JP5107638B2 - MgB2を含有する超伝導素子 - Google Patents

MgB2を含有する超伝導素子 Download PDF

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JP5107638B2
JP5107638B2 JP2007219934A JP2007219934A JP5107638B2 JP 5107638 B2 JP5107638 B2 JP 5107638B2 JP 2007219934 A JP2007219934 A JP 2007219934A JP 2007219934 A JP2007219934 A JP 2007219934A JP 5107638 B2 JP5107638 B2 JP 5107638B2
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powder
carbon
additive
superconducting
mgb
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JP2008091325A (ja
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フルーキガア ルネ
レッツァ パオラ
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Bruker Switzerland AG
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Description

本発明は、超伝導素子及びその製造方法に関する。
超伝導素子は、二ホウ化マグネシウム(=MgB)を含有する。
本発明の範囲は、MgB をベースとする導体の臨界電流密度を改善することである
本発明の超伝導素子は、金属マトリックス2に密閉されかつ高導電性素子4も有する10〜1,000ミクロンの線径マルチフィラメントからなるフィラメント線1を備え超伝導素子は、マトリックス2及び導電性素子4から保護金属層3によって分離されている。尚、フィラメント線1はモノフィラメント線であってもよい。
モノフィラメント線又はマルチフィラメント線の変形は、標準的なスウェージング加工、引抜き加工又は圧延加工の後で生じる。
超伝導フィラメントは、変形の最後に、主成分がホウ素(B)及びマグネシウム(Mg)である粒径5nm〜5ミクロンの様々な粉末からなる粉末混合物の間の反応によってワイヤに形成される。
ただ1つの粉末添加剤を共用するのとは対照的に、本発明は、Mg及びBへの複数の粉末添加剤に関する新しい方法を導入して、様々な添加剤粉末タイプの間の相互作用により、ワイヤの臨界電流密度に好ましい影響を与える可能性のある新しい状態にする。
Cが、1つ又は複数の他の粉末添加剤に加えて第1の添加剤粉末として選択され、すべて炭素を含有している。
第2又は第3の添加剤の選択は、臨界電流密度Jが760℃以下での反応で最大になることを特徴とする。この反応は、500〜760℃の温度で1つ又は複数のステップで起こりうる。添加剤のそれぞれは、X線回折によって検出されるようなMgB構造内の溶解炭素の量を高めるのに個々に寄与する。
C以外の炭素含有添加剤のうちの少なくとも1つは、化合物SiC、MoC、WC、VC、TaC、TiC、ZrC、NbCの中から選択されうる2元、3元又は4元化合物である。BCと、BCへの追加の添加剤の総和との比は、15:1〜1:15の範囲である。
C以外の添加剤のうちの少なくとも1つは、ナノチューブ又はダイヤモンドを含む元素形態の炭素、炭酸塩又は炭水化物、化合物(R.E.)C又は(La1−x)C、ただしx=Lu、Sc、Th、Y、あるいは黒鉛層間化合物のうちの1つである。
C粉末ならびに他の添加剤粉末は、5nm〜5ミクロンの粒子サイズを有し、BC粉末及び他の添加剤粉末は、元の粉末混合物に同時に導入され、BCの含有量とこれらの添加剤のそれぞれの含有量は、MgBに対して0.1〜15重量%であり、BCを含むすべての添加剤の総和は、MgBに対して1〜20重量%であり、最初のマグネシウム粉末とホウ素粉末との比Mg:Bは、1:2〜0.8:2.2とすることができる。
本発明の特定のポイントは、BCへの追加の粉末が、無炭素材料の粉末の中から、すなわち、マグネシウム基化合物(MgCe、MgCu、MgGa及びMgSi)、又はホウ化物(MgB、Mo、Mo、MoB、WB、W、HfB、ZrB、TaB、Ta、TiB、NbB、VB、UB、RuB、CrB、BaB、(R.E.)B、(R.E.)B12(ただし、R.E.は希土類元素))、又はシリサイド(MoSi、MoSi、WSi)、又は窒化物(Si、BN、AlN)、ならびに(RE)タイプの酸化物(ただし、RE=La、Ce、Pr、Nd、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、Lu)、又はAl、V、Nb、Ta、SiO、HfO、ZrO、MgO、ZrMo、ZrW、Y(WO、AlTiO、TiBaMgO、SnO、NbO、BaCO、最後に単一金属元素(Nb、Ta、V、Mo、W、Ti、Zr及びHf)の中から選択されうるということである。
化合物MgBは、T=39Kで超伝導転移を示すことが知られている。この化合物をベースとする超伝導線又は超電導テープを、Fe、Ni、Nb、Ti、モネル又はステンレス鋼のいずれかからなる金属マトリックスの中に製作することについて記述している膨大な量の論文がある。これらのマトリックス材料は電気抵抗が高すぎるので、ワイヤ構成の熱安定化には、一定量の高導電Cuも含まれる。この安定化Cu(Cu stabilizer)は、Nb、Ta、Ti又は工業用合金NbTiからなる超電導フィラメントから保護層によって分離される。
MgBをベースとするモノフィラメント線及びマルチフィラメント線は、多くの研究所で製作されており、今日ではkm長のものが既に入手可能である。本発明の範囲は、これらの導体の幅広い応用のために必須の臨界電流密度の値を高めることである。
MgB線の超伝導通電能力の進展に伴い、2001年におけるその発見以来、この化合物がいくつかの特定のケースでNbTi又はNbSnの可能な代用と見なされうるかどうかという疑問が生じている。MgBに関する積極的な論点が、
*その高い転移温度、
*その弱結合(weak−link)のない性質、
*低い材料コスト、及び
*小さな異方性である。
*MgBの出現は、約20Kの温度でのMRI磁石ならびに2KでのNMR磁石のための中間磁場挿入物として、工学的応用例の有望な候補である。
しかし、超伝導パラメータ、特にBc2値(上部臨界磁場)、Birr値(不可逆磁場、これを超えると超伝導電流を伝えることはできない)及びJ値(臨界電流密度)のさらなる向上が必要である。
原則として、開発は、個別用途に対応する温度条件及び磁場条件で測定される最大限のJ値を得るために行われなければならない。
本発明は、現場における方法によるMgB線とMgBテープの製作が中心である。モノフィラメント線の場合、この方法は、マグネシウム粉末及びホウ素粉末を混合し、それらを金属缶(Fe、Ni又はNi合金、Ti又はTi合金、ステンレス鋼)の中に充填し、それらをワイヤ(直径0.6〜1.2mm)又はテープ(典型的サイズは4×0.3mm)に変形させるものである。工業用マルチフィラメント線又はテープの場合、このプロセスは、1つの中間バンドリングステップと、それに続く0.6〜1.2mmの同一最終サイズに変形させるステップとを含む。熱安定化のための基準を満たすために、金属缶はまた、1つ又は複数の高導電Cuの細長い素子も含むことができる。
MgBの相は、500〜760℃の温度での反応によって2分〜数時間の間に形成されうる。粉末混合物と金属缶との反応時の相互作用を防止するために、これらの要素は、Nb、Ta又はTiからなりうる保護バリヤによって分離される。
臨界電流密度を高めるための条件であるMgB粒子サイズを縮小するためには、工業用MgB線における添加剤との反応が、常に760℃未満のできるだけ低い温度のときに起こるべきである。この温度は、BCを含有する最適化されたMgB線について報告されている反応温度よりも低い。BC添加剤に対する850℃の反応温度が、Superconducting Science and Technology、18(2005)1323において、A.Yamamoto、J.Shimoyama、S.Ueda、I.Iwayama、S.Horii、K.Kishioによって使用された。
1.BC添加剤を有するワイヤに対する800℃の温度が、cond−mat.0607073、2006年6月(arXiv.org>cond−mat>cond−mat.supr−con)において、P.Lezza、C.Senatore及びR.Flukigerによって報告されている。これらの著者は、最適化J値を得るには低すぎた720℃での反応について説明している。その文献には800℃未満でのホウ素、マグネシウム及びBCの最適化反応については示されていない。
本発明は、少なくとも一方が炭素を含有する少なくとも2つの添加剤を使用することについて初めて記述する。この新しい方法は、MgBに様々な添加剤を組み合わせることによって改善された新しいソースを作り出し、したがって特性を高めて単一添加剤によって得られるようにするものである。
追加添加剤の利点の1つは、様々な添加剤の間の反応を促進して分解をもたらし、したがって反応温度の低下をもたらすことである。これは、炭素含有添加剤にも無炭素添加剤にも有効である。この効果は、1つ又は複数の追加添加剤の分解温度がBC添加剤との最適化反応温度よりも低い場合でも強化される。
追加添加剤の第2の利点は、MgB相中の炭素量を、別々に加えられた添加剤のそれぞれの量の値を上回る値に増大させることである。
MgB格子において炭素又は他の元素に置換することの利点は、電気抵抗率すなわち所与の磁場での臨界電流密度を高めることである。確かにMgB相は、Tよりもわずかに高い温度で非常に低い値の正常状態の電気抵抗率ρを有する高次状態(「クリーン(clean)」リミット)になる。添加剤の存在によって引き起こされる置換は、ρの値を高め、それによって臨界磁場を高める。これは、MgBにナノメートルサイズのSiC粉末を加えた後でJが高まることを初めて報告したDouらの論文(S.X.Dou、S.Soltanian、S.Horvat、X.L.Wang、S.H.Zhou、M.Ionescu、H.K.Liu、P.Munroe、M.Tomsic、Applied Physics Letters、81(2002)3419)から得られる。
このことはまた、MgBにナノメートルサイズの炭素を加えたRibeiroの研究(R.A.Ribeiro、S.L.Bud’ko、C.Petrovic、P.C.Canfield、Physica C 384(2003)227)によっても実証されている。
追加添加剤の第3の利点は、様々な機構を組み合わせて、それらの効果をJcの補助的な改善に付加することが期待できることである。炭素の置換に加えて可能な機構としては、
*マグネシウムの置換、
*反応時の粉末の高密度化、
*二次相形成の低減、
*粒界転位の形成の促進、又は
*MgB粒子のサイズ及び領域の縮小がある。
*MgB線の輸送臨界電流密度Jの改善が、P.Lezzaらによって得られ(P.Lezza、C.Senatore及びR.Flukiger、cond.mat.0607073、2006年6月)、Feマトリックスの直径1.11mmのワイヤの場合、10重量%のBC粉末の追加後に800℃での反応の後、4.2K及び9TでJ値1×10A/cmが得られた。MgとBの出発混合体は、サブミクロンサイズのBCでドープされ、比率は、10重量%BCに対応するMg:B:BC=1:2:0.08であった。T>800℃では、Feシースとの反応によるJの低下が見られた。最高800℃での熱処理で輸送特性が改善する原因を調べるために、X線回折測定が行われた。文献のデータと比較すると、BC粉末の追加が、これまで報告されているJの中でSiCに次いで2番目に高い改善につながり、したがって今後の用途の代替となることが分かる。
本発明は、最近の研究(P.Lezza、C.Senatore及びR.Flukiger、cond.mat.0607073、2006年6月)の後でさらなる予期せぬステップを構成し、このステップでは、MgB線に10重量%BCを加えて、9.6T及び4.2KでJを最高1×10A/cmまで高めた。第2の添加剤SiCを加えることにより、組成物7.5重量%BC+2.5重量%SiCでは1.6T高い11.2Tで同じ値を現在得ている。さらに高まることが期待される。
反応後、最初の添加剤の性質は、元素分析と、格子定数の値と、超伝導フィラメントに存在する追加の相とによって同定されうる。
特に本発明の範囲には、超伝導素子(線又はテープ)を構成する部分が、同封の図面の特徴に従ったものであることを特徴とする、上述のプロセスによって製造された超伝導素子がある。上述の実施形態は、網羅的列挙として理解されるべきでないが、本発明を説明するための例示的な特徴を有する。
安定化Cu4が、中心に位置しマトリックス2からバリヤ3によって保護されることを特徴とするMgBベースの超伝導マルチフィラメント線の断面を示す図であり、フィラメント1は、断面全体にわたって分散され、マトリックス2からバリヤ3によって分離されている。 バリヤ3が、各フィラメント1と安定化Cu4を分離することを特徴とするMgBベースの超伝導マルチフィラメント線の断面を示す図であり、バリヤ3及び安定化Cu4によって取り囲まれたフィラメント1は、断面全体にわたって分散されている。
符号の説明
1 フィラメント
2 金属マトリックス
3 保護金属層
4 高導電素子、安定化Cu

Claims (14)

  1. 二ホウ化マグネシウム(=MgB)を含有する、線状及びテープ状のいずれか1つの形態を有する超伝導素子であって、
    金属マトリックス(2)に密閉されかつ少なくとも1つの細長い熱安定化用素子(4)も有する5〜500ミクロンの線径の少なくとも1つの超伝導フィラメント(1)を備え、
