JP2009169386A - Optical irradiation device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical irradiation device irradiating a sealing material, which is coated in various patterns, with light rays without increasing the number of components while attaining power saving. <P>SOLUTION: A UV irradiation device 1 includes: a stage 13 on which a substrate W is placed and irradiation parts 22a to 22d wherein a plurality of UVLEDs emitting UV and being individually turned on/off are linearly arranged and which emit linear light rays having a width nearly equal to that of outer and inner side sealing materials. Further, the UV irradiation device 1 includes: a direction X actuator 19 moving the radiation parts 22a to 22d in a direction X; and a control part 34 turning each UVLED on/off according to the patterns of the outer and inner side sealing materials. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light irradiation apparatus used in a step of bonding substrates used in a liquid crystal display panel or the like.

In this type of light irradiation apparatus, the sealing material is cured by irradiating the bonded substrate with the sealing material made of a photo-curable resin material interposed with light such as ultraviolet rays, and the substrates are bonded together. ing. In addition, in order to prevent the characteristics of the liquid crystal and the like from being changed by irradiation of light such as ultraviolet rays, the liquid crystal interposed between the bonded substrates is not irradiated with ultraviolet rays. For example, in the light irradiation apparatus described in Patent Document 1, irradiation is performed in a state where a light-shielding mask is disposed between a light source for irradiating ultraviolet rays and a bonded substrate, and only a portion where the sealing material is interposed in the bonded substrate. Are irradiated with ultraviolet rays.
JP 2006-66585 A

  By the way, in the said patent document 1, in order to irradiate the whole surface of a bonded substrate collectively, very big electric power is required and there exists a problem that the manufacturing cost of a bonded substrate increases. In particular, in recent years, the size of the manufactured bonded substrate is increasing, and the increase in power consumption is remarkable. Conventionally, since an arc discharge type metal halide lamp or the like is used as a light source, it must be continuously lit even during non-irradiation such as when a substrate is transported, which further increases power consumption. End up.

  In addition, since the pattern of the sealing material applied to the bonded substrate differs depending on the type of bonded substrate (the type of liquid crystal display to be manufactured), in the conventional configuration, a plurality of types of light shielding are provided for each pattern of the sealing material. A mask must be prepared, which increases the number of parts and increases the cost. Furthermore, since the deflection of the light shielding mask increases as the size of the bonded substrate increases, there is a problem that it is difficult to attach the light shielding mask without bending.

  The present invention has been made in view of such circumstances, and its purpose is to save power and to irradiate light onto a sealing material applied in various patterns without increasing the number of parts. It is in providing the light irradiation apparatus which can be performed.

  In order to solve the above-mentioned problem, the invention described in claim 1 is a light irradiation device that irradiates light to a linear sealing material made of a photocurable resin interposed between bonded substrates, A stage on which the bonded substrate is placed, and a plurality of semiconductor elements that can irradiate the light and can be individually turned on / off are linearly arranged, and the linear light according to the width of the sealing material An irradiation unit for irradiating the bonded substrate, and a first unit for moving the irradiation unit in a direction intersecting the direction in which the semiconductor elements are arranged in a plane parallel to a plane on which the bonded substrate is placed. 1 drive part, and the control part which turns on / off each said semiconductor element according to the pattern of the said sealing material.

  According to the same configuration, a portion of the sealing material applied linearly is irradiated to a portion parallel to the irradiation portion, and the irradiation portion is in a direction intersecting with the direction in which the semiconductor elements are arranged, that is, the sealing material irradiated with light. By moving in an intersecting direction and controlling on / off of the semiconductor elements (LEDs) according to the pattern of the sealing material, light is irradiated to all the sealing materials and the substrates are bonded to each other. Since only light having a width corresponding to the sealing material is irradiated, power saving can be achieved without requiring a large amount of power as in the case where the entire surface of the substrate is irradiated. Further, since light is not irradiated on the liquid crystal or the like interposed inside the sealing material, it is not necessary to use a light shielding mask as in the conventional case, and an increase in cost of the apparatus can be prevented. Furthermore, since a semiconductor element is used as the light source, the life of the light source can be extended as compared with the case of using an arc discharge type metal halide lamp as in the prior art. Unlike the conventional case, since the light can be turned off when the substrate is not irradiated, the power can be saved and the life can be extended.

  According to a second aspect of the present invention, in the light irradiation apparatus according to the first aspect, any one of the irradiation unit and the bonded substrate in a plane parallel to a plane on which the bonded substrate is placed. A second driving unit for rotating one of them was provided. According to this configuration, after irradiating a portion parallel to the irradiation portion in the sealing material applied in a rectangular frame shape, either the irradiation portion or the substrate is rotated, and is orthogonal to the portion irradiated with light. The substrate is adhered by irradiating the portion with linear light. Therefore, the time required for the bonding process of the substrate can be shortened as compared with the case where the irradiation unit is moved in the direction intersecting the direction in which the semiconductor elements are arranged and the on / off of the semiconductor elements is controlled according to the pattern of the sealing material.

  According to a third aspect of the present invention, in the light irradiation apparatus according to the second aspect, the control unit is configured to rotate the irradiated portion of the sealing material and the relative portion before relative rotation between the bonded substrate and the irradiation portion. The semiconductor element that irradiates the light is turned off either before or after the relative rotation at the intersection of the sealing material with the irradiated portion. In general, the amount of light applied to the sealing material is preferably within a predetermined range, but the irradiated portion of the sealing material before the relative rotation of the bonded substrate and the irradiated portion, and the irradiated portion of the sealing material after the relative rotation, Since the light is irradiated twice at the crossing portion, problems such as deterioration of the sealing material occur. In this respect, according to the same configuration, since the semiconductor element that irradiates light to the intersection is turned off either before or after the relative rotation, the substrates can be brought together in a short time without deteriorating the sealing material. Can be glued.

