JP5078267B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device including a light emitting element with high current efficiency of light emission and high display quality.

  In recent years, light emitting devices and displays using light emitting elements including organic materials and inorganic materials have been actively developed. A light-emitting element is manufactured by sandwiching an organic compound or an inorganic compound between a pair of electrodes. Unlike a liquid crystal display device, the light-emitting element itself emits light, so a light source such as a backlight is not required and the element itself is very thin. This is very advantageous in producing a thin and light display.

  A light-emitting element has an organic material or an inorganic material between a pair of electrodes, and a predetermined emission color can be obtained by applying an electric current to the material to excite the light-emitting material. It is known that the light emission luminance of such a light emitting element increases in proportion to the current. However, it is also known that simultaneously flowing a large current promotes deterioration of the light emitting element. In other words, it is possible to increase the light emission luminance by applying a high voltage to the electrode and flowing a large amount of current, but it also accelerates the deterioration of the light emitting element. If a large luminance can be obtained with a smaller current, it also extends the life of the light emitting element.

  In view of this, a light-emitting element that can obtain high emission luminance by stacking a plurality of light-emitting elements and flowing a current having the same current density as that of a single light-emitting element has been proposed (see Patent Document 1). By utilizing this, in a light emitting element having a laminated structure, a predetermined luminance can be obtained even with a current density half that of a single layer. For example, when it is desired to obtain n times the luminance at a desired current density, if the number of light emitting units having the same configuration existing between the electrodes is n, it is said that n times the luminance can be realized without increasing the current density. ing. At this time, although the drive voltage is increased by n times or more, it is described that the advantage that n times the luminance can be realized without sacrificing the lifetime is great.

  However, in the case of the configuration described in Patent Document 1, an equipotential surface made of indium tin oxide (ITO) or the like is provided between the light emitting unit and the light emitting unit. If this is formed across a plurality of pixels, so-called crosstalk occurs due to the influence of the voltage of adjacent pixels.

  In addition, since the equipotential surface has conductivity, if the equipotential surface is exposed from the light emitting unit, an initial failure due to a short circuit occurs when the electrode is touched.

In addition, if the equipotential surface is formed so as to coincide with the light emitting region, even a slight deviation occurs between the formation positions of the equipotential surface and the light emitting region, and a difference in brightness appears in the light emitting region or shifts from the potential surface. It is conceivable that the position where it has become a non-light-emitting area, and a slight shift greatly affects the display quality.
JP 2003-45676 A

  Therefore, an object of the present invention is to provide a light emitting device in which occurrence of crosstalk between adjacent light emitting elements is suppressed.

  It is another object of the present invention to provide a light emitting device that can suppress the occurrence of initial failure.

  It is another object of the present invention to provide a light-emitting device using a light-emitting element with high current efficiency and having high display quality.

  In order to solve the above problems, a light-emitting device of the present invention includes a pixel portion including a plurality of light-emitting elements, and the light-emitting element includes a plurality of light-emitting bodies provided between a first electrode and a second electrode; The conductive layer is formed between the light emitters. The conductive layer is provided for each light emitting element, and the end of the conductive layer is covered with the light emitter.

  In order to solve the above problems, a light-emitting device of the present invention includes a pixel portion including a plurality of light-emitting elements, and the light-emitting element includes a plurality of light-emitting bodies provided between a first electrode and a second electrode; It consists of a conductive layer formed between the light emitters, and the conductive layer is provided independently for each light emitting element.

  In the above structure, a layer made of a part or all of the compound constituting the light emitter is provided between adjacent conductive layers provided independently of each other.

  In the above structure, the end portion of the conductive layer is formed outside the end portion of the light emitting region in the light emitting element.

  In the above structure, the second conductive layer is formed in contact with the first electrode.

  In the above structure, the end portion of the second conductive layer is formed outside the end portion of the light emitting region in the light emitting element.

  In the above structure, the third conductive layer is formed in contact with the second electrode.

  In the above structure, the end portion of the third conductive layer is formed outside the end portion of the light emitting region in the light emitting element.

  The light emitting device of the present invention is a light emitting device in which occurrence of crosstalk between adjacent light emitting elements is suppressed.

  In addition, the light emitting device of the present invention is a light emitting device in which the occurrence of initial failure is suppressed.

  The light-emitting device of the present invention is a light-emitting device using a light-emitting element with high current efficiency and having high display quality.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention can be implemented in many different modes, and those skilled in the art can easily understand that the modes and details can be variously changed without departing from the spirit and scope of the present invention. Is done. Therefore, the present invention is not construed as being limited to the description of this embodiment mode.

(Embodiment 1)
FIG. 1 is a schematic view of a light emitting device of the present invention. FIG. 1A illustrates one light-emitting element in a light-emitting device, which includes a first electrode 100, a first light-emitting body 101, a second light-emitting body 102, a second electrode 103, and a conductive layer 110. The conductive layer 110 is provided between the first light-emitting body 101 and the second light-emitting body 102, and an end portion thereof is covered with the first light-emitting body 101 and the second light-emitting body 102 and is covered for each pixel. It is separated.

  For the first electrode 100 and the second electrode 103, a metal, an alloy, an electrically conductive compound, or the like can be used. For example, aluminum (Al), silver (Ag), gold (Au), platinum (Pt), nickel (Ni), tungsten (W), chromium (Cr), molybdenum (Mo), iron (Fe), cobalt (Co ), Copper (Cu), palladium (Pd), lithium (Li), cesium (Cs), magnesium (Mg), calcium (Ca), strontium (Sr), titanium (Ti), or other conductive metals, or Alloys of aluminum and silicon (Al-Si), alloys of aluminum and titanium (Al-Ti), alloys of aluminum, silicon and copper (Al-Si-Cu), or metals such as titanium nitride (TiN) Materials nitride, indium tin oxide (ITO), silicon-containing ITO (ITSO), indium oxide A metal compound such as IZO (Indium Zinc Oxide) mixed with zinc oxide (ZnO) can be used, but the electrode to which the high voltage is applied when the light-emitting element emits light from the first electrode 100 (functions as an anode) Among them, it is preferable that the electrode is made of a material having a high work function (work function of 4.0 eV or more). In addition, when the first electrode 100 is an electrode to which a low voltage is applied when the light emitting element emits light (an electrode functioning as a cathode), a material having a small work function (work function of 3.8 eV or less). It is preferable that it is formed. Note that one of the first electrode 100 and the second electrode 103 corresponds to an electrode that functions as an anode and the other that functions as a cathode.

  Note that the electrode on the side from which light is extracted is preferably formed using a light-transmitting material such as ITO, ITSO, or IZO. Note that aluminum or silver is non-light-transmitting when formed as a thick film. However, since it becomes light-transmitting when the film is thinned, an aluminum or silver thin film can also be used as a light-transmitting electrode. .

  The first light-emitting body 101 and the second light-emitting body 102 are a single layer or a stacked layer including at least a light-emitting substance.

  The stacked structure of the first light emitter 101 and the second light emitter 102 is typically a function-separated stacked structure. Efficiency is achieved by placing a layer made of a material with a high hole-transport property on the electrode side that functions as an anode and a layer made of a material with a high electron-transport property on the cathode side across a light-emitting layer where holes and electrons recombine The hole and electron can be transported well. In addition, by arranging a material having excellent injectability of carriers injected from each electrode in contact with each electrode, carriers can be smoothly injected into the light emitter.

  These laminated structures have a layer with a function of injecting holes from the side close to the electrode functioning as an anode (hole injection layer), a layer with a function of transporting holes (hole transport layer), and a light emitting material. Are contained in each functional layer, such as a layer containing light (emission layer), a layer excellent in the function of transporting electrons (electron transport layer), and a layer excellent in the function of injecting electrons (electron injection layer). In addition to these layers, layers having other functions such as a blocking layer for allowing electrons and holes to be efficiently recombined in the light emitting layer may be formed. A layer having a plurality of functions may be included. All of these functional layers are not necessarily contained in the light emitter, and the light emitter may be formed of a single light emitting layer.

  In the light-emitting device of the present invention, the light-emitting element has a plurality of light-emitting bodies including the first light-emitting body 101 and the second light-emitting body 102. Therefore, the light emitting materials included in the first light emitting body 101 and the second light emitting body 102 are different light emitting materials having different light emission colors, so that the light emission colors of the respective light emitting materials are mixed from the light emitting element. Light emission can be obtained. The number of light emitters is not limited to two and may be more than that. In that case, the conductive layer 110 is provided between the light emitters.

  In addition, by using the same light-emitting substance in the first light-emitting body 101 and the second light-emitting body 102, the current density is lower than that of other light-emitting devices that include the light-emitting substance and have a single light-emitting body. It is possible to obtain the same brightness. In addition, about twice the luminance can be obtained with the same current density.

Specific examples of substances that can be used to form the hole injection layer include phthalocyanine compounds such as phthalocyanine (abbreviation: H ₂ Pc) and copper phthalocyanine (CuPc), or poly (ethylenedioxythiophene) / poly Examples thereof include polymers such as (styrene sulfonic acid) aqueous solution (PEDOT / PSS). A material whose ionization potential of the material used for the hole injection layer is relatively smaller than the ionization potential of the functional layer formed on the hole injection layer in contact with the opposite side of the electrode functioning as an anode. A hole injection layer can be formed by selecting a substance having a transporting property.

Specific examples of a substance that can be used for forming the hole-transporting layer include 4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (abbreviation: NPB), 4,4. '-Bis [N- (3-methylphenyl) -N-phenylamino] biphenyl (abbreviation: TPD), 4,4', 4 ''-tris (N, N-diphenylamino) triphenylamine (abbreviation: TDATA) ), 4,4 ′, 4 ″ -tris [N- (3-methylphenyl) -N-phenylamino] triphenylamine (abbreviation: MTDATA), 4,4′-bis {N- [4- (N , N-di-m-tolylamino) phenyl] -N-phenylamino} biphenyl (abbreviation: DNTPD), 1,3,5-tris [N, N-di (m-tolyl) amino] benzene (abbreviation: m- MTDAB), 4,4 ', 4 "-Tris N- carbazolyl) triphenylamine (abbreviation: TCTA), phthalocyanine _{(abbreviation:} H 2 Pc), copper phthalocyanine (abbreviation: CuPc), or vanadyl phthalocyanine (abbreviation: VOPc), and the like. The hole transport layer may be a layer having a multilayer structure formed by combining two or more layers made of the substances described above.

In addition, by providing the hole transport layer, the distance between the first electrode 100 and the light-emitting layer can be increased, and light emission is quenched due to the metal contained in the first electrode 100 and the like. It can also be prevented. The hole transport layer is preferably formed using a substance having a high hole transport property, and particularly preferably formed using a substance having a hole mobility of 1 × 10 ⁻⁶ cm ² / Vs or higher.

The layer functioning as the light emitting layer is roughly divided into two modes. One is a host-guest type layer in which a light-emitting material is dispersed in a layer made of a material (host material) having an energy gap larger than that of the light-emitting substance serving as a light emission center, and the other is a light-emitting material. It is a layer which comprises a light emitting layer only. The former is a preferable structure because concentration quenching hardly occurs. As the light-emitting material, 9,10-di (2-naphthyl) anthracene (abbreviation: DNA), 2-tert-butyl-9,10-di (2-naphthyl) anthracene (abbreviation: t-BuDNA), 4,4 '-Bis (2,2-diphenylvinyl) biphenyl (abbreviation: DPVBi), coumarin 30, coumarin 6, coumarin 545, coumarin 545T, perylene, rubrene, periflanthene, 2,5,8,11-tetra (tert-butyl) Perylene (abbreviation: TBP), 9,10-diphenylanthracene (abbreviation: DPA), 5,12-diphenyltetracene, 4- (dicyanomethylene) -2-methyl-6- [p- (dimethylamino) styryl] -4H -Pyran (abbreviation: DCM1), 4- (dicyanomethylene) -2-methyl-6- [2- (julolidin-9-yl) ) Ethenyl] -4H-pyran (abbreviation: DCM2), 4- (dicyanomethylene) -2,6-bis [p- (dimethylamino) styryl] -4H-pyran (abbreviation: BisDCM), and the like. In addition, bis [2- (4 ′, 6′-difluorophenyl) pyridinato-N, C ^{2 ′} )] (picolinato) iridium (abbreviation: FIrpic), bis {2- [3 ′, 5′-bis (trifluoro) Methyl) phenyl] pyridinato-N, C2 ^′ )} (picolinato) iridium (abbreviation: Ir (CF ₃ ppy) ₂ (pic)), tris (2-phenylpyridinato-N, C ^{2 ′} ) iridium (abbreviation) : Ir (ppy) ₃ ), (acetylacetonato) bis (2-phenylpyridinato-N, C2 ^' ) iridium (abbreviation: Ir (ppy) ₂ (acac)), (acetylacetonato) bis [2 - (2'-thienyl) pyridinato -N, C ^{3 ']} iridium _{(abbreviation: Ir (thp) 2 (acac} )), ( acetylacetonato) bis (2-phenylquinolinato--N, C ^2') Ili Um _{(abbreviation: Ir (pq) 2 (acac} )), ( acetylacetonato) bis [2- (2'-benzothienyl) pyridinato -N, C ^{3 ']} iridium (abbreviation: _Ir (btp) 2 (acac) A compound capable of emitting phosphorescence such as) can also be used. In addition, as a host material for forming a layer in which the light-emitting material is dispersed, 9,10-di (2-naphthyl) -2-tert-butylanthracene (abbreviation: t-BuDNA) or the like is used as a base material. Anthracene derivatives, carbazole derivatives such as 4,4′-bis (N-carbazolyl) biphenyl (abbreviation: CBP), tris (8-quinolinolato) aluminum (abbreviation: Alq ₃ ), tris (4-methyl-8-quinolinolato) aluminum (Abbreviation: Almq ₃ ), bis (10-hydroxybenzo [h] -quinolinato) beryllium (abbreviation: BeBq ₂ ), bis (2-methyl-8-quinolinolato) -4-phenylphenolato-aluminum (abbreviation: BAlq) , bis [2- (2-hydroxyphenyl) pyridinato] zinc (abbreviation: Znpp _2), bis [2- 2-hydroxyphenyl) benzoxazolato] zinc (abbreviation: ZnBOX) can be used and metal complexes such as. In addition, as a material whose light-emitting layer can be formed using only a light-emitting substance, tris (8-quinolinolato) aluminum (abbreviation: Alq3), 9,10-bis (2-naphthyl) anthracene (abbreviation: DNA), bis ( 2-methyl-8-quinolinolato) -4-phenylphenolato-aluminum (abbreviation: BAlq).

