JP5105105B2 - プラズマCVD法によるSi含有膜形成用有機シラン化合物及びSi含有膜の成膜方法 - Google Patents
プラズマCVD法によるSi含有膜形成用有機シラン化合物及びSi含有膜の成膜方法 Download PDFInfo
- Publication number
- JP5105105B2 JP5105105B2 JP2009260954A JP2009260954A JP5105105B2 JP 5105105 B2 JP5105105 B2 JP 5105105B2 JP 2009260954 A JP2009260954 A JP 2009260954A JP 2009260954 A JP2009260954 A JP 2009260954A JP 5105105 B2 JP5105105 B2 JP 5105105B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- forming
- carbon atoms
- containing film
- plasma cvd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- -1 Organosilane compound Chemical class 0.000 title claims description 50
- 238000000034 method Methods 0.000 title claims description 50
- 238000005268 plasma chemical vapour deposition Methods 0.000 title claims description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 49
- 125000004432 carbon atom Chemical group C* 0.000 claims description 28
- 229910000077 silane Inorganic materials 0.000 claims description 22
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 15
- 239000001301 oxygen Substances 0.000 claims description 15
- 239000012535 impurity Substances 0.000 claims description 13
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- 125000003545 alkoxy group Chemical group 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 9
- 229910052708 sodium Inorganic materials 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 125000004122 cyclic group Chemical group 0.000 claims description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- 239000010408 film Substances 0.000 description 111
- 230000015572 biosynthetic process Effects 0.000 description 33
- 229910052710 silicon Inorganic materials 0.000 description 22
- 238000003786 synthesis reaction Methods 0.000 description 18
- 150000002430 hydrocarbons Chemical group 0.000 description 17
- 239000002994 raw material Substances 0.000 description 15
- 238000005229 chemical vapour deposition Methods 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 11
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 10
- 125000000217 alkyl group Chemical group 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000007789 gas Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 150000004756 silanes Chemical class 0.000 description 9
- 239000010949 copper Substances 0.000 description 8
- 230000010287 polarization Effects 0.000 description 8
- 238000004458 analytical method Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 238000004821 distillation Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 230000000269 nucleophilic effect Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 229910052791 calcium Inorganic materials 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 229910052749 magnesium Inorganic materials 0.000 description 5
