JP4866200B2 - Method for manufacturing light emitting device - Google Patents

Description

  The present invention relates to a light emitting device including an element including an organic material and a method for manufacturing the light emitting device. The present invention also relates to a display device using the light emitting device.

  In recent years, the display device has been replaced with a thin type including a liquid crystal display and a plasma display from a type including a cathode ray tube represented by a monitor for home television and a personal computer, and accordingly, a display screen has been enlarged. It is out. In such a conventional thin type display device, a glass substrate is generally used as a substrate on which various elements are formed. In this case, the glass substrate itself is required to have a certain thickness in order to prevent breakage of the glass substrate, and a large number of structural materials are required as reinforcing materials. There was a limit to weight reduction.

  Therefore, light-emitting devices on flexible substrates that can be expected to be thin and lightweight and not be damaged by some impacts and bending, especially light-emitting devices using printable organic materials that can be expected to realize large screens at low cost. Research and development of display devices that form the screen has been actively conducted.

  When a plastic substrate is used as the flexible substrate, there are many process restrictions from the viewpoint of water resistance, solvent resistance, and gas barrier properties, and when forming an element containing an organic material, the flexible substrate has a sealing function. It is necessary to devise as follows.

  As a method for solving these problems, Patent Document 1 discloses a method of using a composite substrate in which a thinly processed glass substrate is bonded to a plastic substrate as a flexible substrate.

  As another solution, after forming an element on the surface of a glass substrate having the same thickness as that used in a conventional liquid crystal display, a plastic substrate is placed on the glass substrate so as to cover the element. Patent Document 2 discloses a method in which a flexible substrate is obtained by pasting and then etching the back surface of the glass plate to thin the glass substrate.

Furthermore, as another solution, after forming an element on a thin glass substrate or plastic substrate supported by a substrate transport jig having an adhesive layer that maintains a certain adhesive strength, the jig is peeled off from the substrate. This method is disclosed in Patent Document 3.
Japanese Patent No. 3059866 JP 2006-24530 A Japanese Patent No. 3081122

  However, in the method using a composite substrate in which a plastic substrate and a thin glass substrate are bonded in advance as in Patent Document 1, the formation temperature of an element formed on the composite substrate is limited to a heat resistant temperature of the plastic substrate or less. There is a problem that. In general, an organic semiconductor having a low formation temperature has a low glass transition temperature, and the resulting light-emitting device has poor stability. On the other hand, the formation temperature of an element using a material having a high glass transition temperature is often 150 ° C. or higher. Moreover, even if a plastic substrate having a heat resistance equal to or higher than the element formation temperature is used, the plastic substrate and the glass substrate have too different coefficients of thermal expansion. There exists a subject that the curvature of a board | substrate etc. arise.

  Further, as in Patent Document 2, the method of thinning a glass substrate by etching after forming an element on a thick glass substrate can solve the heat resistance problem. However, since the glass substrate on which the element is formed is immersed in an acid solution for a long time in the etching process, even if a plastic substrate is bonded to the glass substrate so as to cover the element, damage to the element is unavoidable. When an element using an organic material is formed, there is a problem that it adversely affects its reliability and life. Further, in order to handle the glass substrate alone during the process, the glass substrate needs to have a certain thickness. It takes a long time to etch such a thick glass substrate to such a thickness as to obtain flexibility, and there is also a problem that the cost is increased.

  Further, in the method of Patent Document 3, after forming an element on a substrate, the substrate has a certain thickness in order to peel a jig having a certain adhesive strength from the substrate without damaging the element. Need to be. The thickness of the thinnest glass substrate disclosed in Patent Document 3 is 0.55 mm. Therefore, there is a problem that a substrate that is thin enough to have flexibility cannot be used.

  The present invention has been made to solve the above-described problems of the prior art, and includes a highly reliable flexible light-emitting device in which an element including at least one organic material having a formation temperature of 150 ° C. or higher is formed. It aims at providing the manufacturing method. Another object of the present invention is to provide a display device using such a light-emitting device that is thin and lightweight and is not damaged by some impact or bending.

  The light emitting device of the present invention includes a first glass substrate having a thickness of 100 μm or less, a flexible first substrate having a thickness of 100 μm or more, and an element formed on the first glass substrate. In the light-emitting device, the element includes at least one organic material having a formation temperature of 150 ° C. or higher, and the thickness of the first glass substrate is that of the first glass substrate when the element is formed. It is characterized by being the same as the thickness.

  A display device of the present invention includes the above-described light emitting device of the present invention.

The first manufacturing method of the light emitting device of the present invention includes:
(1) a step of bonding a thick carrier substrate to the first main surface of a glass substrate having a thickness of 100 μm or less;
(2) forming an element including at least one organic material having a formation temperature of 150 ° C. or higher on the second main surface opposite to the first main surface of the glass substrate;
(3) bonding a first substrate having a thickness of 100 μm or more to the second main surface on which the element of the glass substrate is formed;
(4) A step of peeling the carrier substrate from the glass substrate.