Specific examples of a substance that can be used for forming the electron-transporting layer include tris (8-quinolinolato) aluminum (abbreviation: Alq ₃ ), tris (4-methyl-8-quinolinolato) aluminum (abbreviation: Almq ₃ ). Bis (10-hydroxybenzo [h] -quinolinato) beryllium (abbreviation: BeBq ₂ ), bis (2-methyl-8-quinolinolato) -4-phenylphenolato-aluminum (abbreviation: BAlq), bis [2- ( 2- (hydroxyphenyl) benzoxazolate] zinc (abbreviation: Zn (BOX) ₂ ), bis [2- (2-hydroxyphenyl) benzothiazolate] zinc (abbreviation: Zn (BTZ) ₂ ), etc. 4-biphenylyl) -5- (4-tert-butylphenyl) -1,3,4-oxadiazole (abbreviation: PBD), 1 , 3-bis [5- (p-tert-butylphenyl) -1,3,4-oxadiazol-2-yl] benzene (abbreviation: OXD-7), 3- (4-biphenylyl) -4-phenyl -5- (4-tert-butylphenyl) -1,2,4-triazole (abbreviation: TAZ), 3- (4-biphenylyl) -4- (4-ethylphenyl) -5- (4-tert-butyl) Phenyl) -1,2,4-triazole (abbreviation: p-EtTAZ)), bathophenanthroline (abbreviation: BPhen), bathocuproin (abbreviation: BCP), 2,2 ′, 2 ″-(1,3,5- Benzenetriyl) -tris (1-phenyl-1H-benzimidazole) (abbreviation: TPBI), 4,4-bis (5-methylbenzoxazol-2-yl) stilbene (abbreviation: BzOs), and the like. That. The electron transport layer may be a layer having a multilayer structure formed by combining two or more layers made of the substances described above.

In addition, by providing the electron transport layer, the distance between the second electrode 103 and the light emitting layer can be increased, and light emission can be prevented from being quenched due to the metal contained in the second electrode 103. Can do. The electron transport layer is preferably formed using a substance having a high electron transport property, and particularly preferably formed using a substance having an electron mobility of 1 × 10 ⁻⁶ cm ² / Vs or higher.

  Specific examples of materials that can be used to form the electron injection layer include alkali metal or alkaline earth metal, alkali metal fluoride, alkaline earth metal fluoride, alkali metal oxide, alkaline earth Examples thereof include inorganic substances such as metal oxides. In addition to inorganic substances, substances that can be used to form an electron transport layer such as BPhen, BCP, p-EtTAZ, TAZ, and BzOs are also more preferable than those used to form an electron transport layer. In addition, by selecting a substance having a high electron affinity, it can be used as a substance for forming an electron injection layer. In other words, the electron injection layer can be formed by selecting a substance having an electron transport property such that the electron affinity in the electron injection layer is relatively larger than the electron affinity in the electron transport layer.

A transparent conductive film having translucency can be used to form the conductive layer 110. Specific examples include inorganic conductive films such as ITO, ITSO, and IZO, and inorganic compounds such as MoOx, VOx, and ZnO. semiconductor, a metal film is thinned so as to be able to transmit light, and a conductive organic compounds such as C _60.

The conductive layer 110 may be a stacked body of a layer that generates holes and a layer that generates electrons. This laminated body is provided in the order of a layer generating holes and a layer generating electrons from the layer functioning as a cathode. The layer that generates holes is a composite material of an inorganic compound and an organic compound. In this layer, the inorganic compound is a substance that exhibits an electron accepting property with respect to the organic compound, and the organic compound is a substance that has an excellent hole transporting property. It is. Although it is not particularly limited as an inorganic compound, transition metal oxides are preferable, specifically titanium oxide, zirconium oxide, hafnium oxide, vanadium oxide, niobium oxide, tantalum oxide, chromium oxide, molybdenum oxide, tungsten oxide, manganese oxide, Rhenium oxide is preferred. As the organic compound, the materials mentioned above as the material for the hole transport layer can be used, and among them, fragrances represented by TDATA, MTDATA, m-MTDAB, TPD, NPB, DNTPD, BBPB, TCTA, etc. Group amine compounds are a group of compounds that easily generate holes and are suitable as organic compounds. The layer that generates electrons is not particularly limited as long as it is a layer that can generate electrons. Specifically, a layer having an electron-transporting organic compound and a substance that exhibits an electron-donating property with respect to the organic compound. It only has to be included. Examples of the electron transporting organic compound include Alq ₃ , Almq ₃ , BeBq ₂ , BAlq, Zn (BOX) ₂ , Zn (BTZ) ₂ , BPhen, BCP, PBD, OXD-7, TPBI, TAZ, p-EtTAZ etc. can be used. In addition, examples of the substance exhibiting an electron donating property include alkali metals or alkaline earth metals such as lithium, magnesium, calcium, and barium, and alloys thereof. Alternatively, an alkali metal compound or an alkaline earth metal compound such as lithium oxide, barium oxide, lithium nitride, magnesium nitride, or calcium nitride can be used. Further, a light-transmitting transparent conductive film may be provided between the hole generating layer and the electron generating layer. Examples, ITO, ITSO, inorganic conductive film IZO, etc., MoOx, VOx, inorganic compound semiconductor such as ZnO, a metal film is thinned so as to be able to transmit _light, conductive organic compounds such as _{C 60} and Can be mentioned.

  Note that the conductive layer 110 desirably has as little absorption as possible in the visible light region. Here, in the layer that generates holes, by using an organic material having a structure represented by the following general formula for the organic compound, absorption in the visible light region on the light emission side can be reduced.

ただし、式中Ｒ^１〜Ｒ^２４は、それぞれ同一でも異なっていても良く、水素、アルキル基、アルコキシ基、アリール基、アリールアルキル基のいずれかを表す。

However, in the formula, R ^{1 to} R ²⁴ may be the same or different and each represents hydrogen, an alkyl group, an alkoxy group, an aryl group, or an arylalkyl group.

ただし、式中Ｘは、構造式（２−１）〜（２−６）に示す芳香族炭化水素基のいずれかを表し、Ｒ^１〜Ｒ^２０はそれぞれ同一でも異なっていてもよく、水素、アルキル基、アルコキシ基、アリール基のいずれかを表す。

In the formula, X represents any of the aromatic hydrocarbon groups represented by the structural formulas (2-1) to (2-6), and R ^{1 to} R ²⁰ may be the same or different from each other, hydrogen, It represents any of an alkyl group, an alkoxy group, and an aryl group.

ただし、式中Ｒ^１〜Ｒ^９はそれぞれ同一でも異なっていても良く、水素、アルキル基、アルコキシ基、アリール基のいずれかを表す。

However, in the formula, R ^{1 to} R ⁹ may be the same or different and each represents hydrogen, an alkyl group, an alkoxy group, or an aryl group.

  The conductive layer 110 may be a stacked body in which a hole generating layer, a transparent conductive film, and an electron generating layer are stacked in this order from the layer functioning as a cathode.

  Note that it is preferable that the conductive layer 110 have a thickness of 50 nm or less because the influence can be reduced even if the conductive layer 110 has absorption in the visible light region.

  Since the conductive layer 110 is provided for each pixel and its end is covered with the first light-emitting body 101 and the second light-emitting body 102, the occurrence of crosstalk between the pixels is suppressed and the light-emitting device. Display quality is improved. Thus, the light emitting device of the present invention can be a light emitting device with high luminous efficiency and high display quality. In addition, since the conductive layer 110 is covered with the first light-emitting body 101 and the second light-emitting body 102, there is no possibility that the second electrode 103 and the conductive layer 110 are short-circuited. The initial failure due to the short of the layer 110 at the end of the conductive layer 110 can be eliminated.

  FIG. 1B is a schematic view illustrating an example of an active matrix light-emitting device of the present invention. A thin film transistor including a semiconductor layer 201, a gate insulating film, and a gate electrode 202 is formed over the substrate 200. The first electrode 205, the first light emitter 207, the conductive layer 250, and the first thin film are formed over the thin film transistor through the interlayer insulating film 203. A light emitting element including the second light emitter 208 and the second electrode 209 is formed. An end portion of the first electrode 205 of the light emitting element is covered with a partition wall 206, and the light emitting element is formed in a portion where the first electrode 205 is exposed from the partition wall 206. The light emitting element is electrically connected to the thin film transistor through the electrode 204, and light emission is controlled.

  The substrate 200 is used as a support for a thin film transistor or a light emitting element, and as its material, glass, quartz, plastic (polyimide, acrylic, polyethylene terephthalate, polycarbonate, polyacrylate, polyethersulfone, etc.) can be used. In addition, as long as it can be used as a support of a thin film transistor or a light emitting element, it may be formed of a material other than these. Further, the substrate may be polished by CMP (Chemical Mechanical Polishing) or the like as necessary.

  A base insulating film may be provided as a single layer or a multilayer between the substrate 200 and the semiconductor layer 201. The base insulating film is provided in order to prevent an element such as an alkali metal or an alkaline earth metal in the substrate 200 that adversely affects the characteristics of the semiconductor film from diffusing into the semiconductor layer. As a material, silicon oxide, silicon nitride, silicon oxide containing nitrogen, silicon nitride containing oxygen, or the like can be used. Note that the base insulating layer does not need to be provided if diffusion of impurities from the substrate is not a concern.

  In the present invention, an example of a top gate type (forward stagger type) thin film transistor is shown in the present invention, but a thin film transistor of another shape such as a bottom gate type (reverse stagger type) may be used, and the present invention is a type of transistor for driving a light emitting element. The driving method is not limited.

  The interlayer insulating film 203 is provided to prevent electrical contact between the thin film transistor and the light emitting element in unnecessary portions, and may be a single layer or a multilayer. The interlayer insulating film 203 is preferably formed of a material having self-planarity so that at least one layer can relieve unevenness generated by a lower thin film transistor or the like. For example, acrylic, polyimide, or a skeleton structure composed of a bond of silicon and oxygen, an organic group containing at least hydrogen as a substituent (for example, an alkyl group or an aryl group), a fluoro group, or an organic group containing at least hydrogen and fluoro It is desirable to use a material having a group, such as a so-called siloxane material. As other materials, silicon oxide, silicon nitride, silicon oxide containing silicon nitride, silicon nitride containing silicon oxide, a low dielectric constant material, or the like can be used.

  A light-emitting element including the first electrode 205, the first light-emitting body 207, the conductive layer 250, the second light-emitting body 208, and the second electrode 209 has the same structure as the light-emitting element described in FIG. ing. The edge of the first electrode 205 of the light-emitting element is covered with a partition 206, and a portion where the first electrode 205 is exposed from the partition 206 is a light-emitting region of the light-emitting element. The partition wall 206 can be formed using the same material as the material described for the interlayer insulating film 203.

