JP5075424B2 - Manufacturing method of wiring board with built-in electronic components - Google Patents

Description

  The present invention relates to a wiring board with a built-in electronic component and a method for manufacturing the same, and more particularly to a package structure with a multilayer wiring board that improves the heat dissipation effect of the built-in component and is easy to assemble and a method for manufacturing the same.

  In the printed circuit board field, a package substrate for electrically connecting an element and an external circuit or device is used to transmit a signal or supply power to an element manufactured by a wafer process such as a semiconductor IC / LSI element. ing. As a conventional package substrate, an IC chip that has been separated (divided) is mounted on a circuit substrate larger than the IC chip on which the redistribution layer is formed, and wire bonding connection has been used. Further, a package system is also employed in which a bare chip IC having metal bump terminals is mounted on a circuit board on which a rewiring layer is formed by using an anisotropic conductive adhesive.

  However, with the recent increase in the number of functions of portable electronic devices, further miniaturization of semiconductor devices is required, and in addition to the demand for higher integration of semiconductor IC / LSI, the focus has been on miniaturization of packages. Yes.

  Under such circumstances, in recent years, a wafer level chip scale package (WLCSP) constituted only by a built-up method has been developed as an ultimate small package. The WLCSP is a package in which wiring is formed directly on an IC using a silicon wafer as a base by a built-up method, and the package size is minimized to the same extent as the IC chip size. However, since the number of terminals that can be arranged on the package is restricted by the rule of the terminal pitch of the mounting board, the application of WLCSP is limited to an element having a small number of pins.

  As a technique for solving the restriction of WLCSP, for example, EWLP (Embedded Wafer Level Package) as disclosed in Patent Document 1 is known. However, the EWLP technology has the following problems.

  That is, since the package formation by the EWLP technology is performed by a built-up method such as plating using a resist mask, a heat radiation via (heat conduction path member) is disposed on the back surface (opposite side of the mounting surface) of the semiconductor element chip. However, it is difficult to obtain a package structure that effectively dissipates heat generated during device operation. In addition, the number of processes is long and the manufacturing cost is high, and a large number of heat pressing processes are required to build up multiple layers by built-up. There is a problem that a history is added and resin deterioration is likely to occur.

In addition, there exist patent documents 2-4 etc. as a prior art which improved the heat dissipation effect. Patent Document 2 and Patent Document 3 relate to a multilayer substrate of a type in which a plurality of electronic components are stacked. In the former, a technique in which a ventilation path for improving heat dissipation is provided in a stacked frame body is disclosed, and in the latter, stacking is performed. In addition, a technique in which one heat dissipation metal core substrate is provided for a plurality of electronic components is disclosed. Patent Document 4 relates to a hybrid module, in which circuit components are accommodated in the recesses of a multilayer circuit board obtained by laminating a large number of green sheets so as to form recesses for accommodating circuit components. A technique for contacting a separate parent circuit board via a board is disclosed. Moreover, the difference between the said patent documents 2-4 and this invention is supplementarily mentioned later.
Japanese Patent Laid-Open No. 2004-95836 Japanese Patent Application Laid-Open No. 2001-210954 Japanese Patent Laid-Open No. 2003-31955 Japanese Patent Laid-Open No. 11-220226

  The present invention solves the above-described conventional problems, and particularly has a built-in electronic component built-in wiring board suitable for obtaining a package structure with a multilayer wiring board that has excellent heat dissipation effects of built-in components and is easy to assemble, and a method of manufacturing the same. The purpose is to provide.