The second manufacturing method of the light emitting device of the present invention includes:
(1) bonding a thick first carrier substrate to a first main surface of a first glass substrate having a thickness of 100 μm or less;
(2) bonding the thick second carrier substrate to the first main surface of the second glass substrate having a thickness of 100 μm or less;
(3) At least one of the second main surface of the first glass substrate opposite to the first main surface and the second main surface of the second glass substrate opposite to the first main surface. Forming a device including at least one organic material having a formation temperature of 150 ° C. or higher;
(4) The second glass substrate and the second glass substrate are made to face each other with the second main surface of the first glass substrate facing the second main surface of the second glass substrate. A step of adhering with a sandwich,
(5) peeling the first carrier substrate from the first main surface of the first glass substrate;
(6) laminating a flexible substrate having a thickness of 100 μm or more on the first main surface of the first glass substrate;
(7) A step of peeling the second carrier substrate from the first main surface of the second glass substrate.

The third manufacturing method of the light-emitting device of the present invention includes:
(1) bonding a thick first carrier substrate to a first main surface of a first glass substrate having a thickness of 100 μm or less;
(2) forming an element including at least one organic material having a formation temperature of 150 ° C. or higher on the second main surface opposite to the first main surface of the first glass substrate;
(3) a step of laminating a sealing layer on the second main surface on which the element of the first glass substrate is formed;
(4) a step of laminating a support on the surface of the sealing layer opposite to the first glass substrate;
(5) peeling the first carrier substrate from the first main surface of the first glass substrate;
(6) laminating a flexible first substrate having a thickness of 100 μm or more on the first main surface of the first glass substrate on which the element is formed;
(7) A step of peeling the support from the sealing layer.

  ADVANTAGE OF THE INVENTION According to this invention, the highly reliable flexible light-emitting device in which the element containing the at least 1 organic material whose formation temperature is 150 degreeC or more was formed, and its manufacturing method can be provided.

  In addition, according to the present invention, it is possible to provide a thin and light display device using the light emitting device that is not damaged by some impact or bending.

  The light emitting device of the present invention includes a first glass substrate having a thickness of 100 μm or less, a flexible first substrate having a thickness of 100 μm or more, and an element formed on the first glass substrate. The element includes at least one organic material having a formation temperature of 150 ° C. or higher. The thickness of the first glass substrate is the same as the thickness of the first glass substrate when the element is formed.

  Since the first glass substrate is excellent in water resistance, solvent resistance and gas barrier properties, there are few process restrictions. Therefore, an element including at least one organic material having a formation temperature of 150 ° C. or higher can be formed on the first glass substrate. Further, since the organic material contained in the element has a high glass transition temperature, a highly reliable light-emitting device can be realized.

  The thickness of the first glass substrate is the same as the thickness of the first glass substrate when the element is formed. That is, the process of reducing the thickness of the first glass substrate after forming the element on the first glass substrate is not performed. Therefore, the problem that the element is damaged in the thinning process of the first glass substrate does not occur, and a highly reliable flexible light-emitting device can be realized.

  In the light-emitting device of the present invention, it is preferable that an upper surface of the element formed on the first glass substrate is covered with the first substrate. Thereby, the front and back surfaces of the element can be covered with the first glass substrate and the first substrate while maintaining flexibility.

  In this case, it is preferable that the first substrate has a function of sealing the element. This eliminates the need to form a separate sealing layer.

  Further, a flexible second substrate having a thickness of 100 μm or more may be bonded to the surface of the first glass substrate opposite to the surface on which the element is formed. Thereby, since a 1st glass base material is pinched | interposed by a 1st board | substrate and a 2nd board | substrate, the impact resistance of a light emitting device and bending strength improve, and the reliability of a light emitting device further improves.

  In the light emitting device of the present invention, an upper surface of the element formed on the first glass substrate is covered with a second glass substrate having a thickness of 100 μm or less, and the first substrate is the first substrate. It is preferable that the glass substrate is bonded to the surface of the one glass substrate opposite to the second glass substrate or the surface of the second glass substrate opposite to the first glass substrate. Thereby, since an element can be pinched | interposed and sealed by the 1st and 2nd glass base material, the reliability of a light-emitting device improves further, maintaining a flexibility.

  In this case, a second element is formed on a surface of the second glass substrate facing the first glass substrate, and the second element has at least one forming temperature of 150 ° C. or higher. An organic material is included, and the thickness of the second glass substrate may be the same as the thickness of the second glass substrate when the second element is formed. Thereby, a composite element in which the first element and the second element are combined can be formed, and the elements can be diversified.

  In addition, since the glass transition temperature of the organic material included in the second element is high, a highly reliable light-emitting device can be realized.

