21A can be corrected by adjusting the amount of power supplied to 21A, etc., avoiding the danger of irradiating the human body such as the eyeball with ultraviolet light and preventing the curing failure of the sealant 2.

  By relatively moving the light emitting diode 21A and the illuminance meter 30 of the irradiating means 20, the illuminance of a large number of the light emitting diodes 21A can be checked with a small number of illuminance meters 30.

  The measurement result of the illuminometer 30 can be displayed.

  The lifetime of the light emitting diode 21A can be checked from the measurement result of the illuminometer 30. The illuminance of the light emitting diode 21A can be corrected by adjusting the amount of power supplied to the light emitting diode 21A, etc., but the light emitting diode 21A that deviates from this correctable range is warned of the necessity of replacement. As a result, it is possible to prevent the curing failure of the sealing agent 2 that may occur due to insufficient illuminance of the light emitting diode 21A, thereby improving the yield of the substrate manufacturing apparatus using the ultraviolet light irradiation device 10 and displaying the liquid crystal display to be manufactured. Quality can be improved.

  As shown in FIG. 4, the ultraviolet light irradiation device 10 has a rod-shaped glass (glass lens) 31 having a rectangular cross section in a range longer than the length of the light emitting diode unit 21 in the Y direction on the stage 13. The illuminance meter 30 (left and right illuminance meters 30A and 30B) may be disposed horizontally and on both left and right ends (or one end) of the glass 31. When the light emitting diode unit 21 is positioned immediately above the glass 31 and any light emitting diode 21A of the light emitting diode unit 21 is turned on, the light is emitted from the light emitting diode 21A and the inside of the rod-shaped glass 31 is reflected as indicated by an arrow in FIG. However, the illuminance of the light emitting diode 21 </ b> A can be measured by detecting the light guided to the left and right ends of the rod-shaped glass 31 with the illuminometer 30.

  Irradiation light from each light emitting diode 21A of the irradiation means 20 can be guided to the illuminance meters 30A and 30B via the glass 31, and the illuminance of each light emitting diode 21A can be measured. The ultraviolet light transmission distances La and Lb from the light emitting diodes 21A to the illuminance meters 30A and 30B and the appropriate light reception amounts to be received corresponding to the transmission distances La and Lb by the illuminance meters 30A and 30B are obtained in advance. The illuminance of the light emitting diode 21A can be corrected by comparing the measured illuminance of each light emitting diode 21A by the illuminance meters 30A and 30B with the appropriate amount of received light.

  Further, as shown in FIG. 5, the ultraviolet light irradiation device 10 is provided with an illuminometer 30 on a moving jig 32 arranged to overlap the light emitting diode unit 21 below the light emitting diode unit 21 of the irradiation means 20. The moving jig 32 may be movable below the light emitting diode unit 21 in the XY directions. In a state where the moving jig 32 is moved in the X direction and the illuminance meter 30 is positioned below the light emitting diode unit 21, the moving jig 32 is moved in the Y direction so that the illuminance meter 30 is directly below the arbitrary light emitting diode 21A. The illuminance of the light emitting diode 21A can be measured. A plurality of illuminance meters 30 may be provided on the moving jig 32. A plurality of moving jigs 32 may be provided.

(E) Illuminance distribution of the irradiation means 20 (FIGS. 6 to 9)
The ultraviolet light irradiation apparatus 10 reduces the illuminance variation of the irradiation unit 20 and the light emitting diode unit 21 of the irradiation unit 20 so that the irradiation light of the irradiation unit 20 can secure an illuminance exceeding the necessary minimum illuminance on the substrate 1. The configuration is as follows.

  (1) The illuminance distribution of each light emitting diode 21A of the light emitting diode unit 21 is obtained. First, the light emitting diode 21A is coaxially arranged at the center of the illuminance meter 30, and the illuminance L when the distance H between the light emitting diode 21A and the illuminance meter 30 is changed is measured by the illuminance meter 30 to obtain FIG. From FIG. 6B, a reference distance Ha corresponding to a certain reference illuminance La exceeding the necessary minimum illuminance L0 of the irradiating means 20 is obtained for each light emitting diode 21A.

  Next, the distance H between the light emitting diode 21A and the illuminance meter 30 is maintained at the reference distance Ha described above, the light emitting diode 21A is moved in the lateral direction with respect to the center of the illuminance meter 30, and the relationship between each lateral movement distance and the illuminance L is as follows. Measured by the illuminance meter 30, the illuminance distribution A of the light emitting diode 21A as shown in FIG. 7 is obtained. Similarly, the illuminance distribution B is obtained for the other adjacent light emitting diodes 21A.

