JP3277446B2 - Manufacturing method of liquid crystal display device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a driving substrate on which a plurality of liquid crystal driving elements are formed, and an opposing substrate on which a plurality of opposing electrodes are formed, which are superposed via a common agent and a sealant. Thereafter, the present invention relates to a method of manufacturing a liquid crystal display device in which each substrate is divided to form individual liquid crystal panel components.

[0002]

2. Description of the Related Art In the manufacture of liquid crystal display devices, there are a so-called single-assembly method in which substrates are divided and then superposed, and a so-called surface-assembly method in which substrates are divided and then divided. . In the case of the so-called single-assembly method, first, a thin film transistor or the like for driving a liquid crystal is formed in a matrix on a glass substrate (hereinafter, the thin film transistor or the like formed in a matrix is simply referred to as a TFT), and dicing or the like. Divide into single pieces, apply the alignment film and rubbing and cleaning, apply the common agent, then form the counter electrode and color filter on another glass substrate, apply the alignment film and rubbing After cleaning, apply sealant to each substrate,
The liquid crystal panel components are formed by overlapping both.

In the case of a so-called surface assembly method, first, a plurality of TFTs are formed on a glass substrate before being divided, an alignment film is applied, rubbed and washed, and a common agent is applied. Applying a counter electrode, a color filter and an alignment film, rubbing and cleaning, and applying a sealant to the other glass substrate before dividing, and after dividing each glass substrate, dividing and forming individual liquid crystal panel parts are doing.

Among the methods for manufacturing such a liquid crystal display device, in a so-called surface assembly method, all terminals are short-circuited in order to protect an element such as a TFT from electrostatic damage, or all elements on a glass substrate are manufactured. By applying an alignment film made of polyimide or the like by roll coating and performing a rubbing process, it is possible to make the alignment film uniform, improve the alignment property, reduce the adhesion of dust, and the like.

[0005]

However, in the method of manufacturing a liquid crystal display device in which each glass substrate is divided after being superposed, the method of dividing the substrates after the superposition is performed.
Since the scribe break is performed along the boundaries between the TFTs and the boundaries between the color filters, damage due to external force at the time of the break, chipping and cracking of the glass substrate, reduction in the reliability of the sealant, and the like have become problems. .

For this reason, if full-cut dicing is performed after each glass substrate is superimposed, there is no need for a break, and problems such as chipping or cracking of the glass substrate and reduction in reliability of the sealant at that time are eliminated. It can be resolved.
However, performing full cut dicing in a state where the glass substrates are superimposed imposes a large load on the dicing blade, and it is very difficult to cut accurately.
In addition, the life of the dicing blade is shortened.

Further, when full cut dicing is performed,
The cutting water required at this time enters into the frame of the sealant from the liquid crystal injection port of the sealant, and adversely affects elements such as TFTs and color filters inside the gap. Accordingly, an object of the present invention is to provide a method for manufacturing a liquid crystal display device that can divide a substrate accurately and with good productivity.

[0008]

SUMMARY OF THE INVENTION The present invention is a method for manufacturing a liquid crystal display device which has been made to achieve the above object.
That is, the present invention provides an individual liquid crystal panel by stacking a driving substrate on which a plurality of liquid crystal driving elements are formed and an opposing substrate on which a plurality of opposing electrodes are formed, and then dividing each substrate. A method of manufacturing a liquid crystal display device for forming parts, first, a liquid crystal sealant having a liquid crystal injection port is provided around each liquid crystal driving element or each counter electrode on one of a driving side substrate and a counter side substrate. At the same time, the outer periphery sealing agent is applied in a state surrounding the outermost periphery of the region where the plurality of liquid crystal sealing agents are arranged. Next, in a state where the driving-side substrate coated with the common agent and the opposing-side substrate are overlapped with each other via the liquid crystal sealing agent and the outer peripheral sealing agent , the die is mounted on the opposing-side substrate.
Affix a dicing tape to the drive-side substrate after attaching a cutting groove along the boundary of each liquid crystal drive element on the drive-side substrate halfway in the thickness direction of the substrate.
Opposite side via dicing tape stuck on opposite side substrate
Cut the groove along the boundary of each counter electrode of the substrate in the thickness direction of the substrate.
Halfway in the direction, and then dicing
An external force is applied to each of the driving-side substrate and the opposing-side substrate via the loop to divide the liquid crystal panel component at the position of the cutting groove to form individual liquid crystal panel components.

