JP4301337B2 - Manufacturing method of electro-optical device - Google Patents

Description

  The present invention relates to a method for manufacturing an electro-optical device in which a glass substrate is disposed on the outer surface of a display device.

  In a projection-type liquid crystal display device, which is representative of an electro-optical device, if dust or the like adheres to the vicinity of the surface of the liquid crystal panel, it is enlarged by a projection lens or the like and projected onto a screen, which significantly reduces display quality. become. In order to prevent this, for example, as disclosed in Japanese Patent Application Laid-Open No. 2003-140125, many techniques for attaching a glass substrate having a dustproof function to the outer surface of a liquid crystal panel are employed.

  By protecting the outer surface of the liquid crystal panel with a glass substrate, it is possible to prevent dust and the like from adhering to the liquid crystal panel surface. Furthermore, even if dust adheres to the outer surface of the glass substrate, the distance between the dust and the liquid crystal is increased by the thickness of the glass substrate, and the image of the dust is defocused and greatly blurred on the screen. Because it is displayed, it becomes inconspicuous.

  By the way, even if the surface of the liquid crystal panel is protected by the glass substrate, there may be a case where dust or the like adheres to the surface of the liquid crystal panel or the inner surface of the glass substrate in the manufacturing process.

  Generally, a glass substrate is attached to the outer surface of a completed liquid crystal panel using a thermosetting adhesive or the like. It takes about several tens of minutes to about an hour for the adhesive to cure, and dust or the like may enter between the liquid crystal panel and the glass substrate during that time.

  Therefore, when affixing a glass substrate to a liquid crystal panel, the glass substrate is affixed to one surface of the liquid crystal panel via a thermosetting adhesive, and held and fixed by a jig frame in a predetermined position. Until the thermosetting adhesive is cured, dust is prevented from entering between the liquid crystal panel and the glass substrate.

Japanese Patent Laid-Open No. 2004-21056

  However, when affixing the glass substrate described above, the liquid crystal panel and the glass substrate must be held and fixed to the jig frame one by one, and since this is performed separately on both sides of the liquid crystal panel, the glass substrate is cured. In addition to complicating the attachment and detachment of the tool frame, the time required for adhesion is twice as long as the time for curing the thermosetting adhesive for one liquid crystal panel, resulting in a problem of poor productivity. is there.

  In addition, the positioning accuracy between the liquid crystal panel and the glass substrate by the jig frame is about several tens of microns, and there is a limit to further increase the positioning accuracy.

Method of manufacturing an electro-optical device that by the present invention for achieving the above object, an electro-optical a plurality producing an electro-optical device comprising a first substrate and a second substrate chip-like chip-shaped is formed by Awa bonding In the method of manufacturing an apparatus, a plurality of large substrates that can be cut out are prepared on a chip-shaped first substrate, and a plurality of chip-shaped second substrates are provided so as to face a region of the large substrate that becomes the first substrate. A plurality of chip-shaped dust-proof substrates on the surface of the large substrate opposite to the surface on which the plurality of chip-shaped second substrates are bonded to each other. it and a large dust-proof substrate attaching step of attaching a large-sized dustproof substrate, anda cutout step of cutting with the said large substrate large dustproof substrate and both the first substrate unit, in the large dustproof substrate bonding step, before A thermosetting adhesive is dropped on the large dust-proof substrate, and then the large substrate is placed on the large dust-proof substrate in a reduced-pressure atmosphere, and then the large substrate is pressed toward the large dust-proof substrate, and then the temperature is increased. The thermosetting adhesive is cured in an atmosphere .

In such a configuration, after attaching the large dust-proof substrate to the large substrate having a plurality of first substrates that can be cut out in a chip shape, both the large substrate and the large dust-proof substrate are cut out in units of the first substrate. As a result, the large dustproof substrate can be affixed to the large substrate without requiring high positioning accuracy, and the large substrate and the large dustproof substrate are divided into one piece when cutting out. Obtainable. Further, since the entire large substrate is pressed toward the large dustproof substrate, the large dustproof substrate and the large substrate can be attached with a higher degree of adhesion.

In such a configuration, after dropping large dustproof substrate a heat curable adhesive, the large substrate is placed on a large dustproof substrate, then since so as to press the entire large substrate to a large dustproof substrate direction, more A large dustproof substrate and a large substrate can be attached with high adhesion.