  (2) Adjacent light emitting diodes 21A are adjacent to each other at the adjacent pitch P, and a combined illuminance distribution Z as shown in FIG. 8 is obtained when the illuminance distributions A and B of the respective light emitting diodes 21A are overlapped. From the combined illuminance distribution Z of FIG. 8, the adjacent pitch P of the adjacent light emitting diodes 21A is determined to be a pitch Pa at which the minimum value of the combined illuminance between the adjacent light emitting diodes 21A is not less than the required minimum illuminance L0. That is, as a result, the illuminance of each individual light emitting diode 21A, that is, the illuminance L on the substrate surface located on the optical axis of each light emitting diode 21A is substantially equal to each other, and their combined illuminance, more specifically, The minimum value of the combined illuminance between adjacent light emitting diodes 21A is determined to be a distance Ha and a pitch Pa at which the minimum required illuminance L0 is equal to or greater. The operations (1) and (2) are performed in advance for each light-emitting diode 21A through an experiment or the like. Then, the mounting position in the vertical direction is shifted by the difference of Ha obtained for each light emitting diode 21A with the pitch Pa determined in this experiment, and as a result, the light emitting diode unit 21 is manufactured as shown in FIG. To do.

  In general, the illuminance distribution on the surface of the substrate 1 of the light-emitting diode 21A is high and steep when the distance between the light-emitting diode 21A and the substrate 1 is short, and becomes gentle when the distance is long. Therefore, the illuminance distribution A of adjacent light-emitting diodes 21A , B has a difference as shown in FIG. 9, the difference can be reduced by changing the distance between each light emitting diode 21 </ b> A and the substrate 1.

  As described above, assuming the arrangement of the light emitting diodes 21A of the light emitting diode unit 21 as shown in FIG. 2, the distance Ha to the substrate of each light emitting diode 21A and the adjacent pitch Pa between the adjacent light emitting diodes 21A are determined. To do.

  In the case where variations in the illuminance distribution due to manufacturing errors of the respective light emitting diodes 21A of the light emitting diode unit 21 are within an allowable range and there is no need to obtain the illuminance distribution individually, the illuminance distribution is obtained for each light emitting diode 21A. The other light emitting diodes 21A may be regarded as the same illuminance distribution as the obtained illuminance distribution.

Therefore, the ultraviolet light irradiation device 10 has the following effects.
The light emitting diodes 21A adjacent to each other so as to constitute the irradiating means 20 have a distance to the substrate 1 and their adjacent pitch P, and the illuminances L of the light emitting diodes 21A adjacent to each other are substantially equal to each other, and By setting the distance Ha and the pitch Pa so that the combined illuminance L becomes equal to or more than the necessary minimum illuminance L0, variations in the illuminance L of each light-emitting diode can be eliminated, and the necessary minimum illuminance L0 can be secured, and the energy of ultraviolet light can be obtained. By uniformly irradiating the sealant 2 at the various places above, the sealant 2 at the various places can be uniformly and reliably cured.

  Therefore, the liquid crystal leaks from the encapsulating portion due to the uneven curing of the sealant 2 and gas can be prevented from entering, and the quality and reliability of the liquid crystal display can be improved.

(F) Pulse lighting of the irradiation means 20 (FIG. 10)
The ultraviolet light irradiation device 10 turns on the light emitting diode 21A of the irradiation means 20 in a pulsed manner as shown in FIG. That is, when ultraviolet light is irradiated by turning on the light emitting diode 21 </ b> A, an excited substance is generated in the resin constituting the sealing agent 2. When a substance in an excited state is generated in the resin of the sealant 2, the substance in the excited state reacts with a substance that is not in the resin, and the curing of the resin is started. If the light emitting diode 21A is turned off within a time when the excitation energy of the substance is sufficient, the excitation energy is attenuated and the resin curing reaction stops. However, the curing reaction is not performed until the excitation energy of the already excited substance disappears. move on. Next, before the curing reaction stops, the light emitting diode 21A is turned on again. Thereby, the substance in the excited state is regenerated before the curing reaction stops, and the curing reaction proceeds without stopping.

  Here, since the light emitted from the light emitting diode 21A is less likely to reach the deeper portion of the sealant 2, the pulse lighting on (ON) time of the light emitting diode 21A may be increased with the elapsed time. At this time, the OFF time of pulse lighting may be decreased on the contrary.

  Further, the pulse lighting on (ON) time is increased from the preset reference time by the set time Δt, for example, in five steps, and then returned to the reference time and increased in the five steps. Also good. Also at this time, the OFF time of pulse lighting may be decreased by increments of time with respect to the reference time.

Therefore, the ultraviolet light irradiation device 10 has the following effects.
Energy required to cause a substance in an excited state sufficient to advance the curing reaction in the resin of the sealant 2 by intermittently supplying power to the light emitting diode 21A of the irradiating means 20 and pulsing the light emitting diode 21A. The sealant 2 is irradiated with ultraviolet light having a short time, and the curing reaction is caused to proceed by the reaction between the excited substance and another substance, and then the excited substance is generated again before the excited substance disappears. Repeatedly irradiating the sealant 2 with ultraviolet light having energy required for the short time. Since the irradiation means 20 is not always lit, energy can be used effectively and the sealing agent 2 can be sufficiently cured.

  Since the light emitting diode 21A can flow a large current instantaneously, it is possible to obtain an illuminance higher than that of the constant lighting by pulse lighting. For this reason, more substances in an excited state can be generated, and as a result, the curing rate of the sealant 2 is increased. Further, as compared with the constant lighting method, only the surface layer of the sealant 2 is prevented from being hardened, and even if the reaction proceeds, no unreacted substance is left and a complete reaction occurs. , Sufficient curing of the sealant 2 becomes possible. Thereby, the display quality of the liquid crystal display manufactured with the board | substrate manufacturing apparatus using the ultraviolet light irradiation apparatus 10 can be improved.