[0009]

According to the present invention, a liquid crystal sealing agent having a liquid crystal injection port is applied to the periphery of each liquid crystal driving element or each counter electrode on one of the driving side substrate and the opposite side substrate, and a plurality of liquid crystal sealing agents are provided. The outer periphery sealing agent is applied so as to surround the outermost periphery of the region where the agents are arranged. For this reason, the area where a plurality of liquid crystal sealants are arranged is closed by the outer peripheral sealant. Furthermore, the liquid crystal injection space inside each liquid crystal sealant, which is formed by overlapping the drive side substrate and the opposing side substrate via the liquid crystal sealant and the outer peripheral sealant, with respect to the space outside the outer peripheral sealant. To be sealed.

Further, in a state where the driving side substrate and the opposing side substrate are superimposed, cutting grooves along the boundaries between the liquid crystal driving elements and the boundaries between the opposing substrates are formed halfway in the thickness direction of each substrate. After that, dicing is performed on the driving side substrate and the opposite side substrate.
An external force is applied via a tape to divide at the position of the cut groove. In other words, forming a cutting groove halfway in the thickness direction of each substrate requires less cutting force than in the case of full-cut dicing of two substrates, and applying an external force to each of the cutting grooves. Dividing the substrate makes it possible to divide the substrate with a smaller force than when scribing each substrate. Furthermore, dicing tape
The substrate is divided via the
This prevents scratches and dust from adhering to the surface of the opposing substrate.
Swell.

[0011]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a liquid crystal display according to an embodiment of the present invention; 1 to 3 are schematic sectional views for sequentially explaining a method for manufacturing a liquid crystal display device of the present invention. FIG. 4 is a schematic plan view illustrating a printing example of the outer peripheral sealant, which is one of the features of the present invention.

That is, the method for manufacturing a liquid crystal display device according to the present invention comprises the steps of:
A plurality of the liquid crystal panel components 10, which are main components of the liquid crystal display device, are formed by overlapping the opposing substrate 2 on which a plurality of color filters 21 and opposing electrodes (not shown) are formed, and then dividing each substrate. It is a method of forming.

First, as a common electrode application step shown in FIG. 1A, a process of applying a common electrode 13 to the driving substrate 1 is performed. The drive-side substrate 1 has, for example, 6 to 8
Multiple TFTs on a 0.8 mm thick quartz glass plate
11 and an alignment film 12 made of polyimide or the like (for example,
(Thickness of 30 to 50 nm), and subjected to rubbing treatment and cleaning.
Print coating is performed in accordance with T11.

Next, as a seal printing process shown in FIG. 1B, a process of printing and applying a liquid crystal sealant 23 and an outer peripheral sealant 24 to the opposing substrate 2 is performed. The opposing substrate 2 is made of, for example, a borosilicate glass plate having a diameter of 6 to 8 inches or a diameter of 6 to 8 inches and a thickness of 1.1 mm, a transparent electrode (for example, an ITO electrode) as a not-shown electrode, a color filter, and a polyimide. Orientation film 22 (for example, 30
厚 50 nm thick), and was subjected to rubbing treatment and cleaning. The liquid crystal sealant 23 printed and coated on the opposing substrate 2 surrounds each color filter 21 and the alignment film 22 to seal liquid crystal injected between the driving substrate 1 and the opposing substrate 2 in a later process. , And is provided with a liquid crystal injection port 23a at each predetermined position.

The outer peripheral sealant 24 is applied by printing so as to surround the outermost periphery of the area where the liquid crystal sealants 23 are arranged. As a print pattern of the outer peripheral sealant 24,
Examples shown in the schematic plan views of FIGS. 4A and 4B are conceivable. That is, in the example shown in FIG. 4A, the outer peripheral sealant 24 is printed so as to surround the outside of the region S on the opposing substrate 2 where the liquid crystal sealants 23 are arranged. As a result, the region S including the liquid crystal injection port 23a becomes
4 closes.

In the example shown in FIG. 4B, a part of the liquid crystal sealant 23, which is the outermost periphery of the region S where the liquid crystal sealants 23 are arranged on the opposing substrate 2, is shared with the outer peripheral sealant 24. It is a printing pattern. In other words, of the liquid crystal sealant 23 which is the outermost periphery of the region S, a portion of the liquid crystal sealant 23 where the side without the liquid crystal inlet 23a is open is connected with the outer peripheral sealant 24, and the side with the fill port 23a is outer peripheral seal outside. Agent 24. by this,
The usage amount of the outer peripheral sealing agent 24 can be reduced, and the region S can be closed by the outer peripheral sealing agent 24.

Next, as a superposition step shown in FIG. 1C, the driving-side substrate 1 on which the common electrode 13 is applied and the opposing-side substrate 2 on which the liquid crystal sealant 23 and the outer peripheral sealant 24 are printed. The overlapping process is performed. This allows
The common electrode 13 is connected between the driving-side substrate 1 and the opposing-side substrate 2 and the alignment film 12 on the TFT 11 side is connected.
A predetermined gap (for example, 3.5 to 4.0 μm) is formed between the color filter 21 and the alignment film 22 on the color filter 21 side.

