JP5118147B2 - カメラモジュールの汚染低減ガスケット - Google Patents
カメラモジュールの汚染低減ガスケット Download PDFInfo
- Publication number
- JP5118147B2 JP5118147B2 JP2009535360A JP2009535360A JP5118147B2 JP 5118147 B2 JP5118147 B2 JP 5118147B2 JP 2009535360 A JP2009535360 A JP 2009535360A JP 2009535360 A JP2009535360 A JP 2009535360A JP 5118147 B2 JP5118147 B2 JP 5118147B2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- boot
- lens unit
- camera module
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000011109 contamination Methods 0.000 title description 4
- 230000009467 reduction Effects 0.000 title description 2
- 239000000356 contaminant Substances 0.000 claims description 28
- 239000013013 elastic material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000295 complement effect Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US86434806P | 2006-11-03 | 2006-11-03 | |
| US60/864,348 | 2006-11-03 | ||
| PCT/US2007/023388 WO2008057544A2 (en) | 2006-11-03 | 2007-11-05 | Camera module contamination reduction gasket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010509806A JP2010509806A (ja) | 2010-03-25 |
| JP5118147B2 true JP5118147B2 (ja) | 2013-01-16 |
Family
ID=39365111
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009535360A Expired - Fee Related JP5118147B2 (ja) | 2006-11-03 | 2007-11-05 | カメラモジュールの汚染低減ガスケット |
| JP2009535355A Expired - Fee Related JP5374376B2 (ja) | 2006-11-03 | 2007-11-05 | 汚染低減機構を備えるカメラモジュール |
| JP2012039255A Pending JP2012133389A (ja) | 2006-11-03 | 2012-02-24 | 汚染低減機構を備えるカメラモジュール |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009535355A Expired - Fee Related JP5374376B2 (ja) | 2006-11-03 | 2007-11-05 | 汚染低減機構を備えるカメラモジュール |
| JP2012039255A Pending JP2012133389A (ja) | 2006-11-03 | 2012-02-24 | 汚染低減機構を備えるカメラモジュール |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7983556B2 (https=) |
| JP (3) | JP5118147B2 (https=) |
| CN (4) | CN102109652B (https=) |
| WO (2) | WO2008057544A2 (https=) |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7469100B2 (en) | 2005-10-03 | 2008-12-23 | Flextronics Ap Llc | Micro camera module with discrete manual focal positions |
| US7983556B2 (en) | 2006-11-03 | 2011-07-19 | Flextronics Ap Llc | Camera module with contamination reduction feature |
| JP2010525412A (ja) | 2007-04-24 | 2010-07-22 | フレックストロニクス エーピー エルエルシー | 底部にキャビティを備えるウエハーレベル光学部品とフリップチップ組立を用いた小型フォームファクタモジュール |
| JP4953910B2 (ja) * | 2007-05-08 | 2012-06-13 | 富士フイルム株式会社 | レンズ位置決め治具、及びレンズ鏡筒取付方法 |
| US7825985B2 (en) | 2007-07-19 | 2010-11-02 | Flextronics Ap, Llc | Camera module back-focal length adjustment method and ultra compact components packaging |
| US9118825B2 (en) | 2008-02-22 | 2015-08-25 | Nan Chang O-Film Optoelectronics Technology Ltd. | Attachment of wafer level optics |
| JP2010088088A (ja) * | 2008-10-03 | 2010-04-15 | Fujifilm Corp | カメラモジュール |
| CN101872057B (zh) * | 2009-04-27 | 2013-03-20 | 鸿富锦精密工业(深圳)有限公司 | 对焦结构及具有该对焦结构的镜头模组 |
| JP2011023889A (ja) * | 2009-07-14 | 2011-02-03 | Fujifilm Corp | 撮影モジュールおよび結像調整方法 |
| US9419032B2 (en) * | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
| CN102033285A (zh) * | 2009-09-29 | 2011-04-27 | 鸿富锦精密工业(深圳)有限公司 | 镜头模组 |
| CN102231005B (zh) * | 2009-10-16 | 2013-01-09 | 鸿富锦精密工业(深圳)有限公司 | 镜头模组 |
