JP5109228B2 - Thin glass laminate and method for manufacturing display device using thin glass laminate - Google Patents
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本発明は、液晶表示体、有機ＥＬ表示体等の表示装置に用いられるガラス基板、より具体的には、薄板ガラス基板を用いて表示装置を製造する際に使用される該薄板ガラス基板と基板ガラス基板との積層体、およびそれを用いた表示装置の製造方法に関する。 The present invention relates to a glass substrate used in a display device such as a liquid crystal display or an organic EL display, and more specifically, the thin glass substrate and the substrate used when manufacturing the display device using a thin glass substrate. The present invention relates to a laminate with a glass substrate and a method for manufacturing a display device using the same.
液晶表示装置（ＬＣＤ）、有機ＥＬ表示装置（ＯＬＥＤ）、特にモバイルや携帯電話等の携帯型表示装置の分野では、表示装置の軽量化、薄型化が重要な課題となっている。
この課題に対応するために、表示装置に用いるガラス基板の板厚をさらに薄くする検討が行われてきたが、ガラス基板の板厚を薄くすると、強度の低下が問題となり、撓み量も大きいためそのままでは現行の製造ラインに適用できない。
そこで、板厚の薄いガラス基板（以下、「薄板ガラス基板」とする。）の強度を補強し、併せて現行製造ラインに適用しうる板厚を確保するために、薄板ガラス基板を他の支持ガラス基板と貼り合わせて積層体（薄板ガラス積層体）とした状態で表示装置を製造するための所定の処理を実施し、該処理の終了後に薄板ガラス基板と支持ガラス基板とを分離することで表示装置を製造する方法が提案されている（特許文献１〜６参照）。
In the field of liquid crystal display devices (LCD), organic EL display devices (OLED), especially portable display devices such as mobile phones and mobile phones, weight reduction and thinning of display devices are important issues.
In order to cope with this problem, studies have been made to further reduce the thickness of the glass substrate used in the display device. However, if the thickness of the glass substrate is reduced, a decrease in strength becomes a problem and the amount of deflection is large. As it is, it cannot be applied to the current production line.
Therefore, in order to reinforce the strength of the thin glass substrate (hereinafter referred to as “thin glass substrate”) and to secure the plate thickness applicable to the current production line, the thin glass substrate is supported by other supports. By performing a predetermined process for manufacturing a display device in a state of being laminated with a glass substrate to form a laminate (thin glass laminate), and separating the thin glass substrate and the supporting glass substrate after the completion of the process A method of manufacturing a display device has been proposed (see Patent Documents 1 to 6).
これら表示装置を製造する方法において、薄板ガラス基板と支持ガラス基板と、を積層させて固定する方法としては、ガラス基板間に再剥離性の粘着剤または粘着シートを全面にわたって配置し、その粘着力で両者を固定する方法（例えば、特許文献１〜３参照）、ガラス基板間に生じる静電吸着力や真空吸着力を用いて両者を固定する方法（例えば、特許文献４参照）、ガラス基板の両端をガラスフリットを用いて固定する方法（例えば、特許文献５参照）、または周縁部の端面近傍にレーザ光を照射して２枚のガラス基板を融合させる方法（例えば特許文献６参照）等が提案されている。 In the method of manufacturing these display devices, as a method of laminating and fixing the thin glass substrate and the supporting glass substrate, a removable adhesive or adhesive sheet is disposed over the entire surface between the glass substrates, and the adhesive strength thereof. (For example, refer to Patent Documents 1 to 3), a method for fixing both using electrostatic adsorption force or vacuum adsorption force generated between glass substrates (for example, refer to Patent Document 4), A method of fixing both ends using glass frit (for example, see Patent Document 5), a method of merging two glass substrates by irradiating laser light near the end face of the peripheral edge (for example, see Patent Document 6), etc. Proposed.
これらの方法は、製造される表示装置に悪影響するおそれのある潜在的な問題点を有していた。すなわち、ガラス基板間に再剥離性の粘着剤または粘着シートを全面にわたって配置する方法の場合、ガラス基板同士を固定するのに十分な粘着力を有する粘着剤または粘着シートを使用すると、薄板ガラス基板と支持ガラス基板とを分離することが困難になり、分離する際に薄板ガラス基板が破損するおそれがある。また、分離後の薄板ガラス基板への粘着剤の残存も問題となる。さらに、表示装置の製造工程には、液晶表示装置の製造工程における絶縁膜や配向膜の焼成工程のように、高温での処理が必要となる工程を含んでいるため、粘着剤および粘着シートは耐熱性が要求されるが、耐熱性と、再剥離性との両立は困難である。
ガラス基板同士を静電吸着力や真空吸着力を利用して固定する方法では、表示装置の製造工程中に洗浄剤等の異物が基板同士の界面から侵入するおそれがあり、また真空製膜工程時にガラス基板同士が剥離するおそれもある。
These methods have potential problems that can adversely affect the display device being manufactured. That is, in the case of a method in which a removable adhesive or adhesive sheet is disposed over the entire surface between glass substrates, a thin glass substrate is obtained by using an adhesive or adhesive sheet having sufficient adhesive strength to fix the glass substrates together. It is difficult to separate the glass substrate and the supporting glass substrate, and the thin glass substrate may be damaged during the separation. Further, the remaining adhesive on the thin glass substrate after separation also becomes a problem. Furthermore, since the manufacturing process of the display device includes a process that requires processing at a high temperature, such as the baking process of the insulating film and the alignment film in the manufacturing process of the liquid crystal display device, the adhesive and the adhesive sheet are Although heat resistance is required, it is difficult to achieve both heat resistance and removability.
In the method of fixing glass substrates to each other using electrostatic adsorption force or vacuum adsorption force, there is a possibility that foreign substances such as cleaning agents may enter from the interface between the substrates during the manufacturing process of the display device, and the vacuum film forming process Sometimes the glass substrates may be separated from each other.
ガラス基板の両端をガラスフリットを用いて接着する方法、または周縁部にレーザ光を照射して２枚のガラス基板を融合させる方法の場合、上記した問題点は解消しうるが、ガラス基板を高温、例えばガラスフリットを用いて接着する場合では５００〜６００℃、に加熱することが必要となるため、加熱後室温まで冷却した際に、薄板ガラス基板にたわみが発生し、十分な密着性や平坦性が確保しえないというおそれがある。また、加熱後室温まで冷却した際に接合部に割れが生じるおそれがある。 In the case of a method in which both ends of a glass substrate are bonded using a glass frit, or a method in which a peripheral portion is irradiated with laser light to fuse two glass substrates, the above-mentioned problems can be solved, but the glass substrate is heated to a high temperature. For example, in the case of bonding using glass frit, it is necessary to heat to 500 to 600 ° C. Therefore, when the glass glass frit is cooled to room temperature after heating, the thin glass substrate is bent, and sufficient adhesion and flatness are obtained. There is a risk that the sex cannot be secured. Moreover, when it cools to room temperature after a heating, there exists a possibility that a crack may arise in a junction part.