Further, the liquid crystal injection space T in each liquid crystal sealant 23 is sealed with respect to a space outside the outer peripheral sealant 24 by this superposition. That is,
Even if the liquid crystal sealant 23 is provided with the liquid crystal injection port 23a, the liquid crystal injection space T inside the liquid crystal sealant 23 is sealed by the outer peripheral sealant 24.

Next, in this state, the first type shown in FIG.
Perform dicing. In performing the first dicing, a dicing tape 31 is attached to the opposing substrate 2.
As the dicing tape 31, for example, an ultraviolet irradiation curing type tape or a heat shrinkable release type tape is used. And
A cutting groove 15 is formed at a regular pitch in the X and Y directions along the boundary of the TFT 11 on the driving side substrate 1 on the upper side.

The cutting groove 15 is formed by half-cut dicing or semi-full-cut dicing by cutting a part of the thickness of the driving substrate 1 in the thickness direction with a dicing blade (not shown).
m. When performing half-cut dicing or semi-full-cut dicing, cutting is performed while flowing predetermined cutting water. As described above, the liquid crystal injection space T inside the liquid crystal sealant 23 is sealed by the outer peripheral sealant 24. Therefore, the cutting water does not enter the liquid crystal injection space T from the liquid crystal injection port 23a, and the internal TFT 11 and the color filter 2
1. There is no adverse effect on the alignment films 12 and 22.

Next, as the second dicing shown in FIG. 2B, dicing of the opposing substrate 2 is performed. In performing the second dicing, a dicing tape 32 is pasted on the driving substrate 1. As the dicing tape 32, for example, an ultraviolet irradiation curing type tape is used. A cutting groove is formed along the boundary of the color filter 21 on the upper substrate 2 on the upper side, with a regular pitch in the X direction and an irregular pitch in the Y direction (to expose an electrode pad portion (not shown) of the TFT 11). Insert 25.

The cutting groove 25 is formed by fully cutting the dicing tape 31 with a dicing blade (not shown).
Half-cut dicing or semi-full-cut dicing, in which a cut is made halfway in the thickness direction of the opposing substrate 2, is formed so as to leave the opposing substrate 2 by about 50 to 100 μm. At this time, a predetermined cutting water is used, but as before, the liquid crystal injection space T inside the liquid crystal sealant 23 is sealed by the outer peripheral sealant 24, so that the cutting water flows from the liquid crystal injection port 23a. It does not penetrate into the liquid crystal injection space T, and does not adversely affect the TFT 11, the color filter 21, and the alignment films 12 and 22 therein.

Next, a braking process shown in FIG. 2C is performed. To perform braking, use the specified roller 3
3 or a drive side substrate 1 by a breaker (not shown).
An external force is applied to the cutting groove 1 and the opposite side substrate 2 to form the cutting groove 1 formed earlier.
The drive-side substrate 1 and the opposing-side substrate 2 are divided at positions 5 and 25. At this time, since only about 50 to 100 μm of the drive side substrate 1 and the opposing side substrate 2 remain in the cut grooves 15 and 25, the substrate is applied with a much smaller force than the force required for the scribe break. Division can be performed. In other words, in this braking, the load applied to the driving-side substrate 1 and the opposing-side substrate 2 is extremely small, and the chipping and cracking of the substrate, the reduction in the reliability of the liquid crystal sealant 23, and the like do not occur. Further, since the dicing tapes 31 and 32 protect the surfaces of the driving-side substrate 1 and the opposing-side substrate 2 due to braking, there is no damage or adhesion of dust.

After the braking is completed, a predetermined ultraviolet ray is irradiated (for example, 120 to 150 mJ / cm ² ).
The dicing tape 31 is cured to reduce the adhesive strength. When an ultraviolet irradiation curing type tape is used as the dicing tape 32, ultraviolet light is also applied to the dicing tape 32 (for example, 120 to 150 mJ / cm ² ) to cure the dicing tape 32 to reduce the adhesive strength.

Next, as a pickup step shown in FIG.
By pushing up the liquid crystal panel component 10 from below, pickup separation of the individually divided liquid crystal panel component 10 is performed. At this time, the scar of the push-up pin 34 is set outside the effective area of each substrate. Alternatively, it is necessary to push up the dicing tape 32 without piercing it. The removed liquid crystal panel component 10 is transported with the dicing tape 31 attached. Then, as shown in FIG. 3B, the dicing tape 31 is peeled off (in the case of using a heat shrinkable peeling type tape, it is heated to 70 ° C. or more to self-shrink), thereby performing the subsequent processing ( The liquid crystal panel component 10 prepared for liquid crystal injection, electrical wiring, etc.) is completed.