  Moreover, since the irradiation time of the ultraviolet light with respect to the board | substrate 1 can be kept to the minimum necessary by the above-mentioned, not only the part in which the sealing agent 2 exists but the irradiation time of the ultraviolet light with respect to the liquid crystal enclosure part in the board | substrate 1 may be reduced. As a result, it is possible to more reliably prevent defects such as deterioration of the liquid crystal and damage to the circuit of the substrate due to the irradiation of ultraviolet light, and further improve the manufacturing yield of the substrate manufacturing apparatus and the display quality of the manufactured liquid crystal display. It becomes possible to improve.

(G) Condensing of the irradiation light of the irradiation means 20 (FIGS. 11 and 12)
The ultraviolet light irradiation apparatus 10 includes, for example, a reflection plate 41 and lenses 42 and 43 as means for condensing the irradiation light from the light emitting diode 21 </ b> A of the irradiation means 20 and irradiating the sealing agent 2 of the substrate 1.

  11A and 11B, reflectors 41 are provided on both side edges of the light emitting diode unit 21, and the scattered light portion of the irradiation light from the light emitting diode unit 21 is condensed toward the sealing agent 2 of the substrate 1. Is. 11A and 11B differs from the example in FIG. 1 in that the light emitting diode units 21 are arranged in parallel so as to cover the entire substrate.

  In FIG. 12A, a lens 42 is disposed immediately below the light emitting diode unit 21. The lens 42 has a convex surface in the cross section facing the light emitting diode unit 21 and a flat surface facing the substrate 1, and the irradiation light from the light emitting diode unit 21 diffuses toward the substrate 1. The distance between the light emitting diode unit 21 and the substrate 1 and the distance between the light emitting diode unit 21 and the lens 42 are determined so that the illuminance is higher than the minimum necessary illuminance.

  In FIG. 12B, a lens 43 is arranged immediately below the light emitting diode unit 21. The lens 43 has a cross-sectional plane directed to the light emitting diode unit 21 side and a convex surface directed to the substrate 1 side. Since the irradiation light from the light emitting diode unit 21 is concentrated, the light concentrated on the substrate 1 is concentrated. The distance between the light emitting diode unit 21 and the substrate 1 and the distance between the light emitting diode unit 21 and the lens 43 are determined so as not to be narrower than the width of the sealant 2.

Therefore, the ultraviolet light irradiation device 10 has the following effects.
By condensing the irradiation light from the light emitting diode 21A of the irradiation means 20 and irradiating the sealing agent 2, the illuminance with respect to the sealing agent 2 can be improved and the energy utilization efficiency can be improved.

  FIG. 13 shows a modification of the ultraviolet light irradiation apparatus 10, in which the irradiation means 20 is supported by the turning arm 50, and the irradiation means 20 is rotated and moved while being kept parallel to the substrate 1 on the stage 13. It is a thing.

  In the ultraviolet light irradiation device 10, the sealant position detection unit 22 is arranged in parallel with the light emitting diode unit 21 in the same manner as the irradiation unit 20 described in (B) Control of the irradiation position of the irradiation unit 20. The light emitting diode unit 21 and the sealant position detection unit 22 are provided so as to be slidable in the horizontal direction (arrow direction) with respect to the turning arm 50. As a result, the center position of the light emitting diode unit 21 in the plan view (the center position of the width in the sliding direction) and the center position of the sealant position detection unit 22 in the plan view are moved to coincide with the rotation center of the swivel arm 50. It is possible to make it.

  When acquiring the position information (actual measurement information) of the sealing agent 2, first, the center position of the sealing agent position detection unit 22 is matched with the rotation center of the turning arm 50. In this state, the sealant position detection unit 22 is rotated on the substrate 1 by the swing arm 50, and the amount of light received by the light receiving unit 22B of the sealant position detection unit 22 indicates that the sealant 2 is “present”. Position information regarding the coordinate system with the position information of the sealant 2 as the origin position, based on the attachment position in the longitudinal direction with respect to the rotation center (center position) of the light receiving unit 22B and the rotation angle of the swivel arm 50. Measured as

  When irradiating the sealing agent 2 between the substrates 1 with ultraviolet light, the center position of the light emitting diode unit 21 is made to coincide with the rotation center of the turning arm 50. Then, based on the actual measurement information acquired above, the light emitting diode 21A that has reached the position where the sealant 2 is present is turned on during the rotational movement of the irradiation means 20 by the swing arm 50.

  According to the ultraviolet light irradiation means 10, ultraviolet light can be irradiated to the sealing agent 2 over a wide range of the substrate 1 while reducing the number of light emitting diodes 21 </ b> A included in the irradiation means 20.

