JP5179282B2 - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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JP5179282B2
JP5179282B2 JP2008194789A JP2008194789A JP5179282B2 JP 5179282 B2 JP5179282 B2 JP 5179282B2 JP 2008194789 A JP2008194789 A JP 2008194789A JP 2008194789 A JP2008194789 A JP 2008194789A JP 5179282 B2 JP5179282 B2 JP 5179282B2
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water
organic solvent
processing
substrate
tank
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JP2009099943A (en
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雅洋 基村
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Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Priority to JP2008194789A priority Critical patent/JP5179282B2/en
Priority to US12/209,598 priority patent/US20090087566A1/en
Priority to TW097135432A priority patent/TWI402902B/en
Priority to CN2008102152361A priority patent/CN101399183B/en
Priority to KR1020080093560A priority patent/KR101025688B1/en
Priority to US12/340,235 priority patent/US8640359B2/en
Priority to US12/410,049 priority patent/US8216417B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Description

本発明は、半導体ウエハや液晶表示装置のガラス基板(以下、単に基板と称する)に対して処理液により処理を行う基板処理装置及び基板処理方法に関する。   The present invention relates to a substrate processing apparatus and a substrate processing method for processing a semiconductor wafer or a glass substrate of a liquid crystal display device (hereinafter simply referred to as a substrate) with a processing liquid.

従来、この種の装置として、複数の処理槽と、各処理槽にわたった基板を搬送する搬送機構とを備え、各処理槽において異なる処理液で順次に処理を行う装置がある(例えば、特許文献1参照)。このような装置では、例えば、第1の処理槽においてBHF(バッファードフッ化水素酸)によって表面を軽くエッチングし、第2の処理槽において純水で洗浄し、第3の処理槽においてIPA(イソプロピルアルコール)で純水を置換させ、第4の処理槽において溶剤蒸気雰囲気を形成して基板を乾燥させるように順次に基板を移動させつつ一連の処理を行う。
特開平10−22257号公報(図11)
Conventionally, as this type of apparatus, there is an apparatus that includes a plurality of processing tanks and a transport mechanism that transports a substrate across each processing tank, and sequentially processes with different processing liquids in each processing tank (for example, patents) Reference 1). In such an apparatus, for example, the surface is lightly etched with BHF (buffered hydrofluoric acid) in the first treatment tank, washed with pure water in the second treatment tank, and IPA ( Pure water is replaced with isopropyl alcohol), and a series of processing is performed while moving the substrate sequentially so as to form a solvent vapor atmosphere in the fourth treatment tank and dry the substrate.
Japanese Patent Laid-Open No. 10-22257 (FIG. 11)

しかしながら、このような構成を有する従来例の場合には、次のような問題がある。
すなわち、従来の装置は、基板に微細パターンが形成されている場合、その間に残った純水の表面張力に起因して、基板を処理槽間で移動させる際に、基板に形成されている微細パターンに倒壊が生じることがあるという問題がある。
However, the conventional example having such a configuration has the following problems.
That is, when a fine pattern is formed on a substrate, the conventional apparatus has a fine pattern formed on the substrate when the substrate is moved between the processing tanks due to the surface tension of pure water remaining between them. There is a problem that the pattern may collapse.

本発明は、このような事情に鑑みてなされたものであって、純水の除去率を向上させることにより、基板に形成された微細パターンの倒壊を防止することができる基板処理装置及び基板処理方法を提供することを目的とする。   The present invention has been made in view of such circumstances, and a substrate processing apparatus and a substrate processing capable of preventing the collapse of a fine pattern formed on a substrate by improving the removal rate of pure water. It aims to provide a method.

本発明は、このような目的を達成するために次のような構成をとる。
すなわち、請求項1に記載の発明は、基板を処理液で処理する基板処理装置において、処理液を貯留する内槽と、内槽から溢れた処理液を回収する外槽とを備えた処理槽と、基板を保持し、前記処理槽内の処理位置と、前記処理槽の上方にあたる上方位置とにわたって移動可能な保持機構と、内槽と前記外槽とを連通接続し、処理液を循環させる供給配管と、前記供給配管を分流した第1の分岐配管と、前記供給配管を分流した第2の分岐配管と、前記供給配管を分流した第3の分岐配管と、前記第1の分岐配管に配設され、処理液を所定の温度に冷却する冷却ユニットと、前記第2の分岐配管に配設され、処理液中の純水と溶剤とを分離して処理液から純水を排出する油水分離フィルタと、前記第3の分岐配管に配設され、処理液中の純水を吸着して除去するための吸着フィルタと、前記供給配管に配設され、前記油水分離フィルタより下流側にて純水を注入する注入管と、前記注入管に水溶性有機溶剤を注入する水溶性有機溶剤注入手段と、前記注入管に非水溶性有機溶剤を注入する非水溶性有機溶剤注入手段と、前記保持機構により基板を処理位置に移動させた状態で、前記処理槽内に前記注入管及び前記供給配管から純水を供給して処理槽内の基板を純水で洗浄する純水洗浄処理を行わせ、前記水溶性有機溶剤注入手段から前記注入管及び前記供給配管を介して前記処理槽に水溶性有機溶剤を供給して純水を水溶性有機溶剤で置換する処理を行わせ、前記第1の分岐配管に流路を切り換えるとともに、前記冷却ユニットによって処理液を所定の温度に冷却する処理を行わせ、前記第2の分岐配管に流路を切り換えるとともに、前記油水分離フィルタによって処理液中の純水と溶剤とを分離して処理液から純水を排出する処理を行わせ、前記第3の分岐配管に流路を切り換えるとともに、前記吸着フィルタによって処理液中の純水を吸着して除去する処理を行わせ、前記非水溶性有機溶剤注入手段から前記注入管及び前記供給配管を介して前記処理槽に非水溶性有機溶剤を供給するとともに、前記水溶性有機溶剤注入手段から前記注入管及び前記供給配管を介して前記処理槽に水溶性有機溶剤を供給して基板に対して水溶性有機溶剤と非水溶性有機溶剤との混合液による処理を行わせた後、前記保持機構を上方位置に移動させる制御手段と、を備えていることを特徴とするものである。
The present invention has the following configuration in order to achieve such an object.
That is, the invention described in claim 1 is a substrate processing apparatus for processing a substrate with a processing liquid, a processing tank comprising an inner tank for storing the processing liquid and an outer tank for recovering the processing liquid overflowing from the inner tank. A holding mechanism that holds the substrate, is movable between a processing position in the processing tank and an upper position that is above the processing tank, and connects the inner tank and the outer tank to circulate the processing liquid. A supply pipe, a first branch pipe that divides the supply pipe, a second branch pipe that divides the supply pipe, a third branch pipe that divides the supply pipe, and the first branch pipe A cooling unit that is disposed and that cools the processing liquid to a predetermined temperature and an oil water that is disposed in the second branch pipe and separates the pure water and the solvent in the processing liquid and discharges the pure water from the processing liquid. A separation filter and pure water in the treatment liquid disposed in the third branch pipe An adsorption filter for adsorbing and removing, an injection pipe that is arranged in the supply pipe and injects pure water downstream from the oil-water separation filter, and a water-soluble that injects a water-soluble organic solvent into the injection pipe Organic solvent injection means, water-insoluble organic solvent injection means for injecting a water-insoluble organic solvent into the injection pipe, and the injection pipe in the processing tank in a state where the substrate is moved to the processing position by the holding mechanism And a pure water cleaning process for supplying pure water from the supply pipe to clean the substrate in the processing tank with pure water, and the process from the water-soluble organic solvent injection means through the injection pipe and the supply pipe. A water-soluble organic solvent is supplied to the tank so that pure water is replaced with the water-soluble organic solvent, the flow path is switched to the first branch pipe, and the processing liquid is cooled to a predetermined temperature by the cooling unit. Let the process to do The flow path is switched to the second branch pipe, the pure water and the solvent in the processing liquid are separated by the oil / water separation filter, and the process of discharging the pure water from the processing liquid is performed, and the third branch pipe The processing tank is switched from the non-water-soluble organic solvent injection means through the injection pipe and the supply pipe, and the process is performed by switching the flow path and adsorbing and removing pure water in the processing liquid by the adsorption filter. A non-water-soluble organic solvent is supplied to the substrate, and the water-soluble organic solvent is supplied from the water-soluble organic solvent injection means to the treatment tank via the injection pipe and the supply pipe. And a control unit that moves the holding mechanism to an upper position after performing the treatment with the mixed solution with the water-insoluble organic solvent .

[作用・効果]請求項1に記載の発明によれば、制御手段は、保持機構により基板を処理位置に移動させた状態で、処理槽内の基板を純水で洗浄する純水洗浄処理を行わせ、水溶性有機溶剤注入手段から注入管及び供給配管を介して処理槽に水溶性有機溶剤を供給して純水を水溶性有機溶剤で置換する処理を行わせる。これにより、基板に付着している純水を水溶性有機溶剤で置換させることができるが、基板に微細パターンが形成されている場合には、その奥に入り込んだ純水までも完全に置換するには至らない。その後、第1の分岐配管に流路を切り換えるとともに、冷却フィルタによって処理液を所定の温度に冷却する処理を行わせ、その後、第2の分岐配管に流路を切り換えるとともに、油水分離フィルタによって処理液中の純水と溶剤とを分離して処理液から純水を排出する処理を行わせ、その後、第3の分岐配管に流路を切り換えるとともに、吸着フィルタによって処理液中の純水を除去する処理を行わせ、非水溶性有機溶剤注入手段から注入管及び供給配管を介して処理槽に非水溶性有機溶剤を供給するとともに、水溶性有機溶剤注入手段から注入管及び供給配管を介して処理槽に水溶性有機溶剤を供給して処理を行わせた後、保持機構を上方位置に移動させる。混合液による処理では、基板の微細パターンの奥に入り込んだ純水を少量の水溶性有機溶剤で引き出すことができるので、基板の微細パターン中に純水が残留するのを防止することができる。その結果、基板に形成されている微細パターンの倒壊を防止することができる。 [Operation / Effect] According to the invention described in claim 1, the control means performs a pure water cleaning process in which the substrate in the processing tank is cleaned with pure water while the substrate is moved to the processing position by the holding mechanism. The water-soluble organic solvent is supplied from the water-soluble organic solvent injection means to the treatment tank through the injection pipe and the supply pipe, and the pure water is replaced with the water-soluble organic solvent. As a result, the pure water adhering to the substrate can be replaced with a water-soluble organic solvent. However, when a fine pattern is formed on the substrate, the pure water that has entered deeply into the substrate is also completely replaced. It does not lead to. Thereafter, the flow path is switched to the first branch pipe, and the processing liquid is cooled to a predetermined temperature by the cooling filter, and then the flow path is switched to the second branch pipe and processed by the oil / water separation filter. The pure water and the solvent in the liquid are separated and the pure water is discharged from the processing liquid. After that, the flow path is switched to the third branch pipe and the pure water in the processing liquid is removed by the adsorption filter. The water-insoluble organic solvent is supplied from the water-insoluble organic solvent injection means to the treatment tank via the injection pipe and the supply pipe, and the water-soluble organic solvent injection means is supplied from the water-soluble organic solvent injection means via the injection pipe and the supply pipe. After supplying the water-soluble organic solvent to the treatment tank and performing the treatment, the holding mechanism is moved to the upper position. In the treatment with the mixed solution, pure water that has entered the depth of the fine pattern on the substrate can be drawn out with a small amount of a water-soluble organic solvent, so that the pure water can be prevented from remaining in the fine pattern on the substrate. As a result, collapse of the fine pattern formed on the substrate can be prevented.