In such a configuration, since the large dust-proof substrate and the large substrate are bonded to each other with a predetermined pressing force in a reduced pressure atmosphere, the air bubbles between the large dust-proof substrate and the large substrate are completely evacuated. It can be adhered.

Further, in the large dustproof substrate bonding step, said applying a photocurable adhesive for temporary fixing to the outer periphery of a large dust-proof substrate, after the set time, it is cured by irradiating light to the photocurable adhesive Then, the thermosetting adhesive may be cured in a high temperature atmosphere.

In such a configuration, before the thermosetting adhesive is cured in a high temperature atmosphere, the outer periphery of the large dust-proof substrate and the large substrate are temporarily fixed by adhering them with a photocurable adhesive. The large dustproof substrate and the large substrate are bonded in a stable posture without being displaced.

Further, in a method of manufacturing an electro-optical device that manufactures a plurality of electro-optical devices in which a chip-shaped first substrate and a chip-shaped second substrate are bonded together, a plurality of chips may be cut out on the chip-shaped first substrate. A large substrate that can be prepared, and a second substrate pasting step in which a plurality of chip-shaped second substrates are respectively pasted so as to face a region to be the first substrate of the large substrate; A large dustproof substrate pasting step for pasting a large dustproof substrate that can be cut into a plurality of chip dustproof substrates on the surface opposite to the surface on which the plurality of chip-like second substrates are bonded; and A cutting step for cutting out the large dust-proof substrate in units of the first substrate, and in the large dust-proof substrate attaching step, after applying a photocurable adhesive on the large dust-proof substrate, Placing the large substrate on a substrate, followed by pressing the large-sized substrate to the large dustproof substrate direction, cured by subsequent irradiation with light to the light curing adhesive, the large substrate the large dustproof substrate direction In the process of pressing to, at least one of the two substrates is heated.

In such a configuration, since the viscosity of the photocurable adhesive decreases when heated, at least one of the two substrates is heated when pressing the large substrate and the large dustproof substrate with the photocurable adhesive interposed therebetween. This improves the diffusibility of the photocurable adhesive.

Moreover , the light for curing the photocurable adhesive may be irradiated from the surface of the large dustproof substrate opposite to the surface on which the large substrate is bonded.

In such a configuration, light for curing the photocurable adhesive is irradiated from the large dust-proof substrate side, so that light is irradiated from the large substrate side on which a light-shielding film or the like is formed in the manufacturing process of the first substrate. Compared with the case where it does, there is almost nothing which blocks light, and the whole photocurable adhesive agent can be hardened favorably.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 to 6 show a first embodiment of the present invention. FIG. 1 is a schematic sectional view of a liquid crystal display device, and FIG. 2 is a perspective view of a state in which a chip-like counter substrate is bonded to a large substrate.

  First, the overall configuration of the liquid crystal display device will be briefly described with reference to FIG. FIG. 1 shows a TFT active matrix drive type liquid crystal display device with a built-in drive circuit.

  Reference numeral 1 in FIG. 1 denotes a liquid crystal display device that is representative of an electro-optical device, and is disposed opposite to a thin film transistor (TFT) substrate 10 as a first substrate made of a quartz glass substrate or the like. A liquid crystal panel 120 is formed by bonding a counter substrate 20 as a second substrate made of a quartz glass substrate or the like via a sealing material 52, and the opposing surfaces of both the substrates 10 and 20 formed by the sealing material 52. In the meantime, a liquid crystal 50 as an electro-optical material is sealed.

  Pixel electrodes (ITO) 9a constituting pixels are arranged in a matrix on the TFT substrate 10, and a counter electrode (ITO) 21 is provided on the entire surface of the counter substrate 20. Further, the alignment films 16 and 22 subjected to the rubbing process are formed on the entire surface of the pixel electrode 9a of the TFT substrate 10 and the counter substrate 20, respectively. The alignment films 16 and 22 are made of a transparent organic film such as a polyimide film.

  A data line driving circuit 101 and an external connection terminal 102 are formed on one side outside the region where the sealing material 52 of the TFT substrate 10 is formed. Although not shown, a scanning line driving circuit is provided along two sides adjacent to the one side, and a wiring pattern for connecting the scanning line driving circuits is formed on the remaining side.