  According to a fourth aspect of the present invention, in the light irradiation device according to any one of the first to third aspects, the light emitted from the semiconductor element has a major axis in the direction in which the semiconductor element is arranged. Each of the semiconductor elements is arranged such that light irradiated from adjacent semiconductor elements and condensed in an elliptical shape overlaps in the major axis direction. According to this configuration, since the light is condensed into an elliptical shape by an optical element such as a cylindrical lens, the light emitted from the irradiating unit is blocked by an aperture or the like and the light emitted from the irradiating unit is made linear. Light with high illuminance can be irradiated. In addition, since each semiconductor element is arranged so that light irradiated from adjacent semiconductor elements and collected in an elliptical shape overlaps in the major axis direction, variation in illuminance along the major axis direction of the ellipse is reduced, and the irradiation unit Variations in the illuminance of ultraviolet rays irradiated from can be reduced. Accordingly, the sealing material can be uniformly cured, and partial deterioration of the sealing material can be prevented.

  According to a fifth aspect of the present invention, in the light irradiation device according to the fourth aspect, a reflector for reflecting the light is disposed between the adjacent semiconductor elements. According to this configuration, the light condensed in an elliptical shape by the optical element is reflected at the both ends in the long axis direction by the reflector and becomes rectangular. In this way, the illuminance along the longitudinal direction in each irradiation region is made uniform by reflecting both ends in the major axis direction of the irradiation region of each semiconductor element so as to overlap with the irradiation region of each semiconductor element. In addition, the illuminance can be increased. In addition, since both ends in the major axis direction of the irradiation region are reflected by the reflector, light does not easily leak into the irradiation region of the adjacent semiconductor element, and the irradiation range of the irradiation unit can be accurately controlled by turning on and off the semiconductor element. . Here, in the case of adopting a configuration in which only the semiconductor element that irradiates light to the intersection is turned off as in the configuration of claim 3, the deterioration of the sealing material is sufficient if the irradiation range of the irradiation portion cannot be accurately controlled. Cannot be prevented. Therefore, the present invention is particularly suitable for a structure that limits the irradiation range by turning off only some of the semiconductor elements.

  The invention according to claim 6 is the light irradiation apparatus according to claim 4 or 5, wherein the optical element includes a hemispherical lens for suppressing diffusion of light irradiated from the semiconductor element, and the hemispherical lens. It consists of a cylindrical lens that condenses the emitted light into an ellipse having a major axis in the direction in which the semiconductor elements are arranged. According to this configuration, the diffusion of light irradiated from the semiconductor element is suppressed by the hemispherical lens and is incident on the cylindrical lens. Therefore, it can reduce that the light irradiated from the semiconductor element is irradiated to other members (for example, the wall surface of the housing | casing in which a semiconductor element is accommodated), and can make it enter into a cylindrical lens efficiently.

  The invention according to claim 7 is the light irradiation apparatus according to any one of claims 1 to 6, wherein the irradiation unit is a casing in which an irradiation hole in which the semiconductor element is provided is formed in a lower part. And a negative pressure source for supplying a negative pressure into the housing, and the semiconductor element is provided in each irradiation hole with a gap between the irradiation hole and a side surface of the irradiation hole. An optical element for condensing light emitted from the semiconductor element into an ellipse having a major axis in the direction in which the semiconductor elements are arranged is provided below the hole. According to this configuration, since negative air is supplied into the housing, external air flows into the housing through the gap between the opening and the semiconductor element. The generated semiconductor element can be cooled.

  ADVANTAGE OF THE INVENTION According to this invention, while aiming at power saving, the light irradiation apparatus which can irradiate light with respect to the sealing material apply | coated to various patterns, without increasing a number of parts can be provided.

(First embodiment)
Hereinafter, a first embodiment in which the present invention is embodied in an ultraviolet irradiation apparatus of a bonded substrate manufacturing apparatus will be described with reference to the drawings.

  An ultraviolet irradiation device 1 shown in FIG. 1 is provided in a production line (not shown) for manufacturing an active matrix type liquid crystal display panel by enclosing liquid crystals between two types of substrates (lower substrate and upper substrate). The ultraviolet irradiation device 1 irradiates ultraviolet rays onto a sealing material made of an ultraviolet curable resin interposed between bonded substrates constituting the liquid crystal panel (hereinafter referred to as substrate W) in the manufacturing process of the liquid crystal display panel. Used in the process of curing the material.

  As shown in FIGS. 1 and 2, an outer wall 12 formed in a rectangular frame shape is erected on a substantially rectangular parallelepiped base portion 11 constituting the ultraviolet irradiation device 1, and on the inner side of the outer wall 12, A stage 13 on which the substrate W is placed is provided. The outer wall 12 is bent upward inward to form a rectangular opening 14. A gantry 16 is fixed to the upper end surface 15 of the outer wall 12 so as to straddle the opening 14. The gantry 16 is spanned between a pair of support legs 17 extending parallel to each other upward from substantially the center of one side constituting the outer wall 12 and connects the upper ends of the support legs 17 to each other. A U-shape is formed by the connecting portion 18. An X-axis base 20 that moves in a direction along the connecting portion 18 (hereinafter referred to as the X direction) by an X-axis actuator 19 serving as a first drive unit is connected to the connecting portion 18 of the gantry 16 along the connecting portion 18. A plurality (four in this embodiment) are provided. Each X-axis base 20 has an irradiating portion 22a extending along a direction orthogonal to the X direction (see FIG. 1, hereinafter referred to as Y direction) in a plane parallel to the upper surface of the base portion 11 via the attachment member 21. ˜22d are provided. Each irradiation part 22a-22d is individually movable, and is formed longer in the Y direction than each side of the substrate W. In the present embodiment, a linear motor is adopted as the X-axis actuator 19, and the operation ranges of the plurality of X-axis actuators 19 can overlap and move. Moreover, in FIG.1 and FIG.2, between the irradiation parts 22a-22d and the board | substrate W is shown more widely than actuality for convenience of explanation.