  14 and 15 show modifications of the ultraviolet light irradiation device 10 in which the irradiation unit 22A and the light receiving unit 22B of the sealant position detection unit 22 are transmissive. That is, the irradiation unit 22A is provided at one side edge of the light emitting diode unit 21 (FIG. 16), and the light receiving unit 22B is disposed in the lower hollow portion 13B of the glass plate 13A of the stage 13, and both ends of the light receiving unit 22B are disposed. It is supported by a lifting plate 17C of the left and right height adjusting means 17. The sealant position detection unit 22 transmits the irradiation light from the irradiation unit 22A through the upper and lower glass substrates 1 and the glass plate 13A of the stage 13, and receives the light by the light receiving unit 22B. The presence or absence of the sealant 2 is detected from the difference in the amount of light received by the light receiving unit 22B depending on the presence or absence of the sealant 2 in FIG.

  In this case, another irradiating means is provided in the hollow portion 13B of the stage 13 so as to face the irradiating means 20, and the other irradiating means is turned on in accordance with the lighting of the ultraviolet light by the irradiating means 20. good. By configuring in this way, ultraviolet light can be simultaneously applied to the sealing agent 2 from both the upper and lower sides of the substrate 1, and the curing of the sealing agent 2 can be performed efficiently and reliably. It is possible to improve the manufacturing yield of the device and the display quality of the manufactured liquid crystal display.

  The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration of the present invention is not limited to this embodiment, and even if there is a design change or the like without departing from the gist of the present invention. It is included in the present invention.

  For example, in the above embodiment, the example in which the ultraviolet light irradiation means is moved on the substrate when the sealant is cured has been described. However, the present invention is not limited thereto, and the irradiation means is fixedly arranged to move or irradiate the substrate. You may make it move both a means and a board | substrate.

  Also, ultraviolet light emitting diodes are arranged in a matrix so as to cover the entire area of the substrate, and the light emitting diodes for the substrate sealing agent are turned on to simultaneously irradiate the sealing agent between the substrates with ultraviolet light to seal the sealing agent. May be cured.

  In addition, a light emitting diode unit in which light emitting diodes are arranged according to the sealing agent coating pattern is prepared for each sealing agent coating pattern, and each time the sealing agent coating pattern is changed, the light emitting diode unit is replaced with the sealing agent coating pattern. You may make it replace | exchange for the thing corresponding to.

Example 2 (FIGS. 17 to 25)
The ultraviolet light irradiation apparatus 10 constituting the substrate manufacturing apparatus shown in FIGS. 17 to 19 irradiates the sealing material 2 bonded with two glass substrates 1 with ultraviolet light, as in the first embodiment. Harden.

  The ultraviolet light irradiation device 10 includes a substrate support unit 60. The substrate support unit 60 includes lift pins 61 that can be lifted and lowered by a lifting device (not shown). The substrate support unit 60 supports the substrate 1 transferred to and from the robot arm on an upper end support portion 62 of the lift pins 6, and lower irradiation means 20A described later. To be able to carry in / out. The substrate support unit 60 may be provided with a vacuum suction portion that sucks the substrate 1 at the upper end support portion 62 of the lift pin 61.

  The ultraviolet light irradiation apparatus 10 is provided with a lower irradiation means 20A at the lower part of the substrate 1 supported by the substrate support unit 60 and an upper irradiation means 20B at the upper part.

  The lower irradiation means 20A is installed on a stage 13 provided on a support base 12 (which may be an XY table) (not shown) on a base 11 (not shown). The lower irradiation means 20 </ b> A includes a light emitting diode unit 21 on an attachment base 70 fixed on the stage 13. As shown in FIGS. 17 to 19, the light emitting diode unit 21 includes a large number of ultraviolet light emitting diodes 21 </ b> A (UV-LEDs) arranged in, for example, a lattice arrangement (or a zigzag arrangement). The light emitting diode unit 21 has an area opposite to the entire surface of the substrate 1 of the maximum size to which the ultraviolet light irradiation device 10 is applied, and is detected by, for example, the above-described sealant position detection unit 22 using the control device 25 of the first embodiment. Only the light emitting diode 21A that irradiates the ultraviolet light toward the sealing agent 2 side of the substrate 1 can be turned on.

  In the lower irradiation means 20A, the light emitting diode unit 21 has a mounting base 71 for the light emitting diode 21A. The mounting base 71 is fixed on the mounting base 70, and the light emitting diode 21A is attached to and detached from the mounting base 71. Make it free. Here, as shown in FIG. 20, the light emitting diode 21A is provided in the LED element 21B, the LED control unit 21C connected to the LED element 21B, the transparent block 21D made of quartz or the like covering the LED element 21B, and the LED control unit 21C. A terminal 21E is provided. As shown in FIG. 19, the mounting base 71 includes terminals 71 </ b> A at each of the arrangement positions of the light emitting diodes 21 </ b> A, and makes the terminals 21 </ b> E of the light emitting diodes 21 </ b> A detachable from the terminals 71 </ b> A of the mounting base 71. The light emitting diode 21A has an outer shape made up of the LED control unit 21C and the transparent block 21D in the shape of a square column, and the mounting base 71 has a partition wall 71B that partitions the array position of the light emitting diodes 21A, and is attached in a square hole shape surrounded by the partition wall 71B. The light emitting diode 21A (the LED control unit 21C and the transparent block 21D) is inserted into the hole 71C, the terminal 21E of the light emitting diode 21A can be engaged with the terminal 71A on the bottom surface of the mounting hole 71C, and the upper end surface of the light emitting diode 21A. Is flush with the upper end surface of the partition wall 71B. Thereby, the upper surface of the light emitting diode 21A forms a support surface of the substrate 1 together with the upper end surface of the partition wall 71B. A terminal 21E of the light emitting diode 21A is connected to the control device 25. 17 and 18, the terminal 71A and the partition wall 71B of the mounting base 71 are not shown.

