JP5178351B2 - Electronic component mounting structure - Google Patents

Electronic component mounting structure Download PDF

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JP5178351B2
JP5178351B2 JP2008170208A JP2008170208A JP5178351B2 JP 5178351 B2 JP5178351 B2 JP 5178351B2 JP 2008170208 A JP2008170208 A JP 2008170208A JP 2008170208 A JP2008170208 A JP 2008170208A JP 5178351 B2 JP5178351 B2 JP 5178351B2
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electronic component
coil pattern
mounting structure
circuit board
input
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JP2010010550A (en
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初夫 高田
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Kyocera Corp
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Description

本発明は、絶縁基板の内部に信号伝送線路を有する回路基板の主面上にチップコイルから成る電子部品が実装されている電子部品の実装構造に関する。   The present invention relates to an electronic component mounting structure in which an electronic component composed of a chip coil is mounted on a main surface of a circuit board having a signal transmission line inside an insulating substrate.

従来、回路基板の主面上にチップコイルから成る電子部品を実装する場合、図4に示すように、電子部品におけるコイルパターンが形成された面（積層面）が回路基板の主面に対して垂直になるようにして実装している。この場合、小さな直方体状あるいは立方体状の形状を有する電子部品は、回路基板の主面上に実装する際にコイルパターンの方向を間違え易い。そこで、直方体状の場合には幅、厚みに差を付ける、あるいは識別マークを設ける等の方法で、電子部品の実装方向を間違えないようにしている。そして、例えば、テープ・アセンブリ方式を用いて、テーピング時に電子部品のコイルパターンの方向が揃うようにしていた。   Conventionally, when mounting an electronic component consisting of a chip coil on the main surface of a circuit board, as shown in FIG. 4, the surface (laminated surface) on which the coil pattern of the electronic component is formed is relative to the main surface of the circuit board. It is mounted so that it is vertical. In this case, an electronic component having a small rectangular parallelepiped shape or cubic shape is likely to have the wrong coil pattern direction when mounted on the main surface of the circuit board. Therefore, in the case of a rectangular parallelepiped shape, the mounting direction of the electronic component is not mistaken by a method such as making a difference in width and thickness or providing an identification mark. For example, the direction of the coil pattern of the electronic component is aligned during taping using a tape assembly method.

なお、図４において、１はチップコイルから成る電子部品、１ａは電子部品１の表面に形成され、コイルパターン５と入出力電極３ａとを電気的に接続する導電接続部、２は回路基板、３ａはコイルパターン５に高周波信号は入出力させる入出力電極、３ｂは回路基板２の他の主面側に形成された入出力電極、４ａは入出力電極３ａ，３ａ間に形成された中間導体層、４ｂは入出力電極３ｂ，３ｂ間に形成された中間導体層、５はコイルパターン、６は回路基板２の内部に形成された信号伝送線路等の内層導体層である。   In FIG. 4, 1 is an electronic component made of a chip coil, 1a is formed on the surface of the electronic component 1, and a conductive connection part for electrically connecting the coil pattern 5 and the input / output electrode 3a. 3a is an input / output electrode for inputting / outputting a high frequency signal to / from the coil pattern 5, 3b is an input / output electrode formed on the other main surface side of the circuit board 2, and 4a is an intermediate conductor formed between the input / output electrodes 3a, 3a. The layers 4b are intermediate conductor layers formed between the input / output electrodes 3b, 3b, 5 is a coil pattern, and 6 is an inner conductor layer such as a signal transmission line formed inside the circuit board 2.

中間導体層４ａは、コイルパターン５の内側と外側を周回するように発生した磁束（図４の破線部）をシールドする目的で設けられ、また、中間導体層４ｂは、外部の電磁波をシールドする目的で設けられる。
特開平８−２９８２１２号公報 The intermediate conductor layer 4a is provided for the purpose of shielding a magnetic flux (broken line portion in FIG. 4) generated so as to circulate inside and outside the coil pattern 5, and the intermediate conductor layer 4b shields external electromagnetic waves. It is provided for the purpose.
JP-A-8-298212

図４に示す従来の電子部品の実装構造においては、高周波信号の入力によってコイルパターン５において発生した交流磁界（高周波磁界）による磁束は大部分が周囲の空間に大きく広がり、電子部品１の周囲の他の電子部品に誘導電流等を生じさせて悪影響を与えるといった問題点がある。   In the conventional electronic component mounting structure shown in FIG. 4, most of the magnetic flux generated by the alternating magnetic field (high frequency magnetic field) generated in the coil pattern 5 by the input of the high frequency signal greatly spreads in the surrounding space. There is a problem in that an induced current or the like is generated in other electronic components and adversely affected.

そのため、電子部品１の周囲に密集させて他の電子部品を実装することが難しくなるといった問題点もある。   Therefore, there is also a problem that it is difficult to mount other electronic components densely around the electronic component 1.

また、高周波信号の入力によってコイルパターン５によって発生した磁束のうち回路基板２側に発生した成分は、中間導体層４ａに誘導電流を発生させて中間導体層４ａと内層導体層との間に余分な浮遊容量を発生させ、その結果、信号伝送線路にノイズとして重畳されるという問題点がある。   In addition, the component generated on the circuit board 2 side of the magnetic flux generated by the coil pattern 5 due to the input of the high frequency signal causes an induced current to be generated in the intermediate conductor layer 4a, and is extraneous between the intermediate conductor layer 4a and the inner conductor layer. There is a problem that a large stray capacitance is generated, and as a result, it is superimposed on the signal transmission line as noise.

本発明は、上記従来の問題点に鑑みて完成されたものであり、その目的は、チップコイルから成る電子部品の周囲の他の電子部品に誘導電流等を生じさせて悪影響を与えることを抑制して、電子部品の周囲に密集させて他の電子部品を実装することができ、また、コイルパターンによって発生した交流磁界による磁束が結果的に信号伝送線路にノイズとして重畳されることを抑制することである。   The present invention has been completed in view of the above-described conventional problems, and its object is to suppress the adverse effects caused by inducing an induced current or the like on other electronic components around the electronic component comprising the chip coil. Thus, it is possible to mount other electronic components densely around the electronic component, and suppress the magnetic flux generated by the alternating magnetic field generated by the coil pattern from being superimposed as noise on the signal transmission line as a result. That is.