  As shown in FIG. 2, a stage moving mechanism 31 constituting the stage 13 is fixed on the base 11 inside the outer wall 12. A plurality of shafts 32 formed in a columnar shape are erected on the stage moving mechanism 31, and a flat plate-like base 33 is fixed to the upper end of the shaft 32, and the base 33 is moved in the vertical direction (hereinafter referred to as Z direction). ) To move. The stage moving mechanism 31 is connected to the control unit 34, and the movement of the base 33 in the Z direction is controlled. The stage moving mechanism 31 moves the shaft 32 and the base 33 in the Z direction by, for example, a ball screw mechanism that linearly moves the ball screw by rotating the hollow shaft with a motor.

  In the center of the base 33, an alignment unit 36 having an upper end formed in a disk shape is provided via a substrate moving mechanism 35 as a second driving unit. The substrate moving mechanism 35 moves the alignment unit 36 in the X direction, the Y direction, and the Z direction, and rotates the alignment unit 36 around the rotation axis L. The substrate moving mechanism 35 is connected to the control unit 34, and the movement of the alignment unit 36 in the X direction, the Y direction, and the Z direction and the rotation around the rotation axis L are controlled. Further, columnar support members 37 are erected on the base 33 on both sides in the X direction of the substrate moving mechanism 35, and at the upper end of the support member 37 in the Y direction (a direction orthogonal to the paper surface in FIG. 2). A long rectangular plate-like levitation stage 38 is fixed. Further, columnar support members 39 are erected on the base 33 on both sides in the X direction of the levitation stage 38, and a rectangular plate-like holding stage 40 that is long in the Y direction is fixed to the upper end of the support member 39. ing. A through hole 41 is formed in the holding stage 40, and an alignment camera 42 is disposed coaxially with the through hole 41. The upper surfaces of the alignment unit 36, the floating stages 38, and the holding stages 40 are parallel to the upper surface of the base 11. The substrate W is placed on the alignment unit 36, each floating stage 38, and each holding stage 40, and is rotated by the alignment unit 36 in a plane parallel to these upper surfaces.

  A plurality of suction holes (not shown) are formed in the alignment unit 36 and the floating stage 38, and a vacuum pump (not shown) is connected to the suction holes. The vacuum pump is connected to the control unit 34, and when the ultraviolet rays are irradiated from the irradiation units 22a to 22d, the substrate W is adsorbed to prevent displacement. Further, the suction pressure by the vacuum allows the thermal expansion of the substrate W at the time of irradiation to be released, so that the pressure can be adjusted. On the other hand, when the substrate W is moved on the stage 13, the alignment unit 36 adsorbs the substrate W and exhausts air from the adsorption hole of the levitation stage 38, so that the substrate W is levitated on the levitation stage 38. In this state, the alignment unit 36 moves to move the substrate W. Thereby, when aligning the substrate W, the substrate W can be prevented from coming into contact with the floating stage 38 and the holding stage 40 and being damaged.

Next, the irradiation unit 22a will be described. The irradiation units 22b to 22d are configured in the same manner as the irradiation unit 22a.
As shown in FIG. 3A, a plurality of UV LEDs (ultraviolet irradiation diodes) 52 as semiconductor elements are linearly arranged in a casing 51 formed in a rectangular parallelepiped shape of the irradiation unit 22a. Specifically, as shown in FIGS. 3A and 3B, the casing 51 is formed in a rectangular plate shape and fixed to the X-axis base 20 (see FIG. 1), and a base plate A cover plate 54 having a U-shaped cross section fixed to the lower end of 53, and a cap 55 for closing both ends of the base plate 53 and the cover plate 54 are provided. A plurality of rectangular irradiation holes 57 penetrating in the Z direction are formed in the lower portion 56 of the cover plate 54 (housing 51). The irradiation holes 57 are formed on the cover plate 54 at equal intervals along the Y direction (left and right direction in FIG. 3A). A circuit board 58 is fixed to the upper surface of the lower part 56, and a UVLED 52 is mounted at a position corresponding to the irradiation hole 57 of the circuit board 58. Each UVLED 52 is disposed in the irradiation hole 57 with a gap between the side surface of the irradiation hole 57. Each UVLED 52 is connected to the control unit 34 and is turned on and off independently. In addition, a reflector 59 that reflects ultraviolet rays is disposed in the middle of each adjacent UVLED 52 and on the end portion side of the UVLED 52 disposed at both ends of the irradiation unit 22a. Furthermore, an aperture 60 in which a slit extending in the Y direction is formed is fixed to the lower surface of the lower portion 56. The slit is formed to have a width of, for example, about 0.5 mm to 1 mm, and is formed so as to reflect the ultraviolet ray irradiated beyond the same width on the inner surface of the aperture 60 and guide it to the slit. A cylindrical lens 61 is disposed above the slit at a position corresponding to the UVLED 52.

  The irradiation region of the ultraviolet rays emitted from each UV LED 52 is converged only in the X direction by the cylindrical lens 61 to become substantially elliptical, and the length of the irradiation region is reflected by the reflector 59 as shown in FIGS. Both end portions in the axial direction are reflected so as to be rectangular. In this way, both end portions in the major axis direction of the irradiation regions of the respective UVLEDs 52 are reflected so as to overlap with the irradiation regions of the respective UVLEDs 52, thereby making the illuminance uniform along the longitudinal direction of each irradiation region, and The illuminance in the irradiation area is increased. And by arranging these UVLEDs 52 along the Y direction, the ultraviolet rays emitted from the irradiation units 22a to 22d become linear, and the linear ultraviolet rays emitted from the irradiation units 22a to 22d extend in the Y direction. The variation of illuminance along is reduced. In FIG. 4B, for convenience of explanation, the irradiation areas of the ultraviolet rays emitted from the first, third, and fifth UV LEDs 52 from the right are indicated by broken lines, and the second and fourth from the right are shown. The irradiation region of ultraviolet rays emitted from the UVLED 52 is indicated by a two-dot chain line. In addition, the boundary line between adjacent irradiation regions is indicated by a broken line for convenience.

