JP5168930B2 - 圧電振動子、発振器 - Google Patents
圧電振動子、発振器 Download PDFInfo
- Publication number
- JP5168930B2 JP5168930B2 JP2007034393A JP2007034393A JP5168930B2 JP 5168930 B2 JP5168930 B2 JP 5168930B2 JP 2007034393 A JP2007034393 A JP 2007034393A JP 2007034393 A JP2007034393 A JP 2007034393A JP 5168930 B2 JP5168930 B2 JP 5168930B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric thin
- thin film
- piezoelectric
- arm
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005284 excitation Effects 0.000 claims description 24
- 239000010409 thin film Substances 0.000 description 211
- 239000013078 crystal Substances 0.000 description 127
- 239000010408 film Substances 0.000 description 74
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 30
- 239000010453 quartz Substances 0.000 description 28
- 239000000463 material Substances 0.000 description 26
- 230000008859 change Effects 0.000 description 21
- 238000000034 method Methods 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 11
- 239000003990 capacitor Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 230000005684 electric field Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000008602 contraction Effects 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007034393A JP5168930B2 (ja) | 2007-02-15 | 2007-02-15 | 圧電振動子、発振器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007034393A JP5168930B2 (ja) | 2007-02-15 | 2007-02-15 | 圧電振動子、発振器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008199440A JP2008199440A (ja) | 2008-08-28 |
| JP2008199440A5 JP2008199440A5 (enExample) | 2010-03-18 |
| JP5168930B2 true JP5168930B2 (ja) | 2013-03-27 |
Family
ID=39757975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007034393A Expired - Fee Related JP5168930B2 (ja) | 2007-02-15 | 2007-02-15 | 圧電振動子、発振器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5168930B2 (enExample) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5832335Y2 (ja) * | 1977-11-11 | 1983-07-18 | キンセキ株式会社 | 音叉形圧電振動子 |
| JPS5549020A (en) * | 1978-10-04 | 1980-04-08 | Seiko Instr & Electronics Ltd | Piezoelectric vibrator |
| JPS5699929U (enExample) * | 1979-12-28 | 1981-08-06 | ||
| JPS5853215A (ja) * | 1981-09-25 | 1983-03-29 | Seiko Instr & Electronics Ltd | 音叉型水晶振動子 |
| JP2003347885A (ja) * | 2002-05-29 | 2003-12-05 | Seiko Epson Corp | 圧電振動片、圧電振動片の製造方法および圧電デバイス |
| JP4211578B2 (ja) * | 2003-11-13 | 2009-01-21 | セイコーエプソン株式会社 | 圧電振動片とその製造方法、ならびに圧電デバイスおよび圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器 |
-
2007
- 2007-02-15 JP JP2007034393A patent/JP5168930B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008199440A (ja) | 2008-08-28 |
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