JP5162546B2 - 放射源及びリソグラフィ装置 - Google Patents
放射源及びリソグラフィ装置 Download PDFInfo
- Publication number
- JP5162546B2 JP5162546B2 JP2009197591A JP2009197591A JP5162546B2 JP 5162546 B2 JP5162546 B2 JP 5162546B2 JP 2009197591 A JP2009197591 A JP 2009197591A JP 2009197591 A JP2009197591 A JP 2009197591A JP 5162546 B2 JP5162546 B2 JP 5162546B2
- Authority
- JP
- Japan
- Prior art keywords
- radiation source
- evaporation surface
- radiation
- plasma
- source according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/009—Auxiliary arrangements not involved in the plasma generation
- H05G2/0094—Reduction, prevention or protection from contamination; Cleaning
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- General Physics & Mathematics (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epidemiology (AREA)
- Plasma & Fusion (AREA)
- Environmental & Geological Engineering (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- X-Ray Techniques (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13642808P | 2008-09-04 | 2008-09-04 | |
| US61/136,428 | 2008-09-04 | ||
| US13645108P | 2008-09-05 | 2008-09-05 | |
| US61/136,451 | 2008-09-05 | ||
| US19381408P | 2008-12-24 | 2008-12-24 | |
| US61/193,814 | 2008-12-24 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010062560A JP2010062560A (ja) | 2010-03-18 |
| JP2010062560A5 JP2010062560A5 (enExample) | 2012-12-13 |
| JP5162546B2 true JP5162546B2 (ja) | 2013-03-13 |
Family
ID=41396260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009197591A Active JP5162546B2 (ja) | 2008-09-04 | 2009-08-28 | 放射源及びリソグラフィ装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US8373846B2 (enExample) |
| EP (1) | EP2161725B1 (enExample) |
| JP (1) | JP5162546B2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2161725B1 (en) * | 2008-09-04 | 2015-07-08 | ASML Netherlands B.V. | Radiation source and related method |
| WO2010028899A1 (en) * | 2008-09-11 | 2010-03-18 | Asml Netherlands B.V. | Radiation source and lithographic apparatus |
| JP5559562B2 (ja) | 2009-02-12 | 2014-07-23 | ギガフォトン株式会社 | 極端紫外光光源装置 |
| DE102010041298A1 (de) | 2010-09-24 | 2012-03-29 | Carl Zeiss Smt Gmbh | EUV-Mikrolithographie-Projektionsbelichtungsanlage mit einer Heizlichtquelle |
| WO2013127587A2 (en) * | 2012-02-27 | 2013-09-06 | Asml Netherlands B.V. | Source collector apparatus, lithographic apparatus and device manufacturing method |
| WO2014019803A1 (en) * | 2012-08-01 | 2014-02-06 | Asml Netherlands B.V. | Method and apparatus for generating radiation |
| WO2014121873A1 (en) * | 2013-02-08 | 2014-08-14 | Asml Netherlands B.V. | Radiation source for an euv optical lithographic apparatus, and lithographic apparatus comprising such a power source |
| EP3416180A1 (en) * | 2017-06-18 | 2018-12-19 | Excillum AB | X-ray source with temperature controller |
| US11272606B2 (en) | 2017-06-27 | 2022-03-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV light source and apparatus for lithography |
| KR102676898B1 (ko) * | 2017-10-26 | 2024-06-19 | 에이에스엠엘 네델란즈 비.브이. | 도전성 연료를 수용하는 장치 |
| US10959318B2 (en) * | 2018-01-10 | 2021-03-23 | Kla-Tencor Corporation | X-ray metrology system with broadband laser produced plasma illuminator |
| NL2021345A (en) * | 2018-04-12 | 2018-08-22 | Asml Netherlands Bv | Lithographic apparatus |
| CN117999857A (zh) * | 2021-09-15 | 2024-05-07 | Asml荷兰有限公司 | 用于主动加热euv光源中的基板的装置和方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3601089B2 (ja) * | 1994-12-08 | 2004-12-15 | 株式会社ニコン | X線装置 |
| US6815700B2 (en) * | 1997-05-12 | 2004-11-09 | Cymer, Inc. | Plasma focus light source with improved pulse power system |