  Further, as shown in FIGS. 3A and 3B, a plurality of piping ports 62 are formed in the side portion of the cover plate 54, and a pipeline 63 is connected to the piping ports 62. Yes. And the inside of the housing | casing 51 is formed so that airtightness with the exterior other than the irradiation hole 57 and the piping port 62 is ensured. A negative pressure source 64 is connected to each pipe line 63, and when the negative pressure source 64 is operated, air in a space surrounded by the base plate 53, the cover plate 54, and the cap 55 is sucked. It has become. When the external air flows into the space through the gap between the irradiation hole 57 and the UVLED 52, the UVLED 52 that has generated heat due to the irradiation of light is cooled.

Next, the irradiation of ultraviolet rays onto the sealing material applied to the substrate W will be described.
Prior to the ultraviolet irradiation of the sealing material, the substrate W is placed on the stage 13 by a transport fork (not shown). Subsequently, the alignment of the substrate W on the stage 13 is optically performed using the alignment camera 42. And each irradiation part 22a-22d moves according to the kind of board | substrate W which is conveyed, and irradiates a sealing material with an ultraviolet-ray. The ultraviolet irradiation device 1 moves the substrate W (the levitation stage 38 and the holding stage 40) in the Z direction according to the seal width input to the control unit 34 from the outside, and emits ultraviolet rays having substantially the same width as the seal width. It comes to irradiate. Further, the amount of ultraviolet light applied to the sealing material is made substantially constant by the control unit 34.

  More specifically, as shown in FIG. 5A, the substrate W is coated according to the size of the outer sealing material 71 coated on the outer peripheral edge of the substrate W and the liquid crystal display panel manufactured on the inner side. The applied inner sealing material 72 is applied. In the present embodiment, the inner sealing material 72 applied in the same shape is applied to the inner side of the outer sealing material 71 applied along the outer peripheral edge of the substrate W, and is applied in five rows vertically and three rows horizontally. The outer sealing material 71 and the inner sealing material 72 are applied with substantially the same width.

  First, after irradiating the outer seal material 71 applied along the Y direction by the irradiation units 22a and 22d with ultraviolet rays, the irradiation units 22b and 22c apply the upper side portion and the second lower portion of the inner seal material 72 in the second row from the top. The lower side portion of the inner sealing material 72 in the row is irradiated. At this time, since ultraviolet rays having the same width as the outer and inner sealing materials 71 and 72 are irradiated, the liquid crystal dropped inside the inner sealing material 72 is not irradiated with ultraviolet rays. Next, as shown in FIG. 5B, the irradiation units 22 a to 22 d are moved toward the center of the substrate W, and the inner sealing material 72 adjacent to the outer sealing material 71 or the inner sealing material 72 that has been irradiated is used. Irradiate. Next, as illustrated in FIG. 5C, the irradiation units 22 a to 22 d are moved toward the center of the substrate W, and the inner sealing material 72 adjacent to the outer sealing material 71 or the inner sealing material 72 that has been irradiated is used. Irradiate.

  Next, the alignment unit 36 rotates the substrate W by 90 degrees. Then, as shown in FIG. 6 (a), the substrate W is rotated by the irradiating units 22b and 22c after the irradiating units 22a and 22d irradiate ultraviolet rays onto the portions of the outer sealing material 71 that are orthogonal to the already irradiated portions. In this state, the lower side of the inner sealing material 72 in the first row from the top and the upper side of the inner sealing material 72 in the first row from the bottom are irradiated. At this time, the irradiated portion irradiated with ultraviolet rays before the rotation of the substrate W in the outer and inner sealing materials 71 and 72 (the state shown in FIG. 5A) and after the rotation of the substrate W (FIG. 6A). Irradiation is performed in a state in which the UVLED 52 that irradiates ultraviolet rays is turned off at the intersection 73 with the irradiated portion irradiated with ultraviolet rays. That is, the UVLED 52 that irradiates ultraviolet rays to the apex portion of the outer seal material 71 and the apex portion of the inner seal material 72 and the portion where the extension line of the inner seal material in the outer seal material 71 intersects is irradiated in an off state. Next, as illustrated in FIG. 6B, the irradiation units 22 a to 22 d are moved toward the center of the substrate W, and the inner sealing material 72 adjacent to the outer sealing material 71 or the inner sealing material 72 that has been irradiated is used. Irradiate. At this time, similarly, the UVLED 52 that irradiates the intersection 73 with the ultraviolet rays is irradiated in an off state. Accordingly, the ultraviolet irradiation device 1 only irradiates light having a width corresponding to the outer and inner sealing materials 71 and 72 along the outer and inner sealing materials 71 and 72 applied to the substrate W. Compared to the case where the entire surface is irradiated in a lump, power can be saved without requiring a large amount of power.