  Further, transparent glass substrates (hereinafter referred to as “dust-proof glass substrates”) 30 and 31 having a dust-proof function are attached to both surfaces of the liquid crystal panel 120. The dust-proof glass substrates 30 and 31 prevent dust and the like from adhering to the surface of the liquid crystal panel 120 and defocus the dust and the like away from the liquid crystal display surface, thereby making the image of the dust and the like inconspicuous. Have

  In order to realize such a function, the dust-proof glass substrates 30 and 31 are formed to be relatively thick with a plate thickness of about 1 to 3 mm, and the material is the same as that of the TFT substrate 30 and the counter substrate 20. in use. Further, the dust-proof glass substrates 30 and 31 are a silicon-based adhesive or acrylic-based adhesive adjusted to the same refractive index as the TFT substrate 30 or the counter substrate 20 (and the dust-proof glass substrates 30 and 31) with respect to the surface of the liquid crystal panel 120 A thermosetting transparent adhesive made of an agent or the like is used to adhere the TFT substrate 30 and the outer surface of the counter substrate 20 with air bubbles removed.

  The TFT substrate 10 and the counter substrate 20 are individually bonded through different processes and then bonded together. As shown in FIG. 2, at the time of bonding, a counter substrate 20 formed in a chip shape is bonded to a large substrate 110 on which a large number of TFT substrates 10 are formed, and then the TFT substrate 10 and the counter substrate are bonded. Liquid crystal is injected between 20 and sealed.

  In addition, although the large sized board | substrate 110 by this form is formed in disk shape, a shape is not limited to this, For example, you may form in the rectangular shape. In the figure, twelve TFT substrates 10 are formed on one large substrate 110, but the number of TFT substrates 10 formed on one large substrate 110 is not limited to this. .

  The dustproof glass substrates 30 and 31 are attached to a large substrate 110 as shown in FIG. 2 in a state where a plurality of liquid crystal panels 120 are formed. FIG. 3 shows a process of mounting the dustproof glass substrates 30 and 31 on the liquid crystal panel 120. This work is performed in a clean room.

  Step (a): First, after a plurality of liquid crystal panels 120 are formed on a large substrate 110 in a predetermined manner, the liquid crystal panel 120 is cleaned and inspected for its operating state.

  Step (b): Large dust-proof glass having a shape substantially the same as or slightly smaller than that of the large substrate 110 on the outer surface (the lower surface in FIG. 2) of the large substrate 110 that is the surface opposite to the surface to which the counter substrate 20 is bonded. A substrate 300 is attached. The large dust-proof glass substrate 300 becomes the dust-proof glass substrate 30 by being divided into chips.

  Step (c): After that, the entire substrate is cleaned, and the outer surface (upper surface in FIG. 2), which is the surface opposite to the surface facing the large substrate 110, of each counter substrate 20 has substantially the same shape as the counter substrate 20. A small dust-proof glass substrate 31 is attached.

  Step (d): A scribe line L is formed on the surface of the large substrate 110 where the counter substrate 20 is bonded, the large substrate 110 is divided along the scribe line L, and the chip-like liquid crystal display device 1 is cut out. At this time, the large dustproof glass substrate 300 is also cut out into the chip-shaped dustproof glass substrate 30.

  In the mounting process of the dust-proof glass substrates 30 and 31, the process (b) and the process (c) are interchanged, and before the large dust-proof glass substrate 300 is attached to the large-sized substrate 110, the small dust-proof glass is applied to the counter substrate 20. You may make it affix the glass substrate 31. FIG.

  Next, the process of attaching the large dustproof glass substrate 300 shown in FIG. 3B will be described in more detail with reference to the process diagram of FIG.

  Step (a): A thermosetting type comprising a silicon-based adhesive or an acrylic adhesive adjusted to have the same refractive index as that of the large dust-proof glass substrate 300 placed on the stage 40 and placed in the center thereof. A transparent adhesive 41 is dropped, and an ultraviolet curable adhesive 42 that is cured by irradiating ultraviolet rays, which is representative of light, around the periphery is applied.

  Since the ultraviolet curable adhesive 42 is for temporary fixing, it is not necessary to apply it to the entire circumference of the large dustproof glass substrate 300, and it may be applied at predetermined intervals.

  Next, the large substrate 110 on which the plurality of liquid crystal panels 120 are formed is opposed to the large dust-proof glass substrate 300 and is conveyed to the decompression chamber 130 in that state.