本発明の電子部品の実装構造は、絶縁基板の内部に信号伝送線路を有する回路基板の主面上にチップコイルから成る電子部品が実装されている電子部品の実装構造であって、前記電子部品は、コイルパターンが前記回路基板の主面に沿った面上に形成されており、前記回路基板は、前記信号伝送線路が平面視で前記コイルパターンの内側に入り込んでおらず、かつ、その端部が平面視で前記コイルパターンの内側と一致するように形成されているものである。
The electronic component mounting structure of the present invention is an electronic component mounting structure in which an electronic component comprising a chip coil is mounted on a main surface of a circuit board having a signal transmission line inside an insulating substrate, The coil pattern is formed on a surface along the main surface of the circuit board, and the circuit board has the signal transmission line that does not enter the coil pattern in a plan view and has an end thereof The portion is formed so as to coincide with the inside of the coil pattern in plan view .

また、本発明の電子部品の実装構造は好ましくは、前記回路基板は、前記コイルパターンの下方の部位が絶縁基板部のみである。   In the electronic component mounting structure according to the present invention, it is preferable that the circuit board has only an insulating substrate portion below the coil pattern.

また、本発明の電子部品の実装構造は好ましくは、前記電子部品は、高周波信号が入力される。   In the electronic component mounting structure according to the present invention, preferably, a high-frequency signal is input to the electronic component.

また、本発明の電子部品の実装構造は好ましくは、前記電子部品は、矩形波の高周波信号が入力される。   In the electronic component mounting structure according to the present invention, it is preferable that a rectangular wave high-frequency signal is input to the electronic component.

また、本発明の電子部品の実装構造は好ましくは、前記電子部品は、１ＭＨｚ以上の高周波信号が入力される。   In the electronic component mounting structure of the present invention, it is preferable that a high frequency signal of 1 MHz or more is input to the electronic component.

また、本発明の電子部品の実装構造は好ましくは、前記電子部品は、電圧振幅が３Ｖ以上の高周波信号が入力される。   In the electronic component mounting structure according to the present invention, preferably, a high-frequency signal having a voltage amplitude of 3 V or more is input to the electronic component.

また、本発明の電子部品の実装構造は好ましくは、前記信号伝送線路は、電圧振幅が１００ｍＶ以下の信号が伝送される。   In the electronic component mounting structure of the present invention, it is preferable that a signal having a voltage amplitude of 100 mV or less is transmitted through the signal transmission line.

また、本発明の電子部品の実装構造は好ましくは、前記回路基板は、前記絶縁基板が樹脂から成る。   In the electronic component mounting structure according to the present invention, it is preferable that the circuit board has the insulating substrate made of a resin.

本発明の電子部品の実装構造は、絶縁基板の内部に信号伝送線路が形成されている回路基板の主面上にチップコイルから成る電子部品が実装されている電子部品の実装構造であって、電子部品は、コイルパターンが回路基板の主面に沿った面上に形成されており、回路基板は、信号伝送線路がコイルパターンの下方に位置しないように形成されていることから、高周波信号の入力によってコイルパターンにおいて発生した交流磁界による磁束は、その殆どが回路基板の絶縁基板部を通過するために、絶縁基板部でかなり減衰される。その結果、電子部品の周囲の他の電子部品に誘導電流等を生じさせて悪影響を与えることを大幅に抑制することができる。そのため、電子部品の周囲に密集させて他の電子部品を実装することが容易になる。   The electronic component mounting structure of the present invention is an electronic component mounting structure in which an electronic component consisting of a chip coil is mounted on a main surface of a circuit board in which a signal transmission line is formed inside an insulating substrate, In the electronic component, the coil pattern is formed on a surface along the main surface of the circuit board, and the circuit board is formed so that the signal transmission line is not positioned below the coil pattern. Most of the magnetic flux generated by the alternating magnetic field generated in the coil pattern by the input passes through the insulating substrate portion of the circuit board, and thus is considerably attenuated by the insulating substrate portion. As a result, it is possible to greatly suppress an adverse effect caused by causing an induced current or the like in other electronic components around the electronic component. Therefore, it becomes easy to mount other electronic components densely around the electronic components.

また、高周波信号の入力によってコイルパターンにおいて発生した交流磁界による磁束は、絶縁基板部でかなり減衰され、また、信号伝送線路がコイルパターンの下方に位置しないように形成されていることから、例えば、従来のように中間導体層に誘導電流を発生させて中間導体層と信号伝送線路との間に余分な浮遊容量を発生させ、信号伝送線路にノイズとして重畳されることが大幅に抑制される。   Further, the magnetic flux generated by the alternating magnetic field generated in the coil pattern by the input of the high frequency signal is considerably attenuated in the insulating substrate part, and the signal transmission line is formed so as not to be positioned below the coil pattern. As in the prior art, an induced current is generated in the intermediate conductor layer to generate an extra stray capacitance between the intermediate conductor layer and the signal transmission line, which is significantly suppressed from being superimposed as noise on the signal transmission line.

また、本発明の電子部品の実装構造は好ましくは、回路基板は、信号伝送線路が平面視でコイルパターンの内側に入り込まないように形成されていることから、コイルパターンにおいて発生した交流磁界による磁束の影響を信号伝送線路が受けることを、より有効に抑えることができる。   In the electronic component mounting structure according to the present invention, preferably, the circuit board is formed so that the signal transmission line does not enter the inside of the coil pattern in plan view. It is possible to more effectively suppress the signal transmission line from being affected by the above.