As described above, according to the present embodiment, the following effects can be obtained.
(1) In the ultraviolet irradiation apparatus 1, a stage 13 on which a substrate W is placed and a plurality of UVLEDs 52 that can irradiate ultraviolet rays and can be individually turned on / off are linearly arranged. Irradiating portions 22a to 22d that irradiate linear light having substantially the same width as the above. Furthermore, the ultraviolet irradiation device 1 includes an X-axis actuator 19 that moves the irradiation units 22a to 22d in the X direction, and a control unit 34 that turns each UVLED 52 on and off according to the patterns of the outer and inner sealing materials 71 and 72. . Accordingly, since only light having a width corresponding to the outer and inner sealing materials 71 and 72 is irradiated along the outer and inner sealing materials 71 and 72 applied to the substrate W, the entire surface of the substrate is irradiated at once. Compared with the case where it does, power saving can be achieved without requiring large electric power. Further, since the liquid crystal dripped onto the inner sealing material 71 is not irradiated with ultraviolet rays, it is not necessary to use a light shielding mask as in the prior art, and an increase in the cost of the ultraviolet irradiation device 1 can be prevented. Furthermore, since the UVLED 52 is used as a light source for irradiating ultraviolet rays, the life of the light source can be extended. And unlike the case where the arc discharge type metal halide lamp is used as in the prior art, it is possible to turn off the light when the substrate W is not irradiated, so that further power saving and long life can be achieved.

  (2) Since the substrate W is rotated 90 degrees by the alignment unit 36, after irradiating one side of the outer and inner sealing materials 71, 72, the substrate W is rotated 90 degrees to be orthogonal to the portion irradiated with ultraviolet rays. By irradiating the portion, the substrate W can be bonded. Therefore, compared with the case where each irradiation part 22a-22d is moved to an X-axis direction, and on / off of a semiconductor element (LED) is controlled according to the pattern of the outer side and inner side sealing materials 71 and 72, it takes to the adhesion process of the board | substrate W. You can save time.

  (3) Since the UVLED 52 that irradiates the intersection 73 with the ultraviolet rays is irradiated after the rotation of the substrate W, the substrate W is bonded in a short time without deteriorating the outer and inner sealing materials 71 and 72. be able to.

  (4) The irradiation units 22a to 22d are arranged at a cylindrical lens 61 that collects the ultraviolet rays irradiated from the UVLED 52 into an ellipse having a long axis in the Y direction, and between the adjacent UVLEDs 52 and at both ends of the irradiation unit 22a. And a reflection plate 59 that is disposed on the end side of the UVLED 52 and reflects ultraviolet rays. For this reason, the ultraviolet rays collected in an elliptical shape by the cylindrical lens 61 are reflected by the reflecting plate 59 at both ends in the major axis direction to form a rectangular irradiation region. In this way, by illuminating the irradiation regions of the respective UVLEDs 52 along the longitudinal direction of the respective irradiation regions of the respective UVLEDs 52, the illuminance along the longitudinal direction of each irradiation region is made uniform. Illuminance can be increased. In addition, the reflection plate 59 reflects both ends of the irradiation region in the long axis direction so that light does not easily leak to the irradiation region of the adjacent UVLED 52, and the irradiation range of the irradiation units 22a to 22d can be accurately set by turning the UVLED 52 on and off. Can be controlled. Accordingly, it is possible to sufficiently prevent the outer and inner sealing materials 71 and 72 from being deteriorated without the overlapping portion 73 being irradiated with ultraviolet rays.

  (5) The irradiation units 22 a to 22 d include a casing 51 formed in a rectangular parallelepiped shape and a negative pressure source 64 that supplies a negative pressure into the casing 51. A plurality of rectangular irradiation holes 57 penetrating in the Z direction are formed in the lower portion 56 of the cover plate 54 constituting the housing 51, and each UVLED 52 is irradiated with a gap between the side surfaces of the irradiation holes 57. Arranged in the hole 57. Therefore, when negative pressure is supplied into the housing 51, external air flows into the housing 51 through the gap between the irradiation hole 57 and the UVLED 52. The generated UVLED 52 can be cooled.

(6) Since the substrate W is adsorbed by the alignment unit 36 and the floating stage 38 when the irradiation units 22a to 22d are irradiated with ultraviolet rays, it is possible to prevent the positional deviation of the substrate W.
(7) When the substrate W is moved on the stage 13, the alignment unit 36 adsorbs the substrate W and exhausts air from the adsorption hole of the levitation stage 38, so that the substrate W is levitated on the levitation stage 38. In this state, the alignment unit 36 moves to move the substrate W. Therefore, it can prevent that the board | substrate W contacts with the floating stage 38 and the holding stage 40, and is damaged.

  (8) The irradiation units 22a to 22d irradiate the outer sealing material 71 with ultraviolet rays before the inner sealing material 72 when irradiating the outer and inner sealing materials 71 and 72 parallel to the irradiation units 22a to 22d with ultraviolet rays. Therefore, it is possible to prevent the bonded substrates from being displaced by fixing the outer peripheral edge of the substrate W.

(Second Embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to the drawings. The main difference between this embodiment and the said 1st Embodiment is the structure of the optical element in each irradiation part. For this reason, for convenience of explanation, the same parts as those in the first embodiment are denoted by the same reference numerals, and the explanation thereof is omitted. In addition, since each irradiation part 22a-22d is the same structure, only the irradiation part 22a is demonstrated and the other irradiation parts 22b-22d are abbreviate | omitted for convenience of explanation.

  As shown in FIGS. 7A and 7B, the irradiation unit 22 a of the present embodiment includes a rectangular parallelepiped casing 81. The casing 81 is formed in a rectangular plate shape, and a base plate 82 fixed to the X-axis base 20 (see FIG. 1) via the attachment member 21, and a pair of side plates 83 formed in a rectangular plate shape. And caps 84 provided at both ends of the base plate 82 and the side plate 83. Each side plate 83 is fixed to both ends in the X direction at the lower end of the base plate 82. A plurality of irradiation units 91 are arranged between the side plates 83 along the Y direction.

  Specifically, each irradiation unit 91 includes a circuit board 92 disposed and fixed between a pair of side plates 83, and a plurality of mounting units mounted along the Y direction on the lower surface (surface on the side opposite to the Z direction) of the circuit board 92. (In the present embodiment, eight) UVLEDs (ultraviolet irradiation diodes) 93 are provided. In the present embodiment, the circuit board 92 has a conductor circuit formed on an aluminum plate excellent in thermal conductivity via a high thermal conductive insulating layer. Thereby, the heat of the UVLED 93 mounted on the circuit board 92 is efficiently radiated through the aluminum plate.