  Step (b): After the large dust-proof glass substrate 300 is carried into the decompression chamber 130, the interior is decompressed, and after reaching a set pressure (for example, 2.5 [Pa]), it is left until about 300 [sec] elapses. To do. Alternatively, the decompression chamber 130 is left until reaching a preset pressure (for example, 1.0 [Pa]).

  Step (c): After the decompression chamber 130 reaches the state set in step (b), the large substrate 110 is dropped onto the large dust-proof glass substrate 300 through the lifting device 43, for example, about 0.5 [mm / sec]. Place it gently at a speed and paste it together. Note that the large substrate 110 and the large dust-proof glass substrate 300 at this time are large, and are finally cut out individually as the liquid crystal display device 1, and therefore do not need to be positioned with high accuracy.

  Then, it is left for a predetermined time (for example, about 300 [sec]). Then, the large substrate 110 is brought close to the large dust-proof glass substrate 300 by its own weight, and as a result, the thermosetting transparent adhesive 41 dropped on the center of the large dust-proof glass substrate 300 is diffused to the surroundings.

Step (d): The pressure head 44 is lowered and brought into contact with the entire large substrate 110 from above, and the large substrate 110 is brought into contact with the predetermined pressure (for example, about 100 [g / cm ² ]) for a predetermined time ( (For example, about 180 [sec]). Then, while the air between the large substrate 110 and the large dust-proof glass substrate 300 is vented, the thermosetting transparent adhesive 41 diffuses to the surroundings, and the two substrates 110 and 300 are bonded together with high adhesion.

  Step (e): In step (d), after a predetermined time (for example, about 180 [sec]) has elapsed, the decompression chamber 130 is gradually increased in pressure to reach atmospheric pressure, and then the two bonded together from the decompression chamber 130 are combined. The substrates 110 and 300 are taken out, the ultraviolet curable adhesive 42 applied around the large dust-proof glass substrate 300 is cured by spot irradiation with ultraviolet rays 45, and both the substrates 110 and 300 are temporarily fixed.

  Step (f): Both substrates 110 and 300 temporarily fixed by the ultraviolet curable adhesive 42 are transported to a high temperature chamber 131 heated to a predetermined temperature (for example, about 80 [° C.]), in which a predetermined The substrate is left to stand for a period of time (for example, about 1.5 [h]), and the thermosetting transparent adhesive 41 is cured to bond the substrates 110 and 300 together. Since the large substrate 110 and the large dustproof glass substrate 300 are temporarily fixed by the ultraviolet curable adhesive 42, they are bonded in a stable posture without being displaced.

  Then, after elapse of a predetermined time (for example, about 1.5 [h]), the two substrates 110 and 300 bonded to each other are taken out from the high temperature chamber 131 and cooled to a predetermined level to complete the bonding of the large dustproof glass substrate 300.

  Even if the curing time of the UV curable adhesive is set relatively long, the whole is bonded at once, so the total curing time can be greatly reduced compared to the case of individual curing, Accordingly, productivity can be improved.

  Next, the attaching process of the dustproof glass substrate (hereinafter referred to as “small dustproof glass substrate”) 31 shown in FIG. 3C will be described in more detail with reference to the process diagram of FIG. In addition, the small dustproof glass substrate 31 is stuck in atmospheric pressure.

  Step (a): A large substrate 110 to which a large dust-proof glass substrate 300 is bonded is placed on a hot plate 46 as a heating means heated to a predetermined temperature (for example, about 70 to 80 [° C.]). Next, a thermosetting transparent adhesive 41 is dropped on the center of the upper surface of one counter substrate 20. The hot plate 46 is placed on a stage (not shown).

  On the other hand, a heating head 47 is provided above the counter substrate 20. The heating head 47 and the hot plate 46 on which the large substrate 110 is placed are movable relative to each other, and are opposed to each other in a predetermined position.

  A small dust-proof glass substrate 31 is adsorbed to the lower end surface of the heating head 47. A heater is disposed on the lower end surface of the heating head 47 and a suction port is opened. A suction pump (not shown) is communicated with the suction port. The small dust-proof glass substrate 31 is adsorbed to the lower end surface of the heating head 47 by the suction force of the suction pump, and is heated to about 85 to 100 [° C.] by the heater.

Step (b): The heating head 47 is lowered, the small dust-proof glass substrate 31 adsorbed on the lower end surface thereof is brought into contact with the upper surface of the counter substrate 20, and a predetermined time (for example, about 10 to 20 [sec]), The small dustproof glass substrate 31 is pressed against the counter substrate 20 by pressing with a predetermined pressure (for example, about 0.15 [Kg / cm ² ]).