本発明において、前記制御手段は、前記水溶性有機溶剤と非水溶性有機溶剤との混合液による処理を、前記非水溶性有機溶剤注入手段から前記注入管及び前記供給配管を介して前記処理槽へ非水溶性有機溶剤を供給して行わせる処理と、前記水溶性有機溶剤注入手段から前記注入管及び前記供給配管を介して前記処理槽に水溶性有機溶剤を供給して基板に対して水溶性有機溶剤及び非水溶性有機溶剤の混合液による処理とするのが好ましい(請求項2)。まず、非水溶性有機溶剤を供給させて、水溶性有機溶剤から非水溶性有機溶剤に置換させた後、水溶性有機溶剤を供給させて、水溶性有機溶剤と非水溶性有機溶剤の混合液による処理を行う二段階の処理としても、純水を水溶性有機溶剤で引き出すことができる。 In the present invention, the control means performs the treatment with the mixed solution of the water-soluble organic solvent and the water-insoluble organic solvent from the water-insoluble organic solvent injection means through the injection pipe and the supply pipe. A process of supplying a water-insoluble organic solvent to the substrate and supplying the water-soluble organic solvent from the water-soluble organic solvent injection means to the processing tank via the injection pipe and the supply pipe to make the substrate water-soluble. The treatment with a mixed solution of a water-soluble organic solvent and a water-insoluble organic solvent is preferred (claim 2). First, after supplying a water-insoluble organic solvent, replacing the water-soluble organic solvent with a water-insoluble organic solvent, and then supplying the water-soluble organic solvent, a mixture of the water-soluble organic solvent and the water-insoluble organic solvent As a two-stage process in which the process is performed, pure water can be extracted with a water-soluble organic solvent.

本発明において、前記処理槽を囲うチャンバと、前記チャンバ内に溶剤蒸気を供給する溶剤蒸気供給手段とを備え、前記制御手段は、前記混合液による処理の後、前記保持機構を上方位置へ移動させる前に、前記溶剤蒸気供給手段から溶剤蒸気を供給して前記チャンバ内に溶剤蒸気雰囲気を形成することが好ましい(請求項3)。チャンバ内に溶剤蒸気雰囲気を形成させた後、保持機構を上方位置へ移動させることにより、基板を溶剤蒸気によって乾燥させることができる。 In the present invention, a chamber surrounding the treatment tank and a solvent vapor supply means for supplying a solvent vapor into the chamber are provided, and the control means moves the holding mechanism to an upper position after the treatment with the mixed solution. It is preferable to supply a solvent vapor from the solvent vapor supply means to form a solvent vapor atmosphere in the chamber before the process is performed. After the solvent vapor atmosphere is formed in the chamber, the substrate can be dried by the solvent vapor by moving the holding mechanism to the upper position.

本発明において、前記水溶性有機溶剤供給手段は、水溶性有機溶剤としてIPA(イソプロピルアルコール)を供給し、前記非水溶性有機溶剤供給手段は、非水溶性有機溶剤としてHFE(ハイドロフルオロエーテル)を供給することを特徴とすることが好ましい(請求項4)。IPAは純水を置換するのに優れ、HFEは不燃性であり、IPAよりも表面張力が小さいので、基板を引き上げる際に微細パターンにダメージが生じにくい。 In the present invention, the water-soluble organic solvent supply means supplies IPA (isopropyl alcohol) as a water-soluble organic solvent, and the water-insoluble organic solvent supply means uses HFE (hydrofluoroether) as a water-insoluble organic solvent. It is preferable to supply (claim 4). IPA is excellent in substituting pure water, HFE is nonflammable, and has a lower surface tension than IPA, so that the fine pattern is less likely to be damaged when the substrate is pulled up.

本発明において、前記混合液におけるIPA(イソプロピルアルコール)は、10%以下であることを特徴とすることが好ましい(請求項5)。10%程度の少量のIPAを加えることにより、微細パターン中の純水を引き出すことができる。   In the present invention, IPA (isopropyl alcohol) in the mixed solution is preferably 10% or less (Claim 5). By adding a small amount of IPA of about 10%, pure water in the fine pattern can be extracted.

また、請求項6に記載の発明は、基板を処理液で処理する基板処理方法において、基板を処理槽内の処理位置に移動させる過程と、処理槽内に純水を供給させて、内槽と外槽とに純水を循環させつつ処理槽内の基板を純水で洗浄する過程と、処理槽に水溶性有機溶剤を供給させて、内槽と外槽とに水溶性有機溶剤を循環させつつ純水を水溶性有機溶剤で置換する過程と、冷却ユニットによって処理液を冷却する過程と、油水分離フィルタによって処理液中の純水と溶剤とを分離して処理液から純水を排出する過程と、吸着フィルタによって処理液の純水を吸着除去する過程と、処理槽に非水溶性有機溶剤を供給するとともに、処理槽に水溶性有機溶剤を供給して、内槽と外槽とに非水溶性有機溶剤及び水溶性有機溶剤を循環させつつ基板に対して水溶性有機溶剤と非水溶性有機溶剤との混合液による処理を行わせる過程と、基板を処理槽の上方にあたる上方位置に移動させる過程と、を備えていることを特徴とするものである。 According to a sixth aspect of the present invention, there is provided a substrate processing method for processing a substrate with a processing liquid, a process of moving a substrate to a processing position in a processing tank, and supplying pure water into the processing tank. The process of cleaning the substrate in the treatment tank with pure water while circulating pure water between the outer tank and the outer tank, supplying the water-soluble organic solvent to the treatment tank, and circulating the water-soluble organic solvent between the inner tank and the outer tank The process of replacing pure water with a water-soluble organic solvent while cooling, the process of cooling the treatment liquid by the cooling unit, and separating the pure water and the solvent in the treatment liquid by the oil / water separation filter and discharging the pure water from the treatment liquid A process of adsorbing and removing pure water of the treatment liquid by an adsorption filter, supplying a water-insoluble organic solvent to the treatment tank, and supplying a water-soluble organic solvent to the treatment tank, Circulate the water-insoluble organic solvent and water-soluble organic solvent to the substrate. And is characterized in that it comprises a step of causing the processing by the mixture of water-soluble organic solvent and water-insoluble organic solvent, a process of moving the substrate upward corresponding to a position above the processing tank, the Te .

[作用・効果]請求項6に記載の発明によれば、基板を処理槽内の処理位置に移動させ、処理槽へ純水を供給させて基板に対して純水洗浄処理を行わせた後、処理槽内を純水から水溶性有機溶剤に置換して基板に対して水溶性有機溶剤による処理を行わせる。これにより、基板に付着している純水を水溶性有機溶剤で置換させることができるが、基板に微細パターンが形成されている場合には、その奥に入り込んだ純水までも完全に置換するには至らない。その後、第1の分岐配管に流路を切り換えるとともに、冷却フィルタによって処理液を所定の温度に冷却する処理を行わせ、その後、第2の分岐配管に流路を切り換えるとともに、油水分離フィルタによって処理液中の純水と溶剤とを分離して処理液から純水を排出する処理を行わせ、その後、第3の分岐配管に流路を切り換えるとともに、吸着フィルタによって処理液中の純水を除去する処理を行わせ、非水溶性有機溶剤注入手段から注入管及び供給配管を介して処理槽に非水溶性有機溶剤を供給するとともに、水溶性有機溶剤注入手段から注入管及び供給配管を介して処理槽に水溶性有機溶剤を供給して処理を行わせた後、保持機構を上方位置に移動させる。混合液による処理では、基板の微細パターンの奥に入り込んだ純水を水溶性有機溶剤で引き出すことができるので、基板の微細パターン中に純水が残留するのを防止することができる。その結果、基板に形成されている微細パターンの倒壊を防止することができる。 [Operation / Effect] According to the invention described in claim 6, after the substrate is moved to the processing position in the processing tank and pure water is supplied to the processing tank to perform the pure water cleaning process on the substrate. Then, the inside of the treatment tank is replaced with pure water to a water-soluble organic solvent, and the substrate is treated with the water-soluble organic solvent. As a result, the pure water adhering to the substrate can be replaced with a water-soluble organic solvent. However, when a fine pattern is formed on the substrate, the pure water that has entered deeply into the substrate is also completely replaced. It does not lead to. Thereafter, the flow path is switched to the first branch pipe, and the processing liquid is cooled to a predetermined temperature by the cooling filter, and then the flow path is switched to the second branch pipe and processed by the oil / water separation filter. The pure water and the solvent in the liquid are separated and the pure water is discharged from the processing liquid. After that, the flow path is switched to the third branch pipe and the pure water in the processing liquid is removed by the adsorption filter. The water-insoluble organic solvent is supplied from the water-insoluble organic solvent injection means to the treatment tank via the injection pipe and the supply pipe, and the water-soluble organic solvent injection means is supplied from the water-soluble organic solvent injection means via the injection pipe and the supply pipe. After supplying the water-soluble organic solvent to the treatment tank and performing the treatment, the holding mechanism is moved to the upper position. In the treatment with the mixed solution, pure water that has entered the depth of the fine pattern on the substrate can be drawn out with a water-soluble organic solvent, so that the pure water can be prevented from remaining in the fine pattern on the substrate. As a result, collapse of the fine pattern formed on the substrate can be prevented.