  The electrode 204 that electrically connects the first electrode 205 of the light-emitting element and the thin film transistor is formed of a single layer or a multilayer of aluminum, copper, an alloy of aluminum, carbon, nickel, an alloy of aluminum, carbon, and molybdenum. In the case of a multilayer structure, for example, a laminated structure such as molybdenum, aluminum, molybdenum, titanium, aluminum, titanium or titanium, titanium nitride, aluminum, and titanium from the thin film transistor side can be considered.

  In the light-emitting device of the present invention as shown in FIG. 1B, a conductive layer 250 in the light-emitting element is provided for each pixel, and an end portion of the light-emitting device covers the first light-emitting body 207 and the second light-emitting body 208. Therefore, it is possible to obtain a light emitting device in which occurrence of crosstalk between pixels is suppressed and display quality of the light emitting device is improved. Thus, the light emitting device of the present invention can be a light emitting device with high luminous efficiency and high display quality. In addition, since the conductive layer 250 is covered with the first light emitter 207 and the second light emitter 208, there is no possibility that the second electrode 209 and the conductive layer 250 are short-circuited at the end portion of the conductive layer 250. An initial failure due to a short circuit between the second electrode 209 and the conductive layer 250 can be eliminated.

  Further, it is more preferable that the end portion of the conductive layer 250 be formed outside the end portion of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. A light-emitting element used in the light-emitting device of the present invention can obtain desired light emission only from a region where the conductive layer 250 and the first light-emitting body are in contact with each other when viewed from the substrate surface direction, and the other regions emit light. The light itself cannot be obtained, or only light emission whose luminance is extremely low can be obtained. Alternatively, it is not possible to obtain light emission of a desired color. Therefore, if the conductive layer 250 is formed so as to coincide with the light emitting region, when the conductive layer 250 is formed, the light emitting region is reduced or the display quality is deteriorated when the forming region is slightly shifted. End up. However, by forming the end portion of the conductive layer 250 outside the end portion of the light emitting region, even if the conductive layer 250 is formed slightly deviated, the deterioration of display quality can be reduced. it can. This is particularly suitable when applied to an active matrix light-emitting device in which mask alignment must be performed very severely, and it is possible to suppress deterioration in display quality and throughput due to misalignment of mask alignment.

  FIG. 1C is a schematic diagram illustrating an example of a passive matrix light-emitting device of the present invention. A first electrode 301, a first light-emitting body 303, a conductive layer 350, and a second layer are formed over a substrate 300. A light emitting element including the light emitter 304 and the second electrode 305 is formed. The light-emitting element is separated from other light-emitting elements having the same first electrode 301 by a partition wall 302. The substrate 300, the first electrode 301, the first light emitter 303, the conductive layer 350, the second light emitter 304, the second electrode 305, and the partition wall 302 are the substrate 200, the first electrode in FIG. 205, the first light-emitting body 207, the conductive layer 250, the second light-emitting body 208, the second electrode 209, and the partition wall 206, and similar materials can be used.

  In the light-emitting device of the present invention as illustrated in FIG. 1C, the conductive layer 350 in the light-emitting element is provided for each pixel, and the end portions of the conductive layer 350 are the first light-emitting body 303 and the second light-emitting element. Since it is covered with the light emitter 304, crosstalk between pixels can be suppressed. Thus, the light emitting device of the present invention can be a light emitting device with high luminous efficiency and high display quality. In addition, since the conductive layer 350 is covered with the first light-emitting body 303 and the second light-emitting body 304, there is no possibility that the second electrode 305 and the conductive layer 350 are short-circuited at the end portion of the conductive layer 350. An initial failure due to a short circuit between the second electrode 305 and the conductive layer 350 can be eliminated.

  Further, it is more preferable that the end portion of the conductive layer 350 be formed outside the end portion of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. A light-emitting element used in the light-emitting device of the present invention can obtain desired light emission only from a region where the conductive layer 350 and the first light-emitting body 303 are formed in contact with each other when viewed from the substrate surface direction. Light emission itself cannot be obtained, or only light emission with extremely low luminance can be obtained. Alternatively, it is not possible to obtain light emission of a desired color. Therefore, if the conductive layer 350 is formed so as to coincide with the light emitting region, when the conductive layer 350 is formed, the light emitting region is reduced or the display quality is deteriorated when the forming region is slightly shifted. End up. However, by forming the end portion of the conductive layer 350 outside the end portion of the light emitting region, even if the conductive layer 350 is formed slightly deviated, the deterioration of display quality is reduced. Can do. This is particularly suitable when applied to a high-definition passive matrix light-emitting device in which mask alignment must be performed very severely, and it is possible to suppress degradation in display quality and throughput due to misalignment of mask alignment. .

(Embodiment 2)
FIG. 2 is a schematic view of the light emitting device of the present invention. FIG. 2A illustrates one light-emitting element in the light-emitting device, which includes a first electrode 100, a first light-emitting body 101, a second light-emitting body 102, a second electrode 103, a conductive layer 110, and a conductive layer. 111 is included. 2A, the first electrode 100, the first light-emitting body 101, the second light-emitting body 102, the second electrode 103, and the conductive layer 110 are exactly the same as those in FIG. 1A. 1 (A) is applied. The conductive layer 111 is separated for each pixel, and the same material as that of the conductive layer 110 can be used for the configuration and material thereof. Alternatively, the conductive layer 111 may be formed using only a layer that generates holes and a layer that generates electrons, which are described in the description of the structure of the conductive layer 110 in Embodiment 1.

  In the light-emitting device of the present invention, the light-emitting element has a plurality of light-emitting bodies including the first light-emitting body 101 and the second light-emitting body 102. Therefore, the light emitting materials included in the first light emitting body 101 and the second light emitting body 102 are different light emitting materials having different light emission colors, so that the light emission colors of the respective light emitting materials are mixed from the light emitting element. Light emission can be obtained. The number of light emitters is not limited to two and may be more than that. In that case, the conductive layer 110 is provided between the light emitters.

  In addition, by using the same light-emitting substance in the first light-emitting body 101 and the second light-emitting body 102, the current density is lower than that of other light-emitting devices that include the light-emitting substance and have a single light-emitting body. It is possible to obtain the same brightness. If the current density is the same, it is possible to obtain about twice the luminance.

  In addition, even when the conductive layer 111 has a large thickness, the resistance of the conductive layer 111 is smaller than that of the light emitter, and thus the drive voltage of the light emitting element is not increased. Therefore, by providing the conductive layer 111 with an appropriate film thickness, it is possible to adjust the optical path length until light emitted from the light emitter reaches the first electrode 100. Since the optical path length to the first electrode 100 can be adjusted, the color purity and viewing angle dependency of light emission are controlled by the microcavity effect using the reflected light generated at the interface of the first electrode 100. It becomes possible to perform optical design such as, and display quality can be further improved. Further, since the conductive layer 111 can be made thicker, even if irregularities are generated on the surface of the first electrode 100 for some reason or foreign matters are present on the first electrode, the irregularities are not generated. Can ease or cover foreign objects. As a result, defects (such as a short circuit) caused by unevenness or foreign matter on the first electrode 100 can be reduced.

  Since the conductive layer 110 is provided for each pixel and the end thereof is covered with the first light-emitting body 101 and the second light-emitting body 102, occurrence of crosstalk between the pixels is suppressed and the light-emitting device. Display quality is improved. Thus, the light emitting device of the present invention can be a light emitting device with high luminous efficiency and high display quality. In addition, since the conductive layer 110 is covered with the first light-emitting body 101 and the second light-emitting body 102, there is no possibility that the second electrode 103 and the conductive layer 110 are short-circuited at the end portion of the conductive layer 110. Initial defects due to short-circuiting between the second electrode 103 and the conductive layer 110 can be eliminated.

  FIG. 2B is a schematic view illustrating an example of an active matrix light-emitting device of the present invention. A thin film transistor including a semiconductor layer 201, a gate insulating film, and a gate electrode 202 is formed over a substrate 200. A first electrode 205, a conductive layer 251, a first light emitter 207, and a conductive film are formed over the thin film transistor through an interlayer insulating film 203. A light-emitting element including the layer 250, the second light emitter 208, and the second electrode 209 is formed. An end portion of the first electrode 205 of the light emitting element is covered with a partition wall 206, and the light emitting element is formed in a portion where the first electrode 205 is exposed from the partition wall 206. The light emitting element is electrically connected to the thin film transistor through the electrode 204, and light emission is controlled. In the light-emitting device illustrated in FIG. 2B, the structure other than the conductive layer 251 is the same as that in FIG. 1B and thus follows the description of FIG. The conductive layer 251 is separated for each pixel, and the structure and material of the conductive layer 251 can be the same material as that of the conductive layer 250. Alternatively, the conductive layer 251 may be formed using only a layer that generates holes and a layer that generates electrons, which are described in the description of the structure of the conductive layer 110 in Embodiment 1.

  Further, even when the conductive layer 251 has a large film thickness, the resistance of the conductive layer 251 is smaller than that of the light emitter, and thus the drive voltage of the light emitting element is not increased. Therefore, by providing the conductive layer 251 with an appropriate thickness, it is possible to adjust the optical path length until light emitted from the light emitter reaches the first electrode 205. Since the optical path length to the first electrode 205 can be adjusted, the reflected light generated at the interface of the first electrode 205 is used to control the color purity and viewing angle dependency of light emission by the interference effect. The optical design can be performed, and the display quality can be further improved. Further, since the conductive layer 251 can be thickened, unevenness is generated on the surface of the first electrode 205 for some reason or foreign matter is present on the first electrode 205. Can be eased and foreign substances can be covered. As a result, defects (such as a short circuit) caused by unevenness or foreign matter on the first electrode 205 can be reduced.

  In the light-emitting device of the present invention as illustrated in FIG. 2B, the conductive layer 250 in the light-emitting element is provided for each pixel, and the end portion covers the first light-emitting body 207 and the second light-emitting body 208. Therefore, the occurrence of crosstalk between pixels is suppressed, and the display quality of the light emitting device is improved. Thus, the light emitting device of the present invention can be a light emitting device with high luminous efficiency and high display quality. In addition, since the conductive layer 250 is covered with the first light emitter 207 and the second light emitter 208, there is no possibility that the second electrode 209 and the conductive layer 250 are short-circuited at the end portion of the conductive layer 250. An initial failure due to a short circuit between the second electrode 209 and the conductive layer 250 can be eliminated.

  Further, it is more preferable that the end portion of the conductive layer 250 be formed outside the end portion of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. A light-emitting element used in the light-emitting device of the present invention can obtain desired light emission only from a region where the first electrode 205 and the conductive layer 251 are in contact with each other when viewed from the substrate surface direction, and other regions emit light. The light itself cannot be obtained, or only light emission whose luminance is extremely low can be obtained. Alternatively, it is not possible to obtain light emission of a desired color. Therefore, if the conductive layer 250 is formed so as to coincide with the light emitting region, when the conductive layer 250 is formed, the light emitting region is reduced or the display quality is deteriorated when the forming region is slightly shifted. End up. However, by forming the end portion of the conductive layer 250 outside the end portion of the light emitting region, even if the conductive layer 250 is formed slightly deviated, the deterioration of display quality can be reduced. it can. This is particularly suitable for application to active matrix light-emitting devices and high-definition passive matrix light-emitting devices that require very severe mask alignment, resulting in poor display quality and low throughput due to misalignment of the mask alignment. Can be suppressed.

  The conductive layer 251 is also preferably formed so that the end thereof is positioned outside the end of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. As a result, even if the conductive layer 251 is formed slightly deviated, the conductive layer 251 can remain covering the light emitting region, so that display quality and throughput can be prevented from being lowered.

  FIG. 2C is a schematic diagram illustrating an example of a passive matrix light-emitting device of the present invention. A first electrode 301, a conductive layer 351, a first light-emitting body 303, and a conductive layer 350 are formed over a substrate 300. A light emitting element including the second light emitter 304 and the second electrode 305 is formed. The light-emitting element is separated from another light-emitting element having the same first electrode 301 by a partition wall 302. In the light-emitting device illustrated in FIG. 2C, the structure other than the conductive layer 351 is the same as that in FIG. 1C and thus follows the description of FIG. The conductive layer 351 is separated for each pixel, and the structure and material of the conductive layer 351 can be the same material as that of the conductive layer 350. Alternatively, the conductive layer 351 may be formed using only a layer that generates holes and a layer that generates electrons, which are described in the description of the structure of the conductive layer 110 in Embodiment 1.

