JP5090118B2 - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP5090118B2 JP5090118B2 JP2007254662A JP2007254662A JP5090118B2 JP 5090118 B2 JP5090118 B2 JP 5090118B2 JP 2007254662 A JP2007254662 A JP 2007254662A JP 2007254662 A JP2007254662 A JP 2007254662A JP 5090118 B2 JP5090118 B2 JP 5090118B2
- Authority
- JP
- Japan
- Prior art keywords
- coil
- connection portion
- inductor
- substrate
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 34
- 239000012212 insulator Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 8
- 230000000052 comparative effect Effects 0.000 description 26
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007254662A JP5090118B2 (ja) | 2007-09-28 | 2007-09-28 | 電子部品 |
EP08164558.2A EP2043113B1 (en) | 2007-09-28 | 2008-09-18 | Electronic device |
US12/237,826 US7746210B2 (en) | 2007-09-28 | 2008-09-25 | Electronic device |
CN2008101497957A CN101447277B (zh) | 2007-09-28 | 2008-09-27 | 电子设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007254662A JP5090118B2 (ja) | 2007-09-28 | 2007-09-28 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009088163A JP2009088163A (ja) | 2009-04-23 |
JP5090118B2 true JP5090118B2 (ja) | 2012-12-05 |
Family
ID=40091792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007254662A Active JP5090118B2 (ja) | 2007-09-28 | 2007-09-28 | 電子部品 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7746210B2 (zh) |
EP (1) | EP2043113B1 (zh) |
JP (1) | JP5090118B2 (zh) |
CN (1) | CN101447277B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104282421A (zh) * | 2013-07-03 | 2015-01-14 | 艾默生过程控制流量技术有限公司 | 线圈组件及其制造方法、现场仪表 |
KR20170079183A (ko) * | 2015-12-30 | 2017-07-10 | 삼성전기주식회사 | 코일 부품 |
KR102369430B1 (ko) * | 2017-03-15 | 2022-03-03 | 삼성전기주식회사 | 코일 전자부품 및 그의 실장 기판 |
US11462352B2 (en) * | 2017-08-07 | 2022-10-04 | Sony Corporation | Electronic component, power supply device, and vehicle |
US11605492B2 (en) * | 2017-11-13 | 2023-03-14 | Tdk Corporation | Coil component |
JP7266996B2 (ja) * | 2018-11-20 | 2023-05-01 | 太陽誘電株式会社 | インダクタ、フィルタおよびマルチプレクサ |
KR102706986B1 (ko) * | 2019-04-05 | 2024-09-19 | 삼성전기주식회사 | 코일 부품 |
KR102335426B1 (ko) * | 2020-01-07 | 2021-12-06 | 삼성전기주식회사 | 코일 부품 |
JP7200956B2 (ja) * | 2020-01-27 | 2023-01-10 | 株式会社村田製作所 | インダクタ部品 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05190333A (ja) * | 1992-01-13 | 1993-07-30 | Sharp Corp | 重層型スパイラルインダクタ |
JPH0955472A (ja) * | 1995-08-11 | 1997-02-25 | Mitsubishi Electric Corp | インダクタ |
JP3509362B2 (ja) * | 1996-01-26 | 2004-03-22 | シャープ株式会社 | 半導体装置及びその製造方法 |
GB2321787A (en) * | 1997-01-31 | 1998-08-05 | Nokia Mobile Phones Ltd | Multiple layer printed circuit board inductive arrangement |
KR20000011585A (ko) * | 1998-07-28 | 2000-02-25 | 윤덕용 | 반도체소자및그제조방법 |
KR100580162B1 (ko) * | 1999-10-15 | 2006-05-16 | 삼성전자주식회사 | 박막형 대역 통과 필터 및 그 제조방법 |
JP2002043131A (ja) * | 2000-07-25 | 2002-02-08 | Taiyo Yuden Co Ltd | インダクタンス素子及びインダクタンス素子の製造方法 |
KR100368930B1 (ko) * | 2001-03-29 | 2003-01-24 | 한국과학기술원 | 반도체 기판 위에 높이 떠 있는 3차원 금속 소자, 그 회로모델, 및 그 제조방법 |
US6972635B2 (en) * | 2002-02-26 | 2005-12-06 | The Regents Of The University Of Michigan | MEMS-based, computer systems, clock generation and oscillator circuits and LC-tank apparatus for use therein |
JP2004303823A (ja) * | 2003-03-28 | 2004-10-28 | Tdk Corp | インダクタンス部品、電源トランスおよびスイッチング電源 |
JP4762531B2 (ja) | 2004-11-30 | 2011-08-31 | 太陽誘電株式会社 | 電子部品及びその製造方法 |
JP4707056B2 (ja) * | 2005-08-31 | 2011-06-22 | 富士通株式会社 | 集積型電子部品および集積型電子部品製造方法 |
JP2007142157A (ja) * | 2005-11-18 | 2007-06-07 | Alps Electric Co Ltd | 可変インダクタ |
JP2007254662A (ja) | 2006-03-24 | 2007-10-04 | Teraoka Seisakusho:Kk | 粘着シート用下塗剤組成物並びにそれを用いた粘着シート |
-
2007
- 2007-09-28 JP JP2007254662A patent/JP5090118B2/ja active Active
-
2008
- 2008-09-18 EP EP08164558.2A patent/EP2043113B1/en not_active Not-in-force
- 2008-09-25 US US12/237,826 patent/US7746210B2/en active Active
- 2008-09-27 CN CN2008101497957A patent/CN101447277B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
EP2043113A2 (en) | 2009-04-01 |
JP2009088163A (ja) | 2009-04-23 |
CN101447277B (zh) | 2011-11-23 |
CN101447277A (zh) | 2009-06-03 |
EP2043113B1 (en) | 2017-10-04 |
US20090085707A1 (en) | 2009-04-02 |
EP2043113A3 (en) | 2012-02-08 |
US7746210B2 (en) | 2010-06-29 |
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