JPH1090692A - Manufacture of liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily fit a cooling means and reduce polarizing plate defects by processing even a small-size substrate by a manufacturing device which handles a large-sized substrate. SOLUTION: Sheet glass 1' of 1st size is stuck on base glass 2 of 2nd larger size with a transparent adhesive 3, the base glass 2 is fitted to a specific liquid crystal assembling device, and the sheet glass 1' is processed. Then the base glass 2 is stuck on a dicing sheet and processed by full-cut dicing together with the sheet glass 1' to form a chip member, which is put as one side over a member as the other side. Then liquid crystal is charged between the chip member and the member as the other side and a thermal treatment is performed to orient the liquid crystal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal display device using a translucent substrate.

[0002]

2. Description of the Related Art A liquid crystal display device has a thin film transistor (TFT) for driving liquid crystal.
Is formed by superposing a liquid crystal driving substrate on which a color filter, a microlens array, and a uniform transparent electrode are formed, filling a liquid crystal therebetween, and orienting the liquid crystal by heat treatment.

A liquid crystal driving substrate to which a high-temperature polysilicon TFT is applied is subjected to various processes for forming a polysilicon TFT using a semiconductor manufacturing apparatus or the like. Therefore, a TFT or the like is formed by mounting a quartz glass substrate having the same size as the wafer or the same round shape with an orientation flat on a semiconductor manufacturing apparatus or the like.

On the other hand, since a color filter, a microlens array, a uniform transparent electrode, and the like can be collectively formed on a counter substrate, for example, a color filter or a microlens array is formed on a large rectangular borosilicate glass substrate. After being formed at once, a transparent electrode or the like is manufactured by dividing into a predetermined size.

[0005]

However, the processing of the opposite substrate is the same as that of the liquid crystal driving substrate. However, when processing is performed by the same liquid crystal assembling and manufacturing apparatus, the size and shape of the substrate are different. Then, it is necessary to change (replace) the mounting base of the substrate. For this reason,
From the viewpoint of improving productivity, there is a problem that a manufacturing apparatus corresponding to the liquid crystal driving substrate and a manufacturing apparatus corresponding to the counter substrate must be separately prepared and the processing must be advanced. This is a cause of cost increase such as an increase in capital investment, an increase in clean room area for installation of equipment, and an increase in man-hours for equipment maintenance.

[0006]

SUMMARY OF THE INVENTION The present invention is a method for manufacturing a liquid crystal display device which has been made to solve such problems. That is, a step of bonding a light-transmitting substrate having a first size to a light-transmitting base having a second size equal to or larger than the first size via a light-transmitting adhesive; Attaching the translucent base bonded to the predetermined liquid crystal assembling apparatus to perform processing, and applying the translucent base to which the translucent substrate is bonded to a dicing sheet, A step of performing full cut dicing of the light-transmitting base together with the step of forming a chip member in a state in which the small piece of the light-transmitting substrate and the small piece of the light-transmitting base are bonded to each other, and peeling the chip member from the dicing sheet A step of applying a sealant to the chip member to one side and superimposing the chip member on the other side with the common agent applied so that a small piece of the light-transmitting substrate faces the other side member; Between the tip member and the other member Sealing liquid crystal, comprising a step of performing a liquid crystal alignment by heat treatment.

In the present invention, since the translucent substrate to be processed is bonded to a translucent base having a size larger than that size, even if the translucent substrate has various shapes and sizes. The same liquid crystal assembly device can be set up and processed.

When dicing, the light-transmitting base is cut together with the light-transmitting substrate, so that a small piece of the light-transmitting base can be used as a cooling plate for the light-transmitting substrate. Become.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a method for manufacturing a liquid crystal display device according to the present invention will be described below with reference to the drawings. 1 and 2 are schematic diagrams illustrating a first embodiment. First
The method of manufacturing the liquid crystal display device according to the embodiment is characterized in that the large glass 1 is used as a counter substrate for forming a color filter and the like.

First, as shown in FIG. 1A, a color filter, a microlens array, a transparent electrode and the like are formed on a surface 1a of a large glass 1 made of borosilicate glass or the like. As the large glass 1, for example, 300 (m)
m) x 350 (mm) square, 0.7mm thick
Use the one of about 1.1 mm.

Next, as shown in FIG. 1 (b), the large glass 1 (see FIG. 1 (a)) is divided into, for example, 6 inch square sheet glass 1 '. At the time of this division, it is desirable to chamfer the end portion of the sheet glass 1 'in order to reduce buff residue during rubbing processing described later.

