KR101007833B1 - 노치가 형성된 증착 링 - Google Patents

노치가 형성된 증착 링 Download PDF

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Publication number
KR101007833B1
KR101007833B1 KR1020087024410A KR20087024410A KR101007833B1 KR 101007833 B1 KR101007833 B1 KR 101007833B1 KR 1020087024410 A KR1020087024410 A KR 1020087024410A KR 20087024410 A KR20087024410 A KR 20087024410A KR 101007833 B1 KR101007833 B1 KR 101007833B1
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South Korea
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wall
ring body
deposition ring
annular deposition
annular
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Korean (ko)
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KR20090005317A (ko
Inventor
케이쓰 에이. 밀러
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Drying Of Semiconductors (AREA)
KR1020087024410A 2006-03-07 2007-03-06 노치가 형성된 증착 링 Active KR101007833B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/369,884 US7520969B2 (en) 2006-03-07 2006-03-07 Notched deposition ring
US11/369,884 2006-03-07

Publications (2)

Publication Number Publication Date
KR20090005317A KR20090005317A (ko) 2009-01-13
KR101007833B1 true KR101007833B1 (ko) 2011-01-13

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KR1020087024410A Active KR101007833B1 (ko) 2006-03-07 2007-03-06 노치가 형성된 증착 링

Country Status (6)

Country Link
US (1) US7520969B2 (enExample)
JP (1) JP5166291B2 (enExample)
KR (1) KR101007833B1 (enExample)
CN (1) CN101405431B (enExample)
TW (1) TWI365487B (enExample)
WO (1) WO2007103902A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180016628A (ko) * 2015-07-03 2018-02-14 어플라이드 머티어리얼스, 인코포레이티드 높은 증착 링 및 증착 링 클램프를 갖는 프로세스 키트

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Also Published As

Publication number Publication date
WO2007103902A3 (en) 2008-10-30
US20070209931A1 (en) 2007-09-13
KR20090005317A (ko) 2009-01-13
CN101405431A (zh) 2009-04-08
CN101405431B (zh) 2011-11-30
WO2007103902A2 (en) 2007-09-13
JP2009529249A (ja) 2009-08-13
US7520969B2 (en) 2009-04-21
TW200737305A (en) 2007-10-01
JP5166291B2 (ja) 2013-03-21
TWI365487B (en) 2012-06-01

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