Method of manufacturing an electronic component built-in wiring board of the present invention includes the steps of forming a wiring board by pattern training forming a wiring layer on one surface of the insulating substrate, the insulating substrate, corresponding to a portion of the wiring layer Forming a through hole, forming a through electrode filled in the through hole and having one end surface connected to the wiring layer and the other end surface exposed on the other surface of the insulating substrate; An electronic component chip having an electrode layer is prepared, the other end surface of the through electrode is electrically connected to the electrode layer, and the electronic component chip is bonded to the other surface of the insulating substrate and integrated with each other. step and a step of forming a thermally conductive adhesive layer for heat dissipation in a plurality of projecting the electronic component chip mounting scheduled surface of the radiating board, said aligning the electronic component chip and said heat conducting adhesive layers together and Wiring board, electronic component chip and Superposing a thermal substrate, and interposing an insulating sealing material surrounding the electronic component chip between the heat radiating substrate and the wiring substrate and performing batch heat pressing in the superimposing direction. A method of manufacturing a wiring board with a built-in electronic component as a feature.
Yes In the production method of the present onset Ming electronic component built-in wiring board, the center portion of the wiring layer corresponding to the through hole, the through holes and communicating, the step of forming a small diameter of the small holes from the through hole The step of forming the through electrode is characterized in that the through electrode is formed by filling the through hole and the small hole with a conductive paste.

  According to the structure and manufacturing method of the electronic component built-in wiring board of the present invention, the conventional problems are solved, and in particular, there is an effect that a package structure excellent in the heat dissipation effect of the built-in component can be easily assembled. Such an effect can be exerted particularly when a package structure using a multilayer wiring board to meet the demand for multifunction / multiple terminals of electronic components is obtained.

  Hereinafter, an embodiment of a wiring board with a built-in electronic component according to the present invention will be described with reference to FIG.

  For example, the heat radiating substrate 1 made of copper foil constitutes the outermost layer of one surface (lower surface) of the package of the electronic component built-in wiring substrate, and the outer surface is exposed. The bottom surface of the electronic component chip 2 made of, for example, a semiconductor IC chip is bonded and fixed to the central portion of the inner surface (upper surface) of the heat radiating substrate 1 which is a component chip mounting planned surface through a heat conductive adhesive layer 3. The heat dissipating substrate 1 is preferably composed of a main component of the electronic component chip 2, such as a semiconductor material substrate such as Si, and a material having a close thermal expansion coefficient and excellent heat dissipation characteristics. Alternatively, a metal material such as a metal plate in which an Invar alloy is sandwiched by copper from both sides may be used, or an insulating material such as a resin plate having similar thermal characteristics may be used.

  The heat conductive adhesive layer 3 constitutes a heat path via between the electronic component chip 2 and the heat radiating substrate 1 and is made of, for example, a conductive paste (specifically, excellent in electrical and thermal conductivity). The target component is used later).

  The IC chip 2 is formed on a large number of functional element regions formed in the surface layer of a semiconductor material substrate such as Si, an insulating film such as a Si oxide film or a nitride film coated on the upper surface thereof, and the insulating film. A semiconductor substrate 2a having a chip internal wiring layer and a large number of electrode layers 2b constituting part of the chip internal wiring layer is configured as a base. The IC chip 2 further includes an insulating protective layer 2c formed on the upper surface of the semiconductor substrate 2a with the surface of the electrode layer 2b exposed.

  The rewiring layer 2B connected to the electrode layer 2b and disposed on the insulating protective layer 2c is formed by, for example, gold plating or vapor deposition, and is other than a wiring board laminated / connected to the IC chip 2 Patterning is performed with a desired wiring pitch, wiring length, wiring area, and pattern shape corresponding to the connection portions of the members such as electrodes and terminals.

  Therefore, the rewiring layer 2B has a pattern change adapted to the electrode and terminal arrangement of other members with respect to the wiring pitch and the like when the IC chip 2 in which the pattern of the electrode layer 2b is fixed is mounted on a package or the like. Can do. Further, when the IC chip 2 is electrically connected by pressing an electrode or a terminal of another member, the rewiring layer 2B formed on the insulating protective layer 2c has a portion of the other member. Since the electrodes and the terminals can be pressed and connected, the pressing force at that time is absorbed by the insulating protective layer 2c and the damage to the parts is alleviated.

  The first wiring substrate 4 disposed facing the IC chip 2 is a first insulating substrate 4a made of, for example, a polyimide resin film and a first wiring made of copper foil patterned on one surface (upper surface) thereof. It has a layer 4b. In the first insulating substrate 4a, first through holes 4c (two locations in the drawing) are formed in desired portions located between the first wiring layer 4b and the rewiring layer 2B of the IC chip 2. Yes.