- 229910052748 manganese Inorganic materials 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 239000011541 reaction mixture Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- XYYQWMDBQFSCPB-UHFFFAOYSA-N dimethoxymethylsilane Chemical compound COC([SiH3])OC XYYQWMDBQFSCPB-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- BKXCZTFCUBZQQP-UHFFFAOYSA-N dimethoxymethyl(propoxy)silane Chemical compound C(CC)O[SiH2]C(OC)OC BKXCZTFCUBZQQP-UHFFFAOYSA-N 0.000 description 3
- 238000010574 gas phase reaction Methods 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 239000006200 vaporizer Substances 0.000 description 3
- ZXABMDQSAABDMG-UHFFFAOYSA-N 3-ethenoxyprop-1-ene Chemical compound C=CCOC=C ZXABMDQSAABDMG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- NTHKCSDJQGWPJY-UHFFFAOYSA-N CCCC[SiH](OC)OC Chemical compound CCCC[SiH](OC)OC NTHKCSDJQGWPJY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910002808 Si–O–Si Inorganic materials 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- CNMKFNVCPOVSIU-UHFFFAOYSA-N dimethoxymethyl-[2-(dimethoxymethylsilyl)ethyl]silane Chemical compound COC(OC)[SiH2]CC[SiH2]C(OC)OC CNMKFNVCPOVSIU-UHFFFAOYSA-N 0.000 description 2
- FFUUQWKRQSBSGU-UHFFFAOYSA-N dipropylsilicon Chemical compound CCC[Si]CCC FFUUQWKRQSBSGU-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- MDLRQEHNDJOFQN-UHFFFAOYSA-N methoxy(dimethyl)silicon Chemical compound CO[Si](C)C MDLRQEHNDJOFQN-UHFFFAOYSA-N 0.000 description 2
- CVXWZULUEMIEPK-UHFFFAOYSA-N methoxy-dimethyl-propoxysilane Chemical compound C(C)CO[Si](OC)(C)C CVXWZULUEMIEPK-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000007344 nucleophilic reaction Methods 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 2
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PRBHEGAFLDMLAL-UHFFFAOYSA-N 1,5-Hexadiene Natural products CC=CCC=C PRBHEGAFLDMLAL-UHFFFAOYSA-N 0.000 description 1
- DUKJZYZDOKKAMU-UHFFFAOYSA-N 1-chloronaphthalene-2-carbaldehyde Chemical compound C1=CC=C2C(Cl)=C(C=O)C=CC2=C1 DUKJZYZDOKKAMU-UHFFFAOYSA-N 0.000 description 1
- AOCWWIFKJRJLOP-UHFFFAOYSA-N 2-methyl-3-prop-2-enoxyprop-1-ene Chemical compound CC(=C)COCC=C AOCWWIFKJRJLOP-UHFFFAOYSA-N 0.000 description 1
- GBHHYHNRBWGLBL-UHFFFAOYSA-N 3-ethenoxy-2-methylprop-1-ene Chemical compound CC(=C)COC=C GBHHYHNRBWGLBL-UHFFFAOYSA-N 0.000 description 1
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 1
- CEGOHIRBPWQSQD-UHFFFAOYSA-N 4-ethenoxybut-1-ene Chemical compound C=CCCOC=C CEGOHIRBPWQSQD-UHFFFAOYSA-N 0.000 description 1
- VFOONMUUZUQJEU-UHFFFAOYSA-N 5-ethenoxypent-1-ene Chemical compound C=CCCCOC=C VFOONMUUZUQJEU-UHFFFAOYSA-N 0.000 description 1
- GAGOVKZZDFDLML-UHFFFAOYSA-N 5-prop-2-enoxypent-1-ene Chemical compound C=CCCCOCC=C GAGOVKZZDFDLML-UHFFFAOYSA-N 0.000 description 1
- FWPIUPRFUYJPRN-UHFFFAOYSA-N 6-ethenoxyhex-1-ene Chemical compound C=CCCCCOC=C FWPIUPRFUYJPRN-UHFFFAOYSA-N 0.000 description 1