  Then, the thermosetting transparent adhesive 41 diffuses to the surroundings, and is heated to about 85 to 100 [° C.] by the large substrate 110 heated to about 70 to 80 [° C.] by the hot plate 46 and the heater. The small dustproof glass substrate 31 is heated and cured.

  The curing time of the thermosetting transparent adhesive 41 is determined by the heating temperature of the small dustproof glass substrate 31 by the heating head 47 and the heating temperature of the large substrate 110 by the hot plate 46. The thermosetting transparent adhesive 41 is set according to the curing time.

  As shown in FIG. 6, with the pressure of the heating head 47 fixed, the heating temperature by the heating head 47, the heating temperature by the hot plate 46, and the conditions for the pressure bonding time of the heating head 47 are variously changed. Whether the curable transparent adhesive 41 could be cured was examined. As a result, the thermosetting transparent adhesive 41 can be efficiently cured in the time in which condition 6 is the shortest.

  Step (c): After the pressure bonding time of the small dustproof glass substrate 31 by the heating head 47 reaches a predetermined pressure bonding time, that is, after the thermosetting transparent adhesive 41 is cured, the heating head 47 is raised. Then, since the small dustproof glass substrate 31 is bonded to the counter substrate 20 by the thermosetting transparent adhesive 41, the small dustproof glass substrate 31 is separated from the lower end surface of the heating head 47 and the bonding of the small dustproof glass substrate 31 is completed.

  Next, a stage (not shown) on which the hot plate 46 is placed and the heating head 47 are moved relative to each other so that the heating head 47 is disposed on the adjacent counter substrate 20 and each of the above-described steps (a) to (a) to (b). The same process as (c) is repeated to bond the small dustproof glass substrate 31 to the counter substrate 20. By repeating this for the remaining counter substrates 20, the small dust-proof glass substrate 31 is bonded to the outer surface of all the counter substrates 20 bonded to the large substrate 110.

  As described above, according to the present embodiment, the operation of attaching the dust-proof glass substrates 300 and 31 to the outer surface of the liquid crystal panel 120 is performed in a step before the liquid crystal panel 120 is cut out from the large substrate 110 into a chip shape. It is only necessary to attach one large dust-proof glass substrate 300 to the outer surface of the large substrate 110, and the number of pasting steps can be greatly reduced. Further, since the large dustproof glass substrate 300 is cut out simultaneously with the large substrate 110, the dustproof glass substrate 30 protects the outer surface of the TFT substrate 10. Therefore, when attaching the large dustproof glass substrate 300 to the large substrate 110, High positioning accuracy is not required, and work efficiency is improved.

  On the other hand, in the step of attaching the small dustproof glass substrate 31 to the outer surface of the counter substrate 20, the large substrate 110 is heated by the hot plate 46, and the small dustproof glass substrate 31 is heated by the heating head 47 and is subjected to pressure bonding. Since the small dust-proof glass substrate 31 is stuck with the force applied, the curing time of the thermosetting transparent adhesive 41 can be shortened. As a result, the time required for each sticking process is shortened, the working time is greatly reduced, and high productivity can be obtained. Furthermore, since the small dust-proof glass substrate 31 is bonded one by one in a state where the small dust-proof glass substrate 31 is positioned with respect to the counter substrate 20 from above, high-precision positioning can be performed.

  Furthermore, since the dust-proof glass substrates 30 and 31 can be attached to the outer surface of the liquid crystal panel 120 without using a jig frame, the steps required for assembly and disassembly of the jig frame are not required, and the number of work steps is reduced. Significant reduction can be achieved.

  7 and 8 show a second embodiment of the present invention. In the first embodiment described above, the large dustproof glass substrate 300 and the small dustproof glass substrate 31 are bonded to the large substrate 110 and the counter substrate 20 using the thermosetting transparent adhesive 41. Bonding is performed using a photo-curing (visible light or ultraviolet ray) type transparent adhesive.

  That is, in this embodiment, the step shown in FIG. 7 is adopted in place of the step shown in FIG. 4 of the first embodiment in the step of attaching the large dustproof glass substrate 300.