  In the lower irradiation means 20 </ b> A, the mounting base 70 includes a vacuum suction pipe 73. The mounting base 71 is provided with suction pipes 74 connected to the vacuum suction pipe 73 at an appropriate pitch, the upper end opening of the suction pipe 74 is flush with the upper end surface of the partition wall 71B, and the vacuum suction section that sucks the substrate 1 And

  In the lower irradiation unit 20 </ b> A, the mounting base 70 and the mounting base 71 include insertion holes 75 and 76 for the lift pins 61 of the substrate support unit 60. The lift pins 61 of the substrate support unit 60 are moved up and down in the insertion holes 75 and 76, and the upper end support portion 62 of the lift pins 61 is lifted from the insertion hole 76 surrounded by the partition wall 71 </ b> B of the mounting base 71. The robot arm can be transferred to the upper end support portion 62, and the substrate 1 is moved from the upper end support portion 62 to the upper end surface of the light emitting diode 21A and the partition at the lowered position where the upper end support portion 62 of the lift pin 61 is inserted into the insertion hole 76 of the mounting base 71. It can be delivered to the upper end surface of the wall 71B.

  The upper irradiation means 20B is provided with a light emitting diode unit 21 on the lifting plate 17C of the height adjusting means 17 of the first embodiment. The light emitting diode unit 21 is substantially the same as the light emitting diode unit 21 of the lower irradiation means 20A, and includes a plurality of ultraviolet light emitting diodes 21A arranged so that the light emitting diode 21A can be attached to and detached from the mounting base 71.

  In the ultraviolet light irradiation device 10, the substrate 1 is transferred to the upper end surface of the light emitting diode 21A and the upper end surface of the partition wall 71B of the light emitting diode unit 21 constituting the lower irradiation means 20A. In the state adsorbed to the upper end adsorbing portion, the irradiation light from the lower irradiation means 20A is applied to the sealing agent 2 from the lower substrate 1 side and / or the irradiation light from the upper irradiation means 20B is applied from the upper substrate 1 side. The sealing agent 2 can be irradiated. At this time, the light emitting diode unit 21 of the lower irradiation unit 20A and / or the upper irradiation unit 20B corresponds to the drawing position of the sealing agent 2 on the substrate 1 and only the light emitting diode 21A that irradiates the sealing agent 2 with ultraviolet light. Is controlled to light up. For example, when the sealing agent 2 of the substrate 1 is drawn and applied in two rectangular frames as shown in FIG. 21, only the light emitting diodes 21A corresponding to the two rectangular frames are placed on the light emitting diode unit 21. Light. The light emitting diode 21A to be lit is specified from the position information of the sealing agent 2 acquired in advance from the design information of the substrate, for example.

Therefore, the ultraviolet light irradiation device 10 has the following effects.
(a) The lower irradiation means 20A (the same applies to the upper irradiation means 20B) has a light emitting diode unit 21 having an area opposite to the entire surface of the substrate 1, and the light emitting diode unit 21 is irradiated with ultraviolet light at the position of the sealant 2 on the substrate 1. Only the light-emitting diode 21A that irradiates the light can be turned on. Therefore, while using the same light emitting diode unit 21, only the minimum necessary light emitting diodes 21A can be turned on and immediately irradiated with the necessary ultraviolet light with respect to each of the substrates 1 having different drawing positions of the sealant 2.

  (b) When the light emitting diode unit 21 can cope with the substrate type of the maximum size, the same light emitting diode unit 21 can be used and various substrates 1 having a size smaller than the maximum size can be accommodated.

  In the ultraviolet light irradiation apparatus 10, the light emitting diode unit 21 of the lower irradiation means 20A (the same applies to the upper irradiation means 20B) makes the light emitting diode 21A detachable from the mounting base 71. FIG. As shown, the light emitting diode unit 21 may be provided only at a position where the light emitting diode unit 21 needs to irradiate the sealing agent 2 of the substrate 1 with ultraviolet light. FIG. 22 shows that the dummy block 77 is inserted into the mounting hole 71 </ b> C of the mounting base 71 from which the light emitting diode 21 </ b> A which is unnecessary for the light emitting diode unit 21 is removed. As shown in FIG. 23, the dummy block 77 includes a rectangular columnar main body 77A having substantially the same size as the light emitting diode 21A, and a leg 77B provided on the lower surface of the main body 77A, and the main body 77A is inserted into the mounting hole 71C. The leg 77B can be engaged with the terminal 71A of the mounting hole 71C. By mounting the dummy block 77 in the mounting hole 71C of the mounting base 71 from which the light emitting diode 21A unnecessary for the light emitting diode 21 is removed, the upper end surface of the dummy block 77 together with the upper end surface of the light emitting diode 21 is placed on the substrate. Acts as a support surface.