本発明において、前記水溶性有機溶剤と非水溶性有機溶剤との混合液による処理を行わせる過程を、処理槽へ非水溶性有機溶剤を供給させて、内槽と外槽とに非水溶性有機溶剤を循環させつつ処理槽内を水溶性有機溶剤から非水溶性有機溶剤に置換して基板に対して非水溶性有機溶剤による処理を行わせる過程と、処理槽へ水溶性有機溶剤を供給させて、内槽と外槽とに水溶性有機溶剤及び非水溶性有機溶剤を循環させつつ基板に対して水溶性有機溶剤及び非水溶性有機溶剤の混合液による処理を行わせる過程とするのが好ましい(請求項7)。処理槽内を水溶性有機溶剤から非水溶性有機溶剤に置換して基板に対して非水溶性有機溶剤による処理を行わせ、続いて、水溶性有機溶剤及び非水溶性有機溶剤の混合液による処理を行う二段階の処理としても、純水を水溶性有機溶剤で引き出すことができる。 In the present invention, the process of performing the treatment with the mixed solution of the water-soluble organic solvent and the water-insoluble organic solvent, the water-insoluble organic solvent is supplied to the treatment tank, and the water is insoluble in the inner tank and the outer tank. Replace the inside of the treatment tank from a water-soluble organic solvent to a water-insoluble organic solvent while circulating the organic solvent, and supply the water-soluble organic solvent to the treatment tank. In this process, the substrate is treated with a mixture of the water-soluble organic solvent and the water-insoluble organic solvent while circulating the water-soluble organic solvent and the water-insoluble organic solvent between the inner tank and the outer tank . (Claim 7). The inside of the treatment tank is replaced with a water-insoluble organic solvent from a water-soluble organic solvent, and the substrate is treated with the water-insoluble organic solvent. Pure water can be extracted with a water-soluble organic solvent as a two-stage treatment.

本発明に係る基板処理装置によれば、制御手段は、保持機構により基板を処理位置に移動させた状態で、処理槽内の基板を純水で洗浄する純水洗浄処理を行わせ、水溶性有機溶剤注入手段から注入管及び供給配管を介して処理槽に水溶性有機溶剤を供給して純水を水溶性有機溶剤で置換する処理を行わせる。これにより、基板に付着している純水を水溶性有機溶剤で置換させることができるが、基板に微細パターンが形成されている場合には、その奥に入り込んだ純水までも完全に置換するには至らない。その後、第1の分岐配管に流路を切り換えるとともに、冷却フィルタによって処理液を所定の温度に冷却する処理を行わせ、その後、第2の分岐配管に流路を切り換えるとともに、油水分離フィルタによって処理液中の純水と溶剤とを分離して処理液から純水を排出する処理を行わせ、その後、第3の分岐配管に流路を切り換えるとともに、吸着フィルタによって処理液中の純水を除去する処理を行わせ、非水溶性有機溶剤注入手段から注入管及び供給配管を介して処理槽に非水溶性有機溶剤を供給するとともに、水溶性有機溶剤注入手段から注入管及び供給配管を介して処理槽に水溶性有機溶剤を供給して処理を行わせた後、保持機構を上方位置に移動させる。混合液による処理では、基板の微細パターンの奥に入り込んだ純水を少量の水溶性有機溶剤で引き出すことができるので、基板の微細パターン中に純水が残留するのを防止することができる。その結果、基板に形成されている微細パターンの倒壊を防止することができる。 According to the substrate processing apparatus of the present invention, the control means performs a pure water cleaning process for cleaning the substrate in the processing tank with pure water in a state where the substrate is moved to the processing position by the holding mechanism , and is water-soluble. The water-soluble organic solvent is supplied from the organic solvent injection means to the treatment tank via the injection pipe and the supply pipe, and the pure water is replaced with the water-soluble organic solvent. As a result, the pure water adhering to the substrate can be replaced with a water-soluble organic solvent. However, when a fine pattern is formed on the substrate, the pure water that has entered deeply into the substrate is also completely replaced. It does not lead to. Thereafter, the flow path is switched to the first branch pipe, and the processing liquid is cooled to a predetermined temperature by the cooling filter, and then the flow path is switched to the second branch pipe and processed by the oil / water separation filter. The pure water and the solvent in the liquid are separated and the pure water is discharged from the processing liquid. After that, the flow path is switched to the third branch pipe and the pure water in the processing liquid is removed by the adsorption filter. The water-insoluble organic solvent is supplied from the water-insoluble organic solvent injection means to the treatment tank via the injection pipe and the supply pipe, and the water-soluble organic solvent injection means is supplied from the water-soluble organic solvent injection means via the injection pipe and the supply pipe. After supplying the water-soluble organic solvent to the treatment tank and performing the treatment, the holding mechanism is moved to the upper position. In the treatment with the mixed solution, pure water that has entered the depth of the fine pattern on the substrate can be drawn out with a small amount of a water-soluble organic solvent, so that the pure water can be prevented from remaining in the fine pattern on the substrate. As a result, collapse of the fine pattern formed on the substrate can be prevented.

以下、図面を参照して本発明の一実施例を説明する。
図1は、実施例に係る基板処理装置の概略構成を示すブロック図である。
An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a block diagram illustrating a schematic configuration of a substrate processing apparatus according to an embodiment.

本実施例に係る基板処理装置は処理槽1を備え、この処理槽1は内槽3と外槽5とを備えている。内槽3は、処理液を貯留し、リフタ7によって保持された基板Wを収容可能である。リフタ7は、板状のアームの下部に、基板Wの下縁に当接して基板Wを起立姿勢で支持する支持部材を備えている。このリフタ7は、内槽3の内部にあたる「処理位置」と、内槽3の上方にあたる「上方位置」とにわたって昇降可能である。内槽3は、純水や溶剤またはこれらの混合液等を処理液として貯留し、内槽3から溢れた処理液が、内槽3の上部外周を囲うように設けられた外槽5によって回収される。内槽3の底部両側には、処理液を内槽3に対して供給する二本の噴出管9が配設されている。   The substrate processing apparatus according to this embodiment includes a processing tank 1, and the processing tank 1 includes an inner tank 3 and an outer tank 5. The inner tank 3 stores the processing liquid and can accommodate the substrate W held by the lifter 7. The lifter 7 includes a support member that is in contact with the lower edge of the substrate W and supports the substrate W in an upright position at the lower portion of the plate-like arm. The lifter 7 can be moved up and down over a “processing position” that is inside the inner tank 3 and an “upward position” that is above the inner tank 3. The inner tank 3 stores pure water, a solvent or a mixed solution thereof as a processing liquid, and the processing liquid overflowing from the inner tank 3 is collected by the outer tank 5 provided so as to surround the upper outer periphery of the inner tank 3. Is done. Two jet pipes 9 for supplying the processing liquid to the inner tank 3 are disposed on both sides of the bottom of the inner tank 3.

噴出管9には、供給配管11の一端側が連通接続され、その他端側には外槽5の排出口13が連通接続されている。供給配管11は、外槽5側にあたる上流側から順に、三方弁15と、ポンプ17と、三方弁19〜21と、インラインヒータ22とを備えている。三方弁15は、処理液の循環と排液とを切り換え、ポンプ17は処理液を循環させ、三方弁19は処理液の循環と純水除去(詳細後述)とを切り換え、三方弁20,21は処理液の循環と冷却(詳細後述)とを切り換える。インラインヒータ22は、供給配管11を流通している処理液を所定の温度に加熱する。   One end side of the supply pipe 11 is connected to the ejection pipe 9 and the discharge port 13 of the outer tub 5 is connected to the other end side. The supply pipe 11 includes a three-way valve 15, a pump 17, three-way valves 19 to 21, and an inline heater 22 in order from the upstream side corresponding to the outer tub 5 side. The three-way valve 15 switches between processing liquid circulation and drainage, the pump 17 circulates the processing liquid, the three-way valve 19 switches between processing liquid circulation and pure water removal (details will be described later), and the three-way valves 20 and 21. Switches between circulation and cooling of the processing liquid (details will be described later). The inline heater 22 heats the processing liquid flowing through the supply pipe 11 to a predetermined temperature.

三方弁20,21には、供給配管11から分流した第1の分岐配管23が連通接続されている。この第1の分岐配管23には、冷却ユニット25が取り付けられている。冷却ユニット25は、第1の分岐配管23を流通している処理液を所定の温度に冷却するための機能を備えている。   A first branch pipe 23 branched from the supply pipe 11 is connected to the three-way valves 20 and 21. A cooling unit 25 is attached to the first branch pipe 23. The cooling unit 25 has a function for cooling the processing liquid flowing through the first branch pipe 23 to a predetermined temperature.

インラインヒータ22の下流側であって、噴出管9よりも上流側にあたる供給配管11の一部位には、注入管27の一端側が連通接続されている。注入管27の他端側は、純水供給源29に連通接続されている。注入管27には、下流側から順に、制御弁31と、ミキシングバルブ33と、流量制御弁35とが配設されている。制御弁31は、純水や溶剤、純水に溶剤が混合された処理液などの供給・遮断を制御する。ミキシングバルブ33には、二本の薬液配管37,39の一端側が連通接続され、それぞれの他端側がHFE供給源41、IPA供給源43に連通接続されている。二本の薬液配管37,39は、それぞれ流量を調整するための流量制御弁45,47を備えている。ミキシングバルブ33は、非水溶性有機溶剤として、例えばフッ素系溶剤であるHFE(ハイドロフルオロエーテル)や、水溶性溶として、例えばIPA(イソプロピルアルコール)を混合する機能を備えている。   One end of the injection pipe 27 is connected to one portion of the supply pipe 11 that is downstream of the in-line heater 22 and upstream of the ejection pipe 9. The other end side of the injection pipe 27 is connected to a pure water supply source 29 in communication. In the injection pipe 27, a control valve 31, a mixing valve 33, and a flow rate control valve 35 are arranged in this order from the downstream side. The control valve 31 controls supply / cutoff of pure water, a solvent, a treatment liquid in which a solvent is mixed with pure water, and the like. One end side of the two chemical liquid pipes 37 and 39 is connected to the mixing valve 33, and the other end side thereof is connected to the HFE supply source 41 and the IPA supply source 43. The two chemical liquid pipes 37 and 39 include flow rate control valves 45 and 47 for adjusting the flow rate, respectively. The mixing valve 33 has a function of mixing, for example, HFE (hydrofluoroether) which is a fluorine-based solvent as a water-insoluble organic solvent, or IPA (isopropyl alcohol) as a water-soluble solvent.