| TWI447465B (zh) * | 2009-10-30 | 2014-08-01 | Hon Hai Prec Ind Co Ltd | 鏡頭模組 |
| TWI453493B (zh) * | 2009-11-02 | 2014-09-21 | Hon Hai Prec Ind Co Ltd | 鏡頭模組 |
| TWI456284B (zh) * | 2009-11-11 | 2014-10-11 | Hon Hai Prec Ind Co Ltd | 鏡頭模組 |
| TWI497144B (zh) * | 2010-10-28 | 2015-08-21 | Hon Hai Prec Ind Co Ltd | 鏡座及具有該鏡座的鏡頭模組 |
| KR101779499B1 (ko) * | 2010-12-27 | 2017-09-18 | 엘지이노텍 주식회사 | 카메라 모듈 |
| US8545114B2 (en) | 2011-03-11 | 2013-10-01 | Digitaloptics Corporation | Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane |
| CN102759841B (zh) * | 2011-04-29 | 2016-05-04 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
| US8886031B2 (en) * | 2011-08-31 | 2014-11-11 | Apple Inc. | Camera window assembly for electronic device |
| TWI505704B (zh) * | 2011-09-14 | 2015-10-21 | Hon Hai Prec Ind Co Ltd | 相機模組組裝方法及相機模組 |
| KR101278352B1 (ko) * | 2011-11-07 | 2013-06-25 | 삼성전기주식회사 | 카메라모듈 |
| US8861951B2 (en) * | 2011-12-05 | 2014-10-14 | Flextronics Ap, Llc | Two part camera module |
| US8811814B2 (en) * | 2011-12-05 | 2014-08-19 | Flextronics Ap, Llc | Method and system for camera module alignment |
| US9753244B2 (en) * | 2012-04-13 | 2017-09-05 | Raytheon Canada Limited | Positioning mechanism for aligning an optical device and an image sensor |
| CN102692792A (zh) * | 2012-06-05 | 2012-09-26 | 东莞光阵显示器制品有限公司 | 微型摄像模组制造方法及其产品 |
| CN202837644U (zh) * | 2012-08-14 | 2013-03-27 | 美国莫列斯股份有限公司 | 相机模块 |
| KR102047378B1 (ko) | 2012-11-30 | 2019-11-21 | 엘지이노텍 주식회사 | 카메라 모듈 |
| US9332234B2 (en) * | 2012-12-10 | 2016-05-03 | Duco Technologies, Inc. | Trail camera with interchangeable hardware modules |
| CN104243774B (zh) * | 2013-06-07 | 2018-08-07 | 索尼公司 | 监控摄像机及其机壳 |
| US9225885B2 (en) | 2013-06-14 | 2015-12-29 | Microsoft Technology Licensing, Llc | Reduced height camera module for small form factor applications |
| DE102013212748A1 (de) * | 2013-06-28 | 2014-12-31 | Robert Bosch Gmbh | Imagermodul für eine Kamera, Kamera und Verfahren zum Herstellen des Imagermoduls |
| US9063389B2 (en) * | 2013-07-09 | 2015-06-23 | Samsung Electro-Mechanics Co., Ltd. | Camera module |
| US20150015954A1 (en) * | 2013-07-09 | 2015-01-15 | Samsung Electro-Mechanics Co., Ltd. | Camera module |
| JP6006880B2 (ja) | 2013-08-30 | 2016-10-12 | 株式会社ジーシー | 有床義歯用アタッチメント |
| KR102121296B1 (ko) * | 2013-09-23 | 2020-06-10 | 엘지이노텍 주식회사 | 카메라 모듈 |
| CN103700634B (zh) * | 2013-11-06 | 2016-06-22 | 南昌欧菲光电技术有限公司 | 相机模组及其封装结构和封装方法 |
| EP2887637B1 (en) * | 2013-12-19 | 2015-11-04 | Axis AB | Image collector device having a sealed sensor space, and method of sealing a sensor space in an image collector device |
| CN104950415A (zh) * | 2014-03-27 | 2015-09-30 | 南昌欧菲光电技术有限公司 | 镜头模组结构 |
| US9609195B2 (en) * | 2014-05-07 | 2017-03-28 | Gopro, Inc. | Integrated image sensor and lens assembly |
| DE102014212016A1 (de) * | 2014-06-23 | 2015-12-24 | Robert Bosch Gmbh | Kamera, insbesondere in einem Fahrzeug einsetzbar, sowie ein Verfahren zum Herstellen einer derartigen Kamera |
| KR102351098B1 (ko) | 2015-01-16 | 2022-01-14 | 삼성전자주식회사 | 카메라 및 렌즈 모듈 |
| US9946909B2 (en) * | 2015-09-22 | 2018-04-17 | Symbol Technologies, Llc | Arrangement for and method of trapping debris in an electro-optical reader |