上記した従来技術の問題点を解決するため、本発明は、薄板ガラス基板にたわみが発生することがなく、薄板ガラス基板と支持ガラス基板とが密着性に優れており、かつ薄板ガラス基板と支持ガラス基板との接合部に割れが生じるおそれがなく、薄板ガラス基板と、支持ガラス基板と、の分離が容易な薄板ガラス積層体、および該薄板ガラス積層体を用いて表示装置を製造する方法を提供することを目的とする。 In order to solve the above-described problems of the prior art, the present invention does not cause deflection of the thin glass substrate, the thin glass substrate and the supporting glass substrate have excellent adhesion, and the thin glass substrate and the supporting glass substrate are supported. There is no risk of cracking at the joint with the glass substrate, and the thin glass substrate and the supporting glass substrate can be easily separated from each other, and a method for producing a display device using the thin glass laminate The purpose is to provide.
上記の目的を達成するため、本発明は、薄板ガラス基板と、支持ガラス基板と、を積層させてなる薄板ガラス積層体であって、
前記支持ガラス基板の線膨張係数が前記薄板ガラス基板の線膨張係数以下であり、
前記薄板ガラス積層体の周縁部が熱硬化性樹脂を用いて封止されていることを特徴とする薄板ガラス積層体（以下、「本発明の薄板ガラス積層体」という。）を提供する。
In order to achieve the above object, the present invention is a thin glass laminate obtained by laminating a thin glass substrate and a supporting glass substrate,
The linear expansion coefficient of the supporting glass substrate is less than or equal to the linear expansion coefficient of the thin glass substrate;
Provided is a thin glass laminate (hereinafter referred to as “the thin glass laminate of the present invention”) characterized in that a peripheral portion of the thin glass laminate is sealed with a thermosetting resin.
本発明の薄板ガラス積層体において、前記熱硬化性樹脂は、シリコーン樹脂、ポリイミドシリコーン樹脂および有機シラザン系樹脂からなる群から選択される１種以上であることが好ましい。 In the thin glass laminate of the present invention, the thermosetting resin is preferably at least one selected from the group consisting of a silicone resin, a polyimide silicone resin, and an organic silazane resin.
本発明の薄板ガラス積層体において、前記薄板ガラス基板の厚さが０．３ｍｍ未満であり、前記支持ガラス基板は厚さが０．３ｍｍ以上であることが好ましい。 In the thin glass laminate of the present invention, it is preferable that the thin glass substrate has a thickness of less than 0.3 mm, and the support glass substrate has a thickness of 0.3 mm or more.
また、本発明は、薄板ガラス基板を用いた表示装置の製造方法であって、
薄板ガラス基板と、前記薄板ガラス基板以下の線膨張係数を有する支持ガラス基板と、を積層させて、積層体の周縁部に熱硬化性樹脂を配置し、その後前記熱硬化性樹脂を加熱硬化して前記積層体の周縁部を封止し、
前記薄板ガラス基板上に表示装置を製造するための所定の処理を実施し、
前記所定の処理を実施した後、前記薄板ガラス基板と、前記支持ガラス基板と、を分離することを特徴とする薄板ガラス基板を用いた表示装置の製造方法（以下、「本発明の表示装置の製造方法」という。）を提供する。
本発明の表示装置の製造方法によれば、非常に簡易な方法で表示装置を製造することができる。
Further, the present invention is a method for manufacturing a display device using a thin glass substrate,
A thin glass substrate and a supporting glass substrate having a linear expansion coefficient equal to or less than that of the thin glass substrate are laminated, a thermosetting resin is disposed on a peripheral portion of the laminate, and then the thermosetting resin is heated and cured. Sealing the periphery of the laminate,
A predetermined process for producing a display device on the thin glass substrate is performed,
After the predetermined treatment is performed, the thin glass substrate and the supporting glass substrate are separated from each other, and a method for manufacturing a display device using a thin glass substrate (hereinafter referred to as “the display device of the present invention”). Manufacturing method ").
According to the method for manufacturing a display device of the present invention, the display device can be manufactured by a very simple method.
本発明の表示装置の製造方法において、前記熱硬化性樹脂は、シリコーン樹脂、ポリイミドシリコーン樹脂および有機シラザン系樹脂からなる群から選択される１種以上であることが好ましい。 In the method for manufacturing a display device of the present invention, the thermosetting resin is preferably one or more selected from the group consisting of a silicone resin, a polyimide silicone resin, and an organic silazane resin.
本発明の表示装置の製造方法において、前記薄板ガラス基板と、前記支持ガラス基板と、の分離は、前記積層体の封止部を含む端部を切断することで実施してもよい。
前記積層体の端部の切断は、レーザカッタを用いて実施することが好ましい。
In the display device manufacturing method of the present invention, the thin glass substrate and the supporting glass substrate may be separated by cutting an end portion including a sealing portion of the laminate.
The cutting of the end of the laminate is preferably performed using a laser cutter.
本発明の薄板ガラス積層体は、薄板ガラス基板と、線膨張係数が該薄板ガラス基板以下の支持ガラス基板と、が積層されているため、積層体の周縁部を封止するために積層体を熱硬化性樹脂の硬化温度まで加熱し、その後室温まで冷却した際に、薄板ガラス基板にたわみが発生することがなく、薄板ガラス基板と支持ガラス基板とが密着性に優れている。
支持ガラス基板の線膨張係数を薄板ガラス基板の線膨張係数よりも小さくすれば、積層体を熱硬化性樹脂の硬化温度まで加熱し、その後室温まで冷却した際に薄板ガラス基板に引張応力がかかるため、さらに密着性が向上し、薄板ガラス基板の平坦性が向上する効果が期待される。
Since the thin glass laminate of the present invention is laminated with a thin glass substrate and a supporting glass substrate having a linear expansion coefficient equal to or less than that of the thin glass substrate, the laminate is sealed in order to seal the peripheral portion of the laminate. When heated to the curing temperature of the thermosetting resin and then cooled to room temperature, the thin glass substrate does not bend and the thin glass substrate and the supporting glass substrate are excellent in adhesion.
If the linear expansion coefficient of the supporting glass substrate is made smaller than the linear expansion coefficient of the thin glass substrate, a tensile stress is applied to the thin glass substrate when the laminate is heated to the curing temperature of the thermosetting resin and then cooled to room temperature. Therefore, the adhesiveness is further improved, and the effect of improving the flatness of the thin glass substrate is expected.