また、本発明の電子部品の実装構造は好ましくは、回路基板は、コイルパターンの下方の部位が絶縁基板部のみであることから、コイルパターンにおいて発生した交流磁界による磁束が絶縁基板部で減衰される効果をより向上させることができる。また、電子部品の下方に中間導体層等がないために、中間導体層等に誘導電流が発生して中間導体層等と信号伝送線路との間に余分な浮遊容量が発生し、信号伝送線路にノイズとして重畳されることが、より有効に抑制される。   In the electronic component mounting structure of the present invention, it is preferable that the circuit board has only the insulating substrate portion below the coil pattern, so that the magnetic flux generated by the AC magnetic field in the coil pattern is attenuated by the insulating substrate portion. The effect can be further improved. In addition, since there is no intermediate conductor layer or the like below the electronic component, an induced current is generated in the intermediate conductor layer or the like, and an extra stray capacitance is generated between the intermediate conductor layer or the like and the signal transmission line. Is more effectively suppressed as noise.

また、本発明の電子部品の実装構造は好ましくは、電子部品は、高周波信号が入力されることから、高周波信号の入力によってコイルパターンにおいて交流磁界による磁束が発生し、コイルパターン近傍の導体に誘導電流を発生させ易いものであり、このような高周波型電子部品に対して本発明の構成は顕著な効果を奏する。   The electronic component mounting structure of the present invention is preferably configured so that a high-frequency signal is input to the electronic component, so that a magnetic flux generated by an alternating magnetic field is generated in the coil pattern by the input of the high-frequency signal and is guided to a conductor near the coil pattern. A current is easily generated, and the configuration of the present invention has a remarkable effect on such a high-frequency electronic component.

また、本発明の電子部品の実装構造は好ましくは、電子部品は、矩形波の高周波信号が入力されることから、矩形波の高周波信号の入力によってコイルパターンにおいて鋭く変調される交流磁界による磁束が発生し、コイルパターン近傍の導体に大きな誘導電流を発生させ易いものであり、このような高周波型電子部品に対して本発明の構成は顕著な効果を奏する。   The electronic component mounting structure of the present invention is preferably configured such that a rectangular wave high-frequency signal is input to the electronic component, so that a magnetic flux generated by an alternating magnetic field that is sharply modulated in the coil pattern by the input of the rectangular wave high-frequency signal is generated. It is easy to generate a large induced current in the conductor near the coil pattern, and the configuration of the present invention has a remarkable effect on such a high-frequency electronic component.

また、本発明の電子部品の実装構造は好ましくは、電子部品は、１ＭＨｚ以上の高周波信号が入力されることから、高周波信号の入力によってコイルパターンにおいて交流磁界による磁束が発生し、コイルパターン近傍の導体に大きな誘導電流を発生させ易いものであり、このような高周波型電子部品に対してより本発明の構成は顕著な効果を奏する。   The electronic component mounting structure according to the present invention is preferably configured such that a high frequency signal of 1 MHz or more is input to the electronic component, so that a magnetic flux generated by an alternating magnetic field is generated in the coil pattern by the input of the high frequency signal, and the vicinity of the coil pattern. It is easy to generate a large induced current in the conductor, and the configuration of the present invention is more effective for such a high-frequency electronic component.

また、本発明の電子部品の実装構造は好ましくは、電子部品は、電圧振幅が３Ｖ以上の高周波信号が入力されることから、高周波信号の入力によってコイルパターンにおいて交流磁界による磁束が発生し、コイルパターン近傍の導体に大きな誘導電流を発生させ易いものであり、このような高周波型電子部品に対してより本発明の構成は顕著な効果を奏する。   In the electronic component mounting structure of the present invention, it is preferable that a high frequency signal having a voltage amplitude of 3 V or more is input to the electronic component, so that a magnetic flux generated by an alternating magnetic field is generated in the coil pattern by the input of the high frequency signal. It is easy to generate a large induced current in the conductor in the vicinity of the pattern, and the configuration of the present invention has a remarkable effect on such a high-frequency electronic component.

また、本発明の電子部品の実装構造は好ましくは、信号伝送線路は、電圧振幅が１００ｍＶ以下の信号が伝送されることから、高周波信号の入力によってコイルパターンにおいて交流磁界による磁束が発生し、コイルパターン近傍の導体に誘導電流を発生させて信号伝送線路にノイズとして重畳され易いものであり、このような高周波型電子部品に対してより本発明の構成は顕著な効果を奏する。   In the electronic component mounting structure according to the present invention, preferably, the signal transmission line transmits a signal having a voltage amplitude of 100 mV or less, so that a magnetic flux is generated by an alternating magnetic field in the coil pattern by the input of the high frequency signal, and the coil An induced current is generated in a conductor in the vicinity of the pattern and is easily superimposed as noise on the signal transmission line, and the configuration of the present invention is more effective for such a high-frequency electronic component.

また、本発明の電子部品の実装構造は好ましくは、回路基板は、絶縁基板が樹脂から成ることから、高分子構造の樹脂が、コイルパターンにおいて発生した交流磁界による磁束を減衰させる効果が高いため、上記の本発明の効果がより向上する。   In the electronic component mounting structure according to the present invention, the circuit board preferably has a high effect of attenuating the magnetic flux generated by the alternating magnetic field generated in the coil pattern because the insulating substrate is made of resin. The effects of the present invention are further improved.

本実施の形態の電子部品の実装構造について以下に詳細に説明する。   The electronic component mounting structure of the present embodiment will be described in detail below.

図１は本実施の形態の電子部品の実装構造を示す断面図である。図１において、１はチップコイルから成る電子部品、１ａは電子部品１の表面に形成され、コイルパターン５と入出力電極３ａとを電気的に接続する導電接続部、２は回路基板、３ａはコイルパターン５に高周波信号は入出力させる入出力電極、３ｂは回路基板２の他の主面側に形成された入出力電極、５はコイルパターン、６は回路基板２の内部に形成された信号伝送線路等の内層導体層である。   FIG. 1 is a sectional view showing a mounting structure of an electronic component according to the present embodiment. In FIG. 1, 1 is an electronic component comprising a chip coil, 1a is formed on the surface of the electronic component 1, and a conductive connection part for electrically connecting the coil pattern 5 and the input / output electrode 3a, 2 is a circuit board, 3a is Input / output electrodes for inputting / outputting high frequency signals to / from the coil pattern 5, 3b, input / output electrodes formed on the other main surface side of the circuit board 2, 5 a coil pattern, and 6 a signal formed inside the circuit board 2. An inner conductor layer such as a transmission line.

