JP5159957B2 - ステージ制御用光学システム - Google Patents
ステージ制御用光学システム Download PDFInfo
- Publication number
- JP5159957B2 JP5159957B2 JP2011534488A JP2011534488A JP5159957B2 JP 5159957 B2 JP5159957 B2 JP 5159957B2 JP 2011534488 A JP2011534488 A JP 2011534488A JP 2011534488 A JP2011534488 A JP 2011534488A JP 5159957 B2 JP5159957 B2 JP 5159957B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- template
- alignment
- light
- detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title description 12
- 239000000758 substrate Substances 0.000 claims description 73
- 238000000034 method Methods 0.000 claims description 27
- 238000001459 lithography Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 11
- 238000005286 illumination Methods 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000003993 interaction Effects 0.000 claims 2
- 238000012625 in-situ measurement Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 11
- 238000000059 patterning Methods 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000001015 X-ray lithography Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000000203 droplet dispensing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000002164 ion-beam lithography Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7092—Signal processing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10894108P | 2008-10-28 | 2008-10-28 | |
| US61/108,941 | 2008-10-28 | ||
| US12/580,324 US8345242B2 (en) | 2008-10-28 | 2009-10-16 | Optical system for use in stage control |
| US12/580,324 | 2009-10-16 | ||
| PCT/US2009/005690 WO2010051015A1 (en) | 2008-10-28 | 2009-10-20 | Optical system for use in stage control |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012507173A JP2012507173A (ja) | 2012-03-22 |
| JP2012507173A5 JP2012507173A5 (OSRAM) | 2012-12-06 |
| JP5159957B2 true JP5159957B2 (ja) | 2013-03-13 |
Family
ID=42116699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011534488A Expired - Fee Related JP5159957B2 (ja) | 2008-10-28 | 2009-10-20 | ステージ制御用光学システム |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8345242B2 (OSRAM) |
| JP (1) | JP5159957B2 (OSRAM) |
| WO (1) | WO2010051015A1 (OSRAM) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5498448B2 (ja) * | 2011-07-21 | 2014-05-21 | 株式会社東芝 | インプリント方法及びインプリントシステム |
| CN103631086A (zh) * | 2012-08-21 | 2014-03-12 | 华中科技大学 | 一种用于集成光电子器件的微纳图形的制作方法及应用 |
| US10248018B2 (en) * | 2015-03-30 | 2019-04-02 | Canon Kabushiki Kaisha | Imprint apparatus and method of manufacturing article |
| DE102015110264A1 (de) * | 2015-06-25 | 2016-12-29 | Cl Schutzrechtsverwaltungs Gmbh | Vorrichtung zur generativen Herstellung wenigstens eines dreidimensionalen Objekts |
| JP6799397B2 (ja) * | 2015-08-10 | 2020-12-16 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
| WO2018027069A1 (en) * | 2016-08-03 | 2018-02-08 | Board Of Regents, The University Of Texas System | Roll-to-roll programmable film imprint lithography |
| US10416576B2 (en) * | 2016-09-14 | 2019-09-17 | Canon Kabushiki Kaisha | Optical system for use in stage control |
| US9971147B2 (en) | 2016-09-26 | 2018-05-15 | Xerox Corporation | Integrated micro-channel heatsink in DMD substrate for enhanced cooling capacity |
| JP6818522B2 (ja) * | 2016-11-17 | 2021-01-20 | キヤノン株式会社 | インプリント装置、および物品製造方法 |
| JP6827785B2 (ja) * | 2016-11-30 | 2021-02-10 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品の製造方法 |
| US10998190B2 (en) * | 2017-04-17 | 2021-05-04 | Canon Kabushiki Kaisha | Imprint apparatus and method of manufacturing article |
| JP6606567B2 (ja) * | 2017-04-17 | 2019-11-13 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| CN110500968B (zh) * | 2019-07-11 | 2021-04-20 | 北京理工大学 | 基于稀疏傅里叶变换的数字莫尔干涉相位实时测量方法 |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2569544B2 (ja) * | 1987-04-08 | 1997-01-08 | 株式会社ニコン | 位置決め装置 |
| JPH0613287A (ja) * | 1992-04-27 | 1994-01-21 | Nikon Corp | アライメント装置 |
| JPH08313842A (ja) * | 1995-05-15 | 1996-11-29 | Nikon Corp | 照明光学系および該光学系を備えた露光装置 |
| JP4136067B2 (ja) * | 1997-05-02 | 2008-08-20 | キヤノン株式会社 | 検出装置及びそれを用いた露光装置 |
| TW520457B (en) * | 1997-09-30 | 2003-02-11 | Toshiba Corp | Display panel and position adjusting method for the display panel |
| JP2003504861A (ja) * | 1999-07-01 | 2003-02-04 | エイエスエムエル ネザランドズ ベスローテン フエンノートシャップ | 空間濾波による画像向上装置および方法 |
| US6873087B1 (en) * | 1999-10-29 | 2005-03-29 | Board Of Regents, The University Of Texas System | High precision orientation alignment and gap control stages for imprint lithography processes |
| US6462818B1 (en) * | 2000-06-22 | 2002-10-08 | Kla-Tencor Corporation | Overlay alignment mark design |
| EP2264524A3 (en) * | 2000-07-16 | 2011-11-30 | The Board of Regents of The University of Texas System | High-resolution overlay alignement methods and systems for imprint lithography |
| KR20030040378A (ko) * | 2000-08-01 | 2003-05-22 | 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 | 임프린트 리소그래피를 위한 투명한 템플릿과 기판사이의고정확성 갭 및 방향설정 감지 방법 |
| US7317531B2 (en) * | 2002-12-05 | 2008-01-08 | Kla-Tencor Technologies Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
| JP3507865B2 (ja) * | 2001-02-02 | 2004-03-15 | 和歌山大学長 | Dmdを用いたccdカメラによる実時間形状計測方法と装置 |
| US20050064344A1 (en) | 2003-09-18 | 2005-03-24 | University Of Texas System Board Of Regents | Imprint lithography templates having alignment marks |
| WO2004007462A1 (en) * | 2002-07-11 | 2004-01-22 | Scios Inc. | Improved reagents for n-amination |
| US6916584B2 (en) * | 2002-08-01 | 2005-07-12 | Molecular Imprints, Inc. | Alignment methods for imprint lithography |
| US7027156B2 (en) * | 2002-08-01 | 2006-04-11 | Molecular Imprints, Inc. | Scatterometry alignment for imprint lithography |
| US7070405B2 (en) * | 2002-08-01 | 2006-07-04 | Molecular Imprints, Inc. | Alignment systems for imprint lithography |
| MY136129A (en) * | 2002-12-13 | 2008-08-29 | Molecular Imprints Inc | Magnification correction employing out-of-plane distortion of a substrate |
| SG147288A1 (en) | 2003-04-29 | 2008-11-28 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method and angular encoder |
| EP1510868A1 (en) * | 2003-08-29 | 2005-03-02 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP4478424B2 (ja) * | 2003-09-29 | 2010-06-09 | キヤノン株式会社 | 微細加工装置およびデバイスの製造方法 |
| EP1774407B1 (en) * | 2004-06-03 | 2017-08-09 | Board of Regents, The University of Texas System | System and method for improvement of alignment and overlay for microlithography |
| US20050270516A1 (en) * | 2004-06-03 | 2005-12-08 | Molecular Imprints, Inc. | System for magnification and distortion correction during nano-scale manufacturing |
| TWI340875B (en) | 2004-08-10 | 2011-04-21 | Asml Netherlands Bv | Imprint lithographic apparatus, device manufacturing method and device manufactured thereby |
| US7630067B2 (en) * | 2004-11-30 | 2009-12-08 | Molecular Imprints, Inc. | Interferometric analysis method for the manufacture of nano-scale devices |
| US20070231421A1 (en) | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | Enhanced Multi Channel Alignment |
| US7292326B2 (en) * | 2004-11-30 | 2007-11-06 | Molecular Imprints, Inc. | Interferometric analysis for the manufacture of nano-scale devices |
| JP5198071B2 (ja) * | 2004-12-01 | 2013-05-15 | モレキュラー・インプリンツ・インコーポレーテッド | インプリントリソグラフィ・プロセスにおける熱管理のための露光方法 |
| JP5306989B2 (ja) * | 2006-04-03 | 2013-10-02 | モレキュラー・インプリンツ・インコーポレーテッド | 複数のフィールド及びアライメント・マークを有する基板を同時にパターニングする方法 |
| JP4795300B2 (ja) | 2006-04-18 | 2011-10-19 | キヤノン株式会社 | 位置合わせ方法、インプリント方法、位置合わせ装置、インプリント装置、及び位置計測方法 |
| US7547398B2 (en) * | 2006-04-18 | 2009-06-16 | Molecular Imprints, Inc. | Self-aligned process for fabricating imprint templates containing variously etched features |
| US7837907B2 (en) | 2007-07-20 | 2010-11-23 | Molecular Imprints, Inc. | Alignment system and method for a substrate in a nano-imprint process |
| US20090147237A1 (en) * | 2007-12-05 | 2009-06-11 | Molecular Imprints, Inc. | Spatial Phase Feature Location |
-
2009
- 2009-10-16 US US12/580,324 patent/US8345242B2/en active Active
- 2009-10-20 JP JP2011534488A patent/JP5159957B2/ja not_active Expired - Fee Related
- 2009-10-20 WO PCT/US2009/005690 patent/WO2010051015A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20100102487A1 (en) | 2010-04-29 |
| US8345242B2 (en) | 2013-01-01 |
| JP2012507173A (ja) | 2012-03-22 |
| WO2010051015A1 (en) | 2010-05-06 |
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