  In the light-emitting device of the present invention as illustrated in FIG. 2C, the conductive layer 350 in the light-emitting element is provided for each pixel, and an end portion of the light-emitting device covers the first light-emitting body 303 and the second light-emitting body 304. Therefore, the occurrence of crosstalk between pixels is suppressed, and the display quality of the light emitting device is improved. Thus, the light emitting device of the present invention can be a light emitting device with high luminous efficiency and high display quality. In addition, since the conductive layer 350 is covered with the first light-emitting body 303 and the second light-emitting body 304, there is no possibility that the second electrode 305 and the conductive layer 350 are short-circuited at the end portion of the conductive layer 350. An initial failure due to a short circuit between the second electrode 305 and the conductive layer 350 can be eliminated.

  Further, it is more preferable that the end portion of the conductive layer 350 be formed outside the end portion of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. In a light-emitting element used in the light-emitting device of the present invention, desired light emission can be obtained only from a region where the conductive layer 351 is in contact with the first electrode 301 when viewed from the substrate surface direction, and other regions emit light. The light itself cannot be obtained, or only light emission whose luminance is extremely low can be obtained. Alternatively, it is not possible to obtain light emission of a desired color. Therefore, if the conductive layer 350 is formed so as to coincide with the light emitting region, when the conductive layer 350 is formed, the light emitting region is reduced or the display quality is deteriorated when the forming region is slightly shifted. End up. However, by forming the end portion of the conductive layer 350 outside the end portion of the light emitting region, even if the conductive layer 350 is formed slightly deviated, the deterioration of display quality can be reduced. it can. This is particularly suitable for application to active matrix light-emitting devices and high-definition passive matrix light-emitting devices that require very severe mask alignment, resulting in poor display quality and low throughput due to misalignment of the mask alignment. Can be suppressed.

  In addition, the conductive layer 351 is preferably formed so that the end portion thereof is located outside the end portion of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. As a result, even if the conductive layer 351 is formed slightly deviated, the conductive layer 251 can remain covering the light emitting region, so that display quality and throughput can be prevented from being lowered.

(Embodiment 3)
FIG. 3 is a schematic view of the light emitting device of the present invention. FIG. 3A illustrates one light-emitting element in the light-emitting device, which includes a first electrode 100, a first light-emitting body 101, a second light-emitting body 102, a second electrode 103, a conductive layer 110, and a conductive layer. 112 is included. 3A, the first electrode 100, the first light-emitting body 101, the second light-emitting body 102, the second electrode 103, and the conductive layer 110 have the same structure as that in FIG. 1A. 1 (A) is applied. The conductive layer 112 is provided between the second light emitter 102 and the second electrode 103, and an end portion thereof is covered with the second light emitter 102 and the second electrode 103, and is separated for each pixel. ing. The structure and material of the conductive layer 112 can be the same material as that of the conductive layer 110. Alternatively, the conductive layer 112 may be formed using only the layer that generates holes and the layer that generates electrons described in the description of the structure of the conductive layer 110 in Embodiment 1.

  In the light-emitting device of the present invention, the light-emitting element has a plurality of light-emitting bodies including the first light-emitting body 101 and the second light-emitting body 102. Therefore, the light emitting materials included in the first light emitting body 101 and the second light emitting body 102 are different light emitting materials having different light emission colors, so that the light emission colors of the respective light emitting materials are mixed from the light emitting element. Light emission can be obtained. Note that the number of light emitters is not limited to two, and may be more. In that case, the conductive layer 110 is provided between the light emitters.

  In addition, by using the same light-emitting substance in the first light-emitting body 101 and the second light-emitting body 102, the current density is lower than that of other light-emitting devices that include the light-emitting substance and have a single light-emitting body. It is possible to obtain the same brightness.

  Further, even when the conductive layer 112 has a large thickness, the resistance of the conductive layer 112 is smaller than that of the light emitter, so that the drive voltage of the light emitting element is not increased. Therefore, by providing the conductive layer 112 with an appropriate film thickness, it is possible to adjust the optical path length until the light emitted from the light emitter reaches the second electrode 103. Since the optical path length to the second electrode 103 can be adjusted, the reflected light generated at the interface of the second electrode 103 is used to control the color purity and viewing angle dependency of light emission by the interference effect. The optical design can be performed, and the display quality can be further improved.

  Since the conductive layer 110 is provided for each pixel and the end thereof is covered with the first light-emitting body 101 and the second light-emitting body 102, occurrence of crosstalk between the pixels is suppressed and the light-emitting device. Display quality is improved. Thus, the light emitting device of the present invention can be a light emitting device with high luminous efficiency and high display quality. In addition, since the conductive layer 110 is covered with the first light-emitting body 101 and the second light-emitting body 102, there is no possibility that the second electrode 103 and the conductive layer 110 are short-circuited at the end portion of the conductive layer 110. Initial defects due to short-circuiting between the second electrode 103 and the conductive layer 110 can be eliminated.

  FIG. 3B is a schematic view illustrating an example of an active matrix light-emitting device of the present invention. A thin film transistor including a semiconductor layer 201, a gate insulating film, and a gate electrode 202 is formed over the substrate 200. The first electrode 205, the first light emitter 207, the conductive layer 250, and the first thin film are formed over the thin film transistor through the interlayer insulating film 203. A light emitting element including the second light emitter 208, the conductive layer 252, and the second electrode 209 is formed. An end portion of the first electrode 205 of the light emitting element is covered with a partition wall 206, and the light emitting element is formed in a portion where the first electrode 205 is exposed from the partition wall 206. The light emitting element is electrically connected to the thin film transistor through the electrode 204, and light emission is controlled. In the light-emitting device illustrated in FIG. 3B, the structure other than the conductive layer 252 is the same as that in FIG. 1B and thus follows the description of FIG. The conductive layer 252 is provided between the second light emitter 208 and the second electrode 209, and an end portion of the conductive layer 252 is covered with the second light emitter 208 and the second electrode 209 and is separated for each pixel. ing. The structure and material of the conductive layer 252 can be the same material as that of the conductive layer 250. Alternatively, the conductive layer 252 may be formed using only a layer that generates holes and a layer that generates electrons, which are described in the description of the structure of the conductive layer 110 in Embodiment 1.

  Further, even when the thickness of the conductive layer 252 is increased, the resistance of the conductive layer 252 is smaller than that of the light emitter, so that the drive voltage of the light emitting element is not increased. Therefore, by providing the conductive layer 252 with an appropriate thickness, the optical path length until light emitted from the light emitter reaches the second electrode 209 can be adjusted. Since the optical path length to the second electrode 209 can be adjusted, the reflected light generated at the interface of the second electrode 209 is used to control the color purity and viewing angle dependency of light emission by the interference effect. The optical design can be performed, and the display quality can be further improved.

  In the light-emitting device of the present invention as illustrated in FIG. 3B, the conductive layer 250 in the light-emitting element is provided for each pixel, and the end portion covers the first light-emitting body 207 and the second light-emitting body 208. Therefore, the occurrence of crosstalk between pixels is suppressed, and the display quality of the light emitting device is improved. Thus, the light emitting device of the present invention can be a light emitting device with high luminous efficiency and high display quality. In addition, since the conductive layer 250 is covered with the first light emitter 207 and the second light emitter 208, there is no possibility that the second electrode 209 and the conductive layer 250 are short-circuited at the end portion of the conductive layer 250. An initial failure due to a short circuit between the second electrode 209 and the conductive layer 250 can be eliminated.

  Further, it is more preferable that the end portion of the conductive layer 250 be formed outside the end portion of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. A light-emitting element used in the light-emitting device of the present invention can obtain desired light emission only from a region where the first electrode 205 is formed in contact with the first light-emitting body 207 when viewed from the substrate surface direction. In the region, light emission itself cannot be obtained, or only light emission with extremely low luminance can be obtained. Alternatively, it is not possible to obtain light emission of a desired color. Therefore, if the conductive layer 250 is formed so as to coincide with the light emitting region, when the conductive layer 250 is formed, the light emitting region is reduced or the display quality is deteriorated when the forming region is slightly shifted. End up. However, by forming the end portion of the conductive layer 250 outside the end portion of the light emitting region, even if the conductive layer 250 is formed slightly deviated, the deterioration of display quality can be reduced. it can. This is particularly suitable for application to active matrix light-emitting devices and high-definition passive matrix light-emitting devices that require very severe mask alignment, resulting in poor display quality and low throughput due to misalignment of the mask alignment. Can be suppressed.

  In addition, the conductive layer 252 is preferably formed so that the end portion thereof is located outside the end portion of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. Accordingly, even if the conductive layer 252 is formed with a slight shift, the conductive layer 252 can remain covering the light emitting region, so that deterioration in display quality and throughput can be suppressed.

  FIG. 3C is a schematic view illustrating an example of a passive matrix light-emitting device of the present invention. A first electrode 301, a first light-emitting body 303, a conductive layer 350, and a second layer are formed over a substrate 300. A light-emitting element including the light-emitting body 304, the conductive layer 352, and the second electrode 305 is formed. The light-emitting element is separated from another light-emitting element having the same first electrode 301 by a partition wall 302. In the light-emitting device illustrated in FIG. 3C, the structure other than the conductive layer 352 is the same as that in FIG. 1C and thus follows the description of FIG. The conductive layer 352 is provided between the second light-emitting body 304 and the second electrode 305, and an end portion thereof is covered with the second light-emitting body 304 and the second electrode 305, and is separated for each pixel. ing. The conductive layer 352 can be formed using the same material and material as the conductive layer 350. Alternatively, the conductive layer 352 may be formed using only a layer that generates holes and a layer that generates electrons, which are described in the description of the structure of the conductive layer 110 in Embodiment 1.

  In the light-emitting device of the present invention as illustrated in FIG. 3C, the conductive layer 350 in the light-emitting element is provided for each pixel, and an end portion of the light-emitting device covers the first light-emitting body 303 and the second light-emitting body 304. Therefore, the occurrence of crosstalk between pixels is suppressed, and the display quality of the light emitting device is improved. Thus, the light emitting device of the present invention can be a light emitting device with high luminous efficiency and high display quality. In addition, since the conductive layer 350 is covered with the first light-emitting body 303 and the second light-emitting body 304, there is no possibility that the second electrode 305 and the conductive layer 350 are short-circuited at the end portion of the conductive layer 350. An initial failure due to a short circuit between the second electrode 305 and the conductive layer 350 can be eliminated.

  Further, it is more preferable that the end portion of the conductive layer 350 be formed outside the end portion of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. A light-emitting element used in the light-emitting device of the present invention can obtain desired light emission only from a region where the first electrode 301 is in contact with the first light-emitting body 303 when viewed from the substrate surface direction. In the region, light emission itself cannot be obtained, or only light emission with extremely low luminance can be obtained. Alternatively, it is not possible to obtain light emission of a desired color. Therefore, if the conductive layer 350 is formed so as to coincide with the light emitting region, when the conductive layer 350 is formed, the light emitting region is reduced or the display quality is deteriorated when the forming region is slightly shifted. End up. However, by forming the end portion of the conductive layer 350 outside the end portion of the light emitting region, even if the conductive layer 350 is formed slightly deviated, the deterioration of display quality can be reduced. it can. This is particularly suitable for application to active matrix light-emitting devices and high-definition passive matrix light-emitting devices that require very severe mask alignment, resulting in poor display quality and low throughput due to misalignment of the mask alignment. Can be suppressed.

  In addition, the conductive layer 352 is preferably formed so that the end portion thereof is located outside the end portion of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. As a result, even if the conductive layer 352 is formed slightly deviated, the conductive layer 352 can remain covering the light emitting region, so that deterioration in display quality and throughput can be suppressed.

(Embodiment 4)
FIG. 4 is a schematic view of the light emitting device of the present invention. FIG. 4A illustrates one light-emitting element in the light-emitting device. The first electrode 100, the first light-emitting body 101, the second light-emitting body 102, the second electrode 103, the conductive layer 110, and the conductive layer 111 and a conductive layer 112. 4A, the first electrode 100, the first light emitter 101, the second light emitter 102, the second electrode 103, and the conductive layer 110 have the same structure as that in FIG. 1A. 1 (A) is applied. The conductive layer 111 is the same as that in FIG. 2A, and the conductive layer 112 is the same as that in FIG. 3A. Since the light-emitting device in this embodiment has a conductive layer on both the first electrode 100 side and the second electrode 103 side, optical design can be performed on both sides of the light-emitting element; It can be performed. In addition, since the conductive layer 111 is provided on the first electrode 100 side, defects (such as a short circuit) caused by unevenness or foreign matter on the first electrode 100 can be reduced.

  In the light-emitting device of the present invention, the light-emitting element has a plurality of light-emitting bodies including the first light-emitting body 101 and the second light-emitting body 102. Therefore, the light emitting materials included in the first light emitting body 101 and the second light emitting body 102 are different light emitting materials having different light emission colors, so that the light emission colors of the respective light emitting materials are mixed from the light emitting element. Light emission can be obtained. Note that the number of light emitters is not limited to two, and may be more. In that case, the conductive layer 110 is provided between the light emitters.

  In addition, by using the same light-emitting substance in the first light-emitting body 101 and the second light-emitting body 102, the current density is lower than that of other light-emitting devices that include the light-emitting substance and have a single light-emitting body. It is possible to obtain the same brightness.

  Since the conductive layer 110 is provided for each pixel and the end thereof is covered with the first light-emitting body 101 and the second light-emitting body 102, occurrence of crosstalk between the pixels is suppressed and the light-emitting device. Display quality is improved. Thus, the light emitting device of the present invention can be a light emitting device with high luminous efficiency and high display quality. In addition, since the conductive layer 110 is covered with the first light-emitting body 101 and the second light-emitting body 102, there is no possibility that the second electrode 103 and the conductive layer 110 are short-circuited at the end portion of the conductive layer 110. Initial defects due to short-circuiting between the second electrode 103 and the conductive layer 110 can be eliminated.

  FIG. 4B is a schematic view illustrating an example of an active matrix light-emitting device of the present invention. A thin film transistor including a semiconductor layer 201, a gate insulating film, and a gate electrode 202 is formed over a substrate 200. A first electrode 205, a conductive layer 251, a first light emitter 207, and a conductive film are formed over the thin film transistor through an interlayer insulating film 203. A light-emitting element including the layer 250, the second light emitter 208, the conductive layer 252, and the second electrode 209 is formed. An end portion of the first electrode 205 of the light emitting element is covered with a partition wall 206, and the light emitting element is formed in a portion where the first electrode 205 is exposed from the partition wall 206. The light emitting element is electrically connected to the thin film transistor through the electrode 204, and light emission is controlled. In the light-emitting device illustrated in FIG. 4B, the structure other than the conductive layer 251 and the conductive layer 252 is the same as that in FIG. 1B and thus follows the description of FIG. The conductive layer 251 conforms to the description in FIG. 2B, and the conductive layer 252 conforms to the description in FIG. Since the light-emitting device in this embodiment includes a conductive layer on both the first electrode 205 side and the second electrode 209 side, optical design can be performed on both sides of the light-emitting element; It can be performed. In addition, since the conductive layer 251 is provided on the first electrode 205 side, defects (such as a short circuit) caused by unevenness or foreign matter on the first electrode 205 can be reduced.

  In the light-emitting device of the present invention as illustrated in FIG. 4B, the conductive layer 250 in the light-emitting element is provided for each pixel, and an end portion of the light-emitting device covers the first light-emitting body 207 and the second light-emitting body 208. Therefore, the occurrence of crosstalk between pixels is suppressed, and the display quality of the light emitting device is improved. Thus, the light emitting device of the present invention can be a light emitting device with high luminous efficiency and high display quality. In addition, since the conductive layer 250 is covered with the first light emitter 207 and the second light emitter 208, there is no possibility that the second electrode 209 and the conductive layer 250 are short-circuited at the end portion of the conductive layer 250. An initial failure due to a short circuit between the second electrode 209 and the conductive layer 250 can be eliminated.

  Further, it is more preferable that the end portion of the conductive layer 250 be formed outside the end portion of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. A light-emitting element used in the light-emitting device of the present invention can obtain desired light emission only from a region where the conductive layer 251 and the first electrode 205 are in contact with each other when viewed from the substrate surface direction, and the other regions emit light. The light itself cannot be obtained, or only light emission whose luminance is extremely low can be obtained. Alternatively, it is not possible to obtain light emission of a desired color. Therefore, if the conductive layer 250 is formed so as to coincide with the light emitting region, when the conductive layer 250 is formed, the light emitting region is reduced or the display quality is deteriorated when the forming region is slightly shifted. End up. However, by forming the end portion of the conductive layer 250 outside the end portion of the light emitting region, even if the conductive layer 250 is formed slightly deviated, the deterioration of display quality can be reduced. it can. This is particularly suitable for application to active matrix light-emitting devices and high-definition passive matrix light-emitting devices that require very severe mask alignment, resulting in poor display quality and low throughput due to misalignment of the mask alignment. Can be suppressed.

  The conductive layers 251 and 252 are also preferably formed so that the end portions thereof are located outside the end portions of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. As a result, even if the conductive layer 251 and the conductive layer 252 are formed slightly deviated from each other, the conductive layer 251 and the conductive layer 252 can remain covering the light emitting region, so that deterioration in display quality and throughput are suppressed. be able to.

  FIG. 4C is a schematic diagram illustrating an example of a passive matrix light-emitting device of the present invention. A first electrode 301, a conductive layer 351, a first light-emitting body 303, and a conductive layer 350 are formed over a substrate 300. A light emitting element including the second light emitter 304, the conductive layer 352, and the second electrode 305 is formed. The light-emitting element is separated from another light-emitting element having the same first electrode 301 by a partition wall 302. In the light-emitting device illustrated in FIG. 4C, the structure other than the conductive layer 351 and the conductive layer 352 is the same as that in FIG. 1C and thus follows the description of FIG. The conductive layer 351 conforms to the description of FIG. 2C, and the conductive layer 352 conforms to the description of FIG. Since the light-emitting device in this embodiment includes a conductive layer on both the first electrode 301 side and the second electrode 305 side, optical design can be performed on both sides of the light-emitting element; It can be performed. In addition, since the conductive layer 351 is provided on the first electrode 301 side, defects (such as a short circuit) caused by unevenness or foreign matter on the first electrode 301 can be reduced.

  In the light-emitting device of the present invention as illustrated in FIG. 4C, the conductive layer 350 in the light-emitting element is provided for each pixel, and an end portion of the light-emitting device covers the first light-emitting body 303 and the second light-emitting body 304. Therefore, the occurrence of crosstalk between pixels is suppressed, and the display quality of the light emitting device is improved. Thus, the light emitting device of the present invention can be a light emitting device with high luminous efficiency and high display quality. In addition, since the conductive layer 350 is covered with the first light-emitting body 303 and the second light-emitting body 304, there is no possibility that the second electrode 305 and the conductive layer 350 are short-circuited at the end portion of the conductive layer 350. An initial failure due to a short circuit between the second electrode 305 and the conductive layer 350 can be eliminated.

  Further, it is more preferable that the end portion of the conductive layer 350 be formed outside the end portion of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. In a light-emitting element used in the light-emitting device of the present invention, desired light emission can be obtained only from a region where the conductive layer 351 is in contact with the first electrode 301 when viewed from the substrate surface direction, and other regions emit light. The light itself cannot be obtained, or only light emission whose luminance is extremely low can be obtained. Alternatively, it is not possible to obtain light emission of a desired color. Therefore, if the conductive layer 350 is formed so as to coincide with the light emitting region, when the conductive layer 350 is formed, the light emitting region is reduced or the display quality is deteriorated when the forming region is slightly shifted. End up. However, by forming the end portion of the conductive layer 350 outside the end portion of the light emitting region, even if the conductive layer 350 is formed slightly deviated, the deterioration of display quality can be reduced. it can. This is particularly suitable for application to active matrix light-emitting devices and high-definition passive matrix light-emitting devices that require very severe mask alignment, resulting in poor display quality and low throughput due to misalignment of the mask alignment. Can be suppressed.

  In addition, the conductive layer 351 and the conductive layer 352 are preferably formed so that the end portions thereof are located outside the end portions of the light emitting region (the portion where light emission is obtained when viewed from the substrate surface direction) in the light emitting element. As a result, even if the conductive layer 351 and the conductive layer 352 are formed slightly deviated from each other, the conductive layer 351 and the conductive layer 352 can remain covering the light emitting region, so that deterioration in display quality and throughput are suppressed. be able to.

(Embodiment 5)
FIG. 5 shows an example of an active matrix light-emitting device in which the direction of light emission from the light-emitting elements is different. Note that FIG. 5 is a drawing provided for explaining the light emitting direction of the light emitting device, and the light emitting device of the present invention is not limited to the structure described therein, and it is needless to say that the shape of the thin film transistor can be selected as appropriate. Further, the numbers assigned to the respective numbers are the same as those in the first to fourth embodiments. FIG. 5A illustrates a structure in which light emission from the light-emitting element is extracted to the substrate side on which the thin film transistor is formed. In this case, since light is extracted through the first electrode 205, the first electrode 205 is formed using a light-transmitting material. FIG. 5B illustrates a structure in which light emission from the light-emitting element is extracted in a direction opposite to the direction in which the thin film transistor is formed. In this case, the second electrode 209 is formed using a light-transmitting material. FIG. 5C illustrates a structure in which light emission from the light-emitting element is extracted from both sides. In this case, both the first electrode 205 and the second electrode 209 are formed using a light-transmitting material. Note that the material of the first electrode 205 and the second electrode 209 is a light-transmitting property typified by ITO among the materials described as the materials of the first electrode 100 and the second electrode 103 in Embodiment 1. A material having the above may be selected.

  This embodiment mode can be freely combined with any of Embodiment Modes 1 to 4.

(Embodiment 6)
FIG. 6 illustrates an example of a passive matrix light-emitting device in which the direction of light emission from the light-emitting element is different. Note that FIG. 6 is a drawing provided to explain the light emitting direction of the light emitting device, and the light emitting device of the present invention is not limited to the structure described therein, and it is needless to say that the shape of the thin film transistor can be selected as appropriate. Further, the numbers assigned to the respective numbers are the same as those in the first to fourth embodiments. FIG. 6A illustrates a structure in which light emission of the light-emitting element is extracted to the substrate side on which the first electrode 301 is formed. In this case, since light is extracted through the first electrode 301, the first electrode 301 is formed using a light-transmitting material. FIG. 6B illustrates a structure in which light emission from the light-emitting element is extracted in a direction opposite to the direction where the first electrode 301 is formed. In this case, the second electrode 305 is formed using a light-transmitting material. FIG. 6C illustrates a structure in which light emission from the light-emitting element is extracted from both sides. In this case, both the first electrode 301 and the second electrode 305 are formed using a light-transmitting material. Note that for the materials of the first electrode 301 and the second electrode 305, the light-transmitting property typified by ITO among the materials described as the materials of the first electrode 301 and the second electrode 305 in Embodiment Mode 1. A material having the above may be selected.

  This embodiment mode can be freely combined with any of Embodiment Modes 1 to 4.

(Embodiment 7)
In this embodiment mode, a light-emitting device of the present invention will be described with reference to FIGS. Note that an example of manufacturing an active matrix light-emitting device is described in this embodiment mode.

  First, after the first base insulating layer 51a and the second base insulating layer 51b are formed over the substrate 50, a semiconductor layer is further formed over the second base insulating layer 51b. (Fig. 7 (A))

  As a material of the substrate 50, glass, quartz, plastic (polyimide, acrylic, polyethylene terephthalate, polycarbonate, polyacrylate, polyethersulfone, or the like) can be used. These substrates may be used after being polished by CMP or the like, if necessary. In this embodiment, a glass substrate is used.

  The first base insulating layer 51a and the second base insulating layer 51b prevent an element such as an alkali metal or an alkaline earth metal in the substrate 50 that adversely affects the characteristics of the semiconductor film from diffusing into the semiconductor layer. Provided for this purpose. As a material, silicon oxide, silicon nitride, silicon oxide containing nitrogen, silicon nitride containing oxygen, or the like can be used. In this embodiment mode, the first base insulating layer 51a is formed using silicon nitride, and the second base insulating layer 51b is formed using silicon oxide. In this embodiment mode, the base insulating layer is formed of the first base insulating layer 51a and the second base insulating layer 51b. However, the base insulating layer may be formed of a single layer or a multilayer of two or more layers. It doesn't matter. In addition, it is not necessary to provide a base insulating layer as long as the diffusion of impurities from the substrate does not matter.

  The semiconductor layer formed subsequently is obtained by laser crystallization of an amorphous silicon film in this embodiment mode. An amorphous silicon film is formed to a thickness of 25 to 100 nm (preferably 30 to 60 nm) over the second base insulating layer 51b. As a manufacturing method, a known method such as a sputtering method, a low pressure CVD method or a plasma CVD method can be used. After that, heat treatment is performed at 500 ° C. for 1 hour to dehydrogenate.

  Subsequently, the amorphous silicon film is crystallized using a laser irradiation apparatus to form a crystalline silicon film. In the laser crystallization of this embodiment, an excimer laser is used, and a laser beam oscillated is processed into a linear beam spot using an optical system and irradiated to an amorphous silicon film to form a crystalline silicon film. Used as a semiconductor layer.

  Other crystallization methods for the amorphous silicon film include a method for crystallization only by heat treatment and a method for heat treatment using a catalyst element that promotes crystallization. Examples of elements that promote crystallization include nickel, iron, palladium, tin, lead, cobalt, platinum, copper, and gold. Compared to the case where crystallization is performed only by heat treatment by using such an element, Since crystallization is performed at a low temperature for a short time, there is little damage to the glass substrate. When crystallization is performed only by heat treatment, the substrate 50 may be a quartz substrate resistant to heat.