本実施の形態の電子部品１の実装構造は、絶縁基板の内部に信号伝送線路が形成されている回路基板２の主面上にチップコイルから成る電子部品１が実装されている電子部品１の実装構造であって、電子部品１は、コイルパターン５が回路基板２の主面に沿った面上に形成されており、回路基板２は、信号伝送線路がコイルパターン５の下方に位置しないように形成されている。   The mounting structure of the electronic component 1 according to the present embodiment is such that the electronic component 1 composed of a chip coil is mounted on the main surface of the circuit board 2 in which the signal transmission line is formed inside the insulating substrate. In the mounting structure, the electronic component 1 has a coil pattern 5 formed on a surface along the main surface of the circuit board 2, and the circuit board 2 has a signal transmission line not positioned below the coil pattern 5. Is formed.

上記の構成により、高周波信号の入力によってコイルパターン５において発生した交流磁界による磁束（図1の矢印付き破線部）は、その殆どが回路基板２の絶縁基板部を通過するために、絶縁基板部でかなり減衰される。その結果、電子部品１の周囲の他の電子部品に誘導電流等を生じさせて悪影響を与えることを大幅に抑制することができる。そのため、電子部品１の周囲に密集させて他の電子部品を実装することが容易になる。   With the above configuration, most of the magnetic flux (broken line portion with arrows in FIG. 1) generated by the alternating magnetic field generated in the coil pattern 5 by the input of the high frequency signal passes through the insulating substrate portion of the circuit board 2. Is considerably attenuated. As a result, it is possible to greatly suppress an adverse effect caused by causing an induced current or the like in other electronic components around the electronic component 1. Therefore, it becomes easy to mount other electronic components densely around the electronic component 1.

また、高周波信号の入力によってコイルパターン５において発生した交流磁界による磁束は、絶縁基板部でかなり減衰され、また、信号伝送線路がコイルパターン５の下方に位置しないように形成されていることから、例えば、従来のように中間導体層に誘導電流を発生させて中間導体層と信号伝送線路との間に余分な浮遊容量を発生させ、信号伝送線路にノイズとして重畳されることが大幅に抑制される。   Further, the magnetic flux generated by the alternating magnetic field generated in the coil pattern 5 by the input of the high frequency signal is considerably attenuated in the insulating substrate part, and the signal transmission line is formed so as not to be positioned below the coil pattern 5. For example, as in the past, an induced current is generated in the intermediate conductor layer, an extra stray capacitance is generated between the intermediate conductor layer and the signal transmission line, and it is greatly suppressed that noise is superimposed on the signal transmission line. The

本実施の形態の電子部品１は、例えば、複数のセラミック層が積層され、セラミック層間にコイルパターン５を成す導体層が形成された積層構造を有するものであり、その形状は直方体状、立方体状であり、寸法は一辺が数ｍｍ程度である。   The electronic component 1 of the present embodiment has, for example, a laminated structure in which a plurality of ceramic layers are laminated and a conductor layer that forms the coil pattern 5 is formed between the ceramic layers, and the shape thereof is a rectangular parallelepiped shape or a cubic shape. The dimension is about several mm on one side.

また、電子部品１は、セラミックスから成る基体の内部にコイルパターン５を有するものに限らず、プラスチック，ガラス，ガラスセラミックス等の絶縁体から成る基体の内部にコイルパターン５を有するものであってもよい。   Further, the electronic component 1 is not limited to the one having the coil pattern 5 inside the base made of ceramics, but may be one having the coil pattern 5 inside the base made of an insulator such as plastic, glass or glass ceramics. Good.

コイルパターン５は、セラミックのグリーンシートにＡｇ系ペーストでコイルパターンを塗布し、グリーンシートを積層して焼成したものである。コイルパターン５の厚みは５〜１５μｍ程度であり、幅は５０〜２００μｍ程度である。   The coil pattern 5 is obtained by applying a coil pattern to a ceramic green sheet with an Ag-based paste, laminating the green sheets, and firing. The coil pattern 5 has a thickness of about 5 to 15 μm and a width of about 50 to 200 μm.

電子部品１は、表面形成された、コイルパターン５に接続されている導電接続部１ａが、入出力電極３ａにハンダ等の導電接続材を介して電気的に接続される。導電接続部１ａは、Ｎｉ−Ｓｎ等の材料から成り、電子部品１の表面に電気めっき法等によって形成される。   As for the electronic component 1, the conductive connection part 1a connected to the coil pattern 5 formed on the surface is electrically connected to the input / output electrode 3a via a conductive connection material such as solder. The conductive connection portion 1a is made of a material such as Ni—Sn, and is formed on the surface of the electronic component 1 by an electroplating method or the like.

回路基板２は、電子部品１が実装される第1の主面に入出力電極３ａ、第1の主面と対向する第２の主面に入出力電極３ｂ、内部に信号伝送線路等の内層導体層６が形成されている。入出力電極３ａ、入出力電極３ｂ、内層導体層６は、Ｃｕ等の材料から成り、厚膜形成法、メッキ法等の薄膜形成法、メタライズ法等の方法によって形成される。入出力電極３ａ、入出力電極３ｂ、内層導体層６の厚みは、１０〜５０μｍ程度である。   The circuit board 2 has an input / output electrode 3a on the first main surface on which the electronic component 1 is mounted, an input / output electrode 3b on the second main surface opposite to the first main surface, and an inner layer such as a signal transmission line inside. A conductor layer 6 is formed. The input / output electrode 3a, the input / output electrode 3b, and the inner conductor layer 6 are made of a material such as Cu, and are formed by a method such as a thick film formation method, a thin film formation method such as a plating method, or a metallization method. The thickness of the input / output electrode 3a, the input / output electrode 3b, and the inner conductor layer 6 is about 10 to 50 μm.

