KR102551243B1 - Coil component - Google Patents

Abstract

A coil component according to an embodiment of the present invention includes a body including a plurality of insulation layers including a coil pattern, and the coil pattern includes a coil unit, a lead-out unit disposed on one side of the insulation layer, and connecting the coil unit and the lead-out unit. A pattern line of the coil unit has an arc shape, and the connection unit is formed in a tangential direction of the coil unit at one end of the drawing unit.

Description

Coil component {COIL COMPONENT}

The present invention relates to coil components.

In the case of a recent smart phone, a signal of a wide frequency band is used. Coil parts are mainly used as an impedance matching circuit in a radio frequency system for transmitting/receiving high-frequency signals, and the use of such high-frequency coil parts continues to increase.

Coil parts are required to be usable at a high frequency of 100 MHz or more due to a self resonance frequency (SRF) and low specific resistance in a high frequency band based on miniaturization. In addition, a high Q (quality factor) characteristic is required to reduce loss at the device frequency.

In the case of coil parts, since a high Q (quality factor) is being implemented using a material with low resistivity through a thin film (photolitho) method, the characteristics of the material are absolute. However, in order to implement high quality factor (Q) characteristics when using the same material, optimization of the shape or structure of the coil part is required.

Korea Patent Registration No. 10-1396649 Korean Registered Patent Publication No. 10-1532148

The present invention relates to a coil component capable of improving Q characteristics by changing the shape of a coil.

An embodiment of the present invention includes a body including a plurality of insulating layers including a coil pattern, and the coil pattern includes a coil part, a drawing part disposed on one side of the insulating layer, and a connection part connecting the coil part and the drawing part. The pattern line of the coil part has an arc shape, and the connection part provides a coil part formed in a tangential direction of the coil part at one end of the drawing part.

According to an embodiment of the present invention, the Q characteristic can be improved by lowering the resistance of the inductor.

1 is a perspective view schematically illustrating a coil component according to an embodiment of the present invention.
2 is a cross-sectional view showing the shape of a coil pattern of a coil component according to various embodiments of the present disclosure.
3 is a plan view schematically illustrating the shape of a coil pattern formed on an insulating layer according to an embodiment of the present invention.
FIG. 4 is a diagram illustrating positions of forming vias in the coil component of FIG. 2 .
5A and 5B are perspective views schematically illustrating a coil component according to a comparative example of the present invention.
6 is a process chart showing a method of manufacturing a coil component according to an embodiment of the present invention.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. The shapes and sizes of elements in the drawings may be exaggerated for clarity.

The Q characteristic of the coil component improves as the inductance increases and the resistance decreases.

Accordingly, the present invention intends to improve the Q characteristic by reducing the resistance of coil components, and proposes an optimal coil shape for this purpose.

Hereinafter, coil components according to the present invention will be described.

1 is a schematic perspective view of a coil component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing the shape of a coil pattern of a coil component according to various embodiments of the present invention, and FIG. It is a plan view schematically showing the shape of the coil pattern formed on the insulating layer according to the embodiment.

1 to 3 , a coil component 100 according to an embodiment of the present invention includes a body 110 including a plurality of insulating layers 111 including a coil pattern, and a coil pattern 122 , 122) includes coil parts 121a and 122a, lead-out parts 121c and 122c disposed on one side of the insulating layer, and connection parts 121b and 122b connecting the coil part and the lead-out part, and the pattern line of the coil part is It has an arc shape, and the connecting portion is formed in a tangential direction of the coil portion at one end of the lead portion.

The body 110 is formed by stacking a plurality of insulating layers. The plurality of insulating layers forming the body 110 are in a sintered state, and the boundary between adjacent insulating layers may be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM).

The body 110 may have a hexahedral shape, and includes upper and lower surfaces, a side surface connecting the upper surface and the lower surface, and a cross section connecting the upper and lower surfaces and the side surface. If the direction of the hexahedron is defined in order to clearly explain the embodiment of the present invention, L, W and T shown in FIG. 1 represent the longitudinal direction, width direction, and thickness direction, respectively.

