JP5108381B2 - 貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置 - Google Patents

貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置 Download PDF

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Publication number
JP5108381B2
JP5108381B2 JP2007136213A JP2007136213A JP5108381B2 JP 5108381 B2 JP5108381 B2 JP 5108381B2 JP 2007136213 A JP2007136213 A JP 2007136213A JP 2007136213 A JP2007136213 A JP 2007136213A JP 5108381 B2 JP5108381 B2 JP 5108381B2
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flexible substrate
row
semiconductor integrated
antennas
integrated circuits
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JP2007136213A
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Japanese (ja)
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JP2008010841A (ja
JP2008010841A5 (https=
Inventor
恭介 伊藤
理 中村
幸恵 鈴木
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/743—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

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JP2007136213A 2006-05-31 2007-05-23 貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置 Expired - Fee Related JP5108381B2 (ja)

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JP2007136213A JP5108381B2 (ja) 2006-05-31 2007-05-23 貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006151506 2006-05-31
JP2006151506 2006-05-31
JP2007136213A JP5108381B2 (ja) 2006-05-31 2007-05-23 貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置

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JP2008010841A JP2008010841A (ja) 2008-01-17
JP2008010841A5 JP2008010841A5 (https=) 2010-06-03
JP5108381B2 true JP5108381B2 (ja) 2012-12-26

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102072804B1 (ko) * 2013-02-22 2020-02-04 삼성디스플레이 주식회사 부품 실장 장치 및 부품 실장 방법
JP2020074054A (ja) * 2017-02-01 2020-05-14 株式会社村田製作所 Ｒｆｉｄタグの製造方法、ｒｆｉｄタグの製造装置、及び転写シートの製造方法
JP6957962B2 (ja) * 2017-04-28 2021-11-02 株式会社村田製作所 Ｒｆｉｄタグの製造方法
DE102017129625B3 (de) * 2017-12-12 2019-05-23 Mühlbauer Gmbh & Co. Kg Verfahren und Vorrichtung zur Bestückung einer Antennenstruktur mit einem elektronischen Bauelement
WO2020026878A1 (ja) * 2018-07-31 2020-02-06 株式会社ハリーズ 電子部品の実装装置及び電子部品実装体の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5752143A (en) * 1980-09-16 1982-03-27 Toshiba Corp Mounting method and device for semiconductor pellet
JP3906653B2 (ja) * 2000-07-18 2007-04-18 ソニー株式会社 画像表示装置及びその製造方法
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique

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JP2008010841A (ja) 2008-01-17

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