JP5119705B2 - 発光装置およびそれを用いた面状発光装置 - Google Patents

発光装置およびそれを用いた面状発光装置 Download PDF

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Publication number
JP5119705B2
JP5119705B2 JP2007078009A JP2007078009A JP5119705B2 JP 5119705 B2 JP5119705 B2 JP 5119705B2 JP 2007078009 A JP2007078009 A JP 2007078009A JP 2007078009 A JP2007078009 A JP 2007078009A JP 5119705 B2 JP5119705 B2 JP 5119705B2
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Japan
Prior art keywords
light emitting
light
emitting device
longitudinal direction
wall portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007078009A
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English (en)
Japanese (ja)
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JP2008243864A5 (enExample
JP2008243864A (ja
Inventor
大樹 ▲高▼橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2007078009A priority Critical patent/JP5119705B2/ja
Publication of JP2008243864A publication Critical patent/JP2008243864A/ja
Publication of JP2008243864A5 publication Critical patent/JP2008243864A5/ja
Application granted granted Critical
Publication of JP5119705B2 publication Critical patent/JP5119705B2/ja
Expired - Fee Related legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

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  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
JP2007078009A 2007-03-24 2007-03-24 発光装置およびそれを用いた面状発光装置 Expired - Fee Related JP5119705B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007078009A JP5119705B2 (ja) 2007-03-24 2007-03-24 発光装置およびそれを用いた面状発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007078009A JP5119705B2 (ja) 2007-03-24 2007-03-24 発光装置およびそれを用いた面状発光装置

Publications (3)

Publication Number Publication Date
JP2008243864A JP2008243864A (ja) 2008-10-09
JP2008243864A5 JP2008243864A5 (enExample) 2010-05-06
JP5119705B2 true JP5119705B2 (ja) 2013-01-16

Family

ID=39914890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007078009A Expired - Fee Related JP5119705B2 (ja) 2007-03-24 2007-03-24 発光装置およびそれを用いた面状発光装置

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JP (1) JP5119705B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011198800A (ja) * 2010-03-17 2011-10-06 Mitsubishi Chemicals Corp 半導体発光素子
JP5899508B2 (ja) * 2011-04-28 2016-04-06 パナソニックIpマネジメント株式会社 発光装置及びそれを用いた照明装置
WO2013054483A1 (ja) * 2011-10-11 2013-04-18 パナソニック株式会社 発光装置およびこれを用いた照明装置
JP7307381B2 (ja) * 2018-07-30 2023-07-12 日亜化学工業株式会社 光源装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2772166B2 (ja) * 1991-07-25 1998-07-02 ローム株式会社 Led光源装置
JPH0545812U (ja) * 1991-11-22 1993-06-18 株式会社小糸製作所 車輌用灯具
JPH07121123A (ja) * 1993-08-31 1995-05-12 Sanyo Electric Co Ltd 表示装置
JP3559435B2 (ja) * 1997-01-10 2004-09-02 ローム株式会社 半導体発光素子
JP2002299697A (ja) * 2001-03-29 2002-10-11 Mitsubishi Electric Lighting Corp Led光源デバイス及び照明器具
KR20080033164A (ko) * 2005-07-04 2008-04-16 마츠시타 덴끼 산교 가부시키가이샤 선형광원장치, 면 발광장치 및 액정표시장치
JP2007067000A (ja) * 2005-08-29 2007-03-15 Mitsubishi Rayon Co Ltd 発光ダイオードモジュール

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Publication number Publication date
JP2008243864A (ja) 2008-10-09

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