  In the lower irradiation means 20A and / or the upper irradiation means 20B, a light emitting diode unit 21 having an area facing the entire surface of the substrate 1 and having the light emitting diode 21A detachable as shown in FIG. 22 is used. Sometimes, the light emitting diode unit 21 corresponds to the drawing position of the sealing agent 2 on the substrate 1, and the light emitting diode 21 </ b> A can be provided only at a position where the sealing agent 2 needs to be irradiated with ultraviolet light. For example, when the sealing agent 2 of the substrate 1 is drawn and applied in two rectangular frames as shown in FIG. 21, it corresponds to the two rectangular frames on the light emitting diode unit 21 as shown in FIG. The light emitting diode 21A is provided only at the position where it is to be.

According to this, there exist the following effects.
(a) The lower irradiation means 20A (the same applies to the upper irradiation means 20B) has a light emitting diode unit 21 having an area facing the entire surface of the substrate 1, and the light emitting diode unit 21 irradiates the sealing agent 2 of the substrate 1 with ultraviolet light. The light emitting diode 21A is provided only at the required position. Therefore, it is possible to reliably irradiate the sealing agent 2 of the substrate 1 with ultraviolet light by using the light emitting diode unit 21 having only the minimum necessary light emitting diode 21A.

  (b) The lower irradiation unit 20A (the same applies to the upper irradiation unit 20B) includes the light emitting diode unit 21. The light emitting diode unit 21 includes a mounting base 71A for the light emitting diode 21A, and the light emitting diode 21A is attached to the mounting base 71. Make it detachable. Accordingly, while using the same light emitting diode unit 21, the necessary light emitting diode 21 </ b> A is attached to the sealing agent 2 of the substrate 1 where the drawing position of the sealing agent 2 is different, and is necessary for the sealing agent 2 of the substrate 1. Can be irradiated with ultraviolet light.

  The lower irradiating means 20A and / or the upper irradiating means 20B have a light emitting diode unit 21 having an area facing the entire surface of the substrate 1, and the light emitting diode unit 21 needs to irradiate the sealing agent 2 of the substrate 1 with ultraviolet light. When the light emitting diode 21A is provided only at the position where the light emitting diode 21A is provided, it is not essential that the light emitting diode 21A be detachable from the mounting base 71, and the light emitting diode 21A may be fixedly disposed at a required position of the mounting base 71.

  FIG. 25 shows a modification of the ultraviolet light irradiation apparatus 10, and the mounting base 71 constituting the light emitting diode unit 21 </ b> A of the lower irradiation means 20 </ b> A (the upper irradiation means 20 </ b> B is the same) does not include the partition wall 71 </ b> B. The light emitting diodes 21A adjacent to each other by being attached to 71A are brought into contact with each other without any gap. When the light emitting diode 21A is detachable from the mounting base 71, the dummy block 77 can be inserted into the mounting hole 71C of the mounting base 71 from which the light emitting diode 21A is removed.

Example 3 (FIGS. 26 to 28)
The ultraviolet light irradiation device 10 constituting the substrate manufacturing apparatus shown in FIGS. 26 to 28 irradiates the sealing agent 2 bonded with two glass substrates 1 with ultraviolet light in the same manner as in the first embodiment. Harden.

  The ultraviolet light irradiation device 10 is provided with a lower irradiation means 20A on a stage 13 provided on a support base 12 (which may be an XY table) (not shown) on a base 11 (not shown). The lower irradiation unit 20 </ b> A includes the light emitting diode unit 21 on the mounting base 80 fixed on the stage 13.

  The lower irradiation means 20A has a light emitting diode unit 21 having an area opposite to the entire surface of the substrate 1, and the light emitting diode unit 21 is provided with a light emitting diode 21A only at a position where the sealing agent 2 of the substrate 1 requires ultraviolet light. Yes. The light emitting diode unit 21 has a mounting base 81 for the light emitting diode 21A as shown in FIGS. 27 and 28, and the inner periphery of the mounting frame 81A of the mounting base 81 is a protruding mounting portion 80A of the mounting base 80. Make it detachable. The light emitting diode unit 21 makes the light emitting diode 21 </ b> A detachable from the mounting base 81 as in the second embodiment. Therefore, in the ultraviolet light irradiation apparatus 10, for example, when the sealing agent 2 of the substrate 1 is drawn and applied in two rectangular frame shapes as shown in FIG. 21, as shown in FIG. On the unit 21, light emitting diodes 21A corresponding to the two rectangular frames are provided. The inner periphery of the mounting frame 81A of the mounting base 81 is matched with the inner periphery of the rectangular frame formed by the light emitting diode 21A on the light emitting diode unit 21 in plan view. With the mounting frame 81A of the mounting base 81 of the light emitting diode unit 21 inserted into the mounting portion 80A of the mounting base 80, the upper end surface of the light emitting diode 21A and the upper end surface of the mounting portion 80A are flush with each other. The mounting base 80 has a vacuum suction pipe 82 that opens to the upper end surface of the mounting portion 80A.