  Furthermore, the thickness of the second glass substrate is the same as the thickness of the second glass substrate when the second element is formed. That is, the process of reducing the thickness of the second glass substrate after forming the second element on the second glass substrate has not been performed. Therefore, the problem that the second element is damaged in the thinning process of the second glass substrate does not occur, and a highly reliable flexible light-emitting device can be realized.

  Of the surface of the first glass substrate opposite to the second glass substrate and the surface of the second glass substrate opposite to the first glass substrate, the first substrate is bonded. It is preferable that a flexible second substrate having a thickness of 100 μm or more is bonded to the non-exposed surface. Thereby, since the first and second glass base materials are sandwiched between the first substrate and the second substrate, the impact resistance and bending strength of the light emitting device are improved, and the reliability of the light emitting device is further improved.

  In the light-emitting device of the present invention, the upper surface of the element formed on the first glass substrate is covered with a flexible sealing layer, and the first substrate is the first glass substrate. The material is preferably bonded to the surface opposite to the surface on which the element is formed. Thereby, the element can be sealed while maintaining flexibility, and the reliability of the light emitting device is further improved.

  In this case, it is preferable that a flexible second substrate having a thickness of 100 μm or more is bonded to the surface of the sealing layer opposite to the first glass substrate. Thereby, since a 1st glass base material is pinched | interposed by a 1st board | substrate and a 2nd board | substrate, the impact resistance of a light emitting device and bending strength improve, and the reliability of a light emitting device further improves.

  In the light emitting device of the present invention, the element (including the second element) may include an organic electroluminescence element. Alternatively, the element (including the second element) may include an organic thin film transistor element. Thereby, since these elements can be formed by a printing method, the elements can be formed efficiently.

  The display device of the present invention is configured using the above-described light emitting device of the present invention. Since a highly reliable and flexible light-emitting device is used, a thin and light display device that is not damaged by some impact or bending can be realized.

The first manufacturing method of the light emitting device of the present invention includes:
(1) a step of bonding a thick carrier substrate to the first main surface of a glass substrate having a thickness of 100 μm or less;
(2) forming an element including at least one organic material having a formation temperature of 150 ° C. or higher on the second main surface opposite to the first main surface of the glass substrate;
(3) bonding a first substrate having a thickness of 100 μm or more to the second main surface on which the element of the glass substrate is formed;
(4) A step of peeling the carrier substrate from the glass substrate.

  Since the glass substrate is excellent in water resistance, solvent resistance and gas barrier properties, there are few process restrictions. Therefore, an element including at least one organic material having a formation temperature of 150 ° C. or higher can be formed on the glass substrate. Further, since the organic material contained in the element has a high glass transition temperature, a highly reliable light-emitting device can be obtained.

  In addition, since the process of reducing the thickness of the glass substrate after forming the element on the glass substrate is unnecessary, there is no problem that the element is damaged in the process of thinning the glass substrate, and the reliability is high. A flexible light-emitting device can be obtained.

  In the first manufacturing method, it is preferable that the method further includes (5) a step of laminating a flexible second substrate having a thickness of 100 μm or more on the first main surface of the glass substrate. Thereby, since a glass base material can be pinched | interposed with a 1st board | substrate and a 2nd board | substrate, impact resistance and bending strength can improve, and the light emitting device which further improved reliability can be obtained.

The second manufacturing method of the light emitting device of the present invention includes:
(1) bonding a thick first carrier substrate to a first main surface of a first glass substrate having a thickness of 100 μm or less;
(2) bonding the thick second carrier substrate to the first main surface of the second glass substrate having a thickness of 100 μm or less;
(3) At least one of the second main surface of the first glass substrate opposite to the first main surface and the second main surface of the second glass substrate opposite to the first main surface. Forming a device including at least one organic material having a formation temperature of 150 ° C. or higher;
(4) The second glass substrate and the second glass substrate are made to face each other with the second main surface of the first glass substrate facing the second main surface of the second glass substrate. A step of adhering with a sandwich,
(5) peeling the first carrier substrate from the first main surface of the first glass substrate;
(6) laminating a flexible substrate having a thickness of 100 μm or more on the first main surface of the first glass substrate;
(7) A step of peeling the second carrier substrate from the first main surface of the second glass substrate.

  Since the first and second glass substrates are excellent in water resistance, solvent resistance and gas barrier properties, there are few process restrictions. Therefore, an element including at least one organic material having a formation temperature of 150 ° C. or higher can be formed on the first glass substrate and / or the second glass substrate. Further, since the organic material contained in the element has a high glass transition temperature, a highly reliable light-emitting device can be obtained.

  Moreover, since the process of reducing the thickness of the glass substrate after forming the element on the first glass substrate and / or the second glass substrate is unnecessary, the device is damaged in the process of thinning the glass substrate. Thus, a highly reliable and flexible light-emitting device can be obtained.

