JP5090715B2 - センサ感知軸線の移動用小型パッケージ - Google Patents

センサ感知軸線の移動用小型パッケージ Download PDF

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Publication number
JP5090715B2
JP5090715B2 JP2006305141A JP2006305141A JP5090715B2 JP 5090715 B2 JP5090715 B2 JP 5090715B2 JP 2006305141 A JP2006305141 A JP 2006305141A JP 2006305141 A JP2006305141 A JP 2006305141A JP 5090715 B2 JP5090715 B2 JP 5090715B2
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Japan
Prior art keywords
bracket
contacts
electrical interface
mems
bracket body
Prior art date
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Expired - Fee Related
Application number
JP2006305141A
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English (en)
Japanese (ja)
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JP2007155714A (ja
JP2007155714A5 (enExample
Inventor
ダグラス・シー・マクグガン
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Honeywell International Inc
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Honeywell International Inc
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Publication date
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Publication of JP2007155714A publication Critical patent/JP2007155714A/ja
Publication of JP2007155714A5 publication Critical patent/JP2007155714A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0074—3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/025—Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
JP2006305141A 2005-11-10 2006-11-10 センサ感知軸線の移動用小型パッケージ Expired - Fee Related JP5090715B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/272,154 2005-11-10
US11/272,154 US7467552B2 (en) 2005-11-10 2005-11-10 Miniature package for translation of sensor sense axis

Publications (3)

Publication Number Publication Date
JP2007155714A JP2007155714A (ja) 2007-06-21
JP2007155714A5 JP2007155714A5 (enExample) 2009-07-02
JP5090715B2 true JP5090715B2 (ja) 2012-12-05

Family

ID=37745592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006305141A Expired - Fee Related JP5090715B2 (ja) 2005-11-10 2006-11-10 センサ感知軸線の移動用小型パッケージ

Country Status (3)

Country Link
US (1) US7467552B2 (enExample)
EP (1) EP1785392B1 (enExample)
JP (1) JP5090715B2 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
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EP1394554B1 (en) * 2002-08-30 2011-11-02 STMicroelectronics Srl Process for the fabrication of a threshold acceleration sensor
US7553164B2 (en) * 2005-05-30 2009-06-30 Sanyo Electric Co., Ltd. Circuit device and method of manufacturing the same
DE102006030849B4 (de) * 2006-07-04 2009-03-12 Continental Automotive Gmbh Sensorbaugruppe und Verfahren zum Herstellen einer Sensorbaugruppe
CN101796374A (zh) * 2007-09-03 2010-08-04 松下电器产业株式会社 惯性力传感器
US8100010B2 (en) * 2008-04-14 2012-01-24 Honeywell International Inc. Method and system for forming an electronic assembly having inertial sensors mounted thereto
US8037754B2 (en) * 2008-06-12 2011-10-18 Rosemount Aerospace Inc. Integrated inertial measurement system and methods of constructing the same
FR2933968B1 (fr) * 2008-07-18 2010-09-10 Thales Sa Dispositif electronique comportant des composants electroniques et au moins une interface a base de nanotubes et procede de fabrication
US8080925B2 (en) * 2008-09-23 2011-12-20 Custom Sensors & Technologies, Inc. Inertial sensor with dual cavity package and method of fabrication
ES2352928B1 (es) * 2009-07-28 2012-01-25 Abengoa Solar New Technologies Estantería para el transporte seguro de facetas solares de concentración.
US9706948B2 (en) * 2010-05-06 2017-07-18 Sachin Bhandari Inertial sensor based surgical navigation system for knee replacement surgery
CN102121829B (zh) 2010-08-09 2013-06-12 汪滔 一种微型惯性测量系统
FR2964789A1 (fr) * 2010-09-10 2012-03-16 Commissariat Energie Atomique Circuit intégré comportant un dispositif a élément mobile vertical intégré dans un substrat de support et procédé de réalisation du dispositif a élément mobile
US8692366B2 (en) * 2010-09-30 2014-04-08 Analog Device, Inc. Apparatus and method for microelectromechanical systems device packaging
JP5779946B2 (ja) * 2011-04-07 2015-09-16 セイコーエプソン株式会社 センサーデバイスの製造方法
US8459112B2 (en) * 2011-06-09 2013-06-11 Honeywell International Inc. Systems and methods for three dimensional sensors
WO2013006270A2 (en) * 2011-07-01 2013-01-10 Borgwarner Inc. Position sensor module
US8803262B2 (en) * 2012-01-17 2014-08-12 Rosemount Aerospace Inc. Die attach stress isolation
US8836132B2 (en) 2012-04-03 2014-09-16 Analog Devices, Inc. Vertical mount package and wafer level packaging therefor
WO2014002416A1 (ja) * 2012-06-25 2014-01-03 パナソニック株式会社 歪センサ
JP2014048090A (ja) * 2012-08-30 2014-03-17 Seiko Epson Corp 電子モジュール、電子機器、及び移動体
US9475694B2 (en) 2013-01-14 2016-10-25 Analog Devices Global Two-axis vertical mount package assembly
JP6136402B2 (ja) * 2013-03-15 2017-05-31 セイコーエプソン株式会社 センサーユニット、電子機器、および移動体
DE102013105569A1 (de) * 2013-05-29 2014-12-04 Jochen Hennig Flexibler Sattelbaum mit einem ein- oder mehrstückigen Kopfeisen
US9664516B2 (en) 2014-04-25 2017-05-30 SZ DJI Technology Co., Ltd. Inertial sensing device
CN104316053A (zh) * 2014-11-12 2015-01-28 中国兵器工业集团第二一四研究所苏州研发中心 一种微小型惯性测量单元的实现方法
US10247621B1 (en) * 2015-09-13 2019-04-02 Sitime Corporation High resolution temperature sensor
US11647678B2 (en) 2016-08-23 2023-05-09 Analog Devices International Unlimited Company Compact integrated device packages
US10629574B2 (en) 2016-10-27 2020-04-21 Analog Devices, Inc. Compact integrated device packages
US10697800B2 (en) 2016-11-04 2020-06-30 Analog Devices Global Multi-dimensional measurement using magnetic sensors and related systems, methods, and integrated circuits
EP3795076B1 (en) 2018-01-31 2023-07-19 Analog Devices, Inc. Electronic devices
JP7735067B2 (ja) * 2021-03-31 2025-09-08 キヤノン株式会社 センサモジュール