  In the ultraviolet light irradiation apparatus 10, the substrate 1 is transferred to the upper end surface of the light emitting diode 21A of the light emitting diode unit 21 and the upper end surface of the mounting portion 80A of the mounting base 80 constituting the lower irradiation means 20A. In a state where 1 is adsorbed to the upper end adsorbing portion of the vacuum adsorption pipe 82, the irradiation light from the lower irradiation means 20A can be applied to the sealing agent 2 of the substrate 1.

Therefore, the ultraviolet light irradiation device 10 has the following effects.
The lower irradiation means 20A has a light emitting diode unit 21 having an area facing the entire surface of the substrate 1, and the light emitting diode 21A is provided only at a position where the light emitting diode unit 21 needs to irradiate the sealing agent 2 of the substrate 1 with ultraviolet light. It was. Therefore, it is possible to reliably irradiate the sealing agent 2 of the substrate 1 with ultraviolet light by using the light emitting diode unit 21 having only the minimum necessary light emitting diode 21A.

Example 4 (FIGS. 29 to 32)
29 removes the lower irradiation means 20A of the second embodiment from the stage 13 on the support base 12, and attaches the mounting base 70 and the mounting base 71 of the lower irradiation means 20A to the base 11 ( The substrate support unit 60 is supported by the stage 13 and supported by the stage 13, and as a result, the substrate support unit 60 is moved by the support base 12, and the light emitting diode unit 21 of the lower irradiation means 20A and the substrate 1 are supported. Can be swung with a swing stroke relatively smaller than the application width of the sealant 2. The insertion holes 75 and 76 for the lift pins 61 of the substrate support unit 60 provided on the mounting base 70 and the mounting base 71 of the lower irradiation means 20A are larger in diameter than the swing stroke of the lower irradiation means 20A and the substrate 1. The substrate support unit 60 is allowed to move as described above.

  In FIG. 31, the light emitting diode unit 21 of the lower irradiation means 20A is swung along the square swing locus A, and the irradiation range of, for example, four light emitting diodes 21A adjacent to each other is swung within the coating width of the sealant 2. It is made possible to eliminate the uneven illuminance as shown in FIGS. 32 and 33 when it is movable and not rocked. In FIGS. 31 to 33, one circle indicates an irradiation range on the substrate 1 by one light emitting diode 21A. In FIG. 32, when the adjacent pitch of the four light emitting diodes 21A adjacent to each other is large, the irradiation area a of only one light emitting diode 21A, the irradiation position b of the two light emitting diodes 21A, and the non-irradiation area n are mixed. Causes uneven illumination. In FIG. 33, when the adjacent pitch of the four light emitting diodes 21A adjacent to each other is small, the irradiation area a of only one light emitting diode 21A, the irradiation position b by the two light emitting diodes 21A, and the three light emitting diodes 21A. Irradiation unevenness due to the presence of the irradiation region c by 4 and the irradiation region d by the four light emitting diodes 21A.

Therefore, the ultraviolet light irradiation device 10 has the following effects.
The lower irradiation means 20 </ b> A and the substrate 1 can be relatively swung with a swing stroke equal to or less than the application width of the sealant 2. The adjacent pitch of the adjacent light emitting diodes 21A compensates for the occurrence of illuminance unevenness reaching the sealing agent 2 of the substrate 1 and can uniformly irradiate the sealing agent 2 of the substrate 1 as a whole.

  In addition, as shown in FIG. 30, the ultraviolet light irradiation apparatus 10 that eliminates the occurrence of uneven illuminance on the sealing agent 2 of the substrate 1 is a substrate adsorption provided on a stage 13 on a support table 12 (or an XY table is acceptable). The substrate 1 is supported on the base 90, and the substrate 1 is moved by the support base 12 while irradiating the sealing agent 2 of the substrate 1 with ultraviolet light by the upper irradiation means 20B. The substrate 1 may be relatively swung with a swing stroke that is less than or equal to the coating width of the sealant 2.