  Further, since the element is sandwiched and sealed between the first and second glass base materials, a light emitting device with further improved reliability can be obtained while maintaining flexibility.

The third manufacturing method of the light-emitting device of the present invention includes:
(1) bonding a thick first carrier substrate to a first main surface of a first glass substrate having a thickness of 100 μm or less;
(2) forming an element including at least one organic material having a formation temperature of 150 ° C. or higher on the second main surface opposite to the first main surface of the first glass substrate;
(3) a step of laminating a sealing layer on the second main surface on which the element of the first glass substrate is formed;
(4) a step of laminating a support on the surface of the sealing layer opposite to the first glass substrate;
(5) peeling the first carrier substrate from the first main surface of the first glass substrate;
(6) laminating a flexible first substrate having a thickness of 100 μm or more on the first main surface of the first glass substrate on which the element is formed;
(7) A step of peeling the support from the sealing layer.

  Since the first glass substrate is excellent in water resistance, solvent resistance and gas barrier properties, there are few process restrictions. Therefore, an element including at least one organic material having a formation temperature of 150 ° C. or higher can be formed on the first glass substrate. Further, since the organic material contained in the element has a high glass transition temperature, a highly reliable light-emitting device can be obtained.

  In addition, since the process of reducing the thickness of the first glass substrate after forming the element on the first glass substrate is unnecessary, there is a problem that the element is damaged in the process of thinning the first glass substrate. Therefore, a highly reliable and flexible light-emitting device can be obtained.

  Moreover, a light emitting device can be efficiently manufactured by using a support body with weak adhesive force like an adhesive sheet.

  In the third manufacturing method, it is preferable that the sealing layer includes a second glass substrate having a thickness of 100 μm or less. Thereby, since an element is pinched | interposed and sealed with the 1st and 2nd glass base material, the light-emitting device which reliability improved further can be obtained, maintaining flexibility.

  Said 3rd manufacturing method WHEREIN: (8) It has further the process of laminating | stacking the 2nd board | substrate which has thickness of 100 micrometers or more on the surface on the opposite side to the said 1st glass base material of the said sealing layer. It is preferable. Thereby, since the first glass substrate and the sealing layer can be sandwiched between the first substrate and the second substrate, it is possible to obtain a light emitting device with improved impact resistance and bending strength and further improved reliability. it can.

  In said 1st-3rd manufacturing method, it is preferable that the process of peeling the said carrier substrate includes the process of reducing the adhesive force of the said carrier substrate. Thereby, since a carrier substrate can be easily peeled without damaging a thin glass base material, productivity and a yield improve.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a sectional view of a light emitting device 10 according to Embodiment 1 of the present invention. The light-emitting device 10 in FIG. 1 includes a glass substrate 11 having a thickness of 100 μm or less, an element 12 having a light-emitting function including at least one organic material formed on the glass substrate 11 and having a formation temperature of 150 ° C. or higher, 12, a flexible substrate 13 having a thickness of 100 μm or more bonded to the glass base material 11 through a sealing resin layer 14 is provided. The substrate 13 has a function of sealing the element 12. The thickness of the first glass substrate 11 is the same as the thickness of the first glass substrate 11 when the element 12 is formed.

  A method for manufacturing the light emitting device 10 of FIG. 1 will be described with reference to FIG.

  First, as shown in FIG. 2A, a thick carrier substrate 15 is bonded to the first main surface 11a of the glass substrate 11 having a thickness of 100 μm or less via an adhesive layer 16.

  Next, as shown in FIG. 2B, the second main surface 11b opposite to the first main surface 11a of the glass substrate 11 has a light emitting function including at least one organic material having a formation temperature of 150 ° C. or higher. The element 12 is formed.

  Next, as shown in FIG. 2C, a flexible substrate 13 having a thickness of 100 μm or more is placed on the second main surface 11b on which the element 12 of the glass substrate 11 is formed via the sealing resin layer 14. Glue.

  Next, as shown in FIG. 2D, the adhesive layer is irradiated with a light beam 19 such as ultraviolet (UV) or laser light (for example, YAG laser light) from the surface of the carrier substrate 15 opposite to the glass substrate 11. The adhesive strength of 16 is reduced.

  Next, as shown in FIG. 2E, the carrier substrate 15 and the adhesive layer 16 are peeled off from the glass substrate 11 and removed.

  Thus, the light emitting device 10 of the first embodiment is obtained.

  FIG. 3 is a cross-sectional view of another light emitting device 30 according to Embodiment 1 of the present invention. As shown in FIG. 3, the first main surface 11a opposite to the second main surface 11b on which the element 12 of the glass substrate 11 of the light emitting device 10 is formed has a flexibility having a thickness of 100 μm or more. The two substrates 17 may be bonded via the adhesive layer 18. In this case, the second substrate 17 and the adhesive layer 18 do not need to have a sealing function.