  Step (a): A large dust-proof glass substrate 300 is placed on a hot plate 400 serving as a heating means heated to a predetermined temperature (for example, about 40 to 50 [° C.]), and the large dust-proof glass substrate 300 and A photo-curing (visible light or ultraviolet ray) type transparent adhesive 410 made of a silicon adhesive, an acrylic adhesive or the like adjusted to the same refractive index is dropped. The photocurable transparent adhesive 410 has a property that the viscosity is lowered by heating. Accordingly, the viscosity of the photocurable transparent adhesive 410 dropped on the large dustproof glass substrate 300 heated to a predetermined temperature by the hot plate 400 is reduced, and the diffusibility is improved.

  Next, the large substrate 110 on which the plurality of liquid crystal panels 120 are formed is opposed to the large dust-proof glass substrate 300 and is conveyed to the decompression chamber 130 in that state.

  Step (b): After the large dust-proof glass substrate 300 is carried into the decompression chamber 130, the interior is decompressed, and after reaching a set pressure (for example, 2.5 [Pa]), it is left until about 300 [sec] elapses. To do. Alternatively, the decompression chamber 130 is left until reaching a preset pressure (for example, 1.0 [Pa]).

  Step (c): After the decompression chamber 130 reaches the state set in step (b), the large substrate 110 is dropped onto the large dust-proof glass substrate 300 through the lifting device 43, for example, about 0.5 [mm / sec]. Place it gently at a speed and paste it together. Note that the large substrate 110 and the large dust-proof glass substrate 300 at this time are large, and are finally cut out individually as the liquid crystal display device 1, and therefore do not need to be positioned with high accuracy.

  Then, it is left for a predetermined time (for example, about 300 [sec]). Then, the large substrate 110 is brought close to the large dust-proof glass substrate 300 by its own weight, and as a result, the photocurable transparent adhesive 410 dropped on the center of the large dust-proof glass substrate 300 is diffused to the surroundings. This photo-curing transparent adhesive 410 receives good heat from the large dust-proof glass substrate 300 heated by the hot plate 400 and has reduced viscosity, so that it can obtain good diffusibility.

Step (d): The pressure head 44 is lowered and brought into contact with the entire large substrate 110 from above, and the large substrate 110 is brought into contact with the predetermined pressure (for example, about 100 [g / cm ² ]) for a predetermined time ( For example, press evenly by about 180 [sec]. Then, while the air between the large substrate 110 and the large dust-proof glass substrate 300 is vented, the photocurable transparent adhesive 410 diffuses to the surroundings, and the two substrates 110 and 300 are bonded together with high adhesion.

  Step (e): After a predetermined time (for example, about 180 [sec]) has elapsed in step (d), the pressure in the decompression chamber 130 is gradually increased to reach atmospheric pressure, and then the two bonded together from the decompression chamber 130. The substrates 110 and 300 are taken out, placed on a transparent stage 420 through which light is transmitted, and light curing is performed between the large dustproof glass substrate 300 and the large substrate 110 using the light irradiator 500 from below. The mold transparent adhesive 410 is irradiated with light to cure the photocurable transparent adhesive 410, and the bonding of the large dustproof glass substrate 300 to the large substrate 110 is completed.

  In the case where an ultraviolet curable transparent adhesive is used as the light curable transparent adhesive 410, the light emitted from the light irradiator 500 is ultraviolet light, and a visible light curable transparent adhesive is used. In this case, the light emitted from the light irradiator 500 is visible light having a wavelength region of, for example, 410 [nm] or more.

When the light (ultraviolet) curable transparent adhesive 410 is cured with a light irradiation amount of about 3000 [mJ / cm ² ], for example, when the output is 500 [w], the irradiation time is about 6 [sec]. It will be good. This irradiation time can be freely set according to the output. Therefore, compared with the 1st form which employ | adopts the thermosetting type transparent adhesive 41, hardening time can be shortened significantly and productivity is improved by that much. Further, since the photo-curing transparent adhesive 410 can be cured instantaneously, there is no need to temporarily fix the periphery of the large dust-proof glass substrate 300 using an ultraviolet-curing adhesive as in the first embodiment. Therefore, the manufacturing process can be simplified.

  By the way, when the photocurable transparent adhesive 410 is cured, it is possible to irradiate light from the counter substrate 20 side, that is, from above in FIG. However, since the light shielding film that divides the display area is formed on the inner surface side of the counter substrate 20, the light irradiated from above is easily blocked by the light shielding film, and thus the light irradiation blocks the light. It is preferable to carry out from the side of the large dust-proof glass substrate 300 where there is almost no.