  The UV LEDs 93 arranged on the lower surface of the circuit board 92 along the Y direction are arranged so that the light emitted from the adjacent UV LEDs 93 overlaps in the Y direction. Each UVLED 93 is connected to the control unit 34 (see FIG. 2) and is turned on and off independently.

  A hemispherical lens 94 is arranged below each UVLED 93 so that the spherical surface is on the lower side. Below the hemispherical lens 94 disposed below each UVLED 93, a rod-shaped cylindrical lens 95 that covers the entire hemispherical lens 94 is disposed along the Y direction. In this embodiment, the cylindrical lens 95 is a biconvex cylindrical lens having a substantially elliptical shape in the axial direction, unlike the cylindrical lens 61 in the first embodiment, which is configured by a semiconvex cylindrical lens having a substantially semicircular shape in the axial direction. It is configured. Each hemispherical lens 94 and cylindrical lens 95 are held by a pair of holding portions 96 provided on the lower surface of the circuit board 92.

  Specifically, the holding portions 96 are disposed on both sides of each UVLED 93 arranged in the Y direction on the lower surface of the circuit board 92. The holding portions 96 disposed on both sides sandwich and fix the hemispherical lenses 94 so as to be positioned directly below the UVLED 93 and also sandwich and fix the cylindrical lenses 95. The cylindrical lens 95 sandwiched and fixed by the holding portion 96 is locked by a plurality of locking claws 97 so that the falling of the cylindrical lens 95 is prevented.

  Each hemispherical lens 94 is configured to suppress diffusion of light emitted from the UVLED 93. Note that the light emitted from the adjacent UVLEDs 93 overlaps in the Y direction even after the diffusion of each hemispherical lens 94 is suppressed. That is, the light emitted from each UVLED 93 is diffused after passing through each hemispherical lens 94.

  On the other hand, the cylindrical lens 95 disposed on the lower side of each hemispherical lens 94 converges the light emitted from each hemispherical lens 94 only in the X direction and collects it in an elliptical shape. Therefore, in this embodiment, each hemispherical lens 94 and the cylindrical lens 95 constitute an optical element.

  As shown in FIGS. 8A and 8B, the light emitted from each UVLED 93 is incident on each hemispherical lens 94 disposed immediately below, thereby suppressing the diffusion thereof. The light emitted from each hemispherical lens 94 enters the cylindrical lens 95, converges only in the X direction, and is collected in an elliptical shape. Accordingly, the ultraviolet irradiation region T irradiated from each UVLED 93 has a substantially elliptical shape having a long axis along the Y direction. And as mentioned above, the long-axis direction edge part Te of each irradiation area | region T overlaps, and the light on a line is irradiated from the irradiation part 22a. 8A and 8B, for convenience of explanation, the irradiation region of the ultraviolet light emitted from the first, third, and fifth UVLEDs 93 from the right is indicated by a broken line, and the second from the right. And the irradiation region of the ultraviolet rays irradiated from the fourth UVLED 52 is indicated by a two-dot chain line.

  And as shown in FIG. 9, the longitudinal direction edge part Te of the irradiation area | region T of adjacent UVLED93 overlaps, and linear light is irradiated from the irradiation part 22a. FIG. 9 is a simulation result showing the illuminance distribution of light in the case where there are two UVLEDs 93, and the illuminance of light is shown by the density of point hatching (higher as the illuminance is higher). Thus, the major axis direction end Te of the irradiation region T of each UVLED 52 overlaps to make the illuminance along the Y direction of the light on the line uniform. Then, the irradiation of the ultraviolet light onto the sealing material applied to the substrate W is performed in the same manner as in the first embodiment.

As described above, according to this embodiment, in addition to the effects (1) to (3) and (5) to (8) of the first embodiment, the following effects can be obtained.
(9) The substrate W is irradiated with the light emitted from the UVLED 93 via each hemispherical lens 94 and the cylindrical lens 95. Therefore, it is possible to reduce the light irradiated from the UVLED 93 from being irradiated to other members (for example, the side plate 83), and to make the light incident on the cylindrical lens 95 efficiently.

In addition, you may implement each said embodiment in the following aspects.
In each of the above embodiments, the gantry 16 is fixed to the outer wall 12 and the irradiation units 22a to 22d are individually moved in the X direction. However, the present invention is not limited thereto, and each irradiation unit is fixed to the gantry. The gantry may be moved along the X direction. For example, as shown in FIG. 10, a rail 103 is formed along the Y direction on the upper end surface 102 of the outer wall 101, and the gantry 105 a, 105 b provided with the irradiation parts 104 a, 104 b is moved along the rail 103. It may be. The irradiation units 104a and 104b are configured in the same manner as the irradiation unit 22a.

  In each of the above embodiments, the substrate W placed on the stage 13 is rotated by the alignment unit 36. However, the present invention is not limited to this, and the irradiation unit may be rotated. Specifically, as shown in FIG. 11, the gantry 111 is provided on the upper end surface 113 of the outer wall 112 so as to be movable on the rail 114 along the X direction along the Y direction. A protrusion 116 may be formed at the center, and the irradiation unit 117 may be rotated by a motor or the like provided on the protrusion 116. The irradiation unit 117 is configured in the same manner as the irradiation unit 22a.

  In each of the above embodiments, the stage 13 is moved in the Z direction. However, the present invention is not limited to this, and the width of the irradiated ultraviolet rays is adjusted by moving the irradiation units 22a to 22d in the Z direction. It may be.