- BSYNRYMUTXBXSQ-UHFFFAOYSA-N Aspirin Chemical compound CC(=O)OC1=CC=CC=C1C(O)=O BSYNRYMUTXBXSQ-UHFFFAOYSA-N 0.000 description 1
- NLTGMIOSTSUEES-UHFFFAOYSA-N CCCCO[SiH](C(C)CC)OCCCC Chemical compound CCCCO[SiH](C(C)CC)OCCCC NLTGMIOSTSUEES-UHFFFAOYSA-N 0.000 description 1
- IPKWLNHXHVMOBJ-UHFFFAOYSA-N CCCCO[SiH](CCC)CCC Chemical compound CCCCO[SiH](CCC)CCC IPKWLNHXHVMOBJ-UHFFFAOYSA-N 0.000 description 1
- PMPGBDYFVDJHLK-UHFFFAOYSA-N CCCC[SiH](OCCC)OCCC Chemical compound CCCC[SiH](OCCC)OCCC PMPGBDYFVDJHLK-UHFFFAOYSA-N 0.000 description 1
- KWFZAAGYIJTNNS-UHFFFAOYSA-N CCCO[Si](C)OCCC Chemical compound CCCO[Si](C)OCCC KWFZAAGYIJTNNS-UHFFFAOYSA-N 0.000 description 1
- TVZMDUVQDSNQHF-UHFFFAOYSA-N CCC[SiH](COC)CC[SiH](CCC)COC Chemical compound CCC[SiH](COC)CC[SiH](CCC)COC TVZMDUVQDSNQHF-UHFFFAOYSA-N 0.000 description 1
- NOIFXTRHAJAXOW-UHFFFAOYSA-N CCO[SiH](OCC)C(C)CC Chemical compound CCO[SiH](OCC)C(C)CC NOIFXTRHAJAXOW-UHFFFAOYSA-N 0.000 description 1
- MVMIRRLXXWWSIC-UHFFFAOYSA-N COC(OC)[SiH2]CCCCC(C)[SiH2]C(OC)OC Chemical compound COC(OC)[SiH2]CCCCC(C)[SiH2]C(OC)OC MVMIRRLXXWWSIC-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 235000002597 Solanum melongena Nutrition 0.000 description 1
- 244000061458 Solanum melongena Species 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- GVCJFBPGIITONJ-UHFFFAOYSA-N butan-2-yl(dimethoxy)silane Chemical compound CCC(C)[SiH](OC)OC GVCJFBPGIITONJ-UHFFFAOYSA-N 0.000 description 1
- VXGZTBCZUKFZLV-UHFFFAOYSA-N butan-2-yl(dipropoxy)silane Chemical compound CCCO[SiH](C(C)CC)OCCC VXGZTBCZUKFZLV-UHFFFAOYSA-N 0.000 description 1
- CWLHIHREMPKWDY-UHFFFAOYSA-N butoxy(diethyl)silane Chemical compound CCCCO[SiH](CC)CC CWLHIHREMPKWDY-UHFFFAOYSA-N 0.000 description 1
- SOKKGFZWZZLHEK-UHFFFAOYSA-N butoxy(dimethyl)silane Chemical compound CCCCO[SiH](C)C SOKKGFZWZZLHEK-UHFFFAOYSA-N 0.000 description 1
- DALMMFLTKSAASI-UHFFFAOYSA-N butoxy-ethyl-methylsilane Chemical compound CCCCO[SiH](C)CC DALMMFLTKSAASI-UHFFFAOYSA-N 0.000 description 1
- QXUJXOFXBSLXJC-UHFFFAOYSA-N butoxy-methyl-propylsilane Chemical compound CCCCO[SiH](C)CCC QXUJXOFXBSLXJC-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZEZXMFBCRYGNNP-UHFFFAOYSA-N butyl(diethoxy)silane Chemical compound CCCC[SiH](OCC)OCC ZEZXMFBCRYGNNP-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- DDJSWKLBKSLAAZ-UHFFFAOYSA-N cyclotetrasiloxane Chemical compound O1[SiH2]O[SiH2]O[SiH2]O[SiH2]1 DDJSWKLBKSLAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- DOJBUDQOPFLZAZ-UHFFFAOYSA-N dibutoxy(butyl)silane Chemical compound CCCCO[SiH](CCCC)OCCCC DOJBUDQOPFLZAZ-UHFFFAOYSA-N 0.000 description 1
- PLTKQPNYFHYCNQ-UHFFFAOYSA-N dibutoxy(ethyl)silane Chemical compound CCCCO[SiH](CC)OCCCC PLTKQPNYFHYCNQ-UHFFFAOYSA-N 0.000 description 1
- MSXQSMNVGLDLOK-UHFFFAOYSA-N dibutoxy(phenyl)silane Chemical compound CCCCO[SiH](OCCCC)C1=CC=CC=C1 MSXQSMNVGLDLOK-UHFFFAOYSA-N 0.000 description 1