  Subsequently, in order to control the threshold value in the semiconductor layer as required, a small amount of impurity addition, so-called channel doping is performed. In order to obtain a required threshold value, N-type or P-type impurities (phosphorus, boron, etc.) are added by an ion doping method or the like.

  After that, as shown in FIG. 7A, the semiconductor layer is processed into a predetermined shape, and an island-shaped semiconductor layer 52 is obtained. This step is performed by applying a photoresist to the semiconductor layer, exposing a predetermined mask shape, baking, forming a resist mask on the semiconductor layer, and etching using the mask.

  Subsequently, a gate insulating layer 53 is formed so as to cover the semiconductor layer 52. The gate insulating layer 53 is formed of an insulating layer containing silicon with a film thickness of 40 to 150 nm using a plasma CVD method or a sputtering method. In this embodiment mode, silicon oxide is used.

  Next, the gate electrode 54 is formed over the gate insulating layer 53. The gate electrode 54 may be formed of an element selected from tantalum, tungsten, titanium, molybdenum, aluminum, copper, chromium, and niobium, or an alloy material or a compound material containing the element as a main component. Alternatively, a semiconductor film typified by a polycrystalline silicon film doped with an impurity element such as phosphorus may be used. Further, an AgPdCu alloy may be used.

  Further, although the gate electrode 54 is formed as a single layer in this embodiment mode, a stacked structure of two or more layers such as tungsten in the lower layer and molybdenum in the upper layer may be used. Even in the case where the gate electrode is formed as a stacked structure, the materials described in the preceding stage may be used. Moreover, the combination may be selected as appropriate. The gate electrode 54 is processed by etching using a mask using a photoresist.

  Subsequently, a high concentration impurity is added to the semiconductor layer 52 using the gate electrode 54 as a mask. Thus, the thin film transistor 70 including the semiconductor layer 52, the gate insulating layer 53, and the gate electrode 54 is formed.

  Note that there is no particular limitation on the manufacturing process of the thin film transistor, and it may be changed as appropriate so that a transistor with a desired structure can be manufactured.

  In this embodiment mode, a top-gate thin film transistor using a crystalline silicon film crystallized by laser crystallization is used; however, a bottom-gate thin film transistor using an amorphous semiconductor film is used for a pixel portion. It is also possible. As the amorphous semiconductor, not only silicon but also silicon germanium can be used. When silicon germanium is used, the concentration of germanium is preferably about 0.01 to 4.5 atomic%.

  Alternatively, a microcrystalline semiconductor film (semi-amorphous semiconductor) in which a 0.5 nm to 20 nm crystal can be observed in an amorphous semiconductor may be used. Microcrystals capable of observing 0.5 nm to 20 nm crystals are also called so-called microcrystals (μc).

Semi-amorphous silicon (also referred to as SAS) which is a semi-amorphous semiconductor can be obtained by glow discharge decomposition of SiH ₄ , Si ₂ H ₆ , SiH ₂ Cl ₂ , SiHCl ₃ , SiCl ₄ , SiF ₄ or the like. The formation of SAS can be facilitated by diluting these with one or more kinds of rare gas elements selected from hydrogen, hydrogen and helium, argon, krypton, and neon. The dilution rate is preferably in the range of 10 times to 1000 times. The reaction generation of the film by glow discharge decomposition may be performed at a pressure in the range of 0.1 Pa to 133 Pa. The power for forming the glow discharge may be high frequency power of 1 MHz to 120 MHz, preferably 13 MHz to 60 MHz. The substrate heating temperature is preferably 300 ° C. or less, and a substrate heating temperature of 100 to 250 ° C. is suitable.

In the SAS formed in this way, the Raman spectrum derived from L-O phonon is shifted to a lower wavenumber side than 520 cm ⁻¹ , and X-ray diffraction is attributed to the Si crystal lattice (111), ( 220) is observed. As a terminator for dangling bonds, hydrogen or halogen is contained at least 1 atomic% or more. As an impurity element in the film, an impurity of atmospheric components such as oxygen, nitrogen, and carbon is desirably 1 × 10 ²⁰ atoms / cm ³ or less, and in particular, the oxygen concentration is preferably 5 × 10 ¹⁹ atoms / cm ³ or less. Is 1 × 10 ¹⁹ atoms / cm ³ or less. The field effect mobility when TFT is used is μ = 1 to 10 cm ² / Vsec.

  Further, this SAS may be further crystallized with a laser.

  Subsequently, an insulating film (hydrogenated film) 59 is formed of silicon nitride so as to cover the gate electrode 54 and the gate insulating layer 53. After the insulating film (hydrogenated film) 59 is formed, heating is performed at 480 ° C. for about 1 hour to activate the impurity element and hydrogenate the semiconductor layer 52.

  Subsequently, a first interlayer insulating layer 60 covering the insulating film (hydrogenated film) 59 is formed. As a material for forming the first interlayer insulating layer 60, silicon oxide, acrylic, polyimide, siloxane, a low-k material, or the like may be used. In this embodiment mode, the silicon oxide film is formed as the first interlayer insulating layer. (Fig. 7 (B))

  Next, a contact hole reaching the semiconductor layer 52 is opened. The contact hole can be formed by performing etching using a resist mask until the semiconductor layer 52 is exposed, and can be formed by either wet etching or dry etching. Note that etching may be performed once depending on conditions, or etching may be performed in a plurality of times. In addition, when etching is performed a plurality of times, both wet etching and dry etching may be used. (Fig. 7 (C))

  Then, a conductive layer covering the contact hole and the first interlayer insulating layer 60 is formed. The conductive layer is processed into a desired shape, and the connection portion 61a, the wiring 61b, and the like are formed. This wiring may be a single layer of aluminum, copper, an alloy of aluminum, carbon, and nickel, an alloy of aluminum, carbon, and molybdenum, or a laminated structure of molybdenum, aluminum, molybdenum, titanium, and aluminum from the substrate side. A structure such as titanium, titanium, titanium nitride, aluminum, or titanium may be used. (Fig. 7 (D))

  Thereafter, a second interlayer insulating layer 63 is formed so as to cover the connection portion 61a, the wiring 61b, and the first interlayer insulating layer 60. As a material for the second interlayer insulating layer 63, a coating film of acrylic, polyimide, siloxane or the like having self-flatness can be suitably used. In this embodiment mode, siloxane is used as the second interlayer insulating layer 63. (Fig. 7 (E))

  Subsequently, an insulating layer may be formed of silicon nitride or the like on the second interlayer insulating layer 63. This is formed to prevent the second interlayer insulating layer 63 from being etched more than necessary in the subsequent etching of the pixel electrode. Therefore, when the ratio of the etching rate between the pixel electrode and the second interlayer insulating layer is large, it may not be provided. Subsequently, a contact hole that penetrates through the second interlayer insulating layer 63 and reaches the connection portion 61a is formed.

  Then, after forming the light-transmitting conductive layer so as to cover the contact hole and the second interlayer insulating layer 63 (or insulating layer), the light-transmitting conductive layer is processed to form the first light-emitting element in the thin film light-emitting element. 1 electrode 64 is formed. Here, the first electrode 64 is in electrical contact with the connecting portion 61a.

As the material of the first electrode 64, aluminum (Al), silver (Ag), gold (Au), platinum (Pt), nickel (Ni), tungsten (W), chromium (Cr), molybdenum (Mo), iron (Fe), cobalt (Co), copper (Cu), palladium (Pd), lithium (Li), cesium (Cs), magnesium (Mg), calcium (Ca), strontium (Sr), titanium (Ti), etc. Metal having conductivity, alloy of aluminum and silicon (Al-Si), alloy of aluminum and titanium (Al-Ti), alloy of aluminum, silicon and copper (Al-Si-Cu), or titanium nitride Nitride of metal materials such as (TiN), indium tin oxide (ITO), ITO containing silicon, indium oxide A metal film such as IZO (indium zinc oxide) in which zinc oxide (ZnO) is mixed in a film can be formed using the conductive film as described in Embodiment Mode 1.

  Further, the electrode for extracting light may be formed of a conductive film having transparency, and an ultrathin film of metal such as Al or Ag is used in addition to a metal compound such as ITO, ITSO, or IZO. In the case where light emission is extracted from the second electrode, a material with high reflectivity (Al, Ag, or the like) can be used for the first electrode. In this embodiment mode, ITSO is used as the first electrode 64 (FIG. 8A).

  Next, an insulating layer made of an organic material or an inorganic material is formed so as to cover the second interlayer insulating layer 63 (or the insulating layer) and the first electrode 64. Subsequently, the insulating layer is processed so that a part of the first electrode 64 is exposed, and a partition wall 65 is formed. As the material of the partition wall 65, a photosensitive organic material (acrylic, polyimide, or the like) is preferably used, but it may be formed of an organic material or an inorganic material that does not have photosensitivity. Further, a black pigment or dye such as carbon nitride may be dispersed in the material of the partition wall 65 using a dispersing material or the like, and the partition wall 65 may be blackened to be used like a black matrix. It is desirable that the end face of the partition wall 65 facing the first electrode has a curvature and has a tapered shape in which the curvature continuously changes (FIG. 8B).

  Subsequently, according to any of Embodiments 1 to 4, a plurality of light emitters and a conductive layer provided between the light emitters and at least two or more light emitters are formed. The number of light emitters and conductive layers may be determined as appropriate by the practitioner. These layers are collectively referred to as a layer 66 including a light emitting layer in the drawing.

  Subsequently, a second electrode 67 is formed. Thus, a light-emitting element 93 in which a layer including a light-emitting layer is sandwiched between the first electrode 64 and the second electrode 67 can be manufactured, and a higher voltage than that of the second electrode is applied to the first electrode. Thus, light emission can be obtained. As an electrode material used for forming the second electrode 67, the same material as that of the first electrode can be used. In this embodiment, aluminum is used as the second electrode.

Thereafter, a silicon oxide film containing nitrogen is formed as a passivation film by plasma CVD. In the case of using a silicon oxide film containing nitrogen, a silicon oxynitride film manufactured from SiH ₄ , N ₂ O, NH ₃ by a plasma CVD method, or a silicon oxynitride film manufactured from SiH ₄ , N ₂ O, Alternatively, a silicon oxynitride film formed from a gas obtained by diluting SiH ₄ and N ₂ O with Ar may be formed.

Further, a silicon oxynitride silicon film formed from SiH ₄ , N ₂ O, and H ₂ may be applied as the passivation film. Of course, the passivation film is not limited to a single layer structure, and another insulating layer containing silicon may be used as a single layer structure or a laminated structure. Further, a multilayer film of carbon nitride film and silicon nitride film, a multilayer film of styrene polymer, a silicon nitride film, or a diamond-like carbon film may be formed instead of the silicon oxide film containing nitrogen.

  Subsequently, the display portion is sealed in order to protect the light emitting element from a substance that promotes deterioration such as water. In the case where the counter substrate is used for sealing, bonding is performed with an insulating sealing material so that the external connection portion is exposed. A space between the counter substrate and the element substrate may be filled with an inert gas such as dry nitrogen, or a sealing material may be applied to the entire surface of the pixel portion to bond the counter substrate. It is preferable to use an ultraviolet curable resin or the like for the sealing material. The sealing material may contain a desiccant or particles for keeping the gap between the substrates constant. Subsequently, a flexible wiring substrate is attached to the external connection portion, whereby the light emitting device is completed.

  One example of the structure of the light-emitting device manufactured as described above will be described with reference to FIG. In addition, even if the shapes are different, parts showing similar functions are denoted by the same reference numerals, and explanations thereof are omitted. In this embodiment mode, a thin film transistor having an LDD structure is connected to a light emitting element through a connection portion.

  FIG. 9A illustrates a structure in which the first electrode is formed using a light-transmitting conductive film and light emitted from the light-emitting body is extracted to the substrate side. Reference numeral 94 denotes a counter substrate, which is fixed to the substrate using a sealing material or the like after the light emitting element is formed. By filling a resin 88 or the like having a light-transmitting property between the counter substrate 94 and the element and sealing it, the light-emitting element can be prevented from being deteriorated by moisture. Further, it is desirable that the resin 88 has a hygroscopic property. Further, if a desiccant 89 having high translucency is dispersed in the resin 88, the influence of moisture can be further suppressed, which is a more desirable form.

  In FIG. 9B, both the first electrode and the second electrode 67 are formed using a light-transmitting conductive film, and light can be extracted to both the substrate and the counter substrate. . Further, in this configuration, by providing the polarizing plate 90 on the outside of the substrate and the counter substrate, the screen can be prevented from being seen through, and visibility is improved. A protective film 91 may be provided outside the polarizing plate 90.