Next, as shown in FIG. 1C, a process of bonding the sheet glass 1 'to the base glass 2 with the transparent adhesive 3 is performed. The transparent adhesive 3 does not deteriorate even after washing with an alcohol-based solution or heat treatment of the alignment film (180 ° C., 2 hours). By absorbing the difference in the coefficient of thermal expansion between the glass 2 and the glass 2, stress during heat treatment and temperature cycling can be reduced, and for example, silicone resin, epoxy resin, acrylic resin (all of
An ultraviolet irradiation curing type, a thermosetting type, or an ultraviolet irradiation + thermosetting type) is used.

As shown in FIG. 1 (d), the base glass 2 is larger than the size of the sheet glass 1 'and is provided with an orientation flat (hereinafter simply referred to as an orientation flat) OF'. It has a shape. By making the base glass 2 the same as, for example, an 8-inch diameter wafer shape (for example, the same as a substrate for manufacturing a liquid crystal drive substrate), it is used for forming a liquid crystal drive substrate in later processing. The same manufacturing apparatus (for example, a liquid crystal assembling manufacturing apparatus) can be used.

Next, in a state where the sheet glass 1 'is stuck on the base glass 2, the surface 1 of the sheet glass 1' is
A liquid crystal alignment process such as a rubbing process is performed by applying and firing an alignment film made of polyimide on a. The polyimide alignment film is applied, for example, in a thickness of 30 to 50 nm, and baked at 180 ° C. for about 2 hours. The rubbing treatment is performed using the orientation flat OF ′ of the base glass 2.
Is performed on the basis of

Next, as shown in FIG. 2 (a), the base glass 2 on which the sheet glass 1 'is bonded is stuck on a dicing sheet 4, and the base glass 2 is fully filled together with the sheet glass 1' by a dicing blade B. Cut dicing (cut the dicing sheet 4 by about 30 to 40 μm).

As a result, a large number of chip members C in a state where the small pieces of the sheet glass 1 'and the small pieces of the base glass 2 are bonded to each other are formed.

Next, the chip member C is picked up from the dicing sheet 4 and, if necessary, is washed.
As shown in (b), a sealing agent is applied using the chip member C as an opposing substrate, and a common agent is applied to the TFT-side chip member 10 as the other substrate, which is superimposed, seal-cured, and then heat-treated. (110 ° C., 30 minutes), and rapidly cooled to align the liquid crystal. After that, a liquid crystal (not shown) is injected therebetween to seal.

Then, as shown in FIG. 2C, a polarizing film H is attached to each of the chip member C and the TFT-side chip member 10, and the flexible wiring F is connected to complete the liquid crystal display device.

In the liquid crystal display device manufactured as described above, the base glass 2 for supporting the sheet glass 1 'is also divided with the sheet glass 1', and the TFT side chip member 10 is directly used as a component of the chip member C. After being completed as a liquid crystal display device,
The chip member C functions as a cooling plate.

FIGS. 1A to 1D and FIG.
In the production of the liquid crystal display device in (a) to (c), the base glass 2 is mainly used in the production of the opposing substrate on which the color filters and the like are formed, and the base glass 2 is divided and assembled together with the sheet glass 1 ′ and used as a cooling plate. Although an example is shown, when the TFT side chip member 10 is formed, a similar base glass 2 may be used, divided and assembled to be used as a cooling plate.

FIG. 2D shows an example in which a cooling plate formed by dividing the base glass 2 is bonded to both the chip member C as the opposing substrate and the TFT side chip member 10 as the liquid crystal driving substrate. is there. Thus, the TFT-side chip member 10
When manufacturing a product in which a cooling plate is attached to
If a base glass (for example, 8 inches in diameter) of the same size as the wafer-shaped glass substrate (for example, 8 inches in diameter) used when forming T is bonded with a transparent adhesive, after bonding As a step, it is possible to perform processing in the same step as the above-described method of manufacturing the chip member C as the opposing substrate.

Next, a method of manufacturing the liquid crystal display device according to the second embodiment will be described with reference to the schematic diagram of FIG. The second embodiment mainly has a wafer shape (hereinafter simply referred to as a wafer) as a glass substrate for manufacturing a counter substrate.
This is an example in the case of using the above.

First, as shown in FIG. 3A, a predetermined process is performed on the surface 1a of the wafer W made of a glass material.
A counter substrate is manufactured using a substrate made of the wafer W, for example, when a microlens array or a microprism array is formed. Therefore, as a glass material, for example, crystallized glass, aluminosilicate glass,
Use borosilicate glass or quartz glass. Size is 6
Use an inch diameter, 0.8 mm thick one.

Next, as shown in FIG. 3B, a process of bonding the processed wafer W to the base glass 2 with the transparent adhesive 3 is performed. As in the first embodiment, the transparent adhesive 3 has a high transmittance without being deteriorated even by subsequent washing with an alcohol-based solution or heat treatment of an alignment film (180 ° C., 2 hours), and has light resistance to ultraviolet rays. A thermal expansion coefficient between the sheet glass 1 'and the base glass 2 can be absorbed to relieve stress during heat treatment and temperature cycling.
Acrylic resin (all of which are UV-curable or thermosetting, or UV-irradiated + thermosetting) is used.