本発明の薄板ガラス積層体は、積層体の周縁部を熱硬化性樹脂を用いて封止しているため、積層体の周縁部を加熱処理に用いて封止した際に、封止部に割れが生じるおそれがない。また、弾性を有する樹脂硬化物からなる封止部は、薄板ガラス基板にかかる引張応力を緩和することができるので、過剰な引張応力がかかった場合であっても、薄板ガラス基板の破壊を防止する効果が期待される。 The thin glass laminate of the present invention seals the periphery of the laminate using a thermosetting resin, so when the periphery of the laminate is sealed using heat treatment, There is no risk of cracking. In addition, the sealing part made of an elastic resin cured product can relieve the tensile stress applied to the thin glass substrate, so that even if excessive tensile stress is applied, the thin glass substrate is prevented from being destroyed. Expected to be effective.
本発明の薄板ガラス積層体は、薄板ガラス基板と、支持ガラス基板と、に容易に分離することができ、ガラス基板同士を分離する際に、薄板ガラス基板が破損するおそれがない。 The thin glass laminated body of this invention can be easily isolate | separated into a thin glass substrate and a support glass substrate, and when separating glass substrates, there is no possibility that a thin glass substrate will be damaged.
本発明の表示装置の製造方法は、本発明の薄板積層体を用いることにより、薄板ガラス基板におけるたわみの発生や、製造時における薄板ガラス基板の破損が防止されるので、製造される表示装置の歩留まりを向上することができる。 The display device manufacturing method of the present invention prevents the occurrence of deflection in the thin glass substrate and the damage of the thin glass substrate during manufacturing by using the thin plate laminate of the present invention. Yield can be improved.
以下、本発明の薄板ガラス積層体について説明する。
薄板ガラス基板は、ＬＣＤ、ＯＬＥＤといった表示装置用のガラス基板であり、０．３ｍｍ未満の厚さを有する。薄板ガラス基板の厚さは好ましくは０．２ｍｍ以下であり、より好ましくは０．１ｍｍ以下である。また、薄板ガラス基板の厚さは０．０５ｍｍ以上であることが好ましい。
なお、本発明が対象とする表示装置は、主として携帯電話やＰＤＡのようなモバイル端末に使用される小型の表示装置である。表示装置は、主としてＬＣＤまたはＯＬＥＤであり、ＬＣＤとしては、ＴＮ型、ＳＴＮ型、ＦＥ型、ＴＦＴ型、ＭＩＭ型を含む。
Hereinafter, the thin glass laminated body of this invention is demonstrated.
The thin glass substrate is a glass substrate for a display device such as an LCD or an OLED and has a thickness of less than 0.3 mm. The thickness of the thin glass substrate is preferably 0.2 mm or less, and more preferably 0.1 mm or less. The thickness of the thin glass substrate is preferably 0.05 mm or more.
The display device targeted by the present invention is a small display device mainly used for mobile terminals such as mobile phones and PDAs. The display device is mainly an LCD or an OLED, and the LCD includes a TN type, an STN type, an FE type, a TFT type, and an MIM type.
熱収縮率、表面形状、耐薬品性等、薄板ガラス基板に要求される特性は、表示装置の種類により異なる。したがって、薄板ガラス基板は、アルカリガラス製であってもよい。但し、熱収縮率が少ないことから、無アルカリガラスが好ましい。
本発明において、薄板ガラス基板は熱収縮率が少ないものが好ましい。ガラスの場合、熱膨張および熱収縮の指標として、ＪＩＳ Ｒ３１０２（１９９５年）規定の線膨張係数が用いられる。薄板ガラス基板は、線膨張係数が５０×１０-7／℃以下であることが好ましく、より好ましくは４５×１０-7／℃以下であり、４０×１０-7／℃以下であることがより好ましく、３０×１０-7／℃以下であることがより好ましく、２０×１０-7／℃以下であることがさらに好ましい。
Properties required for a thin glass substrate such as heat shrinkage, surface shape, chemical resistance, and the like vary depending on the type of display device. Therefore, the thin glass substrate may be made of alkali glass. However, alkali-free glass is preferred because of its low thermal shrinkage.
In the present invention, the thin glass substrate preferably has a low thermal shrinkage rate. In the case of glass, a linear expansion coefficient defined in JIS R3102 (1995) is used as an index of thermal expansion and contraction. The thin glass substrate preferably has a linear expansion coefficient of 50 × 10 −7 / ° C. or less, more preferably 45 × 10 −7 / ° C. or less, and more preferably 40 × 10 −7 / ° C. or less. Preferably, it is 30 × 10 −7 / ° C. or less, and more preferably 20 × 10 −7 / ° C. or less.
支持ガラス基板は、薄板ガラス基板の強度を補強する目的で薄板ガラス基板と積層させるものであるため、薄板ガラス基板よりも厚いことが必要である。支持ガラス基板の厚さは、薄板ガラス基板との積層体が現行の製造ラインで流動させることができるような厚さであることが好ましい。例えば、現行の製造ラインが厚さ０．７ｍｍの基板を流動させるように設計されたものであって、薄板ガラス基板の厚さが０．１ｍｍである場合、支持ガラス基板の厚さは０．６ｍｍであることが好ましい。なお、上記したように、薄板ガラス基板の厚さは０．３ｍｍ未満であることが好ましい。現行の製造ラインは、厚さが０．７ｍｍのガラス基板を流動させるように設計されているものが最も一般的である。このため、支持ガラス基板は、厚さが０．４ｍｍ以上であることが好ましい。但し、支持ガラス基板の厚さは、薄板ガラス基板との合計で０．７ｍｍでなくてもよい。この場合支持ガラス基板の厚さは０．３〜１．９ｍｍであることが好ましく、薄板ガラス基板との合計で厚さ０．４〜２ｍｍとなることが好ましい。また、支持ガラス基板と薄板ガラス基板の厚さの差は０．１〜１．５ｍｍであることが好ましい。 Since the supporting glass substrate is laminated with the thin glass substrate for the purpose of reinforcing the strength of the thin glass substrate, the supporting glass substrate needs to be thicker than the thin glass substrate. The thickness of the supporting glass substrate is preferably such that the laminate with the thin glass substrate can be flowed in the current production line. For example, when the current production line is designed to flow a substrate having a thickness of 0.7 mm, and the thickness of the thin glass substrate is 0.1 mm, the thickness of the supporting glass substrate is 0. It is preferable that it is 6 mm. As described above, the thickness of the thin glass substrate is preferably less than 0.3 mm. The current production line is most commonly designed to flow a glass substrate having a thickness of 0.7 mm. For this reason, it is preferable that the supporting glass substrate has a thickness of 0.4 mm or more. However, the thickness of the supporting glass substrate may not be 0.7 mm in total with the thin glass substrate. In this case, the thickness of the supporting glass substrate is preferably 0.3 to 1.9 mm, and the total thickness with the thin glass substrate is preferably 0.4 to 2 mm. The difference in thickness between the supporting glass substrate and the thin glass substrate is preferably 0.1 to 1.5 mm.