  Next, the sticking process of the small dustproof glass substrate 31 will be described. The process shown in FIG. 8 is adopted for the attaching process of the small dustproof glass substrate 31 according to this embodiment instead of the process shown in FIG. 5 of the first embodiment. In addition, this small dustproof glass substrate 31 is stuck in atmospheric pressure.

  Step (a): A large substrate 110 to which a large dust-proof glass substrate 300 is bonded is placed on a transparent plate (hereinafter referred to as “light transmitting plate”) 460 through which light is transmitted. Next, a photocurable transparent adhesive 410 is dropped on the center of the upper surface of one counter substrate 20.

  On the other hand, a heating head 470 is provided above the counter substrate 20. The heating head 470 and the light transmission plate 460 on which the large substrate 110 is placed are relatively movable, and are opposed to each other in a predetermined position.

  A small dust-proof glass substrate 31 is adsorbed to the lower end surface of the heating head 470. The configuration of the heating head 470 is the same as that of the heating head 47 of the first embodiment. The small dust-proof glass substrate 31 is adsorbed to the lower end surface of the heating head 470 by the suction force of the suction pump, and is heated to about 40 to 50 [° C.] by the heater.

Step (b): The heating head 470 is lowered, and the small dust-proof glass substrate 31 adsorbed on the lower end surface of the heating head 470 is brought into uniform contact with the upper surface of the counter substrate 20 for a predetermined time (eg, about 10 to 20 [sec]) ) And pressing with a predetermined pressure (for example, about 0.15 [Kg / cm ² ]), and the small dust-proof glass substrate 31 is pressure-bonded to the counter substrate 20. Since the counter substrate 20 is heated to about 40 to 50 [° C.] by the heating head 470, when the counter substrate 20 comes into contact with the photocurable transparent adhesive 410, the photocurable transparent adhesive 410 is heated and becomes viscous. Decreases and diffuses well to the surroundings.

Then, after the light curable transparent adhesive 410 is uniformly diffused between the counter substrate 20 and the small dust-proof glass substrate 31, the optical fiber 510 disposed below the light transmission plate 460 is used to transmit the counter substrate 20. The light-curing transparent adhesive 410 interposed between the small dust-proof glass substrate 31 and the small dust-proof glass substrate 31 is irradiated with light. Also in this case, as described above, when an ultraviolet curable transparent adhesive is used as the light curable transparent adhesive 410 and cured with a light irradiation amount of about 3000 [mJ / cm ² ], for example, an output of 500 [ For w], the irradiation time may be about 6 [sec].

  Accordingly, even in this case, the curing time can be significantly reduced as compared with the first embodiment employing the thermosetting transparent adhesive 41, and the productivity is improved accordingly.

  Step (c): After the photocurable transparent adhesive 410 is cured to a predetermined level, the heating head 470 is raised. Then, since the small dustproof glass substrate 31 is bonded to the counter substrate 20 by the photocurable transparent adhesive 410, the small dustproof glass substrate 31 is separated from the lower end surface of the heating head 470 and the bonding of the small dustproof glass substrate 31 is completed.

  Next, the light transmission plate 460 and the heating head 470 are moved relative to each other so that the heating head 470 is disposed on the adjacent counter substrate 20 and the same steps as the above-described steps (a) to (c) are repeated. Then, the small dust-proof glass substrate 31 is bonded to the counter substrate 20. By repeating this for the remaining counter substrates 20, the small dust-proof glass substrate 31 is bonded to the outer surface of all the counter substrates 20 bonded to the large substrate 110.

  In this case, the optical fiber 510 may be used to irradiate the entire large substrate 110 with light using a light irradiator (not shown) without irradiating each counter substrate 20 with light.

  As described above, according to the present embodiment, when the dust-proof glass substrates 300 and 31 are attached to the outer surface of the liquid crystal panel 120, the photo-curing transparent adhesive 410 is used as the adhesive, so that the curing time is significantly shortened. The production efficiency can be improved accordingly.

  Further, since the light curable transparent adhesive 410 is diffused between the dust-proof glass substrates 300 and 31 and the substrates 110 and 20 in a state where the viscosity is lowered by heating, the light curable transparent adhesive 410 is made homogeneous. Can be diffused.