なお、噴出管9、供給配管11及び注入管27が本発明における「第1供給手段」に相当する。また、噴出管9、供給配管11、注入管27、ミキシングバルブ33及び薬液配管39が本発明における「第2供給手段」に相当し、噴出管9、供給配管11、注入管27、ミキシングバルブ33及び薬液配管37が本発明における「第3供給手段」に相当する。   The ejection pipe 9, the supply pipe 11, and the injection pipe 27 correspond to the “first supply means” in the present invention. The ejection pipe 9, the supply pipe 11, the injection pipe 27, the mixing valve 33, and the chemical liquid pipe 39 correspond to the “second supply means” in the present invention, and the ejection pipe 9, the supply pipe 11, the injection pipe 27, and the mixing valve 33. And the chemical | medical solution piping 37 is equivalent to the "3rd supply means" in this invention.

供給配管11は、冷却ユニット25の上流側と下流側とを連通接続した第2の分岐配管49を備えている。この第2の分岐配管49は、処理液中の純水と溶剤とを分離するための油水分離フィルタ51を備えている。さらに、供給配管11は、第2の分岐配管49と並列の関係にあたる第3の分岐配管53を備えている。この第3の分岐配管53は、第2の分岐配管49における油水分離フィルタ51の上流側と下流側にあたる部分とを連通接続する。第3の分岐配管53は、処理液中の純水を吸着して除去するための吸着フィルタ55を備えている。この吸着フィルタ55としては、モレキュラーシーブ(Molecular sieve)、活性炭、アルミナ等で構成され、処理液中の微量の純水をも吸着して除去することができる機能を備えている。   The supply pipe 11 includes a second branch pipe 49 that connects the upstream side and the downstream side of the cooling unit 25 in communication. The second branch pipe 49 includes an oil / water separation filter 51 for separating pure water and solvent in the processing liquid. Further, the supply pipe 11 includes a third branch pipe 53 that is in parallel with the second branch pipe 49. The third branch pipe 53 communicates and connects the upstream and downstream portions of the oil / water separation filter 51 in the second branch pipe 49. The third branch pipe 53 includes an adsorption filter 55 for adsorbing and removing pure water in the processing liquid. The adsorption filter 55 is composed of molecular sieve, activated carbon, alumina, or the like, and has a function of adsorbing and removing a small amount of pure water in the treatment liquid.

上述した第2の分岐配管49は、油水分離フィルタ51の上流側にスタティックミキサ57を備えている。このスタティックミキサ57の上流側と、スタティックミキサ57の下流側であって、油水分離フィルタ51の上流側を連通接続しているのが第4の分岐配管58である。第4の分岐配管58は、制御弁59によって処理液の流通が制御される。スタティックミキサ57は、その上流部に、第2の分岐配管49を流通する処理液に純水を注入するための注入部60を備えている。また、注入部60への純水の注入流量を制御する流量制御弁61を備えている。スタティックミキサ57は、詳細後述するが、駆動部がなく、流体を分解・転換・反転の作用によって順次に攪拌混合するものである。   The second branch pipe 49 described above includes a static mixer 57 on the upstream side of the oil / water separation filter 51. The fourth branch pipe 58 connects the upstream side of the static mixer 57 with the downstream side of the static mixer 57 and the upstream side of the oil / water separation filter 51. In the fourth branch pipe 58, the flow of the processing liquid is controlled by the control valve 59. The static mixer 57 includes an injection unit 60 for injecting pure water into the processing liquid flowing through the second branch pipe 49 at the upstream portion thereof. Moreover, the flow control valve 61 which controls the injection flow of the pure water to the injection | pouring part 60 is provided. As will be described in detail later, the static mixer 57 does not have a driving unit, and stirs and mixes the fluid sequentially by the action of decomposition, conversion, and inversion.

三方弁19と第2の分岐配管49の間には、制御弁63が配設され、第3の分岐配管53には、吸着フィルタ55の上流側に制御弁65が配設されている。また、第2の分岐配管49の最上流部には制御弁67が配設され、最下流部には制御弁68が配設されている。また、吸着フィルタ55の下流側にあたる第3の分岐配管53には、制御弁69が配設されている。   A control valve 63 is disposed between the three-way valve 19 and the second branch pipe 49, and a control valve 65 is disposed upstream of the adsorption filter 55 in the third branch pipe 53. Further, a control valve 67 is disposed at the most upstream portion of the second branch pipe 49, and a control valve 68 is disposed at the most downstream portion. A control valve 69 is disposed in the third branch pipe 53 on the downstream side of the adsorption filter 55.

上述した処理槽1はチャンバ70により、周囲雰囲気から分離されるように囲われている。チャンバ70の内部上方には、一対の溶剤ノズル71が配設されている。この溶剤ノズル71は、図示しない溶剤蒸気発生部からIPAの蒸気を供給する。IPA蒸気の供給先は、処理槽1の上方にあたる上方位置であり、チャンバ71の内部を溶剤蒸気雰囲気にする。なお、チャンバ70の上部には、図示しない開閉自在の上部カバーが配設されており、リフタ7がチャンバ70に進退する際には開閉される。   The processing tank 1 described above is surrounded by the chamber 70 so as to be separated from the ambient atmosphere. A pair of solvent nozzles 71 is disposed above the inside of the chamber 70. The solvent nozzle 71 supplies IPA vapor from a solvent vapor generation unit (not shown). The supply destination of the IPA vapor is an upper position above the treatment tank 1, and the inside of the chamber 71 is set to a solvent vapor atmosphere. An openable and closable upper cover (not shown) is disposed on the upper portion of the chamber 70, and is opened and closed when the lifter 7 moves back and forth in the chamber 70.

次に、図2を参照する。なお、図2は、スタティックミキサの概略構成を示す縦断面図である。   Reference is now made to FIG. FIG. 2 is a longitudinal sectional view showing a schematic configuration of the static mixer.

スタティックミキサ57は、本体部73と、本体部73内に配設された複数個のエレメント75とを備えている。各エレメント75は、長方形の板部材を180°ねじった形に形成され、隣接するエレメント75はそれぞれ逆方向にねじって形成されたものである。このスタティックミキサ57は、上述した注入部60を上流部に備え、処理液に対して純水を注入して、それらを分割・転換・反転の作用で攪拌混合する。特に、溶剤がHFE(ハイドロフルオロエーテル)のように、純水に対して完全には溶けない非水溶性有機溶剤である場合には、スタティックミキサ57によって純水と溶剤とを混合してから油水分離フィルタ51で分離を行うことで純水の分離効率を高めることができる。   The static mixer 57 includes a main body portion 73 and a plurality of elements 75 disposed in the main body portion 73. Each element 75 is formed by twisting a rectangular plate member by 180 °, and adjacent elements 75 are formed by twisting in opposite directions. The static mixer 57 includes the above-described injection section 60 in the upstream section, injects pure water into the processing liquid, and stirs and mixes them by the action of division, conversion, and inversion. In particular, when the solvent is a water-insoluble organic solvent that is not completely soluble in pure water, such as HFE (hydrofluoroether), the pure water and the solvent are mixed by the static mixer 57 before oil water Separation by the separation filter 51 can increase the separation efficiency of pure water.

次に、図3を参照する。なお、図3は、油水分離フィルタの概略構成を示す縦断面図である。   Reference is now made to FIG. FIG. 3 is a longitudinal sectional view showing a schematic configuration of the oil / water separation filter.

油水分離フィルタ51は、ハウジング77と、ハウジング77底部の液導入部79と、液導入部79からの処理液を濾過するフィルタ81と、フィルタ81を通過した液体のうち、比重が大きいものを貯留する第1貯留部83と、比重が小さいものを貯留する第2貯留部85と、液導入部79に処理液が流入する流入部87と、第1貯留部83内の液体を排出する第1排出部89と、第2貯留部85内の液体を排出する第2排出部91と、ハウジング77の外壁に沿って配設され、間接的にフィルタ81を冷却するための冷却パイプ93とを備えている。流入部87は第2の分岐管49の上流側にあたり、第1排出部89は第2の分岐管49の下流側にあたる。フィルタ81は、微分散した遊離液を超極細繊維フィルタにより捕捉し、凝集して粗大化する機能を備え、ミクロンオーダに微分散した遊離液をミリメートルオーダに粗大化させて、比重差によって瞬時に完全二層系に分散する。なお、冷却パイプ93を介してフィルタ81を冷却することにより、油水分離の効率を高めることができる。   The oil / water separation filter 51 stores a housing 77, a liquid introduction part 79 at the bottom of the housing 77, a filter 81 for filtering the processing liquid from the liquid introduction part 79, and a liquid having a high specific gravity among the liquids that have passed through the filter 81. The first storage section 83 that stores the second storage section 85 that stores a small specific gravity, the inflow section 87 through which the processing liquid flows into the liquid introduction section 79, and the first storage section 83 that discharges the liquid in the first storage section 83. A discharge portion 89, a second discharge portion 91 for discharging the liquid in the second storage portion 85, and a cooling pipe 93 that is disposed along the outer wall of the housing 77 and indirectly cools the filter 81. ing. The inflow portion 87 is on the upstream side of the second branch pipe 49, and the first discharge portion 89 is on the downstream side of the second branch pipe 49. The filter 81 has a function of capturing finely dispersed free liquid with a microfiber filter and agglomerating and coarsening. The free liquid finely dispersed in a micron order is coarsened to a millimeter order and instantly caused by a difference in specific gravity. Disperse in a complete bilayer system. In addition, the efficiency of oil-water separation can be improved by cooling the filter 81 through the cooling pipe 93.