FIG. 1: shows the ultraviolet light irradiation apparatus of Example 1, (A) is a front view, (B) is sectional drawing which follows the BB line of (A). 2A and 2B show a light emitting diode unit of the irradiating means, in which FIG. 2A is a perspective view showing a lattice arrangement, and FIG. 2B is a perspective view showing a staggered arrangement. FIG. 3 shows a light emitting diode unit and a sealant position detection unit of the irradiation means, (A) is a perspective view, and (B) is a plan view. FIG. 4 is a schematic diagram showing an example of an illuminometer. FIG. 5 is a schematic diagram showing another example of an illuminometer. FIG. 6 is a schematic diagram showing the relationship between the irradiation distance of the light emitting diode and the illuminance. FIG. 7 is a schematic diagram showing the relationship (illuminance distribution) between the lateral position of the light emitting diode and the illuminance. FIG. 8 is a schematic diagram showing a combined illuminance distribution of adjacent light emitting diodes. FIG. 9 is a schematic diagram showing a difference in illuminance distribution depending on the irradiation height of the light emitting diode. FIG. 10 is a schematic diagram showing the pulse lighting of the light emitting diode and the excitation energy of the excitation substance. FIG. 11 is a schematic diagram showing light condensing means using a reflecting plate of a light emitting diode. FIG. 12 is a schematic diagram showing light condensing means using a lens of a light emitting diode. FIG. 13 is a schematic diagram showing the rotation means of the irradiation means. 14A and 14B show a modification of the ultraviolet light irradiation device, in which FIG. 14A is a front view and FIG. 14B is a cross-sectional view taken along line BB in FIG. FIG. 15 is a front view showing a sealant position detection unit of the irradiation means. FIG. 16 is a plan view showing a light emitting diode unit and a sealant position detection unit of the irradiation means. FIG. 17 is a front view showing the ultraviolet light irradiation apparatus of the second embodiment. FIG. 18 is a plan view showing a light emitting diode unit of the irradiation means. FIG. 19 is an enlarged view of a main part of the light emitting diode unit, where (A) is a cross-sectional view and (B) is a plan view. FIG. 20 shows a light emitting diode, (A) is a front view, (B) is a side view, and (C) is a plan view. FIG. 21 is a plan view showing a sealing agent application pattern on the substrate. FIG. 22 is a cross-sectional view showing a light emitting diode attached / detached state in the light emitting diode unit. FIG. 23 shows a dummy block, where (A) is a front view and (B) is a plan view. 24 shows a light emitting diode unit corresponding to the substrate of FIG. 21, wherein (A) is a plan view and (B) is a sectional view. FIG. 25 is a sectional view showing a modification of the light emitting diode unit. FIG. 26 is a cross-sectional view illustrating the ultraviolet light irradiation apparatus according to the third embodiment. FIG. 27 is a cross-sectional view showing a state where the mounting base of the light emitting diode unit is separated from the mounting base. FIG. 28 is a plan view showing the light emitting diode unit. FIG. 29 is a front view showing the ultraviolet light irradiation apparatus of the fourth embodiment. FIG. 30 is a front view showing a modification of the ultraviolet light irradiation apparatus. FIG. 31 is a schematic view showing the swinging action of the light emitting diode unit. FIG. 32 is a schematic diagram showing uneven illuminance due to adjacent light emitting diodes. FIG. 33 is a schematic diagram showing illuminance unevenness due to adjacent light emitting diodes.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Sealing agent 3 Liquid crystal 10 Ultraviolet light irradiation device 17 Height adjustment means 18 Laser displacement meter 20 Irradiation means 20A Lower irradiation means 20B Upper irradiation means 21 Light emitting diode unit 21A Light emitting diode 22 Sealing agent detection unit 22A Irradiation unit 22B Light receiving unit 25 Control device 30 Illuminance meter 31 Glass 41 Reflector 42, 43 Lens 50 Turning arm 71 Mounting base

Claims (9)

In an ultraviolet light irradiation apparatus that irradiates and cures ultraviolet light on a sealing agent provided between two substrates,
A plurality of light emitting diodes for irradiating ultraviolet light, an ultraviolet light irradiating means arranged in a matrix ,
A control device that selects and turns on a light emitting diode that irradiates ultraviolet light toward the sealant provided between the two substrates from among a plurality of light emitting diodes constituting the irradiation means; ,
The ultraviolet light irradiation device, wherein a pitch between the light emitting diodes is determined so that a combined illuminance between the adjacent light emitting diodes on the sealant is not less than a minimum illuminance necessary for curing the sealant. In each of the light emitting diodes, the plurality of light emitting diodes have a facing distance to the sealing agent so that the illuminance of the ultraviolet light on the sealing agent facing the light emitting diode is equal to or greater than the minimum illuminance. The ultraviolet light irradiation apparatus according to claim 1, wherein The ultraviolet light irradiation device according to claim 1 , wherein the control device selects the light emitting diode to be lit based on position information of the sealant provided between the two substrates. The ultraviolet light irradiation according to any one of claims 1 to 3 , further comprising a moving means capable of relatively moving the substrate and the ultraviolet light irradiation means with a moving amount equal to or less than a coating width of the sealant. apparatus. The ultraviolet light irradiation apparatus according to claim 1 , further comprising an illuminance meter that measures illuminance of the light emitting diode. In the ultraviolet light irradiation method of irradiating and curing the ultraviolet light on the sealing agent provided between the two substrates,
While irradiating the sealing agent with ultraviolet light by ultraviolet light irradiation means comprising a plurality of light emitting diodes that irradiate ultraviolet light, the substrate and the ultraviolet light irradiation means are relatively set in advance. An ultraviolet light irradiation method characterized by swinging with a moving stroke. The ultraviolet light irradiation method according to claim 6, wherein the substrate and the plurality of light emitting diodes are swung with a square locus. A substrate for manufacturing a bonded substrate by bonding two substrates, each having a sealing agent applied to at least one in a rectangular frame shape, through the sealing agent, and then curing the sealing agent by irradiating with ultraviolet light. In manufacturing equipment,
Substrate manufacturing apparatus characterized by comprising an ultraviolet light irradiation device according to any one of claims 1 to 5. A substrate for manufacturing a bonded substrate by bonding two substrates, each having a sealing agent applied to at least one in a rectangular frame shape, through the sealing agent, and then curing the sealing agent by irradiating with ultraviolet light. In the manufacturing method,
A substrate manufacturing method using the ultraviolet light irradiation method according to claim 6 .

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