The body 110 may be made of ferrite, for example, Mn-Zn-based ferrite, Ni-Zn-based ferrite, Ni-Zn-Cu-based ferrite, Mn-Mg-based ferrite, Ba-based ferrite, Li-based ferrite, and the like. It may be, but is not limited thereto.

The coil patterns 121 and 122 may be formed by printing a conductive paste containing a conductive metal to a predetermined thickness on the plurality of insulating layers 111 forming the body 110 .

The conductive metal forming the coil pattern is not particularly limited as long as it has excellent electrical conductivity, and examples thereof include silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold ( Au), copper (Cu), or platinum (Pt) may be used alone or in a mixed form.

The coil patterns 121 and 122 include coil parts 121a and 122a, lead parts 121c and 122c disposed on one side of the insulating layer, and connecting parts 121b and 122b connecting the coil part and the lead part. .

The coil pattern may include a first coil pattern 121 exposed on one side of the body 110 in the longitudinal direction and a second coil pattern 122 exposed on the other side in the longitudinal direction and having a polarity different from that of the first coil pattern. can

The first coil pattern 121 includes a first coil unit, a first lead-out portion 121c exposed on a plane perpendicular to the laminated surface of the body 110, and connecting the first coil portion and the first lead-out portion. The second coil pattern 122 has a first connecting portion, and the second coil pattern 122 has a second coil portion, a second lead-out portion 122c exposed in a plane perpendicular to the laminated surface of the body 110, and the first coil portion. 1 has a first connecting portion connecting the lead-out portion.

For example, the first and second lead-out portions 121c and 122c may be exposed to one side and the other side in the longitudinal direction L of the body 110 perpendicular to the stacked surface of the insulating layer to be stacked.

In addition, the first and second lead-out portions 121c and 122c are also exposed to the lower surface of the body 110, which is a board mounting surface. That is, the first and second lead-out portions are formed on one lower side and the other lower side of the insulating layer, respectively, and the first and second lead-out portions may have an L-shape in a cross section of the body 110 in the length-thickness direction. .

The connection part is formed in a tangential direction of the coil part at one end of the drawing part, and may come into contact with an upper portion of the coil part.

That is, the first connection part is formed in a tangential direction of the first coil part at one end of the first lead-out part formed on one side of the insulating layer, and the second connection part is formed on tartan of the second lead-out part formed on the other side of the insulating layer. It is formed in a tangential direction of the second coil part.

Since the drawing part is exposed to the lower surface of the body, the connection part has a structure that can form the shortest distance between the drawing part and the coil part, that is, is formed in a tangential direction of the coil part at one end of the drawing part.

When the connection part is formed in the tangential direction of the coil part, since the corner of the connection part and the drawing part is formed at an obtuse angle, resistance of the entire coil pattern can be reduced and Q characteristics can be improved.

A via 145 is formed at a predetermined position in each insulating layer including the coil pattern, and the first and second coil patterns formed in each insulating layer are electrically interconnected through the via to form one coil. can form

The via 145 may be formed within a pattern line of the coil part.

In the case of the via 145, a via pad (not shown) may be disposed and connected for stable via connection and alignment between patterns. The via pad may be larger than the width of the coil pattern.

In the case of the via pad, it may be formed around the pattern line of the coil part, or may be formed inside or outside the coil part, but is not limited thereto.

The via 145 may be formed by forming a through hole using a mechanical drill or a laser drill, and then filling the through hole with a conductive material through plating.

The via 145 includes a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd), or an alloy thereof. can include

At this time, as the plurality of insulating layers 111 including coil patterns are laminated in the width direction (W) or length direction (L) of the body 110, the first and second coil patterns 121 and 122 are It may be disposed in a vertical direction with respect to the board mounting surface of the body 110 . That is, the coil patterns may be disposed in a vertical direction on the upper and lower surfaces of the body.

5A and 5B are perspective views schematically illustrating a coil component according to a comparative example of the present invention.