- BOKWBHQBXAUBCJ-UHFFFAOYSA-N dibutoxy(propyl)silane Chemical compound CCCCO[SiH](CCC)OCCCC BOKWBHQBXAUBCJ-UHFFFAOYSA-N 0.000 description 1
- ZWTJVXCCMKLQKS-UHFFFAOYSA-N diethoxy(ethyl)silicon Chemical compound CCO[Si](CC)OCC ZWTJVXCCMKLQKS-UHFFFAOYSA-N 0.000 description 1
- GAURFLBIDLSLQU-UHFFFAOYSA-N diethoxy(methyl)silicon Chemical compound CCO[Si](C)OCC GAURFLBIDLSLQU-UHFFFAOYSA-N 0.000 description 1
- BODAWKLCLUZBEZ-UHFFFAOYSA-N diethoxy(phenyl)silicon Chemical compound CCO[Si](OCC)C1=CC=CC=C1 BODAWKLCLUZBEZ-UHFFFAOYSA-N 0.000 description 1
- FZQNBVBLHJXOEA-UHFFFAOYSA-N diethoxy(propyl)silane Chemical compound CCC[SiH](OCC)OCC FZQNBVBLHJXOEA-UHFFFAOYSA-N 0.000 description 1
- DGXPASZXUJQWLQ-UHFFFAOYSA-N diethyl(methoxy)silane Chemical compound CC[SiH](CC)OC DGXPASZXUJQWLQ-UHFFFAOYSA-N 0.000 description 1
- MXYZNGVUWBFEID-UHFFFAOYSA-N diethyl(propoxy)silane Chemical compound CCCO[SiH](CC)CC MXYZNGVUWBFEID-UHFFFAOYSA-N 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- CIQDYIQMZXESRD-UHFFFAOYSA-N dimethoxy(phenyl)silane Chemical compound CO[SiH](OC)C1=CC=CC=C1 CIQDYIQMZXESRD-UHFFFAOYSA-N 0.000 description 1
- SGKDAFJDYSMACD-UHFFFAOYSA-N dimethoxy(propyl)silane Chemical compound CCC[SiH](OC)OC SGKDAFJDYSMACD-UHFFFAOYSA-N 0.000 description 1
- JJLPJGSCOKZWEZ-UHFFFAOYSA-N dimethoxymethyl-[6-(dimethoxymethylsilyl)hexyl]silane Chemical compound COC(OC)[SiH2]CCCCCC[SiH2]C(OC)OC JJLPJGSCOKZWEZ-UHFFFAOYSA-N 0.000 description 1
- BEHPKGIJAWBJMV-UHFFFAOYSA-N dimethyl(propoxy)silane Chemical compound CCCO[SiH](C)C BEHPKGIJAWBJMV-UHFFFAOYSA-N 0.000 description 1
- BBLGAWHITBYJEU-UHFFFAOYSA-N dipropoxy(propyl)silane Chemical compound CCCO[SiH](CCC)OCCC BBLGAWHITBYJEU-UHFFFAOYSA-N 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229940052303 ethers for general anesthesia Drugs 0.000 description 1
- XSAUEOCQIPDIQK-UHFFFAOYSA-N ethoxy(diethyl)silane Chemical compound CCO[SiH](CC)CC XSAUEOCQIPDIQK-UHFFFAOYSA-N 0.000 description 1
- DRUOQOFQRYFQGB-UHFFFAOYSA-N ethoxy(dimethyl)silicon Chemical compound CCO[Si](C)C DRUOQOFQRYFQGB-UHFFFAOYSA-N 0.000 description 1
- PVPZVPJEQJLKLJ-UHFFFAOYSA-N ethoxy-ethyl-methylsilane Chemical compound CCO[SiH](C)CC PVPZVPJEQJLKLJ-UHFFFAOYSA-N 0.000 description 1
- FOAJCPQRBYGAKO-UHFFFAOYSA-N ethoxy-methyl-propylsilane Chemical compound CCC[SiH](C)OCC FOAJCPQRBYGAKO-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- YSLVSGVAVRTLAV-UHFFFAOYSA-N ethyl(dimethoxy)silane Chemical compound CC[SiH](OC)OC YSLVSGVAVRTLAV-UHFFFAOYSA-N 0.000 description 1
- BNFBSHKADAKNSK-UHFFFAOYSA-N ethyl(dipropoxy)silane Chemical compound CCCO[SiH](CC)OCCC BNFBSHKADAKNSK-UHFFFAOYSA-N 0.000 description 1
- PRJZPAJSRRGSNS-UHFFFAOYSA-N ethyl-methoxy-methylsilane Chemical compound CC[SiH](C)OC PRJZPAJSRRGSNS-UHFFFAOYSA-N 0.000 description 1
- STDUJDXDAHSTSQ-UHFFFAOYSA-N ethyl-methyl-propoxysilane Chemical compound CCCO[SiH](C)CC STDUJDXDAHSTSQ-UHFFFAOYSA-N 0.000 description 1