また、支持ガラス基板は、薄板ガラス基板の強度を補強するものなので、その材質は特に限定されず、アルカリガラス、無アルカリガラスのいずれであってもよい。但し、支持ガラス基板は、その線膨張係数が薄板ガラス基板の線膨張係数以下であることが必要である。
詳しくは後で述べるが、本発明の薄板ガラス積層体は、薄板ガラス基板と支持ガラス基板とを積層させた後、その周縁部が熱硬化性樹脂を用いて封止される。この際、積層体は硬化性樹脂の硬化温度まで加熱され、その後室温まで冷却される。
Further, since the supporting glass substrate reinforces the strength of the thin glass substrate, the material thereof is not particularly limited and may be either alkali glass or non-alkali glass. However, the support glass substrate needs to have a linear expansion coefficient that is equal to or less than that of the thin glass substrate.
As will be described in detail later, in the thin glass laminate of the present invention, after laminating a thin glass substrate and a supporting glass substrate, a peripheral portion thereof is sealed using a thermosetting resin. At this time, the laminate is heated to the curing temperature of the curable resin and then cooled to room temperature.
支持ガラス基板の線膨張係数が薄板ガラス基板の線膨張係数よりも大きい場合、積層体を熱硬化性樹脂の硬化温度まで加熱し、その後室温まで冷却した際に、支持ガラス基板の収縮量が薄板ガラス基板の収縮量よりも大きくなるため、薄板ガラス基板が支持ガラス基板から浮き上がってしまい、両者の収縮量の差によってはたわみが生じることとなる。 When the linear expansion coefficient of the supporting glass substrate is larger than the linear expansion coefficient of the thin glass substrate, when the laminate is heated to the curing temperature of the thermosetting resin and then cooled to room temperature, the shrinkage amount of the supporting glass substrate is thin. Since it becomes larger than the shrinkage amount of a glass substrate, a thin glass substrate will float from a support glass substrate, and a deflection | deviation will arise depending on the difference in shrinkage amount of both.
一方、支持ガラス基板の線膨張係数が薄板ガラス基板の線膨張係数以下である場合には、積層体を熱硬化性樹脂の硬化温度まで加熱し、その後室温まで冷却した際に、支持ガラス基板の収縮量が薄板ガラス基板の収縮量と同一であるか、又はそれよりも小さくなるため、薄板ガラス基板が支持ガラス基板から浮き上がったり、たわみが生じるおそれがない。 On the other hand, when the linear expansion coefficient of the supporting glass substrate is less than or equal to the linear expansion coefficient of the thin glass substrate, when the laminate is heated to the curing temperature of the thermosetting resin and then cooled to room temperature, Since the amount of shrinkage is the same as or smaller than the amount of shrinkage of the thin glass substrate, there is no possibility that the thin glass substrate is lifted from the supporting glass substrate or bent.
本発明において、支持ガラス基板の線膨張係数は、薄板ガラス基板の線膨張係数よりも小さいことが好ましい。支持ガラス基板の線膨張係数が薄板ガラス基板の線膨張係数よりも小さい場合、積層体を熱硬化性樹脂の硬化温度まで加熱し、その後室温まで冷却した際に、支持ガラス基板の収縮量は薄板ガラス基板の収縮量よりも小さくなる。板厚の厚い支持ガラス基板は変形を生じないので、結果として薄板ガラス基板に引張応力がかかり、薄板ガラス基板は支持ガラス基板に密着する。これにより薄板ガラス基板の平坦性が高められる効果が期待される。 In the present invention, the linear expansion coefficient of the supporting glass substrate is preferably smaller than the linear expansion coefficient of the thin glass substrate. When the linear expansion coefficient of the supporting glass substrate is smaller than the linear expansion coefficient of the thin glass substrate, when the laminate is heated to the curing temperature of the thermosetting resin and then cooled to room temperature, the shrinkage amount of the supporting glass substrate is thin. It becomes smaller than the shrinkage amount of the glass substrate. Since the supporting glass substrate having a large thickness does not deform, as a result, a tensile stress is applied to the thin glass substrate, and the thin glass substrate adheres to the supporting glass substrate. Thereby, the effect of improving the flatness of the thin glass substrate is expected.
しかしながら、線膨張係数の差が大きすぎると、引張応力が破壊強度を上回り、薄板ガラス基板に割れが生じるおそれがある。このため、薄板ガラス基板のサイズや板厚に応じて、線膨張係数の差が適切になるように選択する必要がある。薄板ガラス基板と支持ガラス基板との線膨張係数の差は３５×１０-7／℃以下であることが好ましく、より好ましくは２５×１０-7／℃以下であり、さらに好ましくは１５×１０-7／℃以下である。また、薄板ガラス基板と支持ガラス基板との線膨張係数の差は５×１０-7／℃以上であることが好ましい。 However, if the difference between the linear expansion coefficients is too large, the tensile stress exceeds the fracture strength, and the thin glass substrate may be cracked. For this reason, it is necessary to make a selection so that the difference in linear expansion coefficient is appropriate according to the size and thickness of the thin glass substrate. The difference in coefficient of linear expansion between the thin glass substrate and the supporting glass substrate is preferably 35 × 10 −7 / ° C. or less, more preferably 25 × 10 −7 / ° C. or less, and even more preferably 15 × 10 − 7 / ° C or less. The difference in linear expansion coefficient between the thin glass substrate and the support glass substrate is preferably 5 × 10 −7 / ° C. or more.
なお、薄板ガラス基板にかかる引張応力は、支持ガラス基板を薄板ガラス基板から分離した時点で解放されることとなる。プラスチック製の基板の場合、この引張応力の解放により、基板表面に形成した機能性薄膜等に欠陥が生じる等の問題があるが、薄板ガラス基板の場合、プラスチック製基板に比べてヤング率がはるかに大きいためこのような問題が生じるおそれはない。 The tensile stress applied to the thin glass substrate is released when the supporting glass substrate is separated from the thin glass substrate. In the case of a plastic substrate, the release of this tensile stress causes problems such as defects in the functional thin film formed on the substrate surface. However, in the case of a thin glass substrate, the Young's modulus is much higher than that of a plastic substrate. Therefore, there is no possibility that such a problem will occur.
なお、支持ガラス基板は、薄板ガラス基板を補強するとともに、薄板ガラス積層体が製造ラインの流動する際には、薄板ガラス基板を保持する基台となるため、その大きさは薄板ガラス基板の大きさと等しいか、またはそれ以上であることが好ましい。 Note that the supporting glass substrate reinforces the thin glass substrate and serves as a base for holding the thin glass substrate when the thin glass laminate flows in the production line, so the size thereof is the size of the thin glass substrate. Is preferably equal to or greater than.