(Embodiment 2)
FIG. 4 is a cross-sectional view of the light emitting device 40 according to Embodiment 2 of the present invention. The light emitting device 40 of FIG. 4 is an element having a light emitting function including a first glass substrate 41 having a thickness of 100 μm or less and at least one organic material formed on the first glass substrate 41 and having a formation temperature of 150 ° C. or higher. 42, a second glass substrate 43 having a thickness of 100 μm or less adhered to the first glass substrate 41 through a sealing resin layer 44 so as to cover the element 42, and a second glass substrate 41 second A first substrate 47 a having a thickness of 100 μm or more bonded to the surface opposite to the glass substrate 43 through an adhesive layer 48 a is provided. The thickness of the first glass substrate 41 is the same as the thickness of the first glass substrate 41 when the element 42 is formed. The first substrate 47a and the adhesive layer 48a do not need to have a sealing function.

  A method for manufacturing the light emitting device 40 of FIG. 4 will be described with reference to FIGS. 5, 6, and 7.

  First, as shown in FIG. 5A, a thick first carrier substrate 45a is bonded to a first main surface 41a of a first glass substrate 41 having a thickness of 100 μm or less via an adhesive layer 46a. Similarly, a thick second carrier substrate 45b is bonded to the first main surface 43a of the second glass substrate 43 having a thickness of 100 μm or less via an adhesive layer 46b.

  Next, as shown in FIG. 5B, the second main surface 41b opposite to the first main surface 41a of the first glass substrate 41 emits light containing at least one organic material having a formation temperature of 150 ° C. or higher. The element 42 having a function is formed.

  Next, as shown in FIG. 5C, the second main surface 41b on which the element 42 of the first glass substrate 41 is formed and the second main surface 43b of the second glass substrate 43 are opposed to each other. The first glass substrate 41 and the second glass substrate 43 are bonded via the sealing resin layer 44 with the element 42 interposed therebetween.

  Next, as shown in FIG. 6A, a light beam 19a such as ultraviolet light (UV) or laser light (for example, YAG laser light) is irradiated from the surface of the first carrier substrate 45a opposite to the first glass substrate 41. Thus, the adhesive force of the adhesive layer 46a is reduced.

  Next, as shown in FIG. 6B, the first carrier substrate 45a and the adhesive layer 46a are peeled off from the first glass substrate 41 and removed.

  Next, as shown in FIG. 6C, a flexible first substrate 47a having a thickness of 100 μm or more is bonded to the first main surface 41a of the first glass substrate 41 via an adhesive layer 48a.

  Next, as shown in FIG. 7A, a light beam 19b such as ultraviolet light (UV) or laser light (for example, YAG laser light) is irradiated from the surface of the second carrier substrate 45b opposite to the second glass substrate 43. Thus, the adhesive force of the adhesive layer 46b is reduced.

  Next, as shown in FIG. 7B, the second carrier substrate 45b and the adhesive layer 46b are peeled off from the second glass substrate 43 and removed.

  Thus, the light emitting device 40 of the second embodiment is obtained.

  In FIG. 5B, the case where the element 42 is formed only on the second main surface 41b of the first glass substrate 41 has been described, but the present invention is not limited to this. As shown in FIG. 8, a first element 42a having a light emitting function including at least one organic material having a formation temperature of 150 ° C. or higher is formed on the second main surface 41b of the first glass substrate 41 to form the second glass. A second element 42b having a light emitting function including at least one organic material having a formation temperature of 150 ° C. or higher may be formed on the second main surface 43b of the base material 43. Thereafter, similarly to FIG. 5C, the second main surface 41b on which the first element 42a of the first glass substrate 41 is formed and the second main surface on which the second element 42b of the second glass substrate 43 is formed. The first glass substrate 41 and the second glass substrate 43 are bonded via the sealing resin layer 44 with the first and second elements 42a and 42b interposed therebetween with the surface 43b facing each other. The first element 42a and the second element 42b are combined to form a composite element 42c. In the finally obtained light emitting device, the thickness of the first glass substrate 41 is the same as the thickness of the first glass substrate 41 when the first element 42 a is formed, and the second glass substrate 43. The thickness of is the same as the thickness of the second glass substrate 43 when the second element 42b is formed.

  Another manufacturing method of the light emitting device 40 of FIG. 4 will be described with reference to FIGS.

  First, as shown in FIG. 9A, a thick first carrier substrate 45a is bonded to a first main surface 41a of a first glass substrate 41 having a thickness of 100 μm or less via an adhesive layer 46a.

  Next, as shown in FIG. 9 (B), the second main surface 41b opposite to the first main surface 41a of the first glass base material 41 includes at least one organic material having a formation temperature of 150 ° C. or higher. The element 42 having a function is formed.

