JP5158337B2 - 圧電デバイス - Google Patents

圧電デバイス Download PDF

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Publication number
JP5158337B2
JP5158337B2 JP2007286532A JP2007286532A JP5158337B2 JP 5158337 B2 JP5158337 B2 JP 5158337B2 JP 2007286532 A JP2007286532 A JP 2007286532A JP 2007286532 A JP2007286532 A JP 2007286532A JP 5158337 B2 JP5158337 B2 JP 5158337B2
Authority
JP
Japan
Prior art keywords
electrode
piezoelectric device
semiconductor chip
piezoelectric
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007286532A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009118000A5 (enExample
JP2009118000A (ja
Inventor
雄一郎 高栖
和彦 下平
誠 駒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2007286532A priority Critical patent/JP5158337B2/ja
Publication of JP2009118000A publication Critical patent/JP2009118000A/ja
Publication of JP2009118000A5 publication Critical patent/JP2009118000A5/ja
Application granted granted Critical
Publication of JP5158337B2 publication Critical patent/JP5158337B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2007286532A 2007-11-02 2007-11-02 圧電デバイス Active JP5158337B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007286532A JP5158337B2 (ja) 2007-11-02 2007-11-02 圧電デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007286532A JP5158337B2 (ja) 2007-11-02 2007-11-02 圧電デバイス

Publications (3)

Publication Number Publication Date
JP2009118000A JP2009118000A (ja) 2009-05-28
JP2009118000A5 JP2009118000A5 (enExample) 2010-12-16
JP5158337B2 true JP5158337B2 (ja) 2013-03-06

Family

ID=40784664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007286532A Active JP5158337B2 (ja) 2007-11-02 2007-11-02 圧電デバイス

Country Status (1)

Country Link
JP (1) JP5158337B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7413682B2 (ja) 2019-08-29 2024-01-16 セイコーエプソン株式会社 振動デバイス、電子機器および移動体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001119264A (ja) * 1999-10-15 2001-04-27 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2002198739A (ja) * 2000-12-26 2002-07-12 Toyo Commun Equip Co Ltd 表面実装型圧電発振器
JP3980943B2 (ja) * 2002-06-06 2007-09-26 日本電波工業株式会社 Ｐｌｌ制御発振器
WO2007091417A1 (ja) * 2006-02-10 2007-08-16 Murata Manufacturing Co., Ltd. 振動子モジュール

Also Published As

Publication number Publication date
JP2009118000A (ja) 2009-05-28

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