JP5098221B2 - 発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ - Google Patents

発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ Download PDF

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Publication number
JP5098221B2
JP5098221B2 JP2006144321A JP2006144321A JP5098221B2 JP 5098221 B2 JP5098221 B2 JP 5098221B2 JP 2006144321 A JP2006144321 A JP 2006144321A JP 2006144321 A JP2006144321 A JP 2006144321A JP 5098221 B2 JP5098221 B2 JP 5098221B2
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Japan
Prior art keywords
light
emitting device
phosphor
light emitting
wavelength
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Expired - Fee Related
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JP2006144321A
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English (en)
Japanese (ja)
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JP2007005781A (ja
JP2007005781A5 (enExample
Inventor
直人 木島
英明 金田
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Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
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Priority to JP2006144321A priority Critical patent/JP5098221B2/ja
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Publication of JP2007005781A5 publication Critical patent/JP2007005781A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Liquid Crystal (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
JP2006144321A 2005-05-24 2006-05-24 発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ Expired - Fee Related JP5098221B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006144321A JP5098221B2 (ja) 2005-05-24 2006-05-24 発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005151175 2005-05-24
JP2005151175 2005-05-24
JP2006144321A JP5098221B2 (ja) 2005-05-24 2006-05-24 発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011204839A Division JP2012033945A (ja) 2005-05-24 2011-09-20 発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ

Publications (3)

Publication Number Publication Date
JP2007005781A JP2007005781A (ja) 2007-01-11
JP2007005781A5 JP2007005781A5 (enExample) 2009-07-09
JP5098221B2 true JP5098221B2 (ja) 2012-12-12

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JP2006144321A Expired - Fee Related JP5098221B2 (ja) 2005-05-24 2006-05-24 発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ

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JP (1) JP5098221B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8451401B2 (en) 2006-04-19 2013-05-28 Mitsubishi Chemical Corporation Color image display device
DE102008006990A1 (de) * 2008-01-31 2009-08-06 Osram Opto Semiconductors Gmbh Hintergrundbeleuchtungseinheit für eine Hintergrundbeleuchtung eines Bildschirms und Bildschirmeinheit des Bildschirms
TWI438262B (zh) 2008-02-07 2014-05-21 三菱化學股份有限公司 A semiconductor light emitting device, a backlight, a color image display device, and a phosphor
US20130002963A1 (en) * 2010-03-25 2013-01-03 Masashi Yokota Display device and television receiver
JP5413405B2 (ja) * 2011-05-30 2014-02-12 パナソニック株式会社 樹脂塗布装置および樹脂塗布方法
JP5413404B2 (ja) 2011-05-30 2014-02-12 パナソニック株式会社 Ｌｅｄパッケージ製造システムおよびｌｅｄパッケージ製造システムにおける樹脂塗布方法
JP6287268B2 (ja) * 2014-01-29 2018-03-07 日亜化学工業株式会社 発光装置
US11781714B2 (en) 2019-03-18 2023-10-10 Bridgelux, Inc. LED-filaments and LED-filament lamps
WO2020190914A1 (en) * 2019-03-18 2020-09-24 Intematix Corporation Packaged white light emitting device comprising photoluminescence layered structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10133352A1 (de) * 2001-07-16 2003-02-06 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
JP4032682B2 (ja) * 2001-08-28 2008-01-16 三菱化学株式会社 蛍光体
JP3946541B2 (ja) * 2002-02-25 2007-07-18 三菱電線工業株式会社 発光装置およびそれを用いた照明装置、ならびに該発光装置の製造方法と設計方法
JP3956972B2 (ja) * 2002-04-25 2007-08-08 日亜化学工業株式会社 蛍光物質を用いた発光装置
JP2004115633A (ja) * 2002-09-25 2004-04-15 Matsushita Electric Ind Co Ltd 珪酸塩蛍光体およびそれを用いた発光装置
US6717353B1 (en) * 2002-10-14 2004-04-06 Lumileds Lighting U.S., Llc Phosphor converted light emitting device
WO2005031797A2 (de) * 2003-09-24 2005-04-07 Patent-Treuhand- Gesellschaft Für Elektrische Glühlampen Mbh Weiss emittierende led mit definierter farbtemperatur
US7094362B2 (en) * 2003-10-29 2006-08-22 General Electric Company Garnet phosphor materials having enhanced spectral characteristics

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