  Next, as shown in FIG. 9C, the second main surface 41b on which the element 42 of the first glass substrate 41 is formed and the second glass substrate 43 having a thickness of 100 μm or less as a sealing layer are opposed to each other. Then, the first glass substrate 41 and the second glass substrate 43 are bonded via the sealing resin layer 44 with the element 42 interposed therebetween.

  Next, as shown in FIG. 9D, an adhesive sheet 49 is attached to the surface of the second glass substrate 43 opposite to the first glass substrate 41. In this state, the adhesive force of the adhesive layer 46a is obtained by irradiating a light beam 19a such as ultraviolet light (UV) or laser light (for example, YAG laser light) from the surface of the first carrier substrate 45a opposite to the first glass substrate 41. Reduce.

  Next, as shown in FIG. 10A, the first carrier substrate 45a and the adhesive layer 46a are peeled off from the first glass substrate 41 and removed. As a result, the laminated structure composed of the first and second glass substrates 41 and 43, the element 42, and the sealing resin layer 44 is transferred to the adhesive sheet 49.

  Next, as shown in FIG. 10B, a flexible first substrate 47a having a thickness of 100 μm or more is bonded to the first main surface 41a of the first glass substrate 41 via an adhesive layer 48a.

  Next, as shown in FIG. 10C, the adhesive sheet 49 is peeled off from the second glass substrate 43 and removed.

  Thus, the light emitting device 40 of the second embodiment is obtained.

  In the light emitting device 40 described above, the adhesive layer 48 a and the first substrate 47 a are laminated on the surface of the first glass substrate 41 opposite to the second glass substrate 43. It may be laminated on the surface opposite to the first glass substrate 41.

  FIG. 11 is a cross-sectional view of another light emitting device 50 according to Embodiment 2 of the present invention. As shown in FIG. 11, a second substrate 47b having a thickness of 100 μm or more is attached to the adhesive layer 48b on the surface of the second glass substrate 43 of the light emitting device 40 opposite to the first glass substrate 41. It may be adhered via. In this case, the second substrate 47b and the adhesive layer 48b do not need to have a sealing function.

(Embodiment 3)
FIG. 12 is a cross-sectional view of a light emitting device 90 according to Embodiment 3 of the present invention. The light emitting device 90 of FIG. 12 is an element having a light emitting function including a first glass substrate 91 having a thickness of 100 μm or less and at least one organic material formed on the first glass substrate 91 and having a formation temperature of 150 ° C. or higher. 92, a flexible sealing layer 93 formed on the first glass substrate 91 so as to cover the element 92, and a surface of the first glass substrate 91 opposite to the surface on which the element 92 is formed. And a flexible first substrate 97a having a thickness of 100 μm or more bonded to the surface via an adhesive layer 98a. The thickness of the first glass substrate 91 is the same as the thickness of the first glass substrate 91 when the element 92 is formed. The first substrate 97a and the adhesive layer 98a do not need to have a sealing function.

  A method for manufacturing the light emitting device 90 of FIG. 12 will be described with reference to FIGS.

  First, as shown in FIG. 13A, a thick first carrier substrate 95 is bonded to a first main surface 91a of a first glass base 91 having a thickness of 100 μm or less via an adhesive layer 96.

  Next, as shown in FIG. 13B, the second main surface 91b opposite to the first main surface 91a of the first glass substrate 91 includes at least one organic material having a formation temperature of 150 ° C. or higher. An element 92 having a function is formed.

  Next, as shown in FIG. 13C, a flexible sealing layer 93 is laminated on the second main surface 91b of the first glass substrate 91 on which the element 92 is formed so as to cover the element 92. .

  Next, as shown in FIG. 13D, an adhesive sheet 99 is attached to the surface of the sealing layer 93 opposite to the first glass substrate 91. In this state, the adhesive force of the adhesive layer 96 is obtained by irradiating light rays 19 such as ultraviolet rays (UV) or laser light (for example, YAG laser light) from the surface of the first carrier substrate 95 opposite to the first glass substrate 91. Reduce.

  Next, as shown in FIG. 14A, the first carrier substrate 95 and the adhesive layer 96 are peeled off from the first glass substrate 91 and removed. As a result, the laminated structure including the first glass substrate 91, the element 92, and the sealing layer 93 is transferred to the adhesive sheet 99.

  Next, as shown in FIG. 14B, a flexible first substrate 97a having a thickness of 100 μm or more is bonded to the first main surface 91a of the first glass substrate 91 via an adhesive layer 98a.

  Next, as shown in FIG. 14C, the pressure-sensitive adhesive sheet 99 is peeled off from the sealing layer 93 and removed.

  Thus, the light emitting device 90 of the third embodiment is obtained.