| NL1008352C2 (nl) | 1998-02-19 | 1999-08-20 | Stichting Tech Wetenschapp | Inrichting, geschikt voor extreem ultraviolet lithografie, omvattende een stralingsbron en een verwerkingsorgaan voor het verwerken van de van de stralingsbron afkomstige straling, alsmede een filter voor het onderdrukken van ongewenste atomaire en microscopische deeltjes welke door een stralingsbron zijn uitgezonden. |
| US6614505B2 (en) | 2001-01-10 | 2003-09-02 | Asml Netherlands B.V. | Lithographic projection apparatus, device manufacturing method, and device manufactured thereby |
| DE10219173A1 (de) * | 2002-04-30 | 2003-11-20 | Philips Intellectual Property | Verfahren zur Erzeugung von Extrem-Ultraviolett-Strahlung |
| EP1394612B1 (en) | 2002-08-27 | 2008-10-08 | ASML Netherlands B.V. | Lithographic projection apparatus and reflector assembly for use in said apparatus |
| DE10251435B3 (de) * | 2002-10-30 | 2004-05-27 | Xtreme Technologies Gmbh | Strahlungsquelle zur Erzeugung von extrem ultravioletter Strahlung |
| US8945310B2 (en) * | 2003-05-22 | 2015-02-03 | Koninklijke Philips Electronics N.V. | Method and device for cleaning at least one optical component |
| EP1624467A3 (en) * | 2003-10-20 | 2007-05-30 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method |
| US7098994B2 (en) * | 2004-01-16 | 2006-08-29 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
| US8075732B2 (en) * | 2004-11-01 | 2011-12-13 | Cymer, Inc. | EUV collector debris management |
| US7355191B2 (en) * | 2004-11-01 | 2008-04-08 | Cymer, Inc. | Systems and methods for cleaning a chamber window of an EUV light source |
| DE102005020521B4 (de) * | 2005-04-29 | 2013-05-02 | Xtreme Technologies Gmbh | Verfahren und Anordnung zur Unterdrückung von Debris bei der Erzeugung kurzwelliger Strahlung auf Basis eines Plasmas |
| KR20080019708A (ko) * | 2005-06-14 | 2008-03-04 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 단락에 대한 방사원 보호 방법 |
| US7561247B2 (en) * | 2005-08-22 | 2009-07-14 | Asml Netherlands B.V. | Method for the removal of deposition on an optical element, method for the protection of an optical element, device manufacturing method, apparatus including an optical element, and lithographic apparatus |
| JP2007134166A (ja) * | 2005-11-10 | 2007-05-31 | Ushio Inc | 極端紫外光光源装置 |
| US7696493B2 (en) * | 2006-12-13 | 2010-04-13 | Asml Netherlands B.V. | Radiation system and lithographic apparatus |
| JP5086664B2 (ja) * | 2007-03-02 | 2012-11-28 | ギガフォトン株式会社 | 極端紫外光源装置 |
| JP5277496B2 (ja) * | 2007-04-27 | 2013-08-28 | ギガフォトン株式会社 | 極端紫外光源装置および極端紫外光源装置の光学素子汚染防止装置 |
| US8054446B2 (en) * | 2008-08-21 | 2011-11-08 | Carl Zeiss Smt Gmbh | EUV lithography apparatus and method for determining the contamination status of an EUV-reflective optical surface |
| EP2161725B1 (en) | 2008-09-04 | 2015-07-08 | ASML Netherlands B.V. | Radiation source and related method |
-
2009
- 2009-08-27 EP EP09167126.3A patent/EP2161725B1/en active Active
- 2009-08-28 JP JP2009197591A patent/JP5162546B2/ja active Active
- 2009-09-03 US US12/553,368 patent/US8373846B2/en active Active
-
2012
- 2012-11-27 US US13/686,633 patent/US8946661B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2161725A2 (en) | 2010-03-10 |
| US20100053576A1 (en) | 2010-03-04 |
| US20130327955A1 (en) | 2013-12-12 |
| JP2010062560A (ja) | 2010-03-18 |
| EP2161725B1 (en) | 2015-07-08 |
| US8373846B2 (en) | 2013-02-12 |
| US8946661B2 (en) | 2015-02-03 |
| EP2161725A3 (en) | 2012-06-13 |
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