入出力電極３ｂは、回路基板２の内部に形成された信号伝送線路に信号を入出力させるものである。   The input / output electrode 3b is for inputting / outputting a signal to / from a signal transmission line formed inside the circuit board 2.

本実施の形態の電子部品１の実装構造は、回路基板２は、信号伝送線路が平面視でコイルパターン５の内側に入り込まないように形成されていることが好ましい。この場合、コイルパターン５において発生した交流磁界による磁束の影響を信号伝送線路が受けることを、より有効に抑えることができる。   In the mounting structure of the electronic component 1 according to the present embodiment, the circuit board 2 is preferably formed so that the signal transmission line does not enter the inside of the coil pattern 5 in plan view. In this case, the signal transmission line can be more effectively suppressed from being affected by the magnetic flux generated by the alternating magnetic field generated in the coil pattern 5.

また、信号伝送線路は、電子部品１に近くなるほど平面視でコイルパターン５の内側からより離れていることが好ましい。電子部品１に近くなるほど磁束の影響を受け易くなるからである。   Further, it is preferable that the signal transmission line is further away from the inside of the coil pattern 5 in plan view as it is closer to the electronic component 1. This is because the closer to the electronic component 1, the more easily affected by the magnetic flux.

また、本実施の形態の電子部品１の実装構造は、回路基板２は、コイルパターン５の下方の部位が絶縁基板部のみであることが好ましい。この場合、コイルパターン５において発生した交流磁界による磁束が絶縁基板部で減衰される効果をより向上させることができる。また、電子部品１の下方に中間導体層等がないために、中間導体層等に誘導電流が発生して中間導体層等と信号伝送線路との間に余分な浮遊容量が発生し、信号伝送線路にノイズとして重畳されることが、より有効に抑制される。   Further, in the mounting structure of the electronic component 1 according to the present embodiment, the circuit board 2 is preferably such that the portion below the coil pattern 5 is only the insulating substrate portion. In this case, the effect that the magnetic flux generated by the alternating magnetic field generated in the coil pattern 5 is attenuated by the insulating substrate portion can be further improved. In addition, since there is no intermediate conductor layer or the like below the electronic component 1, an induced current is generated in the intermediate conductor layer or the like, and an extra stray capacitance is generated between the intermediate conductor layer or the like and the signal transmission line. It is more effectively suppressed that noise is superimposed on the line.

また、コイルパターン５の下方の絶縁基板部が、より磁界を吸収し減衰し易い樹脂等の材料から成ることが好ましい。この場合、コイルパターン５の下方に貫通孔を形成し、その貫通孔により磁界を吸収し減衰し易い樹脂等の材料を充填することができる。   Moreover, it is preferable that the insulating substrate part below the coil pattern 5 is made of a material such as a resin that absorbs a magnetic field and is easily attenuated. In this case, a through-hole can be formed below the coil pattern 5, and the through-hole can be filled with a material such as a resin that easily absorbs and attenuates the magnetic field.

また、本実施の形態の電子部品１の実装構造は、電子部品１は、高周波信号が入力されるものであることがよい。この場合、高周波信号の入力によってコイルパターン５において交流磁界による磁束が発生し、コイルパターン５近傍の導体に誘導電流を発生させ易いものであり、このような高周波型電子部品１に対して顕著な効果を奏する。   Further, in the mounting structure of the electronic component 1 according to the present embodiment, the electronic component 1 is preferably one that receives a high-frequency signal. In this case, a magnetic flux due to an alternating magnetic field is generated in the coil pattern 5 by the input of a high-frequency signal, and an induced current is easily generated in a conductor near the coil pattern 5, which is remarkable for such a high-frequency electronic component 1. There is an effect.

また、本実施の形態の電子部品１の実装構造は、電子部品１は、矩形波の高周波信号が入力されるものであることがよい。この場合、矩形波の高周波信号の入力によってコイルパターン５において鋭く変調される交流磁界による磁束が発生し、コイルパターン５近傍の導体に大きな誘導電流を発生させ易いものであり、このような高周波型電子部品１に対して本実施の形態の構成は顕著な効果を奏する。   In addition, in the mounting structure of the electronic component 1 according to the present embodiment, the electronic component 1 is preferably configured to receive a rectangular wave high-frequency signal. In this case, a magnetic flux is generated by an alternating magnetic field that is sharply modulated in the coil pattern 5 by the input of a rectangular wave high-frequency signal, and a large induced current is likely to be generated in a conductor near the coil pattern 5. The configuration of the present embodiment has a remarkable effect on the electronic component 1.

矩形波の高周波信号が入力される電子部品１は、例えば、スイッチング機能を有するものである。   The electronic component 1 to which a rectangular wave high-frequency signal is input has, for example, a switching function.

また、本実施の形態の電子部品の実装構造は、電子部品１は、１ＭＨｚ以上の高周波信号が入力されることがよい。この場合、高周波信号の入力によってコイルパターン５において交流磁界による磁束が発生し、コイルパターン５近傍の導体に大きな誘導電流を発生させ易いものであり、このような高周波型電子部品１に対して本実施の形態の構成はより顕著な効果を奏する。   In the electronic component mounting structure of the present embodiment, the electronic component 1 is preferably input with a high frequency signal of 1 MHz or more. In this case, a magnetic flux due to an alternating magnetic field is generated in the coil pattern 5 by the input of a high-frequency signal, and a large induced current is likely to be generated in a conductor near the coil pattern 5. The configuration of the embodiment has a more remarkable effect.

高周波信号の周波数の上限は特に限定されないが、チップコイルから成る電子部品１の好ましい実用的な上限値は数ＧＨｚ程度である。   The upper limit of the frequency of the high frequency signal is not particularly limited, but a preferable practical upper limit value of the electronic component 1 composed of the chip coil is about several GHz.