    前記超伝導フィラメントが、前記マトリックス(2)及び前記熱安定化用素子(4)から保護金属層(3)によって分離され、前記超伝導フィラメントが、第1の添加剤として炭化ホウ素(=B C)粉末が導入された粉末混合物中の、ホウ素(B)粉末及びマグネシウム(Mg)粉末との間の反応によって形成され、
    単体の炭素又は炭素を含む化合物からなる粉末で構成される1つ又は複数の追加の炭素含有粉末添加剤が、前記Mg、B及びBCを含む粉末混合物に導入されることを特徴とする超伝導素子。
  2. Cの量と、BCへの追加の炭素含有粉末添加剤の総和の量との比が、15:1〜1:15の範囲であることを特徴とする、請求項1記載の超伝導素子。
  3. 前記追加の炭素含有粉末添加剤のうちの少なくとも1つが、SiC、MoC、WC、VC、TaC、TiC、ZrC、NbCをベースとする2元、3元又は4元化合物であることを特徴とする、請求項1又は2記載の超伝導素子。
  4. 前記追加の炭素含有粉末添加剤のうちの少なくとも1つが、ナノチューブ又はダイヤモンドからなる単体の炭素であることを特徴とする、請求項1乃至3のいずれか1項に記載の超伝導素子。
  5. 前記追加の炭素含有粉末添加剤のうちの少なくとも1つが、炭塩又は炭水化物であることを特徴とする、請求項1乃至4のいずれか1項に記載の超伝導素子。
  6. 前記追加の炭素含有粉末添加剤のうちの少なくとも1つが、化合物(R.E.)C又は(La1−x)C、ただし=Lu、Sc、Th、Y、あるいは黒鉛層間化合物のうちの1つであることを特徴とする、請求項1乃至5のいずれか1項に記載の超伝導素子。
  7. 前記BC粉末ならびに前記追加の炭素含有粉末添加剤が、5nm〜5μmの大きさの粒子からなることを特徴とする、請求項1乃至6のいずれか1項に記載の超伝導素子。
  8. C粉末の含有量と前記追加の炭素含有粉末添加剤のそれぞれの含有量が、MgBの含有量に対して0.1〜15重量%であることを特徴とする、請求項1乃至7のいずれか1項に記載の超伝導素子。
  9. Cを含むすべての炭素含有粉末添加剤の総和が、MgBの含有量に対して1〜20重量%であることを特徴とする、請求項1乃至8のいずれか1項に記載の超伝導素子。
  10. 最初の前記マグネシウム粉末と前記ホウ素粉末との比Mg:Bが、1:2〜0.8:2.2である、請求項1乃至9のいずれか1項に記載の超伝導素子。
  11. 記Mg、B及びBCを含む粉末混合物にさらに導入され少なくとも1つの無炭素添加剤が、MgCe、MgCu、MgGa及びMgSiをベースとする2元、3元又は4元Mg基化合物を含むこと、及び/又は、前記無炭素添加剤が、MgB、Mo、Mo、MoB、WB、W、HfB、ZrB、TaB、Ta、TiB、NbB、VB、UB、RuB、CrB、BaB、(R.E.)B、(R.E.)B12、ただしR.E.は希土類元素をベースとする2元、3元又は4元化合物を含むこと、及び/又は、前記無炭素添加剤が、MoSi、MoSi、WSiをベースとする2元、3元又は4元化合物を含むこと、及び/又は、前記無炭素添加剤が、Si、BN、Zn(CN)、AlNをベースとする2元、3元又は4元化合物を含むこと、及び/又は、前記無炭素添加剤が、(RE)、ただしRE=La、Ce、Pr、Nd、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、Lu、をベースとする2元、3元又は4元化合物、又は酸化物Al、V、Nb、Ta、SiO、HfO、ZrO、MgO、ZrMo、ZrW、Y(WO、AlTiO、TiBaMgO、SnO、NbO、BaCOのうちの1つを含むこと、及び/又は、前記無炭素添加剤が、単一金属元素Nb、Ta、V、Mo、W、Ti、Zr及びHfを含むことを特徴とする、請求項1乃至10のいずれか1項に記載の超伝導素子。
  12. 前記マトリックス(2)が、Fe及び/又はFe合金、Ni及び/又はNi合金、Cu及び/又はCu合金、Ti及び/又はTi合金、ステンレス鋼を含むことを特徴とする、請求項1乃至11のいずれか1項に記載の超伝導素子。
  13. 前記保護金属層(3)が、Nb及び/又はNb合金、Ta及び/又はTa合金、Ti及び/又はTi合金、特にNbTiを含むことを特徴とする、請求項1乃至12のいずれか1項に記載の超伝導素子。
  14. 請求項1乃至13のいずれか1項に記載の超伝導素子を製造する方法であって、前記B C粉末及び前記追加の炭素含有粉末添加剤が、前記元の粉末混合物に同時に導入されることを特徴とする方法。
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