- 238000012685 gas phase polymerization Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- UJSHLJUYMXUGAZ-UHFFFAOYSA-N methoxy-methyl-propylsilane Chemical compound CCC[SiH](C)OC UJSHLJUYMXUGAZ-UHFFFAOYSA-N 0.000 description 1
- AOKZNNDSKORWAG-UHFFFAOYSA-N methyl-propoxy-propylsilane Chemical compound CCCO[SiH](C)CCC AOKZNNDSKORWAG-UHFFFAOYSA-N 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 150000002835 noble gases Chemical class 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- JFJRLGIMKOMFAZ-UHFFFAOYSA-N phenyl(dipropoxy)silane Chemical compound CCCO[SiH](OCCC)C1=CC=CC=C1 JFJRLGIMKOMFAZ-UHFFFAOYSA-N 0.000 description 1
- 239000005360 phosphosilicate glass Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- NSWIHFBXSOMSAX-UHFFFAOYSA-N propoxy(dipropyl)silane Chemical compound CCCO[SiH](CCC)CCC NSWIHFBXSOMSAX-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- UCSBCWBHZLSFGC-UHFFFAOYSA-N tributoxysilane Chemical compound CCCCO[SiH](OCCCC)OCCCC UCSBCWBHZLSFGC-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- AAPLIUHOKVUFCC-UHFFFAOYSA-N trimethylsilanol Chemical compound C[Si](C)(C)O AAPLIUHOKVUFCC-UHFFFAOYSA-N 0.000 description 1
- OZWKZRFXJPGDFM-UHFFFAOYSA-N tripropoxysilane Chemical compound CCCO[SiH](OCCC)OCCC OZWKZRFXJPGDFM-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 229960000834 vinyl ether Drugs 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/62—Plasma-deposition of organic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
Description
例えば、特許文献4(国際公開第2005/53009号パンフレット)で提案されたような材料は、有機側鎖をよく保存した低い誘電率を持つ膜が得られるが、膜中に残存する不飽和結合が後工程でのプロセスダメージによって膜の物性を不安定化するという問題がある。
また、空孔率の高い材料では、特にアルカリ性の水による処理でダメージを起こしやすく、このダメージは絶縁膜表面の親水化から広がり、Si−O結合を持つSiへの求核攻撃によって膜の持つ誘電率が上昇してしまうものと考えられている。
また、ケイ素原子への求核攻撃を抑制する方法としては、膜の疎水性を高める方法も考えられる。即ち、ケイ素原子にアルキル置換基を持たせることによって、膜の疎水性を高めてやることにより、求核種が膜中に侵入しにくくする方法である。
で示されるプラズマCVD法によるSi含有膜形成用有機シラン化合物を挙げることができる(請求項2)。
更に、好ましくは、不純物として含有するNa、Fe、Alがいずれもそれぞれ100ppb以下である(請求項4)。プラズマCVD法によって前記シラン化合物を用いて半導体装置を構成する膜を成膜する際、半導体装置に安定した動作をさせるためには、不純物として含有するNa、Fe、Alがいずれもそれぞれ100ppb以下であることが好ましい。
また、本発明は、前記Si含有膜の成膜方法を用いて成膜することにより得られた絶縁膜である(請求項6)。好ましい成膜速度をもって得られる本絶縁膜は、絶縁特性、化学耐性等の要求特性にも優れる。
更に、本発明は、前記絶縁膜を有する半導体デバイスである(請求項7)。本発明の半導体デバイスは、上記絶縁膜を有することにより、信頼性に優れる。
また、本発明のプラズマCVD法によるSi含有膜の成膜方法を多層配線絶縁膜の成長方法として利用することにより、配線信号遅延の少ない半導体集積回路を安定して製造することができる。
Si含有膜(ここでは、膜表面や、膜を形成する結合剤の一部を、ケイ素含有終端基で修飾するものではなく、膜骨格を形成する構造中にケイ素原子が含まれるものを指すものとする)を成膜する場合、膜中のケイ素原子は、他のケイ素原子との間で2本以上の結合を持つ必要がある。CVD法でSi含有膜を成膜する場合には、気相反応により形成される結合はヘテロ原子によるものであり、一般的な低誘電率絶縁膜を形成する場合には、ケイ素原子間を結合して膜骨格を形成するのは酸素原子である。また、より低い誘電率を得ることを目的として、気相反応用の原料として、複数のケイ素原子に予め特定の構造(配置)を持たせたものを使用して成膜を行い、該特定の構造(配置)を膜中に導入する方法もある。この場合にも、複数のケイ素原子に特定の構造(配置)を持たせるためには、通常Si−O−Si結合を用いて行われてきた。
なお、プラズマCVD反応に使用する材料としては、一定以上の蒸気圧があることが必要であり、上述のシラン化合物が有する炭素数が20以下のものであれば、好ましく適用される。
で示される有機シラン化合物を挙げることができる。