また、本実施の形態の電子部品の実装構造は好ましくは、電子部品は、電圧振幅が３Ｖ以上の高周波信号が入力されることから、高周波信号の入力によってコイルパターンにおいて交流磁界による磁束が発生し、コイルパターン近傍の導体に大きな誘導電流を発生させ易いものであり、このような高周波型電子部品に対して本実施の形態の構成はより顕著な効果を奏する。   Further, the electronic component mounting structure of the present embodiment is preferably such that a high frequency signal having a voltage amplitude of 3 V or more is input to the electronic component, so that a magnetic flux generated by an alternating magnetic field is generated in the coil pattern by the input of the high frequency signal. A large induced current is easily generated in the conductor near the coil pattern, and the configuration of the present embodiment has a more remarkable effect on such a high-frequency electronic component.

高周波信号の電圧振幅の上限は特に限定されないが、チップコイルから成る電子部品１の好ましい実用的な上限値は数１００Ｖ程度である。   The upper limit of the voltage amplitude of the high frequency signal is not particularly limited, but a preferable practical upper limit value of the electronic component 1 composed of the chip coil is about several hundred volts.

また、本実施の形態の電子部品の実装構造は好ましくは、信号伝送線路は、電圧振幅が１００ｍＶ以下の信号が伝送されることから、高周波信号の入力によってコイルパターンにおいて交流磁界による磁束が発生し、コイルパターン近傍の導体に誘導電流を発生させて信号伝送線路にノイズとして重畳され易いものであり、このような高周波型電子部品に対してより本実施の形態の構成は顕著な効果を奏する。   Also, the electronic component mounting structure of the present embodiment is preferably such that a signal transmission line transmits a signal having a voltage amplitude of 100 mV or less, so that a magnetic flux generated by an alternating magnetic field is generated in the coil pattern by the input of a high-frequency signal. Inductive current is generated in the conductor near the coil pattern and is easily superimposed as noise on the signal transmission line, and the configuration of the present embodiment is more effective for such high-frequency electronic components.

信号伝送線路を伝送する高周波信号の電圧振幅の下限は特に限定されないが、好ましい実用的な下限値は数μＶ程度である。   The lower limit of the voltage amplitude of the high-frequency signal transmitted through the signal transmission line is not particularly limited, but a preferable practical lower limit is about several μV.

また、本実施の形態の電子部品の実装構造は好ましくは、回路基板は、絶縁基板が樹脂から成ることから、高分子構造の樹脂が、コイルパターンにおいて発生した交流磁界による磁束を減衰させる効果が高いため、上記の効果がより向上する。高分子構造の樹脂は、磁束が通過しても、磁気双極子が発生して特定方向に配向するようなことがなく、透磁性を高めるようなことがない。逆に、磁界を吸収し減衰させることになるため、本実施の形態の効果が向上することとなる。例えば、回路基板は、絶縁基板がガラエポ基板等の樹脂から成ることがよい。   In the electronic component mounting structure of the present embodiment, the circuit board preferably has an insulating substrate made of resin, so that the polymer resin has the effect of attenuating the magnetic flux generated by the alternating magnetic field generated in the coil pattern. Since it is high, said effect improves more. Even if magnetic flux passes, the polymer resin does not generate magnetic dipoles and is not oriented in a specific direction, and does not increase permeability. Conversely, since the magnetic field is absorbed and attenuated, the effect of the present embodiment is improved. For example, in the circuit board, the insulating substrate may be made of a resin such as a glass epoxy substrate.

また、回路基板は、絶縁基板がセラミックス，ガラスセラミックス等から成っていてもよい。   In the circuit board, the insulating substrate may be made of ceramics, glass ceramics, or the like.

本実施の形態の電子部品１は、例えば、車載用のカメラモジュール等に組み込まれる回路基板に搭載されるものであるが、車載用のカメラモジュール等に限らず、種々の電気製品、電子製品の回路基板に搭載され得る。   The electronic component 1 of the present embodiment is mounted on, for example, a circuit board incorporated in an in-vehicle camera module or the like, but is not limited to an in-vehicle camera module or the like. It can be mounted on a circuit board.

本実施の形態の電子部品の実装構造の実施例について以下に説明する。   Examples of the electronic component mounting structure of the present embodiment will be described below.

図１に示す電子部品の実装構造における各部品を以下のようにして作製した。   Each component in the electronic component mounting structure shown in FIG. 1 was produced as follows.

＜電子部品＞
アルミナセラミックスから成るセラミック層を１６層積層した積層構造を有する絶縁基体の内層に、Ａｇ系から成る螺旋状のコイルパターン５を、メタライズ法により形成した電子部品１を作製した。コイルパターン５は、セラミック層間に形成された方形状で環状の導体パターンをビアホール等の貫通導体で接続して螺旋状にしたものである。コイルパターン５を成す導体パターンの厚みは１８μｍ、幅は１５０μｍとした。 <Electronic parts>
An electronic component 1 was produced in which a spiral coil pattern 5 made of Ag was formed on the inner layer of an insulating base having a laminated structure in which 16 ceramic layers made of alumina ceramics were laminated. The coil pattern 5 is a spiral shape in which rectangular and circular conductor patterns formed between ceramic layers are connected by through conductors such as via holes. The conductor pattern forming the coil pattern 5 had a thickness of 18 μm and a width of 150 μm.

電子部品１の表面に、コイルパターン５と入出力電極３ａとを電気的に接続するためのＮｉ−Ｓｎから成る導電接続部１ａを、メタライズ法によって形成した。   On the surface of the electronic component 1, a conductive connection portion 1a made of Ni—Sn for electrically connecting the coil pattern 5 and the input / output electrode 3a was formed by a metallization method.

コイルパターン５は、回路基板２の主面（第1の主面）に沿った面上に形成されており、図1のように磁束が上下方向に周回するものとした。   The coil pattern 5 is formed on a surface along the main surface (first main surface) of the circuit board 2, and the magnetic flux circulates in the vertical direction as shown in FIG.