  One end surface (upper surface) of the first through electrode 4d provided to fill each of the first through holes 4c is connected to the inner surface (lower surface) of the first wiring layer 4b, and the other end surface (lower surface) thereof. It is connected to the upper surface of the rewiring layer 2B. The first through electrode 4d constitutes a so-called interlayer conductive path, and here, the same conductive paste as the heat conductive adhesive layer 3 having excellent electrical and thermal conductivity is used.

  The insulating sealing layer 5 provided between the heat dissipation substrate 1 and the first wiring substrate 4 includes an insulating spacer 5a made of a resin film having an opening H through which the IC chip 2 can be inserted. The insulating adhesive layers 5b and 5c are provided below and above the spacer 5a, respectively. The insulating sealing layer 5 also surrounds the side periphery of the IC chip 2, and the heat radiating plate 1 and the first wiring board 4 are fixed to each other and hermetically sealed to form a part of the package. The IC chip 2 is directly embedded in the adhesive layers 5b and 5c.

  The spacer 5a suppresses undesired deformation due to fluidity at the time of assembling the adhesive layers 5b and 5c, and the parallelism or flatness between the heat sink 1 and the first wiring board 4 and the first wiring electrons. The positional accuracy of the component chip 2 can be increased.

  The second wiring board 6 disposed above the first wiring board 4 is made of the same material as that of the first wiring board 4, and includes a second insulating substrate 6a made of a polyimide resin film and one surface thereof ( The upper wiring has a second wiring layer 6b made of copper foil and patterned. The second insulating substrate 6a has second through holes 6c (four locations in the figure) at desired portions located between the second wiring layer 6b and the first wiring layer 4b of the first wiring substrate 4. Is formed.

  One end surface (upper surface) of the second through electrode 6d provided by filling each of the second through holes 6c is connected to the inner surface (lower surface) of the second wiring layer 6b, and the other end surface (lower surface). It is connected to the upper surface of the first wiring layer 4b. The upper surface of the first wiring board 4 and the second wiring board 6 are bonded and fixed by an adhesive layer 6e.

  In this way, the first wiring board 4 and the second wiring board 6 are laminated, and further, for example, according to the multi-function / high functionality of the electronic component chip 2, a multilayer in which a plurality of desired wiring boards are laminated. By providing a package with a wiring board structure, it can be freely mounted on a highly functional electronic device.

  Further, the upper surface (front surface) of the second wiring layer 6b is covered with an insulating protective mask 7 such as a solder resist in a state in which portions corresponding to the second through electrodes 6d are exposed. External terminals 8 made of ball-like solder bumps are formed on the exposed surfaces of the second wiring layer 6b. The external terminals 8 are not limited to the ball bumps, and other external terminal structures such as a beam lead type can be adopted according to the connection terminal structure of an electronic device or the like to be mounted. The planar outer shapes of the heat radiating plate 1, the first and second wiring boards 4 and 6, and the spacer 5a have substantially the same shape and dimensions.

  Next, a method for manufacturing an electronic component built-in wiring board according to the embodiment of the present invention will be described with reference to FIGS. 2A to 2E are cross-sectional views for explaining the manufacturing method related to the first wiring board, and FIGS. 3A to 3D are methods for manufacturing the electronic component chip (IC chip). FIG. 4A to FIG. 4D are cross-sectional views according to assembly steps for explaining a method of manufacturing an electronic component built-in wiring board. In these drawings (including FIG. 5), the same reference numerals denote the same or similar components (members), so that the components already described in a certain drawing will be described in detail in the description relating to the subsequent drawings. May be omitted.

  A manufacturing method related to the first wiring board 4 will be described with reference to FIG. First, in the step shown in FIG. 2A, a single-sided copper-clad plate (CCL) in which a wiring material layer 4B made of copper foil is provided on one surface (upper surface) of a flexible first insulating substrate 4a made of a polyimide resin film. ) Is prepared. As the first insulating substrate 4a and the wiring material layer 4B, those having thicknesses of 25 μm and 12 μm were used, respectively.

  2B, after forming an etching resist pattern (etching mask) corresponding to a desired circuit pattern on the surface of the wiring material layer 4B by photolithography, the wiring material layer 4B is chemically etched, The first wiring board 4 is obtained by forming the first wiring layer 4b having a desired circuit pattern. For the etching, an etchant mainly composed of ferric chloride was used.

