JP5108381B2 - 貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置 - Google Patents

貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置 Download PDF

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JP5108381B2
JP5108381B2 JP2007136213A JP2007136213A JP5108381B2 JP 5108381 B2 JP5108381 B2 JP 5108381B2 JP 2007136213 A JP2007136213 A JP 2007136213A JP 2007136213 A JP2007136213 A JP 2007136213A JP 5108381 B2 JP5108381 B2 JP 5108381B2
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flexible substrate
row
semiconductor integrated
antennas
integrated circuits
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JP2007136213A
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Japanese (ja)
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JP2008010841A (ja
JP2008010841A5 (enExample
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恭介 伊藤
理 中村
幸恵 鈴木
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

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JP2007136213A 2006-05-31 2007-05-23 貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置 Expired - Fee Related JP5108381B2 (ja)

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JP2007136213A JP5108381B2 (ja) 2006-05-31 2007-05-23 貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置

Applications Claiming Priority (3)

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JP2006151506 2006-05-31
JP2006151506 2006-05-31
JP2007136213A JP5108381B2 (ja) 2006-05-31 2007-05-23 貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置

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JP2008010841A JP2008010841A (ja) 2008-01-17
JP2008010841A5 JP2008010841A5 (enExample) 2010-06-03
JP5108381B2 true JP5108381B2 (ja) 2012-12-26

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102072804B1 (ko) * 2013-02-22 2020-02-04 삼성디스플레이 주식회사 부품 실장 장치 및 부품 실장 방법
JP2020074054A (ja) 2017-02-01 2020-05-14 株式会社村田製作所 Ｒｆｉｄタグの製造方法、ｒｆｉｄタグの製造装置、及び転写シートの製造方法
JP6957962B2 (ja) * 2017-04-28 2021-11-02 株式会社村田製作所 Ｒｆｉｄタグの製造方法
DE102017129625B3 (de) * 2017-12-12 2019-05-23 Mühlbauer Gmbh & Co. Kg Verfahren und Vorrichtung zur Bestückung einer Antennenstruktur mit einem elektronischen Bauelement
WO2020026878A1 (ja) * 2018-07-31 2020-02-06 株式会社ハリーズ 電子部品の実装装置及び電子部品実装体の製造方法

Family Cites Families (3)

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JPS5752143A (en) * 1980-09-16 1982-03-27 Toshiba Corp Mounting method and device for semiconductor pellet
JP3906653B2 (ja) * 2000-07-18 2007-04-18 ソニー株式会社 画像表示装置及びその製造方法
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique

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