  In each of the above embodiments, as shown in FIG. 5, each inner sealing material 72 is applied in the same shape, but not limited to this, as shown in FIG. 12, different shapes are formed on the inner side of the outer sealing material 121. The inner sealing materials 122 and 123 may be applied to the same substrate W. In this case, for example, as shown in FIGS. 13A and 13B, the irradiation unit 124 includes a plurality of divided units 125 each having a UVLED arranged in a line shorter than one side of the substrate W. The members 126 may be arranged along the Y direction, and each divided portion 125 may be rotated in a plane parallel to the upper surface of the base portion 11. Thereby, for example, after irradiating the left side portion and the right side portion of each inner sealing material 123, by rotating the dividing portion 125, the upper side portion and the lower side portion of the inner sealing material 123 are irradiated together. Can do. Therefore, it is possible to improve the efficiency of the bonding process of the substrate W to which a plurality of patterns having different sizes are applied.

  Further, as shown in FIG. 14, a right angle part 131 having UVLEDs arranged in a line may be provided so as to be orthogonal to the irradiation part 22 d. Thereby, for example, when irradiating the left side portion of the inner sealing material 123 parallel to the irradiation portion 22d, the upper side portion and the lower side portion of the inner sealing material 123 can be irradiated simultaneously by the right angle portion 131. Therefore, it is possible to improve the efficiency of the bonding process of the substrate W to which a plurality of patterns having different sizes are applied.

  In each of the above embodiments, the UVLEDs 52 and 93 that irradiate the intersection 73 with ultraviolet rays are turned off after the substrate W is relatively rotated. However, the present invention is not limited thereto, and the UVLEDs 52 and 93 are turned off before the relative rotation. Also good.

  In the first embodiment, the reflecting plate 59 is disposed in the middle of the adjacent UVLEDs 52. However, the present invention is not limited to this, and the reflecting plate 59 is not disposed and both end portions in the major axis direction of the irradiation regions of the respective UVLEDs 52 are adjacent to each other. You may make it overlap with the irradiation area. By doing in this way, the dispersion | variation in the illumination intensity along the Y direction of the linear ultraviolet rays irradiated from irradiation part 22a-22d can be reduced by reducing the dispersion | variation in the illumination intensity along the major axis direction of an ellipse. . Accordingly, the outer and inner sealing materials 71 and 72 can be uniformly cured, and partial deterioration of the outer and inner sealing materials 71 and 72 can be prevented. Moreover, in the said 2nd Embodiment, you may make it arrange | position a reflecting plate in the middle of adjacent UVLED93.

  In each of the above-described embodiments, the outer sealing material 71 parallel to the irradiation units 22a to 22d is irradiated with ultraviolet rays, the substrate W is rotated by 90 degrees, and ultraviolet rays are irradiated on portions of the outer sealing material 71 that are orthogonal to the already irradiated portions. The inner sealing material 72 may be irradiated after the irradiation, or the outer and inner sealing materials 71 and 72 may be irradiated in other orders.

  In each of the embodiments described above, the substrate W is rotated by rotating the alignment unit 36 in a state where the air is exhausted from the levitation stage 38 and the substrate W is adsorbed by the alignment unit 36. Not limited to this, the stage 13 may be configured in any way as long as the substrate W can be rotated.

  -In above-mentioned 1st Embodiment, irradiation part 22a-22d was provided with the housing | casing 51 formed in the rectangular parallelepiped shape, and the negative pressure source 64 which supplies a negative pressure in this housing | casing 51, However, it is not restricted to this Alternatively, the negative pressure may not be supplied into the housing 51. In the second embodiment, a negative pressure may be supplied into the housing 81.

In the second embodiment, each irradiation unit 91 is provided in the housing 81. However, the present invention is not limited to this. For example, each irradiation unit 91 may be directly fixed to the X-axis base 20.
In the first embodiment, a single convex cylindrical lens is used as the cylindrical lens 61. However, the present invention is not limited to this, and a biconvex cylindrical lens may be used. In the second embodiment, a single convex cylindrical lens may be used as the cylindrical lens 95.

  In the first embodiment, the optical element is configured by the cylindrical lens 61. However, the present invention is not limited to this, and the optical element may be configured by the hemispherical lens and the cylindrical lens 61. Similarly, in the second embodiment, the optical element may be configured with only the cylindrical lens 95.

  In each of the above embodiments, the cylindrical lenses 61 and 95 are used as optical elements for converging the ultraviolet rays emitted from the UVLED 52 in a substantially elliptical shape. However, the present invention is not limited to this, and for example, a rod lens may be used. Moreover, a parabolic mirror can be arrange | positioned in irradiation part 22a-22d, and the condensing efficiency can also be improved by making the irradiation angle of an ultraviolet-ray closer to the parallel light ray which is a infinity light source.

In each of the above embodiments, the outer sealing material 71 is applied to the outer peripheral edge of the substrate W. However, the invention is not limited thereto, and only the inner sealing material 72 may be applied between the substrates W.
In each of the above embodiments, the substrate W is rotated around the rotation axis L and the outer and inner sealing materials 71 and 72 are irradiated with ultraviolet rays. However, the present invention is not limited to this, and the irradiation units 22a to 22d are moved in the X-axis direction. The semiconductor element (LED) may be turned on and off in accordance with the pattern of the outer and inner sealing materials 71 and 72 for irradiation.

  In each of the above embodiments, the outer and inner sealing materials 71 and 72 are irradiated with ultraviolet rays. However, the present invention is not limited to this. If the sealing material is cured, light other than ultraviolet rays may be irradiated.

Next, technical ideas that can be grasped from this embodiment and other examples will be described below together with their effects.
(A) The irradiation unit includes a plurality of divided units in which the semiconductor elements are arranged in a line shorter than the bonded substrate, and the divided substrate is placed on the divided unit. The light irradiation apparatus according to claim 1, wherein the light irradiation apparatus is provided so as to be rotatable in a plane parallel to a flat surface. According to this configuration, when two patterns of sealing materials having different sizes are applied to one substrate, the sealing material applied in parallel with the irradiation portion of one pattern is irradiated, and the divided portion is rotated. Thus, it is possible to irradiate several of the portions orthogonal to the already irradiated portions in the sealing material. For this reason, it is possible to improve the efficiency of the bonding process of the substrates to which a plurality of patterns having different sizes are applied.

