JP5166291B2 - ノッチ付き堆積リング - Google Patents

ノッチ付き堆積リング Download PDF

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Publication number
JP5166291B2
JP5166291B2 JP2008558498A JP2008558498A JP5166291B2 JP 5166291 B2 JP5166291 B2 JP 5166291B2 JP 2008558498 A JP2008558498 A JP 2008558498A JP 2008558498 A JP2008558498 A JP 2008558498A JP 5166291 B2 JP5166291 B2 JP 5166291B2
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Japan
Prior art keywords
wall
main body
ring
kit according
processing kit
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JP2008558498A
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Japanese (ja)
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JP2009529249A5 (enExample
JP2009529249A (ja
Inventor
キース エー ミラー
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2009529249A5 publication Critical patent/JP2009529249A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Drying Of Semiconductors (AREA)
JP2008558498A 2006-03-07 2007-03-06 ノッチ付き堆積リング Active JP5166291B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/369,884 US7520969B2 (en) 2006-03-07 2006-03-07 Notched deposition ring
US11/369,884 2006-03-07
PCT/US2007/063353 WO2007103902A2 (en) 2006-03-07 2007-03-06 Notched deposition ring

Publications (3)

Publication Number Publication Date
JP2009529249A JP2009529249A (ja) 2009-08-13
JP2009529249A5 JP2009529249A5 (enExample) 2011-08-25
JP5166291B2 true JP5166291B2 (ja) 2013-03-21

Family

ID=38475786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008558498A Active JP5166291B2 (ja) 2006-03-07 2007-03-06 ノッチ付き堆積リング

Country Status (6)

Country Link
US (1) US7520969B2 (enExample)
JP (1) JP5166291B2 (enExample)
KR (1) KR101007833B1 (enExample)
CN (1) CN101405431B (enExample)
TW (1) TWI365487B (enExample)
WO (1) WO2007103902A2 (enExample)

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US8900471B2 (en) * 2009-02-27 2014-12-02 Applied Materials, Inc. In situ plasma clean for removal of residue from pedestal surface without breaking vacuum
US8740206B2 (en) * 2010-01-27 2014-06-03 Applied Materials, Inc. Life enhancement of ring assembly in semiconductor manufacturing chambers
KR20130095276A (ko) * 2010-08-20 2013-08-27 어플라이드 머티어리얼스, 인코포레이티드 수명이 연장된 증착 링
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Also Published As

Publication number Publication date
WO2007103902A3 (en) 2008-10-30
US20070209931A1 (en) 2007-09-13
KR20090005317A (ko) 2009-01-13
CN101405431A (zh) 2009-04-08
CN101405431B (zh) 2011-11-30
WO2007103902A2 (en) 2007-09-13
JP2009529249A (ja) 2009-08-13
US7520969B2 (en) 2009-04-21
TW200737305A (en) 2007-10-01
TWI365487B (en) 2012-06-01
KR101007833B1 (ko) 2011-01-13

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