アリルエーテル98gに塩化白金酸のブタノール溶液を添加しておき、ジメトキシメチルシラン212gをゆっくり滴下した。発熱反応が起こるので、反応混合物の温度が80℃以下になるように滴下速度を調整した。滴下終了後、清浄環境で乾燥した蒸留装置を用い、減圧蒸留により3,3’−ビス(ジメトキシメチルシリル)プロピルエーテルを得た。
ここで得たサンプルを、ICP−MSを用いて金属不純物を測定したところ、Mg、Mn、Cu、Cr、Znはいずれも10ppb(W/W)以下、Na、Ca、Fe、Alはいずれも50ppb(W/W)以下であった。分析結果は表1に示す。
アリルエーテル98gに塩化白金酸のブタノール溶液を添加しておき、ジメチルメトキシシラン180gをゆっくり滴下した。発熱反応が起こるので、反応混合物の温度が80℃以下になるように滴下速度を調整した。滴下終了後、合成例1と同様に清浄環境での減圧蒸留により3,3’−ビス(メトキシジメチルシリル)プロピルエーテルを得た。
ここで得たサンプルを、ICP−MSを用いて金属不純物を測定したところ、Mg、Mn、Cu、Cr、Znはいずれも10ppb(W/W)以下、Na、Ca、Fe、Alはいずれも50ppb(W/W)以下であった。分析結果は表1に示す。
アリルビニルエーテル84gに塩化白金酸のブタノール溶液を添加しておき、ジメトキシメチルシラン212gをゆっくり滴下した。発熱反応が起こるので、反応混合物の温度が80℃以下になるように滴下速度を調整した。滴下終了後、合成例1と同様に清浄環境での減圧蒸留により3−(ジメトキシメチルシリル)プロピル−2−(ジメトキシメチルシリル)エチルエーテルを得た。
ここで得たサンプルを、ICP−MSを用いて金属不純物を測定したところ、Mg、Mn、Cu、Cr、Znはいずれも10ppb(W/W)以下、Na、Ca、Fe、Alはいずれも50ppb(W/W)以下であった。分析結果は表1に示す。
ビニルメチルジメトキシシラン198gに塩化白金酸のブタノール溶液を添加しておき、ジメトキシメチルシラン159gをゆっくり滴下した。発熱反応が起こるので、反応混合物の温度が80℃以下になるように滴下速度を調整した。滴下終了後、合成例1と同様に清浄環境での減圧蒸留により1,2−ビス(ジメトキシメチルシリル)エタンを得た。
ここで得たサンプルを、ICP−MSを用いて金属不純物を測定したところ、Mg、Mn、Cu、Cr、Znはいずれも10ppb(W/W)以下、Na、Ca、Fe、Alはいずれも50ppb(W/W)以下であった。分析結果は表1に示す。
1,5−ヘキサジエン41.1gに塩化白金酸のブタノール溶液を添加しておき、ジメトキシメチルシラン106.2gをゆっくり滴下した。発熱反応が起こるので、反応混合物の温度が80℃以下になるように滴下速度を調整した。滴下終了後、合成例1と同様に清浄環境での減圧蒸留により1,5−ビス(ジメトキシメチルシリル)ヘキサンを得た。
ここで得たサンプルを、ICP−MSを用いて金属不純物を測定したところ、Mg、Mn、Cu、Cr、Znはいずれも10ppb(W/W)以下、Na、Ca、Fe、Alはいずれも50ppb(W/W)以下であった。分析結果は表1に示す。
図(1)に示した平行平板容量結合型PECVD装置を用いて、合成例1で合成した3,3’−ビス(ジメトキシメチルシリル)プロピルエーテルをシリコン基板上に成膜した。
成膜条件は、不活性ガスとしてアルゴンガスを10sccmで、供給し、気化させた1,2−ビス(メトキシメチルプロピルシリル)エタンをチャンバー内圧が5〜50Paとなるように供給し続け、基板温度150℃、RF電源電力300W、RF電源周波数13.56MHzの条件で成膜した。
結果は、チャンバー内圧をそれぞれ5Pa、20Pa、50Paとした場合、成膜速度は、5nm/min.、13nm/min.、21nm/min.であった。
実施例1は、比較例2に対し、原料となるシラン化合物が有する炭素数が等しく、等しいプロセス条件、例えば20Paで成膜した場合、得られる膜物性も全く遜色のないものが得られることが確認されたが、エーテルを分子内に入れることで分子量が上がることで沸点が若干上昇する(圧力0.5kPaでの沸点は、合成例1の化合物は145℃、比較合成例2の化合物は130℃)にも拘らず、成膜速度はむしろ向上するという結果が得られ、エーテル構造を導入した効果が確認された。
2 原料ガス導入管
3 不活性ガス導入管
4 サンプル
5 上部電極
6 下部電極
7 排気管
Claims (7)
- Cp−O−Cq(但し、p、qは炭素数を表わし、2≦p≦6、2≦q≦6であり、各炭素鎖には酸素原子と共役する不飽和結合を含まない)結合を含有する炭素数4〜8の直鎖状又は分岐状の酸素含有炭化水素鎖で結合された2個以上のケイ素原子を含有し、かつ該2個以上のケイ素原子はいずれも1個以上の水素原子又は炭素数1〜4のアルコキシ基を有することを特徴とする、プラズマCVD法によるSi含有膜形成用有機シラン化合物。
- 前記シラン化合物が1分子中に含む炭素原子の数は20以下である請求項1又は2記載のプラズマCVD法によるSi含有膜形成用有機シラン化合物。
- 不純物として含有するNa、Fe、Alがいずれもそれぞれ100ppb以下である請求項1乃至3のいずれか1項記載の有機シラン化合物。
- 請求項1乃至4のいずれか1項に記載の有機シラン化合物を用いることを特徴とするプラズマCVD法によるSi含有膜の成膜方法。
- 請求項5記載のSi含有膜の成膜方法を用いて成膜することにより得られた絶縁膜。
- 請求項6記載の絶縁膜を有する半導体デバイス。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009260954A JP5105105B2 (ja) | 2008-12-02 | 2009-11-16 | プラズマCVD法によるSi含有膜形成用有機シラン化合物及びSi含有膜の成膜方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008307199 | 2008-12-02 | ||
JP2008307199 | 2008-12-02 | ||
JP2009260954A JP5105105B2 (ja) | 2008-12-02 | 2009-11-16 | プラズマCVD法によるSi含有膜形成用有機シラン化合物及びSi含有膜の成膜方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010157689A JP2010157689A (ja) | 2010-07-15 |
JP5105105B2 true JP5105105B2 (ja) | 2012-12-19 |