The base glass 2 has a wafer shape larger than the size of the wafer W. For example, a wafer having a diameter of 8 inches is used as the base glass 2. As a result, in the subsequent processing, the same manufacturing apparatus (for example, a liquid crystal assembling manufacturing apparatus) used when forming the liquid crystal driving substrate can be used.

Further, in the present embodiment, the bonding of the wafer W and the base glass 2 is performed as shown in FIG.
This is performed in a positional relationship as shown in FIG. That is, FIG.
In the example shown in (c), the center of the wafer W and the base glass 2
3D. In the example shown in FIG. 3D, the orientation flat OF
And the orientation flat OF ′ of the base glass 2. Regardless of the bonding, a positional relationship is set such that the direction of the orientation flat OF of the wafer W and the direction of the orientation flat OF ′ of the base glass 2 match.

After bonding the wafer W and the base glass 2 as described above, a chip member C is formed by the same processing as in the first embodiment shown in FIGS. To complete. Even when a substrate made of a wafer W is used as in the second embodiment, a common manufacturing apparatus can be used by bonding the base glass 2 having a size corresponding to the liquid crystal assembling and manufacturing apparatus. By dividing the base glass 2 together with the wafer W and assembling it as it is to form a liquid crystal display device, it can also be used as a cooling plate.

Next, a method of manufacturing the liquid crystal display device according to the third embodiment will be described with reference to the schematic diagram of FIG. The third embodiment is characterized in that a support ring R that mainly supports the sheet glass 1 ′ is used.

First, as shown in FIG. 4A, a sheet glass 1 '(large glass divided into a predetermined size)
And the support ring R are attached via the support tape T.
As the support tape T, a tape in which an ultraviolet irradiation-curable adhesive layer is adhered to a highly heat-resistant base film is used. The support ring R is made of a metal or a high heat-resistant resin. Then, a small amount (about 20 mJ / cm ² ) of ultraviolet light is irradiated while the sheet glass 1 ′ is attached,
The exposed portion of the support tape T without the sheet glass 1 'is slightly hardened to eliminate stickiness. This is to prevent dust from adhering in later processing (rubbing or the like). At this time, the adhesive strength of the sheet glass 1 'region is also reduced, but the point is that the sheet glass 1' is adhered to such an extent that the sheet glass 1 'does not peel off from the support tape in the subsequent processing.

FIG. 4B is a schematic plan view showing a state in which the square sheet glass 1 ′ is attached to the support ring R via the support tape T. The outer shape of the support ring R has a wafer shape (for example, 8 inches in diameter), and includes an orientation flat OF ′. By attaching the support ring R to the sheet glass 1 'in this manner, in a later process, the support ring R can be handled in the same manner as a wafer and mounted on a liquid crystal assembling apparatus. By attaching ', the direction of the sheet glass 1' in the liquid crystal assembling apparatus can be accurately specified.

FIG. 4C shows a case in which a substrate made of a wafer W is used. In this case, the direction of the orientation flat OF of the wafer W and the direction of the orientation flat OF 'of the support ring R are matched. Wafer W on support tape T
To paste.

In either case of using the substrate shown in FIGS. 4B and 4C, after attaching the support ring R, an alignment film made of polyimide is applied to the surface of the sheet glass 1 'or the wafer W and baked. Then, a rubbing process is performed. In addition,
The case where the sheet glass 1 ′ is used will be described below, but the same applies to the case where the wafer W is used.

When polyimide is used as the alignment film, a low-temperature cure (100 ° C. or lower) type is used. The rubbing treatment is performed by using the orientation flat O of the support ring R.
This is performed based on F ′. In addition, as the alignment film, a SiO ₂ oblique deposition film may be used instead of polyimide. This S
The rubbing treatment is not required when an obliquely deposited iO ₂ film is used. Further, an alignment treatment by ultraviolet irradiation may be used. This is a process of irradiating polarized ultraviolet light to an alignment film such as polyimide to align the liquid crystal, and there is no rubbing treatment by a rubbing buff, so that there is an advantage that a defect due to adhesion of dust does not occur.

After performing a predetermined treatment on the surface of the sheet glass 1 ', cut dicing is performed to insert a V-groove (for example, 0.1 mm depth) along a line for dividing the surface. Then, as shown in FIG. 4D, the surface having the V-groove is attached to the dicing sheet 4, and as shown in FIG.
The support tape T and the support ring R shown in (c) are removed. Note that the support tape T is easily peeled and removed from the sheet glass 1 'because it is hardened by lightly irradiating ultraviolet rays first.