By these steps, dicing (half-cut dicing or semi-full-cut dicing) is performed without cutting water entering the liquid crystal injection space T inside the liquid crystal sealant 23, and the substrate is cut by a small breaking force. The liquid crystal panel component 10 can be manufactured without causing chipping or cracking, lowering the reliability of the liquid crystal sealant 23, and lowering the yield due to panel scratches or dust adhesion.

In this embodiment, the opposing substrate 2
The example in which the color filter 21 is formed is shown in FIG.
The color filter 21 does not necessarily have to be formed, but may be any as long as a counter electrode (not shown) is formed. Further, the example in which the dicing tape 31 is used when performing the first dicing shown in FIG.
The dicing tape 31 is not always necessary.

Further, the print pattern of the outer peripheral sealant 24 is not limited to the pattern shown in FIGS. 4A and 4B, but has another pattern shape surrounding the region S where the liquid crystal sealants 23 are arranged. Is also good. Further, in the present embodiment, after bonding the substrates, first, the driving side substrate 1 is diced,
Next, an example in which the opposing substrate 2 is diced has been described. On the contrary, the same applies when the opposing substrate 2 is diced first, and then the driving substrate 1 is diced.

[0029]

As described above, according to the method for manufacturing a liquid crystal display device of the present invention, the following effects can be obtained. That is, when the drive side substrate and the opposing side substrate are overlapped and then divided to produce individual liquid crystal panel components, an outer peripheral sealant is applied in a state surrounding the outermost periphery of the area where each liquid crystal sealant is arranged. Therefore, even if dicing is performed, the cutting water used at this time does not enter the liquid crystal injection space inside the liquid crystal sealant so that the reliability of the driving element, the counter electrode, the alignment film, etc. can be ensured. Become.

Further, since a cutting groove is formed halfway in the thickness direction of the substrate for dicing each substrate, cutting resistance can be reduced as compared with the case where full-cut dicing is performed, and the dicing blade can be used. The service life is extended and the productivity can be improved. Moreover,
Since there is a dicing tape for protecting the surface, there is no problem of generation and adhesion of tape cutting debris and sticky dust, and the production yield can be improved.

Further, since an external force is applied to the driving-side substrate and the opposing-side substrate whose surfaces are protected by a dicing tape and the substrate is divided at the position of the cut groove, the substrate is separated with a smaller force than when each substrate is scribed and broken. It can be divided to prevent chipping or cracking of the substrate at the time of break, scratching of the back surface of each substrate (panel surface), adhesion of dust, and suppressing adhesion damage to the liquid crystal sealant, and a highly reliable liquid crystal Panel components can be formed.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view (part 1) for sequentially explaining a manufacturing method of the present invention.

FIG. 2 is a schematic cross-sectional view (part 2) for sequentially explaining the manufacturing method of the present invention.

FIG. 3 is a schematic cross-sectional view (part 3) for sequentially explaining the manufacturing method of the present invention.

FIG. 4 is a schematic plan view illustrating a printing example of an outer peripheral sealant.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Driving side board | substrate 2 Opposite side board | substrate 10 Liquid crystal panel parts 11 TFT12,22 Alignment film 13 Common electrode 15,25 Cutting groove 21 Color filter 23 Liquid crystal sealing agent 23a Injection 24 Outer periphery sealing agent

Claims (1)

(57) [Claims] An individual liquid crystal panel component is obtained by laminating a driving substrate on which a plurality of liquid crystal driving elements are formed and an opposing substrate on which a plurality of opposing electrodes are formed, and then dividing each substrate. A liquid crystal sealant having a liquid crystal injection port around each liquid crystal driving element or each counter electrode on one of the driving side substrate and the counter side substrate. And applying an outer peripheral sealant in a state surrounding the outermost periphery of a region where a plurality of liquid crystal sealants are arranged.Next, the drive side substrate and the opposing side substrate coated with a predetermined common agent are In a state where the liquid crystal sealant and the outer peripheral sealant are overlapped with each other , a die is
Affixing a dicing tape to the drive-side substrate after inserting a cutting groove along the boundary of each liquid crystal drive element of the drive-side substrate halfway in the thickness direction of the substrate.
The dicing tape attached to the opposing substrate.
Cutting along the boundary of each opposing electrode of the opposing substrate through
The groove is inserted halfway in the thickness direction of the substrate, and thereafter, an external force is applied to the driving substrate and the opposing substrate via a dicing tape of the opposing substrate, and the position of the cutting groove is set. And forming individual liquid crystal panel parts by dividing the liquid crystal display device.