Family
ID=41611125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009260954A Active JP5105105B2 (ja) | 2008-12-02 | 2009-11-16 | プラズマCVD法によるSi含有膜形成用有機シラン化合物及びSi含有膜の成膜方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8546597B2 (ja) |
EP (1) | EP2194060B1 (ja) |
JP (1) | JP5105105B2 (ja) |
KR (1) | KR101514466B1 (ja) |
TW (1) | TWI444498B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5105105B2 (ja) | 2008-12-02 | 2012-12-19 | 信越化学工業株式会社 | プラズマCVD法によるSi含有膜形成用有機シラン化合物及びSi含有膜の成膜方法 |
EP2463291B1 (en) | 2010-12-09 | 2016-05-04 | Shin-Etsu Chemical Co., Ltd. | Hydrosilylation method, method for producing organosilicon compound, and organosilicon compound. |
KR101416558B1 (ko) * | 2012-09-28 | 2014-07-10 | 주식회사 테스 | 다이본딩 필름의 증착방법 |
WO2022092212A1 (ja) * | 2020-10-30 | 2022-05-05 | パナソニックIpマネジメント株式会社 | アルコキシシリル化合物およびこれを含む非水電解液用添加剤、ならびにこれを含む非水電解液ならびに非水電解液二次電池 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1643873A1 (de) * | 1967-07-25 | 1971-07-15 | Dynamit Nobel Ag | Verfahren zur Herstellung von Silanen |
DE2159723A1 (de) | 1971-12-02 | 1973-06-14 | Dynamit Nobel Ag | Neue polymerisierbare silane |
US4379891A (en) * | 1981-06-15 | 1983-04-12 | Shell Oil Company | Multifunctional coupling agent |
JPH02286688A (ja) * | 1989-04-27 | 1990-11-26 | Toray Dow Corning Silicone Co Ltd | 有機ケイ素化合物およびその製造方法 |
JP2806216B2 (ja) * | 1993-07-15 | 1998-09-30 | 信越化学工業株式会社 | ケイ素化合物 |
US20060258176A1 (en) | 1998-02-05 | 2006-11-16 | Asm Japan K.K. | Method for forming insulation film |
JP3726226B2 (ja) | 1998-02-05 | 2005-12-14 | 日本エー・エス・エム株式会社 | 絶縁膜及びその製造方法 |
US6593247B1 (en) | 1998-02-11 | 2003-07-15 | Applied Materials, Inc. | Method of depositing low k films using an oxidizing plasma |
US6054379A (en) | 1998-02-11 | 2000-04-25 | Applied Materials, Inc. | Method of depositing a low k dielectric with organo silane |
JP2000302791A (ja) | 1999-04-20 | 2000-10-31 | Fujitsu Ltd | シリコン化合物、絶縁膜形成材料及び半導体装置 |
CA2311706A1 (en) * | 1999-08-10 | 2001-02-10 | Francois Kayser | Ether containing siloxy compounds |
JP2005133060A (ja) * | 2003-10-29 | 2005-05-26 | Rohm & Haas Electronic Materials Llc | 多孔性材料 |
WO2005053009A1 (ja) | 2003-11-28 | 2005-06-09 | Nec Corporation | 多孔質絶縁膜及びその製造方法並びに多孔質絶縁膜を用いた半導体装置 |
JP4433168B2 (ja) | 2004-03-11 | 2010-03-17 | 信越化学工業株式会社 | 保護された水酸基を有するオルガノキシシラン化合物 |
US7892648B2 (en) * | 2005-01-21 | 2011-02-22 | International Business Machines Corporation | SiCOH dielectric material with improved toughness and improved Si-C bonding |
JP5170445B2 (ja) * | 2007-02-14 | 2013-03-27 | Jsr株式会社 | ケイ素含有膜形成用材料、ならびにケイ素含有絶縁膜およびその形成方法 |
JP5222538B2 (ja) | 2007-05-22 | 2013-06-26 | 株式会社デンソー | 非水電解液及び該電解液を用いた非水電解液二次電池 |
KR20090072418A (ko) | 2007-12-28 | 2009-07-02 | 주식회사 삼양사 | 노보넨계 실란 유도체를 사용하는 절연막의 제조방법 및그로부터 제조되는 절연막 |
JP4911143B2 (ja) * | 2008-08-15 | 2012-04-04 | 信越化学工業株式会社 | 高温耐性接着剤組成物、基板の接着方法、及び3次元半導体装置 |