Thereafter, full cut dicing is performed from the back side along the V-groove of the sheet glass 1 '. In this full cut dicing, the dicing blade B is cut to the V-groove portion so that the dicing sheet 4 is not cut. This makes it possible to prevent dust (adhesive and debris of the base film) from being generated from the dicing sheet 4. By this full-cut dicing, a plurality of chip members C are formed.

After the chip member C is formed, the chip member C is washed with an alcohol-based cleaning liquid, picked up from the dicing sheet 4, and a sealing agent is applied to the chip member C to form a counter substrate. T
The liquid crystal display device is completed by applying a common agent to the FT-side chip member and superimposing the liquid crystal, enclosing the liquid crystal, orienting the liquid crystal by heat treatment, attaching a polarizing film, connecting flexible wiring, and the like.

As in the third embodiment, the sheet glass 1 '
When a support ring R having a wafer shape larger than the size of the support ring R is attached to the wafer W or the wafer W, the liquid crystal assembly apparatus can be shared with the liquid crystal drive substrate, and the productivity can be improved. .

[0038]

As described above, according to the method for manufacturing a liquid crystal display device of the present invention, the following effects can be obtained. That is, since a light-transmitting base having a larger size is bonded to the light-transmitting substrate, the same liquid crystal assembling apparatus is used in subsequent steps even if the light-transmitting substrates have different sizes. Will be able to That is,
By setting the size of the translucent base to be the same as the wafer size when forming the liquid crystal driving substrate, the substrate holding part (wafer mounting base, etc.) of the liquid crystal assembly apparatus for forming the alignment film, rubbing, dicing, etc. The liquid crystal assembling apparatus can be shared without replacing the substrate holding unit, and the manufacturing time can be reduced. This makes it possible to manufacture a liquid crystal display device with high productivity.

Further, by dividing and assembling the light-transmitting base bonded to the light-transmitting substrate, a small piece of the light-transmitting base can be used as a cooling plate. The cooling effect of the present invention can be enhanced, and there is no need to attach a complicated cooling mechanism in a separate step, so that significant cost reduction and productivity improvement can be achieved.

Further, since the polarizing plate is bonded to the light-transmitting base and bonded to the light-transmitting substrate and the liquid crystal driving substrate,
As the distance from the liquid crystal layer increases, defects in the polarizing plate (fine dust, scratches, etc.) due to defocusing can be reduced, and the yield and quality can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic diagram (part 1) for explaining a first embodiment;

FIG. 2 is a schematic diagram (part 2) for explaining the first embodiment;

FIG. 3 is a schematic diagram illustrating a second embodiment.

FIG. 4 is a schematic diagram illustrating a third embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Large glass 1 'Sheet glass 2 Base glass 3 Transparent adhesive 4 Dicing sheet 10T
FT side chip member B Dicing blade C Chip member F Flexible wiring H Polarizing film W Wafer

Claims (4)

[Claims] A step of bonding a light-transmitting substrate having a first size to a light-transmitting base having a second size equal to or larger than the first size via a light-transmitting adhesive; Attaching a translucent base to which the light-transmitting substrate is attached to a predetermined liquid crystal assembling apparatus and performing a process; and pasting the translucent base to which the light-transmitting substrate is attached to a dicing sheet; Full-cut dicing the light-transmitting base together with the light-transmitting substrate to form a chip member in a state where the light-transmitting substrate and the light-transmitting base are bonded together. The chip member is peeled off from the dicing sheet, a sealing agent is applied to the chip member to make one side, and a small piece of the light-transmitting substrate is overlapped with the member on the other side to which a common agent is applied, and the other side A step of performing so as to face the member of Method of manufacturing a liquid crystal display device and a liquid crystal sealed between the members of the chip member other side, characterized in that it consists of a step for liquid crystal alignment by heat treatment. 2. The method for manufacturing a liquid crystal display device according to claim 1, wherein said translucent adhesive is made of an ultraviolet irradiation-curable silicone resin. 3. The method according to claim 1, wherein the translucent adhesive is made of a thermosetting silicone resin. 4. A step of attaching a support ring having a second size equal to or larger than the first size to a outside of a light-transmitting substrate having a first size via a predetermined support tape; Attaching the substrate together with the support ring to a predetermined liquid crystal assembling apparatus to perform processing, forming a V-groove on the processing surface side of the light-transmitting substrate, and attaching the processing surface of the light-transmitting substrate to a dicing sheet Dicing a position corresponding to the V-groove on a surface opposite to the processing surface to form a chip member made of a small piece of the light-transmitting substrate; and peeling the chip member from the dicing sheet. A step of applying a sealant to the chip member to make it one side, and superimposing the chip member on the other member to which a common agent has been applied, and sealing a liquid crystal between the chip member and the other member. ,Heat treatment Method of manufacturing a liquid crystal display device characterized by comprising a step of performing a liquid crystal alignment Te.