＜回路基板＞
樹脂から成る多層構造の絶縁基板を有し、電子部品１側の第１の主面に入出力電極３ａが形成され、第１の主面に対向する第２の主面に入出力電極３ｂが形成され、内部に信号伝送線路を含む内層導体層６が形成された回路基板２を準備した。 <Circuit board>
It has an insulating substrate with a multilayer structure made of resin, the input / output electrode 3a is formed on the first main surface on the electronic component 1 side, and the input / output electrode 3b is formed on the second main surface opposite to the first main surface. A circuit board 2 was prepared, on which an inner layer conductor layer 6 including a signal transmission line was formed.

入出力電極３ａ，３ｂはＣｕから成り、露光エッチング法によって形成した。入出力電極３ａ，３ｂの厚みは３５μｍ程度とした。内層導体層６はＣｕから成り、露光エッチング法によって形成した。内層導体層６の厚みは１８μｍ程度とした。   The input / output electrodes 3a and 3b are made of Cu and formed by exposure etching. The thickness of the input / output electrodes 3a and 3b was about 35 μm. The inner conductor layer 6 was made of Cu and formed by an exposure etching method. The thickness of the inner conductor layer 6 was about 18 μm.

また、回路基板２は、信号伝送線路がコイルパターン５の下方に位置しないように形成し、また、信号伝送線路が平面視でコイルパターン５の内側に入り込まないように形成した。さらに、回路基板２におけるコイルパターン５の下方の部位が絶縁基板部のみであるようにした。   The circuit board 2 is formed so that the signal transmission line is not positioned below the coil pattern 5, and is formed so that the signal transmission line does not enter the coil pattern 5 in plan view. Further, the part below the coil pattern 5 in the circuit board 2 is only the insulating board part.

電子部品１に、周波数１ＭＨｚ、電圧振幅６Ｖの矩形波の高周波信号を入力し、回路基板２内部の信号伝送線路に周波数４ＭＨｚ、電圧振幅１０ｍＶの高周波信号を伝送させた。このとき、電子部品１のコイルパターン５のインダクタンスは１１．３３μＨであり、信号伝送線路に重畳されたノイズのＳ／Ｎ比は−６０ｄＢと低い値であった。   A rectangular wave high-frequency signal having a frequency of 1 MHz and a voltage amplitude of 6 V was input to the electronic component 1, and a high-frequency signal having a frequency of 4 MHz and a voltage amplitude of 10 mV was transmitted to the signal transmission line inside the circuit board 2. At this time, the inductance of the coil pattern 5 of the electronic component 1 was 11.33 μH, and the S / N ratio of noise superimposed on the signal transmission line was a low value of −60 dB.

（比較例１）
図２に示す電子部品の実装構造における各部品を以下のようにして作製した。 (Comparative Example 1)
Each component in the electronic component mounting structure shown in FIG. 2 was produced as follows.

＜電子部品＞
コイルパターン５は、回路基板２の主面（第1の主面）に垂直な面上に形成されており、図２のように磁束が横方向に周回するものとした。他の構成は実施例と同様とした。 <Electronic parts>
The coil pattern 5 is formed on a surface perpendicular to the main surface (first main surface) of the circuit board 2, and the magnetic flux circulates in the lateral direction as shown in FIG. Other configurations were the same as in the example.

＜回路基板＞
実施例と同様の構成とした。 <Circuit board>
The configuration was the same as in the example.

電子部品１に、周波数１ＭＨｚ、電圧振幅３Ｖの矩形波の高周波信号を入力し、回路基板２内部の信号伝送線路に周波数４ＭＨｚ、電圧振幅１０ｍＶの高周波信号を伝送させた。このとき、電子部品１のコイルパターン５のインダクタンスは１１．４０μＨであり、信号伝送線路に重畳されたノイズのＳ／Ｎ比は−６０ｄＢであった。   A rectangular high-frequency signal having a frequency of 1 MHz and a voltage amplitude of 3 V was input to the electronic component 1, and a high-frequency signal having a frequency of 4 MHz and a voltage amplitude of 10 mV was transmitted to the signal transmission line inside the circuit board 2. At this time, the inductance of the coil pattern 5 of the electronic component 1 was 11.40 μH, and the S / N ratio of noise superimposed on the signal transmission line was −60 dB.

また、電子部品１のコイルパターン５による磁束が大部分横方向の空間に広がるため、電子部品１の周囲に他の電子部品を実装することが難しくなり、実施例に比較して、電子部品の実装密度が５％程度低下した。   In addition, since the magnetic flux generated by the coil pattern 5 of the electronic component 1 spreads mostly in the lateral space, it is difficult to mount other electronic components around the electronic component 1. The mounting density decreased by about 5%.

（比較例２）
図３に示す電子部品の実装構造における各部品を以下のようにして作製した。 (Comparative Example 2)
Each component in the electronic component mounting structure shown in FIG. 3 was produced as follows.

＜電子部品＞
実施例と同様の構成とした。 <Electronic parts>
The configuration was the same as in the example.

＜回路基板＞
信号伝送線路がコイルパターン５の下方に位置するように形成した。その他の構成は実施例と同様とした。 <Circuit board>
The signal transmission line was formed so as to be positioned below the coil pattern 5. Other configurations were the same as in the example.

電子部品１に、周波数１ＭＨｚ、電圧振幅３Ｖの矩形波の高周波信号を入力し、回路基板２内部の信号伝送線路に周波数４ＭＨｚ、電圧振幅１０ｍＶの高周波信号を伝送させた。このとき、電子部品１のコイルパターン５のインダクタンスは９．５３μＨであり、信号伝送線路に重畳されたノイズのＳ／Ｎ比は−５０ｄＢであった。   A rectangular high-frequency signal having a frequency of 1 MHz and a voltage amplitude of 3 V was input to the electronic component 1, and a high-frequency signal having a frequency of 4 MHz and a voltage amplitude of 10 mV was transmitted to the signal transmission line inside the circuit board 2. At this time, the inductance of the coil pattern 5 of the electronic component 1 was 9.53 μH, and the S / N ratio of noise superimposed on the signal transmission line was −50 dB.

（比較例３）
図４に示す電子部品の実装構造における各部品を以下のようにして作製した。 (Comparative Example 3)
Each component in the electronic component mounting structure shown in FIG. 4 was produced as follows.

＜電子部品＞
コイルパターン５は、回路基板２の主面（第１の主面）に垂直な面上に形成されており、図４のように磁束が横方向に周回するものとした。他の構成は実施例と同様とした。 <Electronic parts>
The coil pattern 5 is formed on a surface perpendicular to the main surface (first main surface) of the circuit board 2, and the magnetic flux circulates in the lateral direction as shown in FIG. Other configurations were the same as in the example.

＜回路基板＞
信号伝送線路がコイルパターン５の下方に位置するように形成した。その他の構成は実施例と同様とした。 <Circuit board>
The signal transmission line was formed so as to be positioned below the coil pattern 5. Other configurations were the same as in the example.

電子部品１に、周波数１ＭＨｚ、電圧振幅３Ｖの矩形波の高周波信号を入力し、回路基板２内部の信号伝送線路に周波数４ＭＨｚ、電圧振幅１０ｍＶの高周波信号を伝送させた。このとき、電子部品１のコイルパターン５のインダクタンスは１１．３３μＨであり、信号伝送線路に重畳されたノイズのＳ／Ｎ比は−６０ｄＢであった。   A rectangular high-frequency signal having a frequency of 1 MHz and a voltage amplitude of 3 V was input to the electronic component 1, and a high-frequency signal having a frequency of 4 MHz and a voltage amplitude of 10 mV was transmitted to the signal transmission line inside the circuit board 2. At this time, the inductance of the coil pattern 5 of the electronic component 1 was 11.33 μH, and the S / N ratio of noise superimposed on the signal transmission line was −60 dB.

また、電子部品１のコイルパターン５による磁束が大部分横方向の空間に広がるため、電子部品１の周囲に他の電子部品を実装することが難しくなり、実施例に比較して、電子部品の実装密度が５％程度低下した。   In addition, since the magnetic flux generated by the coil pattern 5 of the electronic component 1 spreads mostly in the lateral space, it is difficult to mount other electronic components around the electronic component 1. The mounting density decreased by about 5%.

本実施の形態の電子部品の実装構造を示す断面図である。It is sectional drawing which shows the mounting structure of the electronic component of this Embodiment. 比較例１の電子部品の実装構造を示す断面図である。6 is a cross-sectional view showing a mounting structure of an electronic component of Comparative Example 1. FIG. 比較例２の電子部品の実装構造を示す断面図である。10 is a cross-sectional view showing a mounting structure of an electronic component of Comparative Example 2. FIG. 比較例３の電子部品の実装構造を示す断面図である。10 is a cross-sectional view showing a mounting structure of an electronic component of Comparative Example 3. FIG.

符号の説明Explanation of symbols

１：電子部品
１ａ：導電接続部
２：回路基板
３ａ，３ｂ：入出力電極
５：コイルパターン
６：内層導体層 1: Electronic component 1a: Conductive connection portion 2: Circuit boards 3a, 3b: Input / output electrodes 5: Coil pattern 6: Inner layer conductor layer

Claims (8)

絶縁基板の内部に信号伝送線路を有する回路基板の主面上にチップコイルから成る電子部品が実装されている電子部品の実装構造であって、前記電子部品は、コイルパターンが前記回路基板の主面に沿った面上に形成されており、前記回路基板は、前記信号伝送線路が平面視で前記コイルパターンの内側に入り込んでおらず、かつ、その端部が平面視で前記コイルパターンの内側と一致するように形成されている電子部品の実装構造。 An electronic component mounting structure in which an electronic component comprising a chip coil is mounted on a main surface of a circuit board having a signal transmission line inside an insulating substrate, the coil pattern of the electronic component being a main pattern of the circuit board. The circuit board is formed on a plane along the plane, and the signal transmission line does not enter the inside of the coil pattern in a plan view, and an end portion of the circuit board is inside the coil pattern in a plan view. The mounting structure of the electronic component that is formed to match . 前記回路基板は、前記コイルパターンの下方の部位が絶縁基板部のみである請求項１に記載の電子部品の実装構造。 2. The electronic component mounting structure according to claim 1, wherein the circuit board includes only an insulating substrate portion below the coil pattern. 前記電子部品は、高周波信号が入力される請求項１または請求項２に記載の電子部品の実装構造。 The electronic component mounting structure of an electronic component according to claim 1 or claim 2 RF signal is input. 前記電子部品は、矩形波の高周波信号が入力される請求項３に記載の電子部品の実装構造。 The electronic component mounting structure according to claim 3 , wherein a rectangular wave high-frequency signal is input to the electronic component. 前記電子部品は、１ＭＨｚ以上の高周波信号が入力される請求項３または請求項４に記載の電子部品の実装構造。 The electronic component mounting structure of an electronic component according to claim 3 or claim 4 or more high-frequency signal 1MHz is inputted. 前記電子部品は、電圧振幅が３Ｖ以上の高周波信号が入力される請求項３乃至５のいずれかに記載の電子部品の実装構造。 The electronic component mounting structure of an electronic component according to any one of claims 3 to 5 a voltage amplitude higher frequency signal 3V is inputted. 前記信号伝送線路は、電圧振幅が１００ｍＶ以下の信号が伝送される請求項１乃至６のいずれかに記載の電子部品の実装構造。 Said signal transmission line, the mounting structure of an electronic component according to any of claims 1 to 6 the voltage amplitude following signals 100mV is transmitted. 前記回路基板は、前記絶縁基板が樹脂から成る請求項１乃至請求項７のいずれかに記載の電子部品の実装構造。 The circuit board, the mounting structure of the electronic component according to any of claims 1 to 7 wherein the insulating substrate is made of resin.
JP2008170208A 2008-06-30 2008-06-30 Electronic component mounting structure Expired - Fee Related JP5178351B2 (en)

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