また、内槽3は、処理液中の純水濃度を測定するための濃度計95を上部付近に備えている。この濃度計95としては、例えば、赤外線吸収方式のものが挙げられる。   Further, the inner tank 3 is provided with a densitometer 95 for measuring the concentration of pure water in the treatment liquid in the vicinity of the upper part. An example of the densitometer 95 is an infrared absorption type.

上述したリフタ7の昇降や、ポンプ17の作動/停止、インラインヒータ22の温度制御、流量制御弁35,45,47,61の流量制御、制御弁31の開閉制御、三方弁15,19〜21の切り換え制御、制御弁59,63,65,67,68,69の開閉制御などは、本発明における「制御手段」に相当する制御部97が統括的に制御する。   Lifting and lowering of the lifter 7 described above, operation / stop of the pump 17, temperature control of the in-line heater 22, flow control of the flow control valves 35, 45, 47, 61, open / close control of the control valve 31, three-way valves 15, 19-21 The control unit 97 corresponding to the “control means” in the present invention controls the switching control and the opening / closing control of the control valves 59, 63, 65, 67, 68, and 69 in an integrated manner.

また、制御部97は、上述した各部を操作して、リフタ7を処理位置に移動させ、処理液として純水を供給して「純水洗浄処理」を行わせた後、処理液にIPAを供給して純水をIPAで置換する「置換処理」、処理液を冷却ユニット25によって冷却する「冷却処理」、油水分離フィルタ51によって処理液中の純水を除去する「分離除去処理」を行わせる。その後、吸着フィルタ55によって処理液中の純水を吸着除去する「吸着除去処理」を行わせる。そして、処理液にHFEを注入して、IPAをHFEで置換する「置換促進処理」を行わせる。処理液中の純水濃度が所定値以下となった場合には、再度少量(例えば、5〜10%程度)のIPAを注入して、HFEとIPAとの混合液を処理液として用い、吸着フィルタ55によって処理液中の純水をさらに吸着除去する「仕上げ処理」を行う。但し、「置換処理」及び「分離除去処理」の際には、スタティックミキサ57を通して、純水と溶剤とを分割・転換・反転の作用により攪拌混合してから、油水分離フィルタ51を通すようにして、油水分離フィルタ51による分離効率を向上させる。特に、有機溶剤が純水に対して溶けにくいHFEである場合にはスタティックミキサ57による効果が大きい。「仕上げ処理」が完了した後、溶剤ノズル71から有機溶剤の蒸気を供給させてチャンバ70内に溶剤雰囲気を形成して、リフタ7を処理槽1から引き上げることで基板Wに対する乾燥処理を行う。   In addition, the control unit 97 operates each unit described above to move the lifter 7 to the processing position, supplies pure water as a processing liquid to perform “pure water cleaning processing”, and then adds IPA to the processing liquid. A “replacement process” for supplying and replacing pure water with IPA, a “cooling process” for cooling the processing liquid by the cooling unit 25, and a “separation removing process” for removing pure water in the processing liquid by the oil / water separation filter 51 are performed. Make it. Thereafter, an “adsorption removal process” for adsorbing and removing pure water in the treatment liquid is performed by the adsorption filter 55. And HFE is inject | poured into a process liquid and the "replacement acceleration | stimulation process" which replaces IPA with HFE is performed. When the concentration of pure water in the treatment liquid becomes a predetermined value or less, a small amount (for example, about 5 to 10%) of IPA is injected again, and a mixed liquid of HFE and IPA is used as the treatment liquid to adsorb. The filter 55 performs a “finishing process” in which pure water in the processing liquid is further adsorbed and removed. However, in the “replacement process” and the “separation removal process”, the pure water and the solvent are stirred and mixed by the action of division, conversion, and inversion through the static mixer 57 and then passed through the oil / water separation filter 51. Thus, the separation efficiency by the oil / water separation filter 51 is improved. In particular, when the organic solvent is HFE that is difficult to dissolve in pure water, the effect of the static mixer 57 is great. After the “finishing process” is completed, an organic solvent vapor is supplied from the solvent nozzle 71 to form a solvent atmosphere in the chamber 70, and the lifter 7 is lifted from the processing tank 1 to perform a drying process on the substrate W.

なお、「吸着除去処理」を行う前には、処理液中の有機溶剤の飽和溶解度を確認することが好ましいが、濃度計95で代用可能である。純水濃度の具体的な値は、例えば、0.1[%]以下である。これは、あまり純水濃度が高いうちから「吸着除去処理」を行うと、吸着フィルタ55が短時間で吸水力を失い、吸着フィルタ55の交換を頻繁に行う必要が生じるという不都合を回避するためである。   Before performing the “adsorption removal treatment”, it is preferable to check the saturation solubility of the organic solvent in the treatment liquid, but a densitometer 95 can be used instead. A specific value of the pure water concentration is, for example, 0.1 [%] or less. This is to avoid the inconvenience that if the “adsorption removal process” is performed while the concentration of pure water is too high, the adsorption filter 55 loses the water absorption force in a short time and the adsorption filter 55 needs to be replaced frequently. It is.

また、「置換促進処理」において制御部97は、流量制御弁45を操作して、HFEの流量を小流量に設定してHFEの注入を行うことが好ましい。これにより内槽3に貯留しているIPAとの界面を維持したままで内槽3の内部をHFEにすることができる。したがって、効率的にIPAをHFEで置換することができる。   Further, in the “replacement promotion process”, the control unit 97 preferably operates the flow rate control valve 45 to set the HFE flow rate to a small flow rate and injects HFE. Thereby, the inside of the inner tank 3 can be made HFE while maintaining the interface with the IPA stored in the inner tank 3. Therefore, IPA can be efficiently replaced with HFE.

次に、図4〜図6を参照して、上述した基板処理装置の動作について説明する。なお、図4は、動作を示すフローチャートであり、図5及び図6は、(a)〜(d)が有機溶剤の作用の説明に供する模式図である。   Next, the operation of the above-described substrate processing apparatus will be described with reference to FIGS. FIG. 4 is a flowchart showing the operation, and FIGS. 5 and 6 are schematic diagrams in which (a) to (d) are used to explain the action of the organic solvent.

ステップS1
制御部97は、三方弁15を循環側に切り換えるとともに、三方弁19〜21を供給配管11側に切り換え、制御弁31を開放するとともに流量制御弁35を調整して、純水供給源29から注入管27及び供給配管11を介して純水を所定流量で内槽3へ供給する。内槽3及び外槽5並びに供給配管11を全て純水で満たした後、ポンプ17及びインラインヒータ22を作動させて所定の温度(例えば、60℃)に純水を加熱する。所定温度になった後、リフタ7をチャンバ70外の待機位置から処理位置へ下降させ、これを所定時間だけ維持して、所定温度に加熱した純水で基板Wを洗浄処理する。このときの状態は、図5(a)の模式図のように、基板Wの微細パターンの間に純水が浸入した状態である。
Step S1
The control unit 97 switches the three-way valve 15 to the circulation side, switches the three-way valves 19 to 21 to the supply piping 11 side, opens the control valve 31 and adjusts the flow rate control valve 35, so that the pure water supply source 29 Pure water is supplied to the inner tank 3 through the injection pipe 27 and the supply pipe 11 at a predetermined flow rate. After all of the inner tank 3 and the outer tank 5 and the supply pipe 11 are filled with pure water, the pump 17 and the in-line heater 22 are operated to heat the pure water to a predetermined temperature (for example, 60 ° C.). After reaching the predetermined temperature, the lifter 7 is lowered from the standby position outside the chamber 70 to the processing position and maintained for a predetermined time, and the substrate W is cleaned with pure water heated to the predetermined temperature. The state at this time is a state in which pure water has entered between the fine patterns of the substrate W as shown in the schematic diagram of FIG.

ステップS2
制御部97は、インラインヒータ22及びポンプ17を停止させるとともに、三方弁15を排液側へ切り換えるとともに、流量制御弁35を閉止する。そして、流量制御弁47を所定流量に調節して、供給配管11へIPAを供給する(図5(b))。内槽3及び外槽5がIPAで満たされた後、三方弁15を供給配管11側へ切り換えるとともにポンプ17を作動させる。これにより、処理液のうち純水の大半が排出され、処理液にIPAが混合されて純水がIPAで置換される。この状態は、図5(c)の模式図のように、基板Wの微細パターンに浸入した純水DIWの大半をIPAで置換することができるものの、微細パターンの奥にある純水DIWをIPAで完全には置換することができない。
Step S2
The control unit 97 stops the inline heater 22 and the pump 17, switches the three-way valve 15 to the drain side, and closes the flow control valve 35. Then, the flow rate control valve 47 is adjusted to a predetermined flow rate, and IPA is supplied to the supply pipe 11 (FIG. 5B). After the inner tank 3 and the outer tank 5 are filled with IPA, the three-way valve 15 is switched to the supply pipe 11 side and the pump 17 is operated. As a result, most of the pure water is discharged from the treatment liquid, IPA is mixed with the treatment liquid, and the pure water is replaced with IPA. In this state, as shown in the schematic diagram of FIG. 5C, although most of the pure water DIW that has entered the fine pattern of the substrate W can be replaced by IPA, the pure water DIW in the back of the fine pattern is changed to IPA. Cannot be completely replaced.

ステップS3
制御部97は、三方弁20,21を第1の分岐配管23側へ切り換えるとともに、冷却ユニット25によって処理液を所定の温度にまで冷却する。冷却することにより、純水がIPAに溶けにくくすることができる。
Step S3
The control unit 97 switches the three-way valves 20 and 21 to the first branch pipe 23 side and cools the processing liquid to a predetermined temperature by the cooling unit 25. By cooling, pure water can be made difficult to dissolve in IPA.