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2802411B2 (ja) * 1992-05-26 1998-09-24 シャープ株式会社 光学装置
JP2915706B2 (ja) * 1992-07-15 1999-07-05 シャープ株式会社 発光装置
JP3127747B2 (ja) * 1993-12-27 2001-01-29 株式会社日立製作所 加速度センサ
US5503016A (en) * 1994-02-01 1996-04-02 Ic Sensors, Inc. Vertically mounted accelerometer chip
JP2877034B2 (ja) * 1994-06-15 1999-03-31 株式会社デンソー 加速度検出装置および加速度センサ
US5554806A (en) * 1994-06-15 1996-09-10 Nippondenso Co., Ltd. Physical-quantity detecting device
US5756895A (en) * 1995-09-01 1998-05-26 Hughes Aircraft Company Tunneling-based rate gyros with simple drive and sense axis coupling
JP3849203B2 (ja) * 1996-02-23 2006-11-22 株式会社デンソー 表面実装型半導体パッケージ、トランスデューサアッセンブリおよび表面実装型ユニット
US6060780A (en) * 1996-02-23 2000-05-09 Denson Corporation Surface mount type unit and transducer assembly using same
JPH10335530A (ja) * 1997-06-03 1998-12-18 Sony Corp 半導体装置のパッケージ
JPH1164369A (ja) * 1997-08-26 1999-03-05 Nippon Inter Electronics Corp 半導体センサ
US6404204B1 (en) * 2000-05-01 2002-06-11 ARETé ASSOCIATES Sensor and sensor system for liquid conductivity, temperature and depth
US7253079B2 (en) * 2002-05-09 2007-08-07 The Charles Stark Draper Laboratory, Inc. Coplanar mounting member for a MEM sensor
JP2003344439A (ja) * 2002-05-28 2003-12-03 Matsushita Electric Works Ltd 半導体加速度センサ装置
US6922118B2 (en) * 2002-11-01 2005-07-26 Hrl Laboratories, Llc Micro electrical mechanical system (MEMS) tuning using focused ion beams
US6918297B2 (en) * 2003-02-28 2005-07-19 Honeywell International, Inc. Miniature 3-dimensional package for MEMS sensors

Also Published As

Publication number Publication date
EP1785392A3 (en) 2008-07-02
EP1785392B1 (en) 2011-12-21
US20070101812A1 (en) 2007-05-10
US7467552B2 (en) 2008-12-23
EP1785392A2 (en) 2007-05-16
JP2007155714A (ja) 2007-06-21

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