  FIG. 15 is a cross-sectional view of another light emitting device 100 according to Embodiment 3 of the present invention. As shown in FIG. 15, a flexible second substrate 97 b having a thickness of 100 μm or more is provided on the surface of the sealing layer 93 of the light emitting device 100 opposite to the first glass substrate 91 with an adhesive layer 98 b interposed therebetween. And may be bonded. In this case, the second substrate 97b and the adhesive layer 98b do not need to have a sealing function.

  In the above-described first to third embodiments, as glass substrates 11, 41, 43, 91 having a thickness of 100 μm or less, a glass plate material for a general electronic material obtained by thin plate processing can be used. For example, Matsunami Glass Industrial Co., Ltd. ultrathin plate glass # 100, AF45, etc. (thickness is 30 micrometers, 50 micrometers, 70 micrometers, etc.) can be used.

  The flexible substrates 13, 17, 47a, 47b, 97a, and 97b having a thickness of 100 μm or more are not particularly limited. For example, a plastic film such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) is used. be able to. When a sealing function for sealing an element is required, it is preferable to use a laminated film composed of an organic film layer and an inorganic film layer.

  The sealing resin layers 14 and 44 having a sealing function are not particularly limited, but are generally resins used for bonding a sealing can of an organic EL element, for example, thermosetting, ultraviolet (UV) curing. Or a two-component mixed curable epoxy resin can be used.

  As the flexible sealing layer 93, a laminated film of an organic film and an inorganic film using a thin film sealing technique proposed by Vitex Systems Inc. can be used.

  The adhesive layers 18, 48 a, 48 b, 98 a, 98 b are not particularly limited, but may be any adhesive layer that can adhere and hold a flexible substrate as a final device configuration, Further, it may be a sheet type or formed in advance on a surface to be bonded to a flexible substrate.

  The elements 12, 42, 42a, 42b, 42c, and 92 are not particularly limited as long as a flexible light-emitting device can be realized. For example, an element including an organic electroluminescence (EL) element as the light emitting portion may be used. In this case, the element driving method may be a passive matrix driving type or an active matrix driving type. In the case of the active matrix drive type, for example, an organic thin film transistor (TFT) may be used as the drive transistor, or a TFT other than this may be used. Alternatively, an active matrix element in which an organic TFT and an LCD are combined may be used.

  Examples of at least one organic material having a formation temperature of 150 ° C. or higher include the following. The organic material used for the organic TFT is an organic material (specifically, solubilized pentacene or porphyrin) that is applied as a solution and then baked at 150 ° C. or higher and insolubilized by thermal conversion to form a thin film to form a channel. Derivatives, etc.), organic materials for forming channels by baking and drying at 150 ° C. or higher after coating as a solution, and polymer insulating film materials (BCB, PI, PVP, etc.) can be exemplified. Examples of the organic material used for the organic EL include an organic material for forming a light emitting layer, a transport layer, or an injection layer by applying it as a solution, baking it at 150 ° C. or higher and drying it to form a thin film.

  In addition, an organic material having a formation temperature of 150 ° C. or higher may be used to form a wiring material or an insulating film material constituting the element.

  When the element includes at least one organic material having a formation temperature of 150 ° C. or higher, the reliability of the light-emitting device can be improved.

  As the thick carrier substrates 15, 45 a, 45 b, and 95, the adhesive layers 16, 46 a, 46 b, and 96 are bonded to each other and then irradiated with light (UV light or YAG laser light) to increase the adhesive strength of the adhesive layer 16. Since it is necessary to perform the step of weakening, it is necessary to have transparency that can transmit light. Therefore, for example, a glass substrate can be used. As the carrier substrates 15, 45a, 45b, 95 and the adhesive layers 16, 46a, 46b, 96, for example, WSS (wafer support system) manufactured by Sumitomo 3M Limited can be used.

  Although there is no restriction | limiting in particular as the adhesive sheets 49 and 99, The dicing tape generally used in the case of dicing of Si wafer, a slightly adhesive sheet | seat, etc. can be used.

(Embodiment 4)
The display device of the present invention is configured using the light-emitting devices of Embodiments 1 to 3 described above. Since the light-emitting device of the present invention has flexibility and is thin and lightweight, it is flexible and can be realized without being damaged by some impact or bending, thereby realizing a thin and light display device. Furthermore, impact resistance can be further improved by covering the glass substrate with a flexible substrate or sealing layer.

  Electronic paper will be described as an example of the display device of the present invention.

  16A is a cross-sectional view illustrating a schematic configuration of an electronic paper 200 using the light-emitting device 201 of the present invention, and FIG. 16B is a perspective view thereof. As shown in FIG. 16A, the light emitting device 201 is wound up in a roll shape and stored in a semi-cylindrical storage case 210. The storage case 210 includes a case main body 211 and a door 212 that opens and closes an opening on a side surface of the case main body 211. As shown in FIG. 16B, the door 212 is opened, the light emitting device 201 is unwound, and the light emitting device 201 can perform various displays. The electronic paper 200 is compact and easy to carry when the light emitting device 201 is stored in the storage case 210 as shown in FIG. 16A, and the light emitting device 201 is unwound as shown in FIG. 16B. In this case, a large screen display is possible, and for example, it can be used as a display device for various portable information terminals. Note that the storage method of the light emitting device 201 is not limited to the method of winding in a roll shape as illustrated in FIG. 16A, and may be, for example, a folding method.