ステップS4
制御部97は、制御弁63,67,68を開放するとともに、三方弁19を第1の分岐管49側へ切り換える。これにより、スタティックミキサ57でIPAと純水とが充分に混合された後、処理液が油水分離フィルタ51を通ることになる。
Step S4
The control unit 97 opens the control valves 63, 67, and 68 and switches the three-way valve 19 to the first branch pipe 49 side. As a result, after the IPA and pure water are sufficiently mixed by the static mixer 57, the treatment liquid passes through the oil / water separation filter 51.

なお、このときに流量制御弁61を調整して、スタティックミキサ57を流通する処理液に対して少量の純水を注入するようにしてもよい。これは、溶剤中の純水濃度が一定値以下であると、油水分離フィルタ51による純水と溶剤との分離効率が低下するので、純水濃度が低下した処理液に対して積極的に純水を注入・混合することにより、一定値以下になった純水を、純水で引き出すようにして油水分離フィルタ51によって分離するためである。   At this time, the flow control valve 61 may be adjusted so that a small amount of pure water is injected into the processing liquid flowing through the static mixer 57. This is because if the concentration of pure water in the solvent is below a certain value, the separation efficiency between the pure water and the solvent by the oil / water separation filter 51 is lowered, so that the pure water is positively treated with respect to the treatment liquid having a reduced pure water concentration. This is because pure water that has become a certain value or less by injecting and mixing water is separated by the oil / water separation filter 51 so as to be drawn out with pure water.

上記の処理を所定時間行った後、制御部97は、制御弁59を開放して流路を第4の分岐配管58へ切り換え、処理液の流れがスタティックミキサ57を通らないようにバイパスする。これにより、純水濃度が低くされた処理液が油水分離フィルタ51だけを通るようになる。なお、第4の分岐配管58を省略して、常にスタティックミキサ57を処理液が流通するようにしてもよい。   After performing the above processing for a predetermined time, the control unit 97 opens the control valve 59 and switches the flow path to the fourth branch pipe 58 to bypass the flow of the processing liquid so as not to pass through the static mixer 57. As a result, the treatment liquid having a reduced pure water concentration passes only through the oil / water separation filter 51. Note that the fourth branch pipe 58 may be omitted, and the processing liquid may always flow through the static mixer 57.

ステップS5
制御部97は、制御弁65,69を開放するとともに、制御弁67,68を閉止する。これにより、純水濃度が低減された処理液(大半がIPA)が第3の分岐管53へ流れる。これにより、処理液中に僅かに残った純水が吸着フィルタ55によって吸着除去される。
Step S5
The control unit 97 opens the control valves 65 and 69 and closes the control valves 67 and 68. As a result, the treatment liquid (mostly IPA ) having a reduced pure water concentration flows to the third branch pipe 53. Thus, the pure water remaining slightly in the processing liquid is removed by adsorption by the adsorption filter 55.

ステップS6
上記の吸着除去処理を所定時間だけ行った後、制御部97は、制御弁15を排液側へ切り換えるとともに、三方弁19〜21を供給配管11側へ切り換える。さらに、流量制御弁45を調整して、小流量でHFEを内槽3に供給する(図5(d))。これにより、IPAがHFEと混ざり合うことなく徐々に押し上げられて内槽3から排出されるとともにHFEで置換される。但し、僅かな純水が処理液中や基板Wの微細パターン内には未だに残留している(図6(a))。つまり、HFEは、IPAよりも微細パターンの奥にまで浸入しやすいが、HFEは純水に溶けないので、微細パターンの奥には純水が残ったままとなる。HFEで内槽3が満たされた後、制御弁31及び流量制御弁45を閉止するとともに、三方弁19を第2の分岐配管49側に切り換え、制御弁67,68を開放する一方、制御弁58を閉止する。これにより、上記ステップS4のように、HFEを含む処理液がスタティックミキサ57と油水分離フィルタ51を流通し、純水が除去される。制御部97は、所定時間だけ油水分離フィルタ51による純水除去を行った後、上記ステップS5のように流路を切り換えて吸着フィルタ55による吸着除去を行う。
Step S6
After performing the above-described adsorption removal process for a predetermined time, the control unit 97 switches the control valve 15 to the drain side and switches the three-way valves 19 to 21 to the supply pipe 11 side. Further, the flow rate control valve 45 is adjusted to supply HFE to the inner tank 3 with a small flow rate (FIG. 5 (d)). Thereby, IPA is gradually pushed up without being mixed with HFE and discharged from the inner tank 3 and is replaced with HFE. However, a slight amount of pure water still remains in the processing solution and in the fine pattern of the substrate W (FIG. 6A). That is, HFE penetrates more deeply into the fine pattern than IPA, but since HFE does not dissolve in pure water, pure water remains behind in the fine pattern. After the inner tank 3 is filled with HFE, the control valve 31 and the flow rate control valve 45 are closed, the three-way valve 19 is switched to the second branch pipe 49 side, and the control valves 67 and 68 are opened. 58 is closed. Thereby, like the said step S4, the process liquid containing HFE distribute | circulates the static mixer 57 and the oil-water separation filter 51, and a pure water is removed. The controller 97 performs pure water removal by the oil / water separation filter 51 for a predetermined time, and then performs adsorption removal by the adsorption filter 55 by switching the flow path as in step S5.

ステップS7
制御部97は、濃度計95を参照して処理液中の純水濃度が所定値以下となるまで吸着フィルタ55による吸着除去を行う。所定値は、例えば0.1[%]以下である。
Step S7
The control unit 97 refers to the concentration meter 95 and performs adsorption removal by the adsorption filter 55 until the concentration of pure water in the processing liquid becomes a predetermined value or less. The predetermined value is, for example, 0.1 [%] or less.

ステップS8
制御部97は、純水濃度が低減された処理液に再びIPAを注入して仕上げ処理を行う。具体的には、制御弁31を開放するとともに、流量制御弁47を調整して、少量のIPAを処理液に注入する(図6(b))。その濃度は、例えば、5〜10%程度である。この状態で吸着フィルタ55による吸着除去を維持することで、HFEが大半を占め、少量のIPAを含む処理液から僅かな純水を除去する。これにより、基板Wの微細パターン内にも残留している純水を引き出して除去することができる。換言すると、図6(c)に示すように、基板Wの微細パターンの奥に残った純水と、基板Wの微細パターンの奥に浸入しているHFEとを、純水及びHFEの双方に溶けるIPAが結びつけるようにして取り込むとともに、図6(d)に示すように、IPAと純水がHFEによって基板Wから除去される。
Step S8
The control unit 97 performs the finishing process by injecting IPA again into the processing liquid whose pure water concentration is reduced. Specifically, the control valve 31 is opened and the flow rate control valve 47 is adjusted to inject a small amount of IPA into the processing liquid (FIG. 6B). The concentration is, for example, about 5 to 10%. By maintaining the adsorption removal by the adsorption filter 55 in this state, HFE occupies the majority, and a small amount of pure water is removed from the treatment liquid containing a small amount of IPA. Thereby, pure water remaining in the fine pattern of the substrate W can be drawn out and removed. In other words, as shown in FIG. 6C, the pure water remaining in the back of the fine pattern of the substrate W and the HFE that has penetrated into the back of the fine pattern of the substrate W are used as both pure water and HFE. IPA and pure water are removed from the substrate W by HFE as shown in FIG.

なお、上述したIPAと純水との関係は、図7のようになる。図7は、IPAと純水との関係の説明に供する図である。
すなわち、上述した処理の過程においてIPAの濃度が低下してゆくと、IPAに溶ける純水DIWが減少してゆくので、結果として純水DIWの濃度が一定値よりも低下しない。その結果、純水DIWが残ることになる(符号rs)。そこで、上述したようにして、HFEを供給した後に再度IPAを供給して、純水DIWの残りrsをIPAに溶かし込むようにしている。
The relationship between IPA and pure water described above is as shown in FIG. FIG. 7 is a diagram for explaining the relationship between IPA and pure water.
That is, when the concentration of IPA decreases in the process described above, pure water DIW dissolved in IPA decreases, and as a result, the concentration of pure water DIW does not decrease below a certain value. As a result, pure water DIW remains (reference rs). Therefore, as described above, after supplying HFE, IPA is supplied again, and the remaining rs of pure water DIW is dissolved in IPA.

ステップS9
上記の処理を所定時間だけ行った後、制御部97は、溶剤ノズル71から溶剤蒸気を供給して、処理槽1の周囲に溶剤雰囲気を形成する。そして、リフタ7を上昇させて基板Wに付着しているHFEを揮発させて基板Wを乾燥させる。
Step S9
After performing the above processing for a predetermined time, the control unit 97 supplies solvent vapor from the solvent nozzle 71 to form a solvent atmosphere around the processing tank 1. Then, the lifter 7 is raised to volatilize the HFE adhering to the substrate W and dry the substrate W.

上述したように、本実施例装置によると、制御部79は、リフタ7により基板Wを処理位置に移動させた状態で、処理槽1内の基板Wを純水で洗浄する純水洗浄処理を行わせ、ミキシングバルブ33から供給配管11にIPAを注入して純水をIPAで置換する置換処理を行わせる。これにより、基板Wに付着している純水をIPAで置換させることができるが、基板Wに微細パターンが形成されている場合には、その奥に入り込んだ純水までも完全に置換するには至らない。その後、第2の分岐配管49に流路を切り換えるとともに、油水分離フィルタ51によって処理液中の純水を除去する分離除去処理を行わせ、ミキシングバルブ33から供給配管11にHFEを注入して置換促進処理を行わせ、ミキシングバルブ33から供給配管11に少量のIPAを注入して仕上げ処理を行わせた後、リフタ7を上方位置に移動させる。仕上げ処理では、基板Wの微細パターンの奥に入り込んだ純水を少量のIPAで引き出すことができるので、基板Wの微細パターン中に純水が残留するのを防止することができる。その結果、基板Wに形成されている微細パターンの倒壊を防止することができる。   As described above, according to the apparatus of the present embodiment, the control unit 79 performs the pure water cleaning process in which the substrate W in the processing tank 1 is cleaned with pure water while the substrate W is moved to the processing position by the lifter 7. Then, a replacement process is performed in which IPA is injected from the mixing valve 33 into the supply pipe 11 to replace pure water with IPA. As a result, the pure water adhering to the substrate W can be replaced with IPA. However, when a fine pattern is formed on the substrate W, the pure water that has entered deeply into the substrate W is also completely replaced. Is not reached. Thereafter, the flow path is switched to the second branch pipe 49, and separation / removal processing for removing pure water in the processing liquid is performed by the oil / water separation filter 51, and HFE is injected from the mixing valve 33 into the supply pipe 11 for replacement. After the acceleration process is performed and a small amount of IPA is injected from the mixing valve 33 into the supply pipe 11 to perform the finishing process, the lifter 7 is moved to the upper position. In the finishing process, pure water that has entered the depth of the fine pattern on the substrate W can be drawn out with a small amount of IPA, so that the pure water can be prevented from remaining in the fine pattern on the substrate W. As a result, the fine pattern formed on the substrate W can be prevented from collapsing.