  Note that either an analog video signal or a digital video signal may be used for the light-emitting device of the present invention having a display function. When a digital video signal is used, the video signal is classified into one using a voltage and one using a current. When the light emitting element emits light, the video signal input to the pixel has a constant voltage and a constant current. When the video signal has a constant voltage, the voltage applied to the light emitting element is constant. And the current flowing through the light emitting element is constant. In addition, a video signal having a constant current includes a constant voltage applied to the light emitting element and a constant current flowing in the light emitting element. A constant voltage applied to the light emitting element is constant voltage driving, and a constant current flowing through the light emitting element is constant current driving. In constant current driving, a constant current flows regardless of the resistance change of the light emitting element. Any of the above driving methods may be used for the light emitting device and the driving method thereof of the present invention.

  The light emitting device of the present invention having such a structure is a light emitting device with high luminous efficiency and high display quality.

  This embodiment mode can be combined with any suitable structure in Embodiment Modes 1 to 7.

(Embodiment 8)
In this embodiment mode, a method for manufacturing an active matrix light-emitting device of the present invention will be described with reference to FIGS. Note that materials and the like of each component are the same as those in Embodiments 1 to 7, and description thereof is omitted.

  FIG. 10A is a top view of the light-emitting device manufactured up to the partition wall 65 in Embodiment 7. FIG. A dotted line portion provided over the substrate 200 indicates a scanning line driver circuit formation region 400, a signal line driver circuit formation region 401, an external connection portion formation region 402, and a pixel portion 403. 404 corresponds to an opening of the partition wall 65. The lower first electrode is exposed. Note that 404 corresponds to a light emitting region. In this manner, the light emitting regions 404 where a part of the first electrodes electrically connected to the thin film transistors are exposed are arranged in a matrix.

  FIG. 10B illustrates a state in which the first light emitter 207 is formed so as to cover the pixel portion 403. In the present embodiment, the same light emitter is formed over all the pixels, but light emitters that emit different light may be formed separately for each pixel or for a certain region of the pixel. Since the light emitter basically has a large resistance, there is no concern about crosstalk in adjacent pixels.

  FIG. 11A shows a state in which a conductive layer 250 is provided separately for each pixel. In addition, since the end portions of the conductive layer 250 are provided outside the end portions of the light emitting region 404, the light emitting region 404 can be covered with the conductive layer 250 even if the mask alignment is slightly shifted, so that the display quality is deteriorated. Without inviting, defects caused by the mask displacement can also be reduced.

  FIG. 11B illustrates a state in which the second light-emitting body 208 is formed so as to cover the pixel portion 403. As a result, the end portion of the conductive layer 250 can be covered with the first light emitter 207 and the second light emitter 208, and since the conductive layer 250 is separated for each pixel, crosstalk between adjacent pixels is sufficient. Can be reduced. From this, a light emitting device with high display quality in which the crosstalk between adjacent pixels is sufficiently reduced while the light emitting device has high light emission efficiency by light emission from the first light emitter 207 and the second light emitter 208 is obtained. be able to.

  FIG. 12 shows a state where up to the second electrode 209 is formed. The second electrode 209 may be formed across all pixels. Note that a cross-sectional view of the active matrix light-emitting device described in any of Embodiments 1 to 4 corresponds to a cross section taken along line AB in FIG.

  This embodiment can be combined with any of Embodiments 1 to 8 as appropriate.

(Embodiment 9)
In this embodiment mode, the appearance of a panel which is a light-emitting device of the present invention will be described with reference to FIGS. 13 is a top view of a panel in which a transistor and a light-emitting element formed over a substrate are sealed with a sealant formed between a counter substrate 4006 and FIG. 13B is a cross-sectional view of FIG. It corresponds to. The structure of the light-emitting element mounted on this panel is the structure shown in Embodiment Mode 4.

  A sealant 4005 is provided so as to surround the pixel portion 4002, the signal line driver circuit 4003, and the scan line driver circuit 4004 which are provided over the substrate 4001. A counter substrate 4006 is provided over the pixel portion 4002, the signal line driver circuit 4003, and the scan line driver circuit 4004. Therefore, the pixel portion 4002, the signal line driver circuit 4003, and the scan line driver circuit 4004 are sealed together with the filler 4007 by the substrate 4001, the sealant 4005, and the counter substrate 4006.

  The pixel portion 4002, the signal line driver circuit 4003, and the scan line driver circuit 4004 provided over the substrate 4001 include a plurality of thin film transistors. In FIG. 13B, the thin film transistor 4008 included in the signal line driver circuit 4003 is provided. And a thin film transistor 4010 included in the pixel portion 4002.

  The light emitting element 4011 is electrically connected to the thin film transistor 4010.

  The lead wiring 4014 corresponds to a wiring for supplying a signal or a power supply voltage to the pixel portion 4002, the signal line driver circuit 4003, and the scan line driver circuit 4004. The lead wiring 4014 is connected to the connection terminal 4016 through the lead wiring 4015a and the lead wiring 4015b. The connection terminal 4016 is electrically connected to a terminal included in a flexible printed circuit (FPC) 4018 through an anisotropic conductive film 4019.

  Note that as the filler 4007, in addition to an inert gas such as nitrogen or argon, an ultraviolet curable resin or a thermosetting resin can be used, and polyvinyl chloride, acrylic, polyimide, epoxy resin, silicon resin, polyvinyl butyral, Alternatively, ethylene vinylene acetate can be used.

  Note that the light-emitting device of the present invention includes in its category a panel in which a pixel portion having a light-emitting element is formed and a module in which an IC is mounted on the panel.

  The light emitting device of the present invention having such a structure is a light emitting device with high luminous efficiency and high display quality.

  This embodiment can be combined with any of Embodiments 1 to 9 as appropriate.

(Embodiment 10)
In this embodiment mode, pixel circuits and protection circuits included in the panel and module described in Embodiment Mode 9 and operations thereof will be described. Note that the cross-sectional views shown in FIGS. 7 and 8 are cross-sectional views of the driving TFT 1403 and the light emitting element 1405.

  In the pixel shown in FIG. 14A, a signal line 1410 and power supply lines 1411 and 1412 are arranged in the column direction, and a scanning line 1414 is arranged in the row direction. The pixel further includes a switching TFT 1401, a driving TFT 1403, a current control TFT 1404, a capacitor element 1402, and a light emitting element 1405.

  The pixel shown in FIG. 14C is different from the pixel shown in FIG. 14A except that the gate electrode of the driving TFT 1403 is connected to the power supply line 1412 arranged in the row direction. It is a configuration. That is, both pixels shown in FIGS. 14A and 14C show the same equivalent circuit diagram. However, in the case where the power supply line 1412 is arranged in the column direction (FIG. 14A) and in the case where the power supply line 1412 is arranged in the row direction (FIG. 14C), each power supply line has a different layer. It is formed of a conductive film. Here, attention is paid to the wiring to which the gate electrode of the driving TFT 1403 is connected, and FIGS. 14A and 14C are shown separately to show that the layers for manufacturing these are different.

  14A and 14C, a driving TFT 1403 and a current control TFT 1404 are connected in series in the pixel, and a channel length L (1403) and a channel width W (1403) of the driving TFT 1403 are connected. ), The channel length L (1404) and the channel width W (1404) of the current control TFT 1404 satisfy L (1403) / W (1403): L (1404) / W (1404) = 5 to 6000: 1. It is good to set to.

  Note that the driving TFT 1403 operates in a saturation region and has a role of controlling a current value flowing through the light emitting element 1405, and the current control TFT 1404 operates in a linear region and has a role of controlling supply of current to the light emitting element 1405. . Both TFTs preferably have the same conductivity type in terms of manufacturing process, and in this embodiment mode, they are formed as n-channel TFTs. The driving TFT 1403 may be a depletion type TFT as well as an enhancement type. In the light emitting device of the present invention having the above structure, since the current control TFT 1404 operates in a linear region, a slight change in the gate electrode-source electrode voltage Vgs of the current control TFT 1404 is caused by the current value of the light emitting element 1405. Has no effect. That is, the current value of the light emitting element 1405 can be determined by the driving TFT 1403 operating in the saturation region. With the above structure, it is possible to provide a light-emitting device in which luminance unevenness of a light-emitting element due to variation in TFT characteristics is improved and image quality is improved.

  In the pixels shown in FIGS. 14A to 14D, the switching TFT 1401 controls input of a video signal to the pixel. When the switching TFT 1401 is turned on, the video signal is input into the pixel. Then, the voltage of the video signal is held in the capacitor element 1402. 14A and 14C illustrate the structure in which the capacitor 1402 is provided, the present invention is not limited to this, and the capacity for holding a video signal can be covered by a gate capacity or the like. In this case, the capacitor 1402 is not necessarily provided.

  The pixel shown in FIG. 14B has the same pixel structure as that shown in FIG. 14A except that a TFT 1406 and a scanning line 1415 are added. Similarly, the pixel illustrated in FIG. 14D has the same pixel structure as that illustrated in FIG. 14C except that a TFT 1406 and a scanning line 1415 are added.

  The TFT 1406 is controlled to be turned on or off by a newly arranged scanning line 1415. When the TFT 1406 is turned on, the charge held in the capacitor element 1402 is discharged, and the current control TFT 1404 is turned off. That is, the arrangement of the TFT 1406 can forcibly create a state where no current flows through the light-emitting element 1405. Therefore, the TFT 1406 can be called an erasing TFT. 14B and 14D, the lighting period can be started at the same time as or immediately after the start of the writing period without waiting for signal writing to all pixels, so that the duty ratio is improved. It becomes possible.

  In the pixel shown in FIG. 14E, a signal line 1410, a power supply line 1411 are arranged in the column direction, and a scanning line 1414 is arranged in the row direction. Further, the pixel includes a switching TFT 1401, a driving TFT 1403, a capacitor element 1402, and a light emitting element 1405. The pixel shown in FIG. 14F has the same pixel structure as that shown in FIG. 14E except that a TFT 1406 and a scanning line 1415 are added. Note that the duty ratio of the structure in FIG. 14F can also be improved by the arrangement of the TFT 1406.

  FIG. 21 shows an example of a pixel configuration in the case where the driving TFT 1403 is forcibly turned off. A selection TFT 1451, a driving TFT 1453, an erasing diode 1461, and a light emitting element 1454 are arranged. The source and drain of the selection TFT 1451 are connected to the signal line 1455 and the gate of the driving TFT 1453, respectively. The gate of the selection TFT 1451 is connected to the first gate line 1457. The source and drain of the driving TFT 1453 are connected to the first power supply line 1456 and the light emitting element 1454, respectively. The erasing diode 1461 is connected to the gate of the driving TFT 1453 and the second gate line 1467.

  The capacitor element 1452 serves to hold the gate potential of the driving TFT 1453. Therefore, although connected between the gate of the driving TFT 1453 and the power supply line 1456, the present invention is not limited to this. It suffices if the gate potential of the driving TFT 1453 can be held. Further, in the case where the gate potential of the driving TFT 1453 can be held using the gate capacitance of the driving TFT 1453, the capacitor 1452 may be omitted.

  As an operation method, the first gate line 1457 is selected, the selection TFT 1451 is turned on, and a signal is input from the signal line 1455 to the capacitor 1452. Then, the current of the driving TFT 1453 is controlled according to the signal, and the current flows from the first power supply line 1456 to the second power supply line 1458 through the light emitting element 1454.

When the signal is to be erased, the second gate line 1467 is selected (in this case, set to a high potential), the erasing diode 1461 is turned on, and a current flows from the second gate line 1467 to the gate of the driving TFT 1453. To. As a result, the driving TFT 1453 is turned off. Then, no current flows from the first power supply line 1456 to the second power supply line 1458 through the light emitting element 1454. As a result, a non-lighting period can be created and the length of the lighting period can be freely controlled.

When it is desired to hold the signal, the second gate line 1467 is not selected (here, set to a low potential). Then, since the erasing diode 1461 is turned off, the gate potential of the driving TFT 1453 is held.

  The erasing diode 1461 may be anything as long as it has a rectifying property. A PN-type diode, a PIN-type diode, a Schottky diode, or a Zener-type diode may be used.

  As described above, various pixel circuits can be employed. In particular, in the case where a thin film transistor is formed from an amorphous semiconductor film, it is preferable to increase the semiconductor film of the driving TFTs 1403 and 1453. Therefore, it is preferable that the pixel circuit be a top emission type in which light from the light emitter is emitted from the sealing substrate side.

  Such an active matrix light-emitting device is considered to be advantageous because it can be driven at a low voltage because a TFT is provided in each pixel when the pixel density is increased.