Referring to FIGS. 5A and 5B , coil patterns 212 and 222 of the coil component 200 according to the comparative example have a rectangular shape. However, when the coil pattern has a polygonal shape with corners, the corners of the coil pattern have a higher current density than other portions. Therefore, in the case of the comparative example, the resistance of the coil part itself increases due to the existence of the corner, and thus the Q characteristics may be deteriorated.

Referring to FIG. 2 , in the coil part 100 according to the present invention, since the pattern lines of the coil parts 121a and 122a of the coil pattern have an arc shape without corners, the resistance of the coil part can be lowered, resulting in Q characteristics can improve

The pattern lines of the coil units 121a and 122a may have any one of a circular shape, an elliptical shape, and a track shape.

FIG. 4 is a diagram illustrating positions of forming vias in the coil component of FIG. 2 . A portion marked with a dotted line in FIG. 3 indicates a via formation position.

Referring to (a) and (b) of FIG. 4 , when the pattern lines of the coil part have a circular or elliptical shape, the vias 145 may be positioned at equal intervals of 45° (A).

As the distance between the coil pattern and the external electrode increases, the influence of parasitic capacitance or current flow generated between the coil pattern and the external electrode can be prevented, so that the via is formed so as not to be adjacent to the external electrode.

When a via is formed in an area of the pattern line of the coil part that contacts a diagonal line connecting the edge of the body, a via pad for connecting the via may be formed inside the coil part, and the via pad formed in the other area may be formed around a pattern line of the coil part or may be formed outside the coil part.

Referring to (c) of FIG. 4 , when the pattern lines of the coil unit have a track shape, the vias 145 may be located at equal intervals of 90° and at points where straight lines and curves meet (A, B ).

In particular, when the pattern line of the coil part has a track shape, the via 145 may be disposed in a straight section in the coil part. When the vias are formed in the straight section of the coil part (A), more vias can be formed within the allowable space than in the case where the vias are formed in the curved section (B) of the coil part. defects can be reduced.

As the allowable space for arranging vias in a certain region of the coil pattern becomes wider, the number of turns available in a coil pattern of one layer may increase. Due to this, when implementing a specific number of turns of a coil, even if the number of stacked coil layers is reduced, the capacity can be realized by satisfying the number of turns of the coil, so the resistance can be lowered and the Q characteristic can be improved because space utilization is high with a small number of layers. there is. In addition, since the number of coil turns is implemented even if the number of coil layers is small, the process can be simplified.

For example, in a structure in which only two vias can be disposed in one coil pattern, the number of turns of the coil pattern in one layer may be a maximum of 1/2 turn. However, in the case of a structure in which five or more vias can be disposed, the number of turns that a coil pattern can have may increase.

Therefore, when the pattern line of the coil part is track-shaped, the number of vias that can be disposed in a straight section is greater than that of a circular or elliptical section, and the number of turns of the coil pattern can be increased more than that of a circular or elliptical section, resulting in improved resistance and Q characteristics. Coil parts can be secured.

When the pattern line of the coil part is track-shaped, a plurality of vias may be arranged at equal intervals in a straight section, and the number of vias may be 3 to 5, but is not limited thereto.

Table 1 below shows comparison of product characteristics of the coil component according to the embodiment of FIG. 1 and the coil component according to the comparative example of FIG. 4A. For reference, the rest of the design rules except for the line width were the same, and only the coil shape was changed, and both were designed with the same inductance capacity for smooth comparison.

Inductance (L;nH) Q Rs(Ω) Rs(Ω) Rate of change (0.5, 2.4Hz) 0.5 2.4 0.5 2.4 0.5 2.4 0.001 %L %Q %Rs %Rdc comparative example 0.62 0.61 23.96 51.35 0.08 0.18 0.018 0.0% 0.0% 0.0% 0.0% Example 0.62 0.61 24.96 54.69 0.08 0.17 0.020 -0.1% 6.5% -5.9% 12.9%

Referring to Table 1, it can be seen that the Q characteristic of the coil component according to an embodiment of the present invention is improved by about 6.5% when compared to the coil component according to the comparative example, even though the inductance capacity is the same.