本発明は、上記実施形態に限られることはなく、下記のように変形実施することができる。   The present invention is not limited to the above embodiment, and can be modified as follows.

(1)上述した実施例では、内槽3と外槽5とを供給配管11で連通接続し、ポンプ17で処理液を循環させる循環方式を採用しているが、本発明はこの循環方式に限定されるものではない。   (1) In the above-described embodiment, a circulation system is adopted in which the inner tank 3 and the outer tank 5 are connected to each other by the supply pipe 11 and the processing liquid is circulated by the pump 17. It is not limited.

すなわち、外槽5で回収した処理液を供給配管11に戻すことなく、三方弁15を通して排液する構成とするとともに、冷却ユニット25、油水分離フィルタ51、吸着フィルタ55などを省略した構成とする。このような構成とした場合、次のようにして処理を行う。   That is, the processing liquid collected in the outer tank 5 is drained through the three-way valve 15 without returning to the supply pipe 11, and the cooling unit 25, the oil / water separation filter 51, the adsorption filter 55, and the like are omitted. . In such a configuration, processing is performed as follows.

制御部97は、リフタ7により基板Wを処理位置に移動させた状態で、ミキシングバルブ33から処理槽1へ純水を供給させ、外槽5から処理液を排出させつつ、基板Wに対して純水洗浄処理を行わせる。次に、ミキシングバルブ33から処理槽1へIPAを供給させて処理槽1内を純水からIPAに置換してIPAによる置換処理を行わせる。これにより、基板Wに付着している純水をIPAで置換させることができるが、基板Wに微細パターンが形成されている場合には、その奥に入り込んだ純水までも完全に置換するには至らない。次に、ミキシングバルブ33から処理槽1へHFEを供給させ、外槽5から処理液を排出させつつ処理槽1内をIPAからHFEに置換し、基板Wに対してHFEによる置換促進処理を行わせる。さらに、ミキシングバルブ33から処理槽1へIPAを供給させ、外槽5から処理液を排出させつつ、基板Wに対してIPA及びHFEの混合液による仕上げ処理を行わせ、リフタ7を上方位置に移動させて、基板Wに対する処理を完了する。仕上げ処理では、基板Wの微細パターンの奥に入り込んだ純水をIPAで引き出すことができるので、基板Wの微細パターン中に純水が残留するのを防止できる。その結果、基板Wに形成されている微細パターンの倒壊を防止できる。   The control unit 97 supplies pure water from the mixing valve 33 to the processing tank 1 while discharging the processing liquid from the outer tank 5 while moving the substrate W to the processing position by the lifter 7. A pure water washing process is performed. Next, IPA is supplied from the mixing valve 33 to the treatment tank 1 to replace the inside of the treatment tank 1 with pure water to IPA, and a replacement process using IPA is performed. As a result, the pure water adhering to the substrate W can be replaced with IPA. However, when a fine pattern is formed on the substrate W, the pure water that has entered deeply into the substrate W is also completely replaced. Is not reached. Next, HFE is supplied from the mixing valve 33 to the processing tank 1, while the processing liquid is discharged from the outer tank 5, the inside of the processing tank 1 is replaced with IPA to HFE, and the substrate W is subjected to replacement promotion processing with HFE. Make it. Further, IPA is supplied from the mixing valve 33 to the processing tank 1 and the processing liquid is discharged from the outer tank 5 while the substrate W is subjected to a finishing process using a mixed liquid of IPA and HFE, and the lifter 7 is moved to the upper position. It is moved to complete the processing for the substrate W. In the finishing process, pure water that has entered the back of the fine pattern of the substrate W can be drawn out by IPA, so that the pure water can be prevented from remaining in the fine pattern of the substrate W. As a result, collapse of the fine pattern formed on the substrate W can be prevented.

(2)上述した実施例では、水溶性有機溶剤としてIPAを採用し、非水溶性有機溶剤としてHFEを採用しているが、本発明はこれらの有機溶剤に限定されるものではなく、他の有機溶剤を採用してもよい。   (2) In the above-described embodiments, IPA is adopted as the water-soluble organic solvent and HFE is adopted as the water-insoluble organic solvent, but the present invention is not limited to these organic solvents, An organic solvent may be employed.

(3)上述した実施例では、冷却ユニット25による処理液の冷却を行っているが、これを省略し、処理液を冷却することなく純水除去を図る構成としてもよい。これにより装置構成を簡易化することができる。   (3) In the above-described embodiment, the processing liquid is cooled by the cooling unit 25, but this may be omitted, and pure water removal may be performed without cooling the processing liquid. Thereby, the apparatus configuration can be simplified.

(4)上述した実施例では、溶剤ノズル71からIPAの蒸気を供給する構成としているが、これに代えてHFEの蒸気を供給するようにしてもよい。また、溶剤ノズル71を省略して、仕上げ処理の後、そのまま基板Wを搬出する構成としてもよい。これにより装置構成を簡易化することができる。   (4) In the above-described embodiment, the IPA vapor is supplied from the solvent nozzle 71, but HFE vapor may be supplied instead. Alternatively, the solvent nozzle 71 may be omitted, and the substrate W may be unloaded after the finishing process. Thereby, the apparatus configuration can be simplified.

(5)上述した実施例では、純水をIPAで置換した後に、HFEを供給し、その後に少量のIPAを供給するようにしているが、これに代えて、純水をIPAで置換した後に、HFEと少量のIPAを同時に供給するようにしてもよい。つまり、少量のIPAを含むHFEの処理液を供給するようにしてもよい。このようにしても、上述した実施例と同様の作用効果を奏する。   (5) In the above-described embodiment, after replacing pure water with IPA, HFE is supplied, and then a small amount of IPA is supplied. Instead, after replacing pure water with IPA, , HFE and a small amount of IPA may be supplied simultaneously. That is, you may make it supply the processing liquid of HFE containing a small amount of IPA. Even if it does in this way, there exists an effect similar to the Example mentioned above.

実施例に係る基板処理装置の概略構成を示すブロック図である。It is a block diagram which shows schematic structure of the substrate processing apparatus which concerns on an Example. スタティックミキサの概略構成を示す縦断面図である。It is a longitudinal cross-sectional view which shows schematic structure of a static mixer. 油水分離フィルタの概略構成を示す縦断面図である。It is a longitudinal cross-sectional view which shows schematic structure of an oil-water separation filter. 動作を示すフローチャートである。It is a flowchart which shows operation | movement. (a)〜(d)は有機溶剤の作用の説明に供する模式図である。(A)-(d) is a schematic diagram with which it uses for description of the effect | action of an organic solvent. (a)〜(d)は有機溶剤の作用の説明に供する模式図である。(A)-(d) is a schematic diagram with which it uses for description of the effect | action of an organic solvent. IPAと純水との関係の説明に供する図である。It is a figure where it uses for description of the relationship between IPA and a pure water.

符号の説明Explanation of symbols

W … 基板
1 … 処理槽
3 … 内槽
5 … 外槽
7 … リフタ
9 … 噴出管
11 … 供給配管
23 … 第1の分岐配管
33 … ミキシングバルブ
49 … 第2の分岐配管
51 … 油水分離フィルタ
53 … 第3の分岐配管
55 … 吸着フィルタ
57 … スタティックミキサ
58 … 第4の分岐配管
97 … 制御部
70 … チャンバ
71 … 溶剤ノズル
W ... Substrate 1 ... Processing tank 3 ... Inner tank 5 ... Outer tank 7 ... Lifter 9 ... Jet pipe 11 ... Supply pipe 23 ... First branch pipe 33 ... Mixing valve 49 ... Second branch pipe 51 ... Oil-water separation filter 53 ... Third branch pipe 55 ... Adsorption filter 57 ... Static mixer 58 ... Fourth branch pipe 97 ... Control unit 70 ... Chamber 71 ... Solvent nozzle

Claims (8)