本発明の薄板ガラス積層体を製造する場合、薄板ガラス基板と支持ガラス基板とを積層させた後、積層体の周縁部に熱硬化性樹脂を配置する。なお、積層体の周縁部を封止するのは、薄板ガラス基板と支持ガラス基板とを接合することが目的の１つであるが、表示装置の製造工程中に洗浄剤等の異物が基板同士の界面から侵入することを防止するという目的のためでもある。このため、熱硬化性樹脂は積層体の全周縁部に配置する。 When manufacturing the thin glass laminated body of this invention, after laminating | stacking a thin glass substrate and a support glass substrate, a thermosetting resin is arrange | positioned in the peripheral part of a laminated body. The purpose of sealing the peripheral edge of the laminate is to bond the thin glass substrate and the supporting glass substrate. However, foreign substances such as a cleaning agent are present between the substrates during the manufacturing process of the display device. This is also for the purpose of preventing intrusion from the interface. For this reason, a thermosetting resin is arrange | positioned at the whole peripheral part of a laminated body.
薄板ガラス基板と支持ガラス基板を積層する際には、両基板の表面を十分に洗浄しておくことが必要である。異物等が基板同士の界面に存在すると、両基板の密着性不良につながり、積層後の薄板ガラス基板表面の平坦性が十分確保されず露光工程等で問題が生ずるおそれがある。 When laminating a thin glass substrate and a supporting glass substrate, it is necessary to sufficiently clean the surfaces of both substrates. If foreign matter or the like is present at the interface between the substrates, it will lead to poor adhesion between the two substrates, and the flatness of the surface of the thin glass substrate after lamination will not be sufficiently secured, which may cause problems in the exposure process.
熱硬化性樹脂は、表示装置の製造工程で実施される熱処理に耐え得るだけの耐熱性を有するものである限り、一般に接着剤や封止材として使用しうる材料から広く選択することができる。熱硬化性樹脂の中でも、耐熱性に優れ、硬化物がある程度弾性を有するものであることが好ましい。このような熱硬化性樹脂の具体例としては、例えばシリコーン樹脂、ポリイミドシリコーン樹脂、および有機シラザン系樹脂が例示される。これらの熱硬化性樹脂であれば、表示装置の製造工程で実施される熱処理に対して十分な耐熱性を有している。また、硬化物がある程度弾性を有するため、両基板の線膨張係数の差によって薄板ガラス基板にかかる引張応力を緩和し得る。これにより、両基板の線膨張係数の差がある程度大きい場合であっても、引張応力によって薄板ガラス基板に割れが発生するのを防止することができる。なお、これらの熱硬化性樹脂は、１種のみを使用してもよいし、２種以上を併用してもよい。 The thermosetting resin can be widely selected from materials that can generally be used as an adhesive or a sealing material as long as it has heat resistance enough to withstand heat treatment performed in the manufacturing process of the display device. Among thermosetting resins, it is preferable that the resin is excellent in heat resistance and has a certain degree of elasticity. Specific examples of such thermosetting resins include silicone resins, polyimide silicone resins, and organic silazane resins. These thermosetting resins have sufficient heat resistance against the heat treatment performed in the manufacturing process of the display device. Further, since the cured product has a certain degree of elasticity, the tensile stress applied to the thin glass substrate can be relieved by the difference in linear expansion coefficient between the two substrates. Thereby, even if the difference between the linear expansion coefficients of both the substrates is large to some extent, it is possible to prevent the thin glass substrate from being cracked by the tensile stress. In addition, these thermosetting resins may use only 1 type and may use 2 or more types together.
積層体の周縁部に熱硬化性樹脂を配置する方法は特に限定されず、公知の方法から適宜選択することができる。例えば、熱硬化性樹脂が所望の溶媒に溶解された溶液状またはペースト状である場合、刷毛、スプレー、ディスペンサ等を用いて塗布すればよい。但し、熱硬化性樹脂は、シート状、ワイヤー状、スティック状等、固形であってもよい。 The method for disposing the thermosetting resin on the peripheral edge of the laminate is not particularly limited, and can be appropriately selected from known methods. For example, when the thermosetting resin is in the form of a solution or paste dissolved in a desired solvent, it may be applied using a brush, spray, dispenser, or the like. However, the thermosetting resin may be solid, such as a sheet shape, a wire shape, or a stick shape.
積層体の周縁部に熱硬化性樹脂を配置した後、熱硬化性樹脂の硬化温度まで加熱して樹脂を硬化させることによって積層体の周縁部が封止される。加熱条件は、使用する熱硬化性樹脂や、封止部の面積等に応じて適宜選択することができる。例えば、加熱温度は１００〜３００℃であることが好ましく、加熱時間は５〜１２０分であることが好ましい。また、加熱は大気中で実施することが好ましい。本発明の薄板ガラス積層体では、支持ガラス基板の線膨張係数は、薄板ガラス基板の線膨張係数以下であるため、熱硬化樹脂の硬化温度まで加熱し、その後室温まで冷却した際に、薄板ガラス基板が支持ガラス基板から浮き上がったり、たわみが生じるおそれがない。また、支持ガラス基板の線膨張係数が薄板ガラス基板の線膨張係数よりも小さい場合、熱硬化性樹脂の硬化温度まで加熱し、その後室温まで冷却した際に、薄板ガラス基板に引張応力が発生し、薄板ガラス基板は支持ガラス基板に密着する。これによって、薄板ガラス基板の平坦性が向上する効果が期待される。 After arrange | positioning a thermosetting resin to the peripheral part of a laminated body, the peripheral part of a laminated body is sealed by heating to the curing temperature of a thermosetting resin and hardening resin. The heating conditions can be appropriately selected according to the thermosetting resin to be used, the area of the sealing portion, and the like. For example, the heating temperature is preferably 100 to 300 ° C., and the heating time is preferably 5 to 120 minutes. Moreover, it is preferable to implement heating in air | atmosphere. In the thin glass laminate of the present invention, since the linear expansion coefficient of the supporting glass substrate is less than or equal to the linear expansion coefficient of the thin glass substrate, the thin glass is heated when heated to the curing temperature of the thermosetting resin and then cooled to room temperature. There is no possibility that the substrate will be lifted from the supporting glass substrate or bend. In addition, when the linear expansion coefficient of the supporting glass substrate is smaller than that of the thin glass substrate, tensile stress is generated in the thin glass substrate when heated to the curing temperature of the thermosetting resin and then cooled to room temperature. The thin glass substrate is in close contact with the supporting glass substrate. This is expected to improve the flatness of the thin glass substrate.
次に本発明の表示装置の製造方法について説明する。本発明の表示装置の製造方法では、上記手順で本発明の薄板ガラス積層体を形成した後、積層体の薄板ガラス基板上に表示装置を製造するための所定の処理を実施する。本明細書において、表示装置を製造するための所定の処理と言った場合、ＬＣＤまたはＯＬＥＤといった表示装置を製造する際に、製造工程で実施される各種処理を広く含む。ここで実施される処理の具体例としては、ＬＣＤを製造する場合を例にとると、薄板ガラス基板上にアレイを形成する工程、前記薄板ガラス基板とは異なる薄板ガラス基板上にカラーフィルタを形成する工程、アレイが形成された薄板ガラス基板と、カラーフィルタが形成された薄板ガラス基板と、を貼合わせる工程（アレイ・カラーフィルタ貼合わせ工程）等の各種工程を含み、これらの工程で実施される処理として、具体的には例えば、純水洗浄、乾燥、成膜、レジスト塗布、露光、現像、エッチングおよびレジスト除去等が挙げられる。本発明において、薄板ガラス積層体の周縁部の封止に用いられる熱硬化性樹脂は、耐薬品性に優れており、ＬＣＤまたはＯＬＥＤといった表示装置を製造する際に使用されるエッチング液、現像液およびエッチング除去液に耐性を有している。
さらに、アレイ・カラーフィルタ貼合わせ工程を実施した後に行われる工程として、液晶注入工程および該処理の実施後に行われる注入口の封止工程があり、これらの工程で実施される処理も含む。但し、これらの処理を積層体の状態で実施する必要はない。例えば、強度および取り扱い性の点からは、アレイ・カラーフィルタ貼合わせ工程までを積層体の状態で実施した後、薄板ガラス基板と支持ガラス基板とを分離してから液晶注入処理を実施することが好ましい。
Next, a method for manufacturing the display device of the present invention will be described. In the manufacturing method of the display device of the present invention, after the thin glass laminate of the present invention is formed by the above procedure, a predetermined process for manufacturing the display device is performed on the thin glass substrate of the laminate. In this specification, the term “predetermined process for manufacturing a display device” includes a wide variety of processes performed in the manufacturing process when manufacturing a display device such as an LCD or an OLED. As a specific example of the processing performed here, in the case of manufacturing an LCD, for example, a process of forming an array on a thin glass substrate, a color filter is formed on a thin glass substrate different from the thin glass substrate And various processes such as a process of laminating a thin glass substrate on which an array is formed and a thin glass substrate on which a color filter is formed (array / color filter laminating process). Specific examples of the treatment include pure water cleaning, drying, film formation, resist coating, exposure, development, etching, and resist removal. In the present invention, the thermosetting resin used for sealing the peripheral portion of the thin glass laminate is excellent in chemical resistance, and is used in manufacturing a display device such as an LCD or an OLED. In addition, it has resistance to etching removal liquid.
Furthermore, as a process performed after implementing an array color filter bonding process, there exists a liquid-crystal injection | pouring process and the sealing process of the injection port performed after implementation of this process, The process performed by these processes is also included. However, it is not necessary to perform these processes in the state of a laminated body. For example, from the viewpoint of strength and handleability, it is possible to carry out the liquid crystal injection process after separating the thin glass substrate and the supporting glass substrate after performing the array / color filter bonding step in the state of a laminate. preferable.
また、ＯＬＥＤを製造する場合を例にとると、薄板ガラス基板上に有機ＥＬ構造体を形成するための工程として、透明電極を形成する工程、ホール注入層・ホール輸送層・発光層・電子輸送層等を蒸着する工程、封止工程等の各種工程を含み、これらの工程で実施される処理として、具体的には例えば、成膜処理、蒸着処理、封止板の接着処理等が挙げられる。 Taking the case of manufacturing an OLED as an example, as a process for forming an organic EL structure on a thin glass substrate, a process of forming a transparent electrode, a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport Various processes such as a process for depositing layers and the like, a sealing process, and the like, and specific examples of the processes performed in these processes include a film forming process, a vapor deposition process, and a sealing plate bonding process. .
上記所定の処理を実施した後、薄板ガラス基板と、支持ガラス基板と、を分離する。両ガラス基板を分離するには、例えば、紫外線照射や所望の溶媒等を外的処理によって積層体の周縁部を封止している樹脂硬化物を除去した後、両ガラス基板を分離してもよい。また、樹脂硬化物の除去が困難な場合には、封止部を含んだ薄板ガラス積層体の端部付近を切断除去してから両ガラス基板を分離してもよい。この場合、支持ガラス基板と薄板ガラス基板とを同時に切断して、封止部を含んだ薄板ガラス積層体の端部付近を切断除去することが望ましい。但し、薄板ガラス基板のみを封止部よりも内側で切断してもよい。この場合、薄板ガラス基板の封止部は支持ガラス基板と接合したままの状態で、該封止部よりも内側で切断された部分が支持ガラス基板から分離される。ガラス基板は、砥粒による研削作用を利用したスクライブ−ブレイク法により切断してもよいが、レーザカッタを用いて切断してもよい。薄板ガラス基板と、支持ガラス基板と、を同時に切断する場合には、切断処理によって薄板ガラス基板の強度が低下せず、またカレットも出ないことから、レーザカッタによる切断が好ましい。 After performing the said predetermined process, a thin glass substrate and a support glass substrate are isolate | separated. To separate the two glass substrates, for example, after removing the cured resin sealing the peripheral edge of the laminate by external treatment with ultraviolet irradiation or a desired solvent, the glass substrates may be separated. Good. Moreover, when it is difficult to remove the cured resin, both glass substrates may be separated after cutting and removing the vicinity of the end of the thin glass laminate including the sealing portion. In this case, it is desirable that the supporting glass substrate and the thin glass substrate are simultaneously cut, and the vicinity of the end portion of the thin glass laminate including the sealing portion is cut and removed. However, you may cut | disconnect only a thin glass substrate inside a sealing part. In this case, the part cut | disconnected inside the sealing part is isolate | separated from a support glass substrate in the state which the sealing part of the thin glass substrate was joined with the support glass substrate. The glass substrate may be cut by a scribe-break method using a grinding action by abrasive grains, but may be cut using a laser cutter. When the thin glass substrate and the supporting glass substrate are cut at the same time, cutting with a laser cutter is preferable because the strength of the thin glass substrate is not reduced by the cutting process and no cullet is produced.
薄板ガラス基板と、支持ガラス基板と、を分離した後、必要とされる所望の工程を経て、薄板ガラス基板を有する表示装置が得られる。ここで実施される工程としては、ＬＣＤの場合には、例えば所望の大きさのセルに分断する工程、液晶を注入しその後注入口を封止する工程、偏光板を貼付する工程、モジュール形成工程が挙げられる。ＯＬＥＤの場合には、これらの工程に加えて、有機ＥＬ構造体が形成された薄板ガラス基板と、対向基板と、を組み立てる工程が含まれる。なお、所望の大きさのセルに分断する工程は、切断処理によって薄板ガラス基板の強度が低下せず、またカレットも出ないことから、レーザカッタによる切断が好ましい。 After separating the thin glass substrate and the supporting glass substrate, a display device having the thin glass substrate is obtained through a desired process. In the case of LCD, for example, the steps performed here are a step of dividing into cells of a desired size, a step of injecting liquid crystal and then sealing the injection port, a step of attaching a polarizing plate, a step of forming a module Is mentioned. In the case of an OLED, in addition to these steps, a step of assembling a thin glass substrate on which an organic EL structure is formed and a counter substrate is included. Note that the step of dividing into cells of a desired size is preferably cut by a laser cutter because the strength of the thin glass substrate is not lowered by the cutting process and no cullet is produced.
（実施例１）
本実施例では、薄板ガラス基板として縦３９０ｍｍ、横２９０ｍｍ、厚さ０．１ｍｍ、線膨張係数３８×１０-7／℃の無アルカリガラス（旭硝子株式会社製ＡＮ１００）を使用し、支持ガラス基板として縦４００ｍｍ、横３００ｍｍ、厚さ０．５ｍｍ、線膨張係数３８×１０-7／℃の無アルカリガラス（旭硝子株式会社製ＡＮ１００）を使用した。純水洗浄およびＵＶ洗浄により表面を清浄化した後、両ガラス基板を積層させた。熱硬化性樹脂として市販の溶液状のシリコーン樹脂製品（東レダウコーニング社ＳＨ８０５）を使用し、ディスペンサを用いて薄板ガラス基板と支持ガラス基板との積層体の周縁部に塗布した。樹脂の硬化温度（２５０℃）で１時間大気中で加熱してシリコーン樹脂を硬化させて、積層体の周縁部を封止した。その後、室温まで徐冷して本発明の薄板ガラス積層体（薄板ガラス積層体１）を得た。薄板ガラス積層体１において、薄板ガラス基板は支持ガラス基板と密着しており、浮きやたるみを発生は認められなかった。また、薄板ガラス基板は、表面の平滑性が良好であり、割れの発生は認められなかった。
Example 1
In this example, a non-alkali glass (AN100 manufactured by Asahi Glass Co., Ltd.) having a vertical glass plate of 390 mm, a horizontal width of 290 mm, a thickness of 0.1 mm, and a linear expansion coefficient of 38 × 10 −7 / ° C. is used as the supporting glass substrate. Non-alkali glass (AN100 manufactured by Asahi Glass Co., Ltd.) having a length of 400 mm, a width of 300 mm, a thickness of 0.5 mm, and a linear expansion coefficient of 38 × 10 −7 / ° C. was used. After the surface was cleaned by pure water cleaning and UV cleaning, both glass substrates were laminated. A commercially available solution-like silicone resin product (Toray Dow Corning SH805) was used as the thermosetting resin, and applied to the periphery of the laminate of the thin glass substrate and the supporting glass substrate using a dispenser. The silicone resin was cured by heating in the atmosphere for 1 hour at the resin curing temperature (250 ° C.) to seal the periphery of the laminate. Then, it cooled gradually to room temperature and obtained the thin glass laminated body (thin glass laminated body 1) of this invention. In the thin glass laminate 1, the thin glass substrate was in close contact with the supporting glass substrate, and no occurrence of floating or sagging was observed. Further, the thin glass substrate had good surface smoothness and no cracks were observed.
（実施例２）
薄板ガラス基板として、縦３９０ｍｍ、横２９０ｍｍ、厚さ０．１ｍｍ、線膨張係数４８×１０-7／℃の無アルカリガラス（旭硝子株式会社製ＡＮ６３５）を使用し、支持ガラス基板として、縦４００ｍｍ、横３００ｍｍ、厚さ０．５ｍｍ、線膨張係数３８×１０-7／℃の無アルカリガラス（旭硝子株式会社製ＡＮ１００）を使用した点以外は、実施例１と同様の手順で実施して本発明の薄板ガラス積層体（薄板ガラス積層体２）を得た。薄板ガラス積層体２において、薄板ガラス基板は支持ガラス基板と密着しており、浮きやたるみを発生は認められなかった。また、薄板ガラス基板は、表面の平滑性が実施例１よりも良好であり、割れの発生は認められなかった。
(Example 2)
As a thin glass substrate, non-alkali glass (AN635 manufactured by Asahi Glass Co., Ltd.) having a length of 390 mm, a width of 290 mm, a thickness of 0.1 mm, and a linear expansion coefficient of 48 × 10 −7 / ° C. is used. The present invention was carried out in the same procedure as in Example 1 except that non-alkali glass (AN100 manufactured by Asahi Glass Co., Ltd.) having a width of 300 mm, a thickness of 0.5 mm, and a linear expansion coefficient of 38 × 10 −7 / ° C. was used. A thin glass laminate (thin glass laminate 2) was obtained. In the thin glass laminate 2, the thin glass substrate was in close contact with the supporting glass substrate, and no occurrence of floating or sagging was observed. The thin glass substrate had a surface smoothness better than that of Example 1, and no cracks were observed.
（実施例３）
熱硬化性樹脂として市販の溶液状のポリイミドシリコーン樹脂製品（信越化学工業社製ＳＭＰ−２００１）を使用する点以外は、実施例１と同様の手順を実施して本発明の薄板ガラス積層体（薄板ガラス積層体３）を得る。薄板ガラス積層体３において、薄板ガラス基板は支持ガラス基板と密着しており、浮きやたるみを発生は認められない。また、薄板ガラス基板は、表面の平滑性も良好であり、割れの発生は認められない。
(Example 3)
Except for using a commercially available solution-type polyimide silicone resin product (SMP-2001, manufactured by Shin-Etsu Chemical Co., Ltd.) as the thermosetting resin, the same procedure as in Example 1 was performed, and the thin glass laminate ( A thin glass laminate 3) is obtained. In the thin glass laminate 3, the thin glass substrate is in close contact with the supporting glass substrate, and no floating or sagging is observed. Further, the thin glass substrate has good surface smoothness and no cracks are observed.
（実施例４）
本実施例では、実施例１で得た薄板ガラス積層体１を用いてＬＣＤを製造する。２枚の薄板ガラス積層体１を準備して、１枚にはアレイ形成工程を実施して薄板ガラス基板の表面にアレイを形成する。残りの１枚にカラーフィルタ形成工程を実施して薄板ガラス基板の表面にカラーフィルタを形成する。アレイが形成された薄板ガラス基板と、カラーフィルタが形成された薄板ガラス基板とを貼合わせた後、封止部を含む積層体の端部をレーザカッタを用いて切断し、薄板ガラス基板と支持ガラス基板とを分離する。続いて、薄板ガラス基板をレーザカッタを用いて切断して、縦５１ｍｍ×横３８ｍｍの２８個のセルに分断した後、液晶注入工程および注入口の封止工程を実施して液晶セルを形成する。形成された液晶セルに偏光板を貼付する工程を実施し、続いてモジュール形成工程を実施してＬＣＤを得る。形成されるＬＣＤでは、レーザカッタによる割れの発生も認められない。また、本発明の薄板ガラス積層体がＬＣＤとして有用であることが判明する。
Example 4
In this example, an LCD is manufactured using the thin glass laminate 1 obtained in Example 1. Two sheet glass laminates 1 are prepared, and an array is formed on one sheet to form an array on the surface of the sheet glass substrate. The remaining one sheet is subjected to a color filter forming process to form a color filter on the surface of the thin glass substrate. After laminating the thin glass substrate on which the array is formed and the thin glass substrate on which the color filter is formed, the end of the laminate including the sealing portion is cut using a laser cutter to support the thin glass substrate Separate the glass substrate. Subsequently, the thin glass substrate is cut using a laser cutter and divided into 28 cells of 51 mm length × 38 mm width, and then a liquid crystal injection step and an injection port sealing step are performed to form a liquid crystal cell. . A step of attaching a polarizing plate to the formed liquid crystal cell is performed, and then a module formation step is performed to obtain an LCD. In the formed LCD, generation of cracks due to the laser cutter is not recognized. Moreover, it turns out that the thin glass laminated body of this invention is useful as LCD.