| EP3168682B1 (en) * | 2015-11-16 | 2017-12-27 | Axis AB | A lens arrangement and a monitoring camera comprising the lens arrangement |
| CN105681637B (zh) * | 2016-03-15 | 2019-12-31 | 宁波舜宇光电信息有限公司 | 阵列摄像模组及其感光组件和制造方法 |
| US10750071B2 (en) | 2016-03-12 | 2020-08-18 | Ningbo Sunny Opotech Co., Ltd. | Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof |
| KR102618045B1 (ko) * | 2016-10-06 | 2023-12-27 | 엘지이노텍 주식회사 | 카메라 모듈 |
| CN109792483B (zh) * | 2016-10-06 | 2022-03-01 | Lg伊诺特有限公司 | 相机模块及相机模块制造方法 |
| JP6983550B2 (ja) * | 2017-06-29 | 2021-12-17 | 日本電産サンキョー株式会社 | 振れ補正機能付き光学ユニットおよび振れ補正機能付き光学ユニットの製造方法 |
| US10750063B2 (en) * | 2018-07-19 | 2020-08-18 | Hand Held Products, Inc. | System and method for an image focusing adjustment module |
| CN109343298B (zh) * | 2018-12-25 | 2023-11-24 | 浙江舜宇智领技术有限公司 | 一种摄像模组 |
| CN110032241A (zh) * | 2019-01-30 | 2019-07-19 | 瑞声科技(新加坡)有限公司 | 移动终端 |
| US11428896B2 (en) | 2019-10-07 | 2022-08-30 | Hand Held Products, Inc. | Housing of an image capturing device |
| CN112350499B (zh) * | 2020-10-21 | 2025-12-16 | 江西晶浩光学有限公司 | 马达、摄像模组及电子设备 |
| CN115250300A (zh) * | 2021-04-25 | 2022-10-28 | 北京小米移动软件有限公司 | 摄像头的装饰环安装结构和移动终端 |
| CN114979446A (zh) * | 2022-06-09 | 2022-08-30 | 深圳市豪恩汽车电子装备股份有限公司 | 摄像头模组 |
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| US7983556B2 (en) | 2006-11-03 | 2011-07-19 | Flextronics Ap Llc | Camera module with contamination reduction feature |
-
2007
- 2007-11-02 US US11/982,726 patent/US7983556B2/en not_active Expired - Fee Related
- 2007-11-05 CN CN201110063877.1A patent/CN102109652B/zh not_active Expired - Fee Related
- 2007-11-05 WO PCT/US2007/023388 patent/WO2008057544A2/en not_active Ceased
- 2007-11-05 JP JP2009535360A patent/JP5118147B2/ja not_active Expired - Fee Related
- 2007-11-05 US US11/982,846 patent/US7773876B2/en active Active
- 2007-11-05 CN CN201210291705.4A patent/CN102819167B/zh not_active Expired - Fee Related
- 2007-11-05 JP JP2009535355A patent/JP5374376B2/ja not_active Expired - Fee Related
- 2007-11-05 CN CN200780041066.3A patent/CN101543045B/zh not_active Expired - Fee Related
- 2007-11-05 WO PCT/US2007/023335 patent/WO2008057517A2/en not_active Ceased
- 2007-11-05 CN CN200780040705.4A patent/CN101535861B/zh not_active Expired - Fee Related
-
2012
- 2012-02-24 JP JP2012039255A patent/JP2012133389A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008057544A3 (en) | 2008-07-03 |
| WO2008057517A2 (en) | 2008-05-15 |
| JP2010509806A (ja) | 2010-03-25 |
| JP2010509620A (ja) | 2010-03-25 |
| WO2008057544A2 (en) | 2008-05-15 |
| JP5374376B2 (ja) | 2013-12-25 |
| CN102819167B (zh) | 2015-07-08 |
| US20080152339A1 (en) | 2008-06-26 |
| CN101543045B (zh) | 2012-07-04 |
| WO2008057517A3 (en) | 2008-07-10 |
| CN101543045A (zh) | 2009-09-23 |
| WO2008057544A9 (en) | 2008-08-14 |
| US20080159734A1 (en) | 2008-07-03 |
| CN102819167A (zh) | 2012-12-12 |
| US7983556B2 (en) | 2011-07-19 |
| US7773876B2 (en) | 2010-08-10 |
| CN101535861B (zh) | 2011-05-18 |
| CN102109652B (zh) | 2013-09-18 |
| CN101535861A (zh) | 2009-09-16 |
| JP2012133389A (ja) | 2012-07-12 |
| CN102109652A (zh) | 2011-06-29 |
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