基板を処理液で処理する基板処理装置において、
処理液を貯留する内槽と、内槽から溢れた処理液を回収する外槽とを備えた処理槽と、
基板を保持し、前記処理槽内の処理位置と、前記処理槽の上方にあたる上方位置とにわたって移動可能な保持機構と、
内槽と前記外槽とを連通接続し、処理液を循環させる供給配管と、
前記供給配管を分流した第1の分岐配管と、
前記供給配管を分流した第2の分岐配管と、
前記供給配管を分流した第3の分岐配管と、
前記第1の分岐配管に配設され、処理液を所定の温度に冷却する冷却ユニットと、
前記第2の分岐配管に配設され、処理液中の純水と溶剤とを分離して処理液から純水を排出する油水分離フィルタと、
前記第3の分岐配管に配設され、処理液中の純水を吸着して除去するための吸着フィルタと、
前記供給配管に配設され、前記油水分離フィルタより下流側にて純水を注入する注入管と、
前記注入管に水溶性有機溶剤を注入する水溶性有機溶剤注入手段と、
前記注入管に非水溶性有機溶剤を注入する非水溶性有機溶剤注入手段と、
前記保持機構により基板を処理位置に移動させた状態で、前記処理槽内に前記注入管及び前記供給配管から純水を供給して処理槽内の基板を純水で洗浄する純水洗浄処理を行わせ、前記水溶性有機溶剤注入手段から前記注入管及び前記供給配管を介して前記処理槽に水溶性有機溶剤を供給して純水を水溶性有機溶剤で置換する処理を行わせ、前記第1の分岐配管に流路を切り換えるとともに、前記冷却ユニットによって処理液を所定の温度に冷却する処理を行わせ、前記第2の分岐配管に流路を切り換えるとともに、前記油水分離フィルタによって処理液中の純水と溶剤とを分離して処理液から純水を排出する処理を行わせ、前記第3の分岐配管に流路を切り換えるとともに、前記吸着フィルタによって処理液中の純水を吸着して除去する処理を行わせ、前記非水溶性有機溶剤注入手段から前記注入管及び前記供給配管を介して前記処理槽に非水溶性有機溶剤を供給するとともに、前記水溶性有機溶剤注入手段から前記注入管及び前記供給配管を介して前記処理槽に水溶性有機溶剤を供給して基板に対して水溶性有機溶剤と非水溶性有機溶剤との混合液による処理を行わせた後、前記保持機構を上方位置に移動させる制御手段と、
を備えていることを特徴とする基板処理装置。
In a substrate processing apparatus for processing a substrate with a processing liquid,
A treatment tank comprising an inner tank for storing the treatment liquid, and an outer tank for collecting the treatment liquid overflowing from the inner tank;
A holding mechanism that holds the substrate and is movable between a processing position in the processing tank and an upper position that is above the processing tank;
A supply pipe for connecting the inner tank and the outer tank in communication and circulating the processing liquid;
A first branch pipe that divides the supply pipe;
A second branch pipe that divides the supply pipe;
A third branch pipe that divides the supply pipe;
A cooling unit that is disposed in the first branch pipe and cools the processing liquid to a predetermined temperature;
An oil-water separation filter that is disposed in the second branch pipe and separates the pure water and the solvent in the processing liquid and discharges the pure water from the processing liquid ;
An adsorption filter disposed in the third branch pipe for adsorbing and removing pure water in the treatment liquid;
An injection pipe disposed in the supply pipe and injecting pure water downstream from the oil-water separation filter;
Water-soluble organic solvent injection means for injecting a water-soluble organic solvent into the injection tube;
Water-insoluble organic solvent injection means for injecting a water-insoluble organic solvent into the injection tube;
In a state where the substrate is moved to the processing position by the holding mechanism, pure water cleaning processing is performed in which pure water is supplied from the injection pipe and the supply pipe into the processing tank to clean the substrate in the processing tank with pure water. Performing a process of supplying a water-soluble organic solvent from the water-soluble organic solvent injection means to the treatment tank through the injection pipe and the supply pipe to replace pure water with the water-soluble organic solvent. The flow path is switched to one branch pipe, the process for cooling the processing liquid to a predetermined temperature is performed by the cooling unit, the flow path is switched to the second branch pipe, and the processing liquid is The pure water and the solvent are separated and the pure water is discharged from the treatment liquid, the flow path is switched to the third branch pipe, and the pure water in the treatment liquid is adsorbed by the adsorption filter. Where to remove And supplying the water-insoluble organic solvent from the water-insoluble organic solvent injection means to the treatment tank via the injection pipe and the supply pipe, and from the water-soluble organic solvent injection means to the injection pipe and the after through the supply pipe to perform the treatment with a mixed solution of water-soluble organic solvent and water-insoluble organic solvent to the substrate by supplying a water-soluble organic solvent into the processing bath, the holding mechanism at the upper position Control means to move;
A substrate processing apparatus comprising:
請求項に記載の基板処理装置において、
前記制御手段は、前記水溶性有機溶剤と非水溶性有機溶剤との混合液による処理を、前記非水溶性有機溶剤注入手段から前記注入管及び前記供給配管を介して前記処理槽へ非水溶性有機溶剤を供給して行わせる処理と、前記水溶性有機溶剤注入手段から前記注入管及び前記供給配管を介して前記処理槽に水溶性有機溶剤を供給して基板に対して水溶性有機溶剤及び非水溶性有機溶剤の混合液による処理とすることを特徴とする基板処理装置。
The substrate processing apparatus according to claim 1 ,
The control means performs water-insoluble treatment with a mixture of the water-soluble organic solvent and the water-insoluble organic solvent from the water-insoluble organic solvent injection means to the treatment tank via the injection pipe and the supply pipe. a process to perform by supplying an organic solvent, a water-soluble organic solvent and the substrate by supplying water-soluble organic solvent into the processing bath through the injection pipe and the supply pipe from the water-soluble organic solvent injection means A substrate processing apparatus characterized in that the processing is performed with a mixed solution of a water-insoluble organic solvent.
請求項またはに記載の基板処理装置において、
前記処理槽を囲うチャンバと、
前記チャンバ内に溶剤蒸気を供給する溶剤蒸気供給手段とを備え、
前記制御手段は、前記混合液による処理の後、前記保持機構を上方位置へ移動させる前に、前記溶剤蒸気供給手段から溶剤蒸気を供給して前記チャンバ内に溶剤蒸気雰囲気を形成することを特徴とする基板処理装置。
The substrate processing apparatus according to claim 1 or 2 ,
A chamber surrounding the treatment tank;
Solvent vapor supply means for supplying solvent vapor into the chamber,
The control means supplies a solvent vapor from the solvent vapor supply means to form a solvent vapor atmosphere in the chamber before moving the holding mechanism to an upper position after the treatment with the mixed solution. A substrate processing apparatus.
請求項からのいずれかに記載の基板処理装置において、
前記水溶性有機溶剤供給手段は、水溶性有機溶剤としてIPA(イソプロピルアルコール)を供給し、前記非水溶性有機溶剤供給手段は、非水溶性有機溶剤としてHFE(ハイドロフルオロエーテル)を供給することを特徴とする基板処理装置。
The apparatus according to any one of claims 1 to 3,
The water-soluble organic solvent supply means supplies IPA (isopropyl alcohol) as a water-soluble organic solvent, and the water-insoluble organic solvent supply means supplies HFE (hydrofluoroether) as a water-insoluble organic solvent. A substrate processing apparatus.
請求項に記載の基板処理装置において、
前記混合液におけるIPA(イソプロピルアルコール)は、10%以下であることを特徴とする基板処理装置。
The substrate processing apparatus according to claim 4 ,
An IPA (isopropyl alcohol) in the mixed solution is 10% or less.
基板を処理液で処理する基板処理方法において、
基板を処理槽内の処理位置に移動させる過程と、
処理槽内に純水を供給させて、内槽と外槽とに純水を循環させつつ処理槽内の基板を純水で洗浄する過程と、
処理槽に水溶性有機溶剤を供給させて、内槽と外槽とに水溶性有機溶剤を循環させつつ純水を水溶性有機溶剤で置換する過程と、
冷却ユニットにより処理液を冷却する過程と、
油水分離フィルタにより処理液中の純水と溶剤とを分離して処理液から純水を排出する過程と、
吸着フィルタにより処理液の純水を吸着除去する過程と、
処理槽に非水溶性有機溶剤を供給するとともに、処理槽に水溶性有機溶剤を供給して、内槽と外槽とに非水溶性有機溶剤及び水溶性有機溶剤を循環させつつ基板に対して水溶性有機溶剤と非水溶性有機溶剤との混合液による処理を行わせる過程と、
基板を処理槽の上方にあたる上方位置に移動させる過程と、
を備えていることを特徴とする基板処理方法。
In a substrate processing method for processing a substrate with a processing liquid,
Moving the substrate to a processing position in the processing tank;
A process of cleaning the substrate in the processing tank with pure water while supplying pure water into the processing tank and circulating the pure water between the inner tank and the outer tank,
A process of supplying a water-soluble organic solvent to the treatment tank and replacing the pure water with the water-soluble organic solvent while circulating the water-soluble organic solvent between the inner tank and the outer tank;
A process of cooling the processing liquid by the cooling unit;
The process of separating the pure water and the solvent in the treatment liquid by the oil / water separation filter and discharging the pure water from the treatment liquid,
The process of adsorbing and removing pure water of the treatment liquid by the adsorption filter,
Supplies the water-insoluble organic solvent to the processing tank, and supplies the water-soluble organic solvent in the processing tank, the substrate while circulating the water-insoluble organic solvent and a water-soluble organic solvent and the inner tub and the outer tub A process of performing treatment with a mixture of a water-soluble organic solvent and a water-insoluble organic solvent;
A process of moving the substrate to an upper position above the processing tank;
A substrate processing method characterized by comprising:
請求項に記載の基板処理方法において、
前記水溶性有機溶剤と非水溶性有機溶剤との混合液による処理を行わせる過程を、
処理槽へ非水溶性有機溶剤を供給させて、内槽と外槽とに非水溶性有機溶剤を循環させつつ処理槽内を水溶性有機溶剤から非水溶性有機溶剤に置換して基板に対して非水溶性有機溶剤による処理を行わせる過程と、
処理槽へ水溶性有機溶剤を供給させて、内槽と外槽とに水溶性有機溶剤及び非水溶性有機溶剤を循環させつつ基板に対して水溶性有機溶剤及び非水溶性有機溶剤の混合液による処理を行わせる過程とすることを特徴とする基板処理方法。
The substrate processing method according to claim 6 ,
A process of performing a treatment with a mixed solution of the water-soluble organic solvent and the water-insoluble organic solvent,
Supply the water-insoluble organic solvent to the processing tank and circulate the water-insoluble organic solvent between the inner tank and the outer tank, and replace the inside of the processing tank from the water-soluble organic solvent to the water-insoluble organic solvent. A process of performing treatment with a water-insoluble organic solvent,
To the treatment tank by supplying water-soluble organic solvent, the inner tank and the outer tank and in a mixture of water-soluble organic solvent and water-insoluble organic solvent to the substrate while circulating the water-soluble organic solvent and water-insoluble organic solvent A method for processing a substrate, characterized in that a process for performing a process is performed.
請求項またはに記載基板処理方法において、
前記水溶性有機溶剤はIPA(イソプロピルアルコール)であり、前記非水溶性有機溶剤はHFE(ハイドロフルオロエーテル)であって、前記混合液におけるIPA(イソプロピルアルコール)は10%以下であることを特徴とする基板処理方法。
In the substrate processing method of Claim 6 or 7 ,
The water-soluble organic solvent is IPA (isopropyl alcohol), the water-insoluble organic solvent is HFE (hydrofluoroether), and the IPA (isopropyl alcohol) in the mixed solution is 10% or less. Substrate processing method.
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