  The electronic paper 200 illustrated in FIGS. 16A and 16B is merely an example, and the display device of the present invention is not limited thereto. For example, it may be a roll screen type large screen television that can be rolled up in a compact form when not in use and can be unwound and suspended from the ceiling or the like when used. Alternatively, it may be an outdoor advertising device that can be attached to a curved wall surface (for example, a columnar column).

  Since the light-emitting device of the present invention is highly reliable and flexible, it can be used in a wide range of electronic devices including a display device that is thin and light and does not break due to some impact or bending.

FIG. 1 is a cross-sectional view showing a schematic configuration of a light emitting device according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view showing the method for manufacturing the light-emitting device according to Embodiment 1 of the present invention in the order of steps. FIG. 3 is a cross-sectional view showing a schematic configuration of another light emitting device according to Embodiment 1 of the present invention. FIG. 4 is a cross-sectional view showing a schematic configuration of the light-emitting device according to Embodiment 2 of the present invention. FIG. 5 is a cross-sectional view showing the method of manufacturing the light emitting device according to Embodiment 2 of the present invention in the order of steps. FIG. 6 is a cross-sectional view showing the method for manufacturing the light-emitting device according to Embodiment 2 of the present invention in the order of steps. FIG. 7 is a cross-sectional view illustrating the method for manufacturing the light-emitting device according to Embodiment 2 of the present invention in the order of steps. FIG. 8 is a cross-sectional view showing one step of a method for manufacturing another light-emitting device according to Embodiment 2 of the present invention. FIG. 9 is a cross-sectional view showing still another manufacturing method of the light-emitting device according to Embodiment 2 of the present invention in the order of steps. FIG. 10 is a cross-sectional view showing still another method for manufacturing the light-emitting device according to Embodiment 2 of the present invention in the order of steps. FIG. 11 is a cross-sectional view showing a schematic configuration of another light emitting device according to Embodiment 2 of the present invention. FIG. 12 is a cross-sectional view showing a schematic configuration of the light emitting device according to Embodiment 3 of the present invention. FIG. 13 is a cross-sectional view showing the method for manufacturing the light-emitting device according to Embodiment 3 of the present invention in the order of steps. FIG. 14 is a cross-sectional view showing the method for manufacturing the light-emitting device according to Embodiment 3 of the present invention in the order of steps. FIG. 15 is a cross-sectional view showing a schematic configuration of another light emitting device according to Embodiment 3 of the present invention. FIG. 16A is a cross-sectional view showing a schematic configuration of electronic paper using the light emitting device of the present invention, and FIG. 16B is a perspective view thereof.

Explanation of symbols

10, 30, 40, 50, 90, 100 Light-emitting device 11, 41, 43, 91 Glass substrate 12, 42, 42a, 42b, 42c, 92 Element 13, 17, 47a, 47b, 97a, 97b Substrate 14, 44 Sealing resin layer 15, 45a, 45b, 95 Carrier substrate 16, 46a, 46b, 96 Adhesive layer 18, 48a, 48b, 98a, 98b Adhesive layer 93 Sealing layer 49, 99 Adhesive sheet 200 Electronic paper 201 Light Emitting Device 210 Storage Case 211 Case Main Body 212 Door

Claims (4)

(1) bonding a thick first carrier substrate to a first main surface of a first glass substrate having a thickness of 100 μm or less;
(2) forming an element including at least one organic material on the second main surface opposite to the first main surface of the first glass substrate;
(3) a step of laminating a sealing layer on the second main surface on which the element of the first glass substrate is formed;
(4) a step of laminating a support on the surface of the sealing layer opposite to the first glass substrate;
(5) peeling the first carrier substrate from the first main surface of the first glass substrate;
(6) laminating a flexible first substrate having a thickness of 100 μm or more on the first main surface of the first glass substrate on which the element is formed;
(7) separating the support from the sealing layer,
In the step of forming an element including at least one organic material, a baking temperature of the organic material is set to 150 ° C. or higher.   The method for manufacturing a light-emitting device according to claim 1, wherein the sealing layer includes a second glass substrate having a thickness of 100 μm or less. (8) The step of laminating a flexible second substrate having a thickness of 100 μm or more on a surface opposite to the first glass substrate of the sealing layer. Production method. The method for manufacturing a light emitting device according to claim 1 , wherein the step of peeling the first carrier substrate includes a step of reducing the adhesive force of the first carrier substrate.

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