（実施例５）
本実施例では、実施例３で得た薄板ガラス積層体３を用いてＯＬＥＤを製造する。透明電極を形成する工程、補助電極を形成する工程、ホール注入層・ホール輸送層・発光層・電子輸送層等を蒸着する工程、これらを封止する工程を実施して、薄板ガラス積層体３の薄板ガラス基板上に有機ＥＬ構造体を形成する。次に封止部を含む積層体の端部をレーザカッタを用いて切断し、薄板ガラス基板と支持ガラス基板とを分離する。続いて、薄板ガラス基板をレーザカッタを用いて切断して、縦４１ｍｍ×横３０ｍｍの４０個のセルに分断した後、有機ＥＬ構造体が形成された薄板ガラス基板と対向基板とを組み立てて、モジュール形成工程を実施してＯＬＥＤを作成する。形成されるＯＬＥＤでは、レーザカッタによる割れの発生も認められない。また、本発明の薄板ガラス積層体がＯＬＥＤとして有用であることが判明する。
(Example 5)
In this example, an OLED is manufactured using the thin glass laminate 3 obtained in Example 3. The process of forming a transparent electrode, the process of forming an auxiliary electrode, the process of vapor-depositing a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and the like, and the process of sealing them are carried out to obtain a thin glass laminate 3 An organic EL structure is formed on the thin glass substrate. Next, the edge part of the laminated body containing a sealing part is cut | disconnected using a laser cutter, and a thin glass substrate and a support glass substrate are isolate | separated. Subsequently, the thin glass substrate was cut using a laser cutter and divided into 40 cells of 41 mm in length and 30 mm in width, and then the thin glass substrate on which the organic EL structure was formed and the counter substrate were assembled, A module forming process is performed to create an OLED. In the formed OLED, no cracking due to the laser cutter is observed. Moreover, it turns out that the sheet glass laminated body of this invention is useful as OLED.
（比較例）
薄板ガラス基板として、厚さ０．１ｍｍ、線膨張係数４８×１０-7／℃の無アルカリガラス（旭硝子製ＡＮ６３５）を使用し、支持ガラス基板として厚さ０．５ｍｍ、線膨張係数７８×１０-7／℃のアルカリガラス（旭硝子株式会社製ＡＳ）を使用した点以外は、実施例１と同様の手順で実施して比較例の薄板ガラス積層体を得た。薄板ガラス積層体において、支持ガラス基板から薄板ガラス基板が一部浮き上がっていることが確認された。また、薄板ガラス基板に割れが発生していることが確認された。
(Comparative example)
Non-alkali glass (AN635 manufactured by Asahi Glass) having a thickness of 0.1 mm and a linear expansion coefficient of 48 × 10 −7 / ° C. is used as the thin glass substrate, and a thickness of 0.5 mm and a linear expansion coefficient of 78 × 10 is used as the supporting glass substrate. A thin glass laminate of Comparative Example was obtained in the same manner as in Example 1 except that -7 / ° C alkali glass (ASA manufactured by Asahi Glass Co., Ltd.) was used. In the thin glass laminate, it was confirmed that the thin glass substrate partially lifted from the support glass substrate. Moreover, it was confirmed that the thin glass substrate was cracked.
本発明によって得られた薄板ガラス積層体は、各種表示装置のガラス基板として使用することができる。 The thin glass laminate obtained by the present invention can be used as a glass substrate for various display devices.
Claims (6)
前記薄板ガラス基板の厚さが０．３ｍｍ未満であり、前記支持ガラス基板の厚さが０．３ｍｍ以上であり、かつ、
支持ガラス基板の線膨張係数は、薄板ガラス基板の線膨張係数よりも小さく、薄板ガラス基板と支持ガラス基板との線膨張係数の差が、５×１０ -7 ／℃以上３５×１０ -7 ／℃以下であり、
前記薄板ガラス積層体の周縁部が、前記薄板ガラス基板と、支持ガラス基板と、を積層させた後に該周縁部に配置した熱硬化性樹脂を用いて封止されていることを特徴とする薄板ガラス積層体。 A thin glass laminate formed by laminating a thin glass substrate and a supporting glass substrate,
The thickness of the thin glass substrate is less than 0.3 mm, the thickness of the support glass substrate is 0.3 mm or more, and
The linear expansion coefficient of the supporting glass substrate is smaller than the linear expansion coefficient of the thin glass substrate, and the difference between the linear expansion coefficients of the thin glass substrate and the supporting glass substrate is 5 × 10 −7 / ° C. or more and 35 × 10 −7 / ℃ or less ,
A thin plate characterized in that a peripheral portion of the thin glass laminate is sealed using a thermosetting resin disposed on the peripheral portion after the thin glass substrate and a supporting glass substrate are laminated. Glass laminate.
厚さが０．３ｍｍ未満の薄板ガラス基板と、薄板ガラス基板よりも線膨張係数が小さく、薄板ガラス基板との線膨張係数の差が、５×１０The thin glass substrate having a thickness of less than 0.3 mm has a smaller linear expansion coefficient than the thin glass substrate, and the difference in the linear expansion coefficient between the thin glass substrate is 5 × 10 -7-7 ／℃以上３５×１０/ ℃ or more 35 × 10 -7-7 ／℃以下であり、かつ、厚さが０．３ｍｍ以上の支持ガラス基板と、を積層させた後に、積層体の周縁部に熱硬化性樹脂を配置し、その後前記熱硬化性樹脂を加熱硬化して前記積層体の周縁部を封止し、After laminating a supporting glass substrate having a thickness of 0.3 mm or more, a thermosetting resin is disposed on the periphery of the laminate, and the thermosetting resin is then heat-cured. And sealing the peripheral edge of the laminate,
前記薄板ガラス基板上に表示装置を製造するための所定の処理を実施し、A predetermined process for producing a display device on the thin glass substrate is performed,
前記所定の処理を実施した後、前記薄板ガラス基板と、前記支持ガラス基板と、を分離することを特徴とする薄板ガラス基板を用いた表示装置の製造方法。A manufacturing method of a display device using a thin glass substrate, wherein the thin glass substrate and the supporting glass substrate are separated after performing the predetermined treatment.
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