  (B) A right angle portion having the semiconductor elements arranged in a line is provided, and the right angle portion is orthogonal to the irradiation portion in a plane parallel to a plane on which the bonded substrate is placed. The light irradiation apparatus according to claim 1, wherein the light irradiation apparatus is provided. According to this configuration, when the sealing material applied in parallel to the irradiation unit is irradiated by the right-angled part, the sealing material applied orthogonal to the irradiation unit can be irradiated simultaneously. Therefore, for example, when two patterns of sealing materials having different sizes are applied to one substrate, when irradiating a portion parallel to the irradiation portion of one sealing material, the irradiation portion of the sealing material is orthogonal to the irradiation portion. It becomes possible to irradiate a part simultaneously, and it is possible to improve the efficiency of the bonding process of a substrate coated with a plurality of patterns having different sizes.

  (C) The sealing material is composed of an outer sealing material interposed at an outer peripheral edge of the bonded substrate and an inner sealing material interposed inside the outer sealing material, and the control unit is configured to be the irradiation unit. The light is applied to the outer sealing material prior to the inner sealing material, and the light is applied to the outer sealing material according to any one of (1) and (b) above. Light irradiation device. According to this configuration, the outer peripheral edge of the substrate is fixed by irradiating the outer sealing material first, and the bonded substrates can be prevented from shifting.

The perspective view of an ultraviolet irradiation device. Sectional drawing of an ultraviolet irradiation device. (A) The partially broken view which shows the lower surface of the irradiation part of 1st Embodiment, (b) The schematic cross section which shows the structure of the optical element of the irradiation part in 1st Embodiment. (A), (b) The schematic diagram which shows the irradiation area | region of the ultraviolet-ray irradiated from the irradiation part of 1st Embodiment. (A)-(c) Operation | movement explanatory drawing which shows the irradiation procedure with respect to the board | substrate before rotating. (A), (b) Operation | movement explanatory drawing which shows the irradiation procedure with respect to the board | substrate after rotating. (A) The bottom view of the irradiation part of 2nd Embodiment, (b) The schematic cross section which shows the structure of the optical element of the irradiation part in 2nd Embodiment. (A), (b) The schematic diagram which shows the irradiation area | region of the ultraviolet-ray irradiated from the irradiation part of 2nd Embodiment. Explanatory drawing which shows the illumination intensity distribution of the irradiation part of 2nd Embodiment in the case of two UVLED. The perspective view of another ultraviolet irradiation device. The perspective view of another ultraviolet irradiation device. The top view which shows the application pattern of another sealing material. (A), (b) The perspective view which shows another irradiation part. The perspective view which shows another irradiation part.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Ultraviolet irradiation apparatus, 13 ... Stage, 19 ... X-axis actuator, 22a-22d, 104a, 104b, 117, 124 ... Irradiation part, 34 ... Control part, 35 ... Substrate moving mechanism, 51 ... Housing, 52, 93 ... UVLED, 56 ... lower part, 57 ... irradiation hole, 59 ... reflecting plate, 61,95 ... cylindrical lens, 64 ... negative pressure source, 71,121 ... outer sealing material, 72,122,123 ... inner sealing material, 73 ... Crossing part, 94 ... hemispherical lens, 125 ... dividing part, 131 ... right angle part, W ... substrate.

Claims (7)

A light irradiation device for irradiating light to a linear sealing material made of a photocurable resin interposed between bonded substrates,
A stage on which the bonded substrate is placed;
A plurality of semiconductor elements that can irradiate the light and can be individually turned on / off are arranged in a line, and an irradiation unit that irradiates the bonded substrate with linear light according to the width of the sealing material;
A first driving unit that moves the irradiation unit in a direction intersecting a direction in which the semiconductor elements are arranged in a plane parallel to a plane on which the bonded substrate is placed;
A control unit for turning each semiconductor element on and off according to the pattern of the sealing material;
A light irradiation apparatus comprising:   The second drive unit that rotates any one of the irradiation unit and the bonded substrate in a plane parallel to a plane on which the bonded substrate is placed is provided. The light irradiation apparatus according to 1.   The control unit irradiates the light to the intersection between the irradiated portion of the sealing material before the relative rotation of the bonded substrate and the irradiated portion and the irradiated portion of the sealing material after the relative rotation. The light irradiation apparatus according to claim 2, wherein the semiconductor element is turned off either before or after relative rotation. An optical element for condensing light emitted from the semiconductor element into an ellipse having a major axis in a direction in which the semiconductor elements are arranged;
Each said semiconductor element is arranged so that the light irradiated from the said adjacent semiconductor element and condensed by the ellipse may overlap in a major axis direction. The light irradiation apparatus as described in.   The light irradiation apparatus according to claim 4, wherein a reflector that reflects the light is disposed between the adjacent semiconductor elements.   The optical element includes a hemispherical lens for suppressing the diffusion of light emitted from the semiconductor element, and the light emitted from the hemispherical lens is collected in an ellipse having a major axis in the direction in which the semiconductor elements are arranged. 6. The light irradiation apparatus according to claim 4, comprising a cylindrical lens that emits light. The irradiation unit is
A housing in which an irradiation hole in which the semiconductor element is provided is formed at the bottom;
A negative pressure source for supplying a negative pressure into the housing,
In each of the irradiation holes, the semiconductor element is provided with a gap between the irradiation holes and the side surfaces thereof.
2. An optical element for condensing light emitted from the semiconductor element into an ellipse having a major axis in a direction in which the semiconductor elements are arranged is provided below the irradiation hole. The light irradiation apparatus as described in any one of -6.

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