  In this embodiment mode, an active matrix light-emitting device in which each pixel is provided with each TFT has been described; however, a passive matrix light-emitting device in which a TFT is provided for each column can also be formed. A passive matrix light-emitting device has a high aperture ratio because a TFT is not provided for each pixel. In the case of a light-emitting device that emits light to both sides of a light-emitting body, transmittance using a passive matrix light-emitting device is increased.

  Next, the case where a diode is provided as a protective circuit in the scan line and the signal line will be described using the equivalent circuit illustrated in FIG.

  In FIG. 15, a switching TFT 1401, a driving TFT 1403, a capacitor element 1402, and a light emitting element 1405 are provided in the pixel portion 1500. The signal line 1410 is provided with diodes 1561 and 1562. Like the switching TFT 1401 or the driving TFT 1403, the diodes 1561 and 1562 are manufactured based on the above embodiment mode and include a gate electrode, a semiconductor layer, a source electrode, a drain electrode, and the like. The diodes 1561 and 1562 operate as diodes by connecting a gate electrode and a drain electrode or a source electrode.

  Common potential lines 1554 and 1555 connected to the diode are formed in the same layer as the gate electrode. Therefore, in order to connect to the source electrode or the drain electrode of the diode, it is necessary to form a contact hole in the gate insulating layer.

  A diode provided in the scan line 1414 has a similar structure.

  Thus, according to the present invention, the protection diode provided in the input stage can be formed simultaneously. Note that the position where the protective diode is formed is not limited to that in FIG. 15, and the protective diode can be provided between the driver circuit and the pixel.

The light-emitting device of the present invention having such a protective circuit is a light-emitting device that has high luminous efficiency and high display quality, and has the above structure, thereby further improving the reliability as the light-emitting device. Is possible.

(Embodiment 11)
In this embodiment mode, a method for manufacturing a passive matrix light-emitting device of the present invention will be described with reference to FIGS. Note that the materials and the like of each component are the same as those in Embodiments 1 to 4, and a description thereof is omitted.

  First, a first electrode 301 extending in one direction and a terminal 500 for forming an input terminal portion are formed using the same material on the main surface of the substrate 300. The composition and manufacturing method of the first electrode 301 are as described above. As the substrate 300, for example, a glass substrate such as barium borosilicate glass or alumino borosilicate glass, a quartz substrate, or the like can be used. Note that in FIG. 16A, since the light-emitting element that extracts light from the first electrode 301 is used, the substrate 300 is formed using a light-transmitting material; however, when light is extracted from the second electrode 305, In addition to the above substrate, for example, a metal substrate including a stainless steel substrate or a silicon substrate with an insulating film formed on the surface thereof, a ceramic substrate, or the like may be used. A substrate made of a synthetic resin having flexibility such as plastic generally tends to have a lower heat resistant temperature than the above substrate, but can be used as long as it can withstand the processing temperature in the manufacturing process. .

  Next, as shown in FIG. 16B, auxiliary electrodes 501a and 501b are formed in the input terminal portion formation region of the first electrode 301 and the connection / input terminal portion formation region of the second electrode. The auxiliary electrode is preferably formed of a conductive material having good heat sealability when connected to an external circuit, and may be formed of a metal material containing chromium, nickel, or the like. Next, the partition 302 is formed. The partition wall 302 is provided to be orthogonal to the first electrode 301. The partition wall 302 is formed using silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, aminium oxynitride, an inorganic material having insulating properties, or It can be formed of acrylic acid, methacrylic acid and derivatives thereof, a polymer material having heat resistance such as polyimide, aromatic polyamide, polybenzimidazole, or siloxane.

  After that, as shown in FIG. 17A, a first light emitter 303 is formed over the first electrode 301 exposed from the partition wall 302. In this embodiment mode, the first light-emitting body 303 is formed by coating three types each having a light-emitting material exhibiting a different light emission color for each column. Of course, the same light emitter may be formed in all pixels. Note that the light-emitting region in this embodiment is a portion where the first electrode 301 is exposed from the partition wall 302.

  Subsequently, as shown in FIG. 17B, a conductive layer 350 is provided separately for each pixel. In addition, the end portions of the conductive layer 350 are provided outside the light emitting region end portions. Accordingly, even if the mask alignment is slightly shifted, the light emitting region can be covered with the conductive layer 350, so that the display quality is not deteriorated, and defects caused by the misalignment of the mask can be reduced. .

  Next, as illustrated in FIG. 18A, the second light-emitting body 304 is formed over the conductive layer 350. Similarly to the first light emitter 303, the second light emitter 304 is formed by coating three kinds of light emitting materials having different emission colors for each column. As a result, the end portion of the conductive layer 350 can be covered with the first light emitter 303 and the second light emitter 304, and since the conductive layer 350 is separated for each pixel, crosstalk between adjacent pixels is sufficient. Can be reduced. Accordingly, a light emitting device with high display quality in which the crosstalk between adjacent pixels is sufficiently reduced while the light emitting device has high light emission efficiency by light emission from the first light emitter 303 and the second light emitter 304 is obtained. be able to.

  Subsequently, as illustrated in FIG. 18B, the first electrode 301 and the first electrode 301 are formed in a region where the first light-emitting body 303, the conductive layer 350, and the second light-emitting body 304 are formed over the first electrode 301. A second electrode 305 extending in the intersecting direction is formed.

  As described above, a panel having a pixel portion in which a light emitting element is formed is formed. Note that the cross-sectional view of the passive matrix light-emitting device described in any of Embodiments 1 to 4 corresponds to a cross-sectional view taken along line CD in FIG.

  After that, as shown in FIG. 19A, a protective film 306 that prevents intrusion of moisture and the like is formed, and a sealing substrate 308 made of a ceramic material such as glass, quartz, or alumina or a synthetic material is used as a sealing adhesive 307. Secure with. Further, when connecting to the external input terminal portion with an external circuit, the flexible printed wiring board 310 is used for connection through the anisotropic conductive film 309. In addition to the protective film 306 formed of silicon nitride, the protective film 306 may be formed of a laminate of carbon nitride and silicon nitride as a structure that increases the gas barrier property while reducing stress.

  FIG. 19B shows a module formed by connecting an external circuit to the panel shown in FIG. In the module, a flexible printed wiring board 25 is fixed to the external input terminal portions 18 and 19 and electrically connected to an external circuit board on which a power supply circuit and a signal processing circuit are formed. Also, the mounting method of the driver IC 28 which is one of the external circuits may be either the COG method or the TAB method. In FIG. 19B, the driver IC 28 which is one of the external circuits is mounted using the COG method. It shows how it is doing.

  Note that the panel and the module correspond to one mode of the light-emitting device of the present invention, and both are included in the category of the present invention.

(Embodiment 12)
As an electronic device of the present invention equipped with the module of the present invention, a camera such as a video camera or a digital camera, a goggle type display (head mounted display), a navigation system, a sound reproduction device (car audio component, etc.), a computer, a game device, Play back a recording medium such as a portable information terminal (mobile computer, mobile phone, portable game machine or electronic book), an image playback device (specifically, Digital Versatile Disc (DVD)) equipped with a recording medium, A device having a display capable of displaying). Specific examples of these electronic devices are shown in FIGS.

  FIG. 20A shows a light-emitting device, such as a television receiver or a personal computer monitor. A housing 2001, a display portion 2003, a speaker portion 2004, and the like are included. The light emitting device of the present invention is a light emitting device with high display quality of the display portion 2003. In order to increase the contrast, the display portion may include a polarizing plate or a circularly polarizing plate. For example, a film may be provided on the sealing substrate in the order of a 1 / 4λ plate, a 1 / 2λ plate, and a polarizing plate. Further, an antireflection film may be provided on the polarizing plate.

  FIG. 20B illustrates a mobile phone, which includes a main body 2101, a housing 2102, a display portion 2103, an audio input portion 2104, an audio output portion 2105, operation keys 2106, an antenna 2108, and the like. The mobile phone of the present invention is a mobile phone with high display quality of the display portion 2103.

  FIG. 20C illustrates a computer, which includes a main body 2201, a housing 2202, a display portion 2203, a keyboard 2204, an external connection port 2205, a pointing mouse 2206, and the like. The computer of the present invention is a computer with high display quality of the display portion 2203. Although FIG. 20C illustrates a laptop computer, the present invention can also be applied to a desktop computer or the like.

  FIG. 20D illustrates a mobile computer, which includes a main body 2301, a display portion 2302, a switch 2303, operation keys 2304, an infrared port 2305, and the like. The mobile computer of the present invention is a mobile computer with high display quality of the display unit 2302.

  FIG. 20E illustrates a portable game machine including a housing 2401, a display portion 2402, speaker portions 2403, operation keys 2404, a recording medium insertion portion 2405, and the like. The portable game machine of the present invention is a portable game machine with high display quality of the display portion 2402.

  As described above, the applicable range of the present invention is so wide that it can be used for electronic devices in various fields.

Sectional drawing of the light-emitting device of this invention. Sectional drawing of the light-emitting device of this invention. Sectional drawing of the light-emitting device of this invention. Sectional drawing of the light-emitting device of this invention. Sectional drawing of the light-emitting device of this invention. Sectional drawing of the light-emitting device of this invention. 9A to 9D are cross-sectional views illustrating a method for manufacturing an active matrix light-emitting device of the present invention. 9A to 9D are cross-sectional views illustrating a method for manufacturing an active matrix light-emitting device of the present invention. Sectional drawing of the light-emitting device of this invention. FIG. 6 is a top view illustrating a method for manufacturing an active matrix light-emitting device of the present invention. FIG. 6 is a top view illustrating a method for manufacturing an active matrix light-emitting device of the present invention. FIG. 6 is a top view illustrating a method for manufacturing an active matrix light-emitting device of the present invention. 2A and 2B are a top view and a cross-sectional view of a light-emitting device of the present invention. FIG. 6 illustrates an example of a pixel circuit of a light-emitting device of the present invention. FIG. 9 illustrates an example of a protection circuit of a light-emitting device of the present invention. 4A and 4B are top views illustrating a method for manufacturing a passive matrix light-emitting device of the present invention. 4A and 4B are top views illustrating a method for manufacturing a passive matrix light-emitting device of the present invention. 4A and 4B are top views illustrating a method for manufacturing a passive matrix light-emitting device of the present invention. 2A and 2B are a cross-sectional view and a top view of a light-emitting device of the present invention. FIG. 10 illustrates an electronic device to which the present invention is applicable. FIG. 6 illustrates an example of a pixel circuit of a light-emitting device of the present invention.

Claims (5)

A pixel portion including a first light emitting element and a second light emitting element;
The first light emitting element and the second light emitting element are separated by a partition,
Each of the first light emitting element and the second light emitting element includes a first electrode, a second electrode, a first light emitter, a second light emitter, and a conductive layer.
The first electrode is independent between the first light emitting element and the second light emitting element,
The partition is provided so as to cover the end of the first electrode,
The first light emitter is provided on the first electrode and the partition, and is common to the first light emitting element and the second light emitting element,
The conductive layer is provided on the first light emitter, and is independent between the first light emitting element and the second light emitting element,
The second light emitter is provided on the conductive layer and the first light emitter, and is common to the first light emitter and the second light emitter,
The second electrode is provided on the second light emitter, and is common to the first light emitting element and the second light emitting element,
An end of the conductive layer is covered with the first light emitter and the second light emitter,
The light-emitting device, wherein the first light-emitting body and the second light-emitting body are provided in contact with each other in a region where the conductive layer is not provided over the partition wall. A pixel portion including a first light emitting element and a second light emitting element;
The first light emitting element and the second light emitting element are separated by a partition,
Each of the first light emitting element and the second light emitting element includes a first electrode, a second electrode, a first light emitter, a second light emitter, and a conductive layer.
The first electrode is common to the first light emitting element and the second light emitting element,
The partition is provided on the first electrode;
The first light emitter is provided on the first electrode and the partition, and is common to the first light emitting element and the second light emitting element,
The conductive layer is provided on the first light emitter, and is independent between the first light emitting element and the second light emitting element,
The second light emitter is provided on the conductive layer and the first light emitter, and is common to the first light emitter and the second light emitter,
The second electrode is provided on the second light emitter, and is independent of the first light emitting element and the second light emitting element,
An end of the conductive layer is covered with the first light emitter and the second light emitter,
The light-emitting device, wherein the first light-emitting body and the second light-emitting body are provided in contact with each other in a region where the conductive layer is not provided over the partition wall. In claim 1 or 2 ,
The light emitting device, wherein the conductive layer is made of a transparent conductive film. In any one of Claims 1 thru | or 3 ,
The light emitting device is characterized in that the first electrode is made of a light-transmitting material. In any one of Claims 1 thru | or 4 ,
The light emitting device, wherein the second electrode is made of a light-transmitting material.

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