According to one embodiment of the present invention, the body 110 may further include a dummy lead-out portion 123 disposed on a plurality of insulating layers and exposed to the outside.

The dummy lead-out part 123 may be included in the body 110 by forming a pattern having the same shape as the first and second lead-out parts 121c and 122c on a plurality of insulating layers.

The dummy lead part 123 may be connected to the first and second coil patterns 121 and 122 through first and second dummy vias (not shown), and the first and second coil patterns may be parallel to each other. can be connected with

That is, the body according to an embodiment of the present invention is formed by adjacently stacking a plurality of insulating layers on which the first and second coil patterns 121 and 122 are formed and a plurality of insulating layers on which the dummy lead-out part 123 is formed. (110) can be implemented.

The plurality of insulating layers on which the dummy lead-out parts 123 are formed are stacked adjacent to the plurality of insulating layers on which the first and second coil patterns 121 and 122 are formed, so that the side surfaces and lower surfaces of the body 110 in the longitudinal direction are formed. Since a larger number of metal bonds may occur with the external electrodes 131 and 132 disposed, the adhesive strength between the first and second coil patterns and the external electrodes and between the electronic component and the printed circuit board may be improved. .

In the multilayer electronic component according to an embodiment of the present invention, the first external electrode 131 disposed on one side surface and the lower surface in the longitudinal direction of the body 110 and connected to the first lead-out portion 121c and the other side surface in the longitudinal direction and a second external electrode 132 disposed on the lower surface and connected to the second lead-out portion 122c.

The first external electrode 131 and the second external electrode 132 are connected to the first and second lead portions 121c and 122c of the first and second coil patterns 121 and 122, respectively. It may be formed on a surface perpendicular to the lower surface and the laminated surface of the body 110, particularly on the other side facing one side in the longitudinal direction of the body 110.

The first external electrode 131 and the second external electrode 132 are not particularly limited as long as they are metals that can be plated, and may be, for example, nickel (Ni) or tin (Sn) alone or in a mixed form.

Hereinafter, a method for manufacturing a coil component according to the present invention will be described.

6 is a process chart showing a method of manufacturing a coil component according to an embodiment of the present invention.

Referring to FIG. 6 , a method of manufacturing a coil component according to an embodiment of the present invention includes forming an insulating layer including a coil pattern and forming a body by collectively stacking the insulating layer including the coil pattern. , The coil pattern includes a coil part, a drawing part disposed on one side of the insulating layer, and a connection part connecting the coil part and the drawing part, the pattern line of the coil part has an arc shape, and the connection part is at one end of the drawing part. is formed in the tangential direction of

First, a coil pattern may be formed on a substrate.

The substrate may be a resin or a copper clad laminate (CCL) in which copper foil is clad on the resin so that a circuit board can be used, but is not limited thereto.

The resin may be a phenol resin, an epoxy resin, polyester, or polyimide.

A coil pattern may be formed on the substrate by plating a conductive metal using a photosensitive film.

The conductive metal is not particularly limited as long as it is a metal having excellent electrical conductivity. For example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper ( Cu) or platinum (Pt) may be used alone or in a mixed form, for example, copper (Cu), but is not limited thereto.

The coil pattern includes a coil part, a lead part disposed on one side of the insulating layer, and a connection part connecting the coil part and the lead part.

The pattern line of the coil part has an arc shape, and may have, for example, any one of a circular shape, an elliptical shape, and a track shape.

The lead-out portion may be formed below one side of the insulating layer and may have an L-shape.

The connection part is formed in a tangential direction of the coil part at one end of the drawing part, and may come into contact with an upper portion of the coil part.

Next, an insulating layer including a coil pattern is formed.

An insulating layer including the coil pattern is formed by bonding an insulating material on the coil pattern.

The insulating material may be formed to cover the exposed coil pattern on the substrate.

The insulating material used for preparing the insulating layer is not particularly limited as a magnetic material, and examples thereof include Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite, Li A known ferrite powder such as ferrite-based ferrite can be used.

A plurality of insulating layers may be provided by applying and drying the slurry formed by mixing the magnetic material and the organic material on a carrier film.

Next, vias are formed in the insulating layer including the coil pattern.

To connect the coil patterns, vias are formed.

The via 45 may be formed by forming a through hole using a mechanical drill or a laser drill, and then filling the through hole with a conductive material through plating.

The via 45 includes a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd), or an alloy thereof. can include

As will be described later, the coil patterns are formed into coils in a step of forming a body by stacking them.

Afterwards, the insulating layer may be separated from the substrate.

Next, a body is formed by collectively stacking the insulating layer including the coil pattern.

A plurality of insulating layers separated from the substrate may be stacked to form a body including a lower surface and a coil in which a lead portion is exposed in a plane perpendicular to the laminated surface.

Vias may be formed between the coil patterns, and coil patterns formed on each insulating layer may be electrically interconnected through the vias to form one coil.

The lead-out portion of the coil pattern formed of one coil may be exposed on a surface perpendicular to the lower surface of the body and the laminated surface.

Meanwhile, the coil pattern may be formed in a direction perpendicular to the board mounting surface of the body.

Next, external electrodes connected to the lead-out portions of the coil patterns may be formed on a surface perpendicular to the lower surface of the body and the laminated surface.

The external electrode may be formed using a conductive paste containing a metal having excellent electrical conductivity or may be formed by metal plating, and the metal may be nickel (Ni), tin (Sn) alone, or an alloy thereof.

Other features identical to those of the above-described multilayer electronic component according to an embodiment of the present invention will be omitted here.

The present invention is not intended to be limited by the foregoing embodiments and accompanying drawings, but is intended to be limited by the appended claims.

Therefore, various forms of substitution, modification, and change will be possible by those skilled in the art within the scope of the technical spirit of the present invention described in the claims, which also falls within the scope of the present invention. something to do.

100: coil part
110: body
121, 122: coil pattern
123: dummy draw-out unit
131, 132: external electrode
145 Via

Claims (14)

a body including a plurality of insulating layers including a coil pattern; Including,
The coil pattern includes a coil part, a drawing part disposed on one side of the insulating layer, and a connection part connecting the coil part and the drawing part,
The pattern line of the coil part has an arc shape,
The connection part extends from the outer end of the coil part along the tangential line of the arc shape and is connected to the lead part at the shortest distance.
coil parts.
According to claim 1,
The coil part pattern line of the coil part has a shape of any one of a circular shape, an elliptical shape, and a track shape.
According to claim 1,
The lead-out part is formed below one side of the insulating layer and has an L-shape.
According to claim 1,
The coil part in contact with the upper part of the coil part.
According to claim 1,
The coil pattern is a coil component connected by vias.
According to claim 5,
The pattern line of the coil part has a track-like shape,
The via is disposed in a straight section in the coil part.
According to claim 1,
The body includes an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface,
The coil pattern is a coil component laminated in a vertical direction on the upper and lower surfaces.
According to claim 1,
A coil component including external electrodes electrically connected to the coil pattern and disposed on a lower surface and a portion of a side surface of the body.
According to claim 8,
The external electrode is an L-shaped coil component.
forming an insulating layer including a coil pattern; and
forming a body by collectively stacking insulating layers including the coil patterns; Including,
The coil pattern includes a coil part, a drawing part disposed on one side of the insulating layer, and a connection part connecting the coil part and the drawing part,
The pattern line of the coil part has an arc shape,
The connection part extends from an outer end of the coil part along a tangential line of the arc shape and is connected to the lead part by the shortest distance.
According to claim 10,
The method of manufacturing a coil part in which the pattern line of the coil part has any one of a circular shape, an elliptical shape, and a track shape.
According to claim 10,
The lead-out part is formed below one side of the insulating layer and has an L-shape.
According to claim 10,
The coil pattern is a method of manufacturing a coil component connected by a via.
According to claim 13,
The pattern line of the coil part has a track-like shape,
The via is disposed in a straight section in the coil part manufacturing method of the coil part.

Images