JP2010067810A (ja) * | 2008-09-11 | 2010-03-25 | Shin-Etsu Chemical Co Ltd | Si含有膜の成膜方法、絶縁膜、並びに半導体デバイス |
JP5105105B2 (ja) | 2008-12-02 | 2012-12-19 | 信越化学工業株式会社 | プラズマCVD法によるSi含有膜形成用有機シラン化合物及びSi含有膜の成膜方法 |
-
2009
- 2009-11-16 JP JP2009260954A patent/JP5105105B2/ja active Active
- 2009-12-01 US US12/628,469 patent/US8546597B2/en active Active
- 2009-12-01 KR KR1020090117702A patent/KR101514466B1/ko active IP Right Grant
- 2009-12-01 TW TW098140987A patent/TWI444498B/zh active
- 2009-12-02 EP EP09252717.5A patent/EP2194060B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2194060A1 (en) | 2010-06-09 |
JP2010157689A (ja) | 2010-07-15 |
TWI444498B (zh) | 2014-07-11 |
US20100137626A1 (en) | 2010-06-03 |
EP2194060B1 (en) | 2013-07-17 |
KR101514466B1 (ko) | 2015-04-22 |
KR20100062947A (ko) | 2010-06-10 |
TW201035363A (en) | 2010-10-01 |
US8546597B2 (en) | 2013-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6440876B1 (en) | Low-K dielectric constant CVD precursors formed of cyclic siloxanes having in-ring SI—O—C, and uses thereof | |
US6572923B2 (en) | Asymmetric organocyclosiloxanes and their use for making organosilicon polymer low-k dielectric film | |
US20020192980A1 (en) | Methods for forming low-k dielectric films | |
JP2013016859A (ja) | 応力を加えたSiN膜用アミノ・ビニルシラン前駆体 | |
JP5105105B2 (ja) | プラズマCVD法によるSi含有膜形成用有機シラン化合物及びSi含有膜の成膜方法 | |
JP2008274365A (ja) | Si含有膜形成材料、Si含有膜及びその製造方法、並びに半導体デバイス | |
JP2010067810A (ja) | Si含有膜の成膜方法、絶縁膜、並びに半導体デバイス | |
JP5353845B2 (ja) | 環状シロキサン化合物 | |
WO2020233480A1 (zh) | 低介电常数膜及其制备方法 | |
US8513448B2 (en) | Cyclic siloxane compound, a material for forming Si-containing film, and its use | |
US20100140754A1 (en) | Film-forming material, silicon-containing insulating film and method for forming the same | |
JP4333480B2 (ja) | Si含有膜形成材料、およびその用途 | |
JP5019742B2 (ja) | 環状シロキサン化合物、Si含有膜形成材料、およびその用途 | |
TWI772883B (zh) | 單烷氧基矽烷及使用其製造的密有機二氧化矽膜 | |
JP4341560B2 (ja) | Si含有膜形成材料、Si含有膜、Si含有膜の製法、及び、半導体デバイス | |
TW202111153A (zh) | 單烷氧基矽烷及二烷氧基矽烷和使用其製造的密有機二氧化矽膜 | |
JP4618086B2 (ja) | Si含有膜及びその製造方法等 | |
US20100151151A1 (en) | Method of forming low-k film having chemical resistance | |
US20010036754A1 (en) | Film forming method and manufacturing method of semiconductor device | |
JP6993394B2 (ja) | ケイ素化合物及びケイ素化合物を使用してフィルムを堆積する方法 | |
CN110952074B (zh) | 硅化合物和使用硅化合物沉积膜的方法 | |
KR20220035506A (ko) | 규소 화합물 및 이를 사용하여 막을 증착시키는 방법 | |
WO2007018268A1 (ja) | 絶縁膜材料、この絶縁膜材料を用いた成膜方法および絶縁膜 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20111027 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120412 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120502 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120905 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120918 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5105105 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151012 Year of fee payment: 3 |