    In the present invention, the electro-optical device may be a liquid crystal device having a passive matrix type liquid crystal device or a TFD (thin diode) as a switching element in addition to the TFT active matrix driving type liquid crystal device. In addition to electroluminescence devices, organic electroluminescence devices, plasma display devices, electrophoretic display devices, devices using electron-emitting devices (Field Emission Dispiay and Surface-Conductin Electron-Emitter Display), and DLP (Registration) The present invention can also be applied to various electro-optical devices such as trademark (Digital Light Processing) and DMD (Digital Micromirror Device).

Schematic sectional view of the liquid crystal display device according to the first embodiment The perspective view of the state where the chip-like counter substrate is bonded to the large substrate Process diagram showing the process of mounting a dust-proof glass substrate on the outer surface of the liquid crystal panel Process drawing showing the process of attaching a large dustproof glass substrate Process drawing showing the process of attaching a small dustproof glass substrate Same as above, chart showing whether or not thermosetting transparent adhesive can be cured Process drawing showing the process of attaching a large dustproof glass substrate according to the second embodiment Process drawing showing the process of attaching a small dustproof glass substrate

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display device, 10 ... TFT substrate, 20 ... Opposite substrate, 30, 31 ... Dust-proof glass substrate, 40, 420 ... Stage, 41 ... Thermosetting transparent adhesive, 42 ... Ultraviolet curable adhesive, 43 ... Lifting Equipment 44 ... Pressure head 45 ... UV light 46,400 ... Hot plate 47,470 ... Heating head 110 ... Large substrate 120 ... Liquid crystal panel 130 ... Decompression chamber 131 ... High temperature chamber 300 ... Large dustproof Glass substrate, 410 ... light curable transparent adhesive, 460 ... light transmission plate, 500 ... light irradiator, 510 ... optical fiber.

Claims (4)

In a manufacturing method of an electro-optical device for manufacturing a plurality of electro-optical devices in which a chip-shaped first substrate and a chip-shaped second substrate are bonded together,
A second large substrate that can be cut out is prepared on the first chip-shaped substrate, and a plurality of second chip-shaped substrates are bonded to each other so as to face the first substrate area of the large substrate. Pasting process of the substrate,
A large dust-proof substrate attaching step of attaching a plurality of large dust-proof substrates that can be cut out to a chip-like dust-proof substrate on the surface of the large substrate opposite to the surface on which the plurality of chip-shaped second substrates are bonded; ,
Cutting out both the large substrate and the large dust-proof substrate in units of the first substrate,
In the large dust-proof substrate attaching step, a thermosetting adhesive is dropped on the large dust-proof substrate, and then the large substrate is placed on the large dust-proof substrate in a reduced-pressure atmosphere, and then the large-sized substrate is attached to the large dust-proof substrate. A method for manufacturing an electro-optical device, characterized in that the thermosetting adhesive is cured in a high temperature atmosphere after pressing toward the substrate.   In the large dust-proof substrate pasting step, a photocurable adhesive for temporary fixing is applied to the outer periphery of the large dust-proof substrate, and after the set time has elapsed, the photocurable adhesive is irradiated with light and cured, and thereafter The method of manufacturing an electro-optical device according to claim 1, wherein the thermosetting adhesive is cured in a high temperature atmosphere. In a manufacturing method of an electro-optical device for manufacturing a plurality of electro-optical devices in which a chip-shaped first substrate and a chip-shaped second substrate are bonded together,
A second large substrate that can be cut out is prepared on the first chip-shaped substrate, and a plurality of second chip-shaped substrates are bonded to each other so as to face the first substrate area of the large substrate. Pasting process of the substrate,
A large dust-proof substrate attaching step of attaching a plurality of large dust-proof substrates that can be cut out to a chip-like dust-proof substrate on the surface of the large substrate opposite to the surface on which the plurality of chip-shaped second substrates are bonded; ,
Cutting out both the large substrate and the large dust-proof substrate in units of the first substrate,
In the large dust-proof substrate attaching step, after applying a photocurable adhesive on the large dust-proof substrate, the large substrate is placed on the large dust-proof substrate, and then the large substrate is pressed toward the large dust-proof substrate. Then, the photocurable adhesive is cured by irradiating with light.
In the process of pressing the large substrate in the direction of the large dust-proof substrate, at least one of the two substrates is heated. 4. The electro-optical device according to claim 3 , wherein the light that cures the photocurable adhesive is irradiated from a surface of the large dust-proof substrate opposite to a surface on which the large substrate is bonded. Production method.

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