JP5167010B2 - 研磨終点検知方法および研磨装置 - Google Patents

研磨終点検知方法および研磨装置 Download PDF

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JP5167010B2
JP5167010B2 JP2008189869A JP2008189869A JP5167010B2 JP 5167010 B2 JP5167010 B2 JP 5167010B2 JP 2008189869 A JP2008189869 A JP 2008189869A JP 2008189869 A JP2008189869 A JP 2008189869A JP 5167010 B2 JP5167010 B2 JP 5167010B2
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light
polishing
end point
angle
substrate
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JP2010023210A (ja
JP2010023210A5 (enExample
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利文 金馬
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Ebara Corp
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Ebara Corp
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  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2008189869A 2008-07-23 2008-07-23 研磨終点検知方法および研磨装置 Active JP5167010B2 (ja)

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JP2008189869A JP5167010B2 (ja) 2008-07-23 2008-07-23 研磨終点検知方法および研磨装置

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JP2008189869A JP5167010B2 (ja) 2008-07-23 2008-07-23 研磨終点検知方法および研磨装置

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JP2010023210A JP2010023210A (ja) 2010-02-04
JP2010023210A5 JP2010023210A5 (enExample) 2011-05-12
JP5167010B2 true JP5167010B2 (ja) 2013-03-21

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5980476B2 (ja) 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
JP6025055B2 (ja) * 2013-03-12 2016-11-16 株式会社荏原製作所 研磨パッドの表面性状測定方法
JP6066192B2 (ja) 2013-03-12 2017-01-25 株式会社荏原製作所 研磨パッドの表面性状測定装置
JP6473050B2 (ja) 2015-06-05 2019-02-20 株式会社荏原製作所 研磨装置
JP7023063B2 (ja) * 2017-08-08 2022-02-21 株式会社荏原製作所 基板研磨装置及び方法
JP7503418B2 (ja) 2020-05-14 2024-06-20 株式会社荏原製作所 膜厚測定装置、研磨装置及び膜厚測定方法
JP2025156745A (ja) 2024-04-02 2025-10-15 株式会社荏原製作所 研磨方法および研磨装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3550594B2 (ja) * 1997-08-12 2004-08-04 株式会社ニコン 多層膜試料の膜厚測定装置及びそれを有する研磨装置
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
JP2005340679A (ja) * 2004-05-31 2005-12-08 Matsushita Electric Ind Co Ltd 研磨装置及び研磨終点検出方法ならびに半導体装置の製造方法
KR101381341B1 (ko) * 2006-10-06 2014-04-04 가부시끼가이샤 도시바 가공 종점 검지방법, 연마방법 및 연마장치
JP4996331B2 (ja) * 2007-05-17 2012-08-08 株式会社荏原製作所 基板研磨装置および基板研磨方法

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