  In the step shown in FIG. 2C, the adhesive layer 5c and the resin film F are sequentially bonded to the other surface (the lower surface opposite to the first wiring layer 4b) of the first insulating substrate 4a. An epoxy thermosetting resin film adhesive having a thickness of 25 μm was used for the adhesive layer 5c, and a polyimide resin film having a thickness of 25 μm was used for the resin film F.

  As a material of the adhesive layer 5c, an adhesive such as an acrylic resin or a thermoplastic adhesive can be used instead of the epoxy thermosetting resin. The adhesive layer 5c may be formed by applying, for example, a varnish-like resin adhesive on the lower surface of the first insulating substrate 4a instead of the film material. For the resin film F, a plastic film such as PET or PEN may be used instead of polyimide, and a film that can be bonded or peeled off by UV irradiation may be formed on the surface of the adhesive layer 5c. .

  Next, in the step shown in FIG. 2D, the first insulating substrate 4a, the adhesive layer 5c, and the resin film F are penetrated from the lower surface side, and a plurality of first through holes 4c (two places in the drawing) are formed. It is formed. These first through holes 4c are formed as via holes having a diameter of 100 μm by punching the first insulating substrate 4a with, for example, a YAG laser. During this laser processing, a small hole h having a diameter of about 30 μm is formed in the central portion of the first wiring layer 4b corresponding to each first through hole 4c. The first through holes 4c and the small holes h can also be formed by laser processing using a carbonic acid laser, excimer laser, or the like, drilling, or chemical etching.

  In the step shown in FIG. 2E, a plurality of conductive pastes are filled in the first through holes 4c by screen printing until the spaces of the through holes 4c and the small holes h are filled. A first through electrode 4d is formed. Therefore, one end surface (small hole h side) of the first through electrode 4d is connected in an engaged state with a relatively wide area across the inner surface (lower surface) of the first wiring layer 4b and the inner wall of the small hole h. The

  Thereafter, the resin film F is peeled off. As a result, the portion of the other end surface (lower surface) of the first through electrode 4d is exposed in a state of protruding to the lower surface side of the adhesive layer 5c with a height corresponding to the thickness dimension of the resin film F. The resin film F can adjust the protruding height of the through electrode by variously selecting the thickness thereof. The assembly member A related to the first wiring board 4 is formed through the above steps.

  By the way, the conductive paste for the first through electrode 4d was selected from the group of at least one low electrical resistance metal particle selected from the group of nickel, silver and copper, and the group of tin, bismuth, indium and lead. It comprised at least 1 type of low melting metal particle, and comprised with the paste which mixed the binder component which has an epoxy resin as a main component. Since the conductive paste is also excellent in thermal conductivity, it can exhibit the effect of conducting and dissipating generated heat to the outside.

  Next, a method for manufacturing the electronic component chip will be described with reference to FIG. In the step shown in FIG. 3A, a number of IC element regions X, Y, and Z respectively corresponding to a desired number of IC chips are formed on the Si semiconductor wafer 2A by a normal IC manufacturing technique. On the surface of each IC element region X, Y, Z, a chip internal wiring layer (not shown) and a large number of electrode layers 2b constituting a part thereof are formed.

  In the step shown in FIG. 3B, a liquid photosensitive polyimide precursor, for example, is spin-coated over the entire upper surface of the wafer 2A including the electrode layer 2b, and the electrode layers 2b are exposed by photolithography. An insulating protective layer 2c having a contact hole Ch for opening is formed.

  In forming the insulating protective layer 2c, benzocyclobutene (BCB), polybenzoxazole (PBO), or the like may be used as another resin material. The photosensitive resin is not limited to liquid and may be laminated on the wafer using a film-like resin. The coating of the photosensitive resin is not limited to the application by spin coating, and may be performed by any one of curtain coating, screen printing, spray coating, and the like.

  In the step shown in FIG. 3C, the rewiring layer 2B connected to the electrode layers 2b of the IC element regions X, Y, and Z through the contact holes Ch is formed on the insulