JP5157364B2 - 接合対象物のアライメント方法、これを用いた部品接合方法および部品接合装置 - Google Patents

接合対象物のアライメント方法、これを用いた部品接合方法および部品接合装置 Download PDF

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Publication number
JP5157364B2
JP5157364B2 JP2007275050A JP2007275050A JP5157364B2 JP 5157364 B2 JP5157364 B2 JP 5157364B2 JP 2007275050 A JP2007275050 A JP 2007275050A JP 2007275050 A JP2007275050 A JP 2007275050A JP 5157364 B2 JP5157364 B2 JP 5157364B2
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Japan
Prior art keywords
joining
component
joined
image recognition
bonded
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Expired - Fee Related
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JP2007275050A
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Japanese (ja)
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JP2009105196A (ja
JP2009105196A5 (enExample
Inventor
和美 篠原
誠 阿南
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2007275050A priority Critical patent/JP5157364B2/ja
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Publication of JP2009105196A5 publication Critical patent/JP2009105196A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
JP2007275050A 2007-10-23 2007-10-23 接合対象物のアライメント方法、これを用いた部品接合方法および部品接合装置 Expired - Fee Related JP5157364B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007275050A JP5157364B2 (ja) 2007-10-23 2007-10-23 接合対象物のアライメント方法、これを用いた部品接合方法および部品接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007275050A JP5157364B2 (ja) 2007-10-23 2007-10-23 接合対象物のアライメント方法、これを用いた部品接合方法および部品接合装置

Publications (3)

Publication Number Publication Date
JP2009105196A JP2009105196A (ja) 2009-05-14
JP2009105196A5 JP2009105196A5 (enExample) 2010-11-25
JP5157364B2 true JP5157364B2 (ja) 2013-03-06

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JP2007275050A Expired - Fee Related JP5157364B2 (ja) 2007-10-23 2007-10-23 接合対象物のアライメント方法、これを用いた部品接合方法および部品接合装置

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JP (1) JP5157364B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110765159A (zh) * 2019-11-01 2020-02-07 上海达梦数据库有限公司 对象解析方法、装置、存储介质及设备

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113206025B (zh) * 2020-01-30 2024-07-19 芝浦机械电子装置株式会社 电子零件的安装装置
TWI807304B (zh) * 2021-04-15 2023-07-01 高科晶捷自動化股份有限公司 部件取放貼合系統及其方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232363A (ja) * 1996-02-23 1997-09-05 Toshiba Corp 半導体チップの位置合せ方法およびボンディング装置
JP3937162B2 (ja) * 2002-10-07 2007-06-27 ソニー株式会社 部品実装装置および部品実装方法
JP4128540B2 (ja) * 2003-06-05 2008-07-30 株式会社新川 ボンディング装置
JP2006041006A (ja) * 2004-07-23 2006-02-09 Matsushita Electric Ind Co Ltd 半導体チップのボンディング方法及び装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110765159A (zh) * 2019-11-01 2020-02-07 上海达梦数据库有限公司 对象解析方法、装置、存储介质及设备
CN110765159B (zh) * 2019-11-01 2022-08-12 上海达梦数据库有限公司 对象解析方法、装置、存储介质及设备

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Publication number Publication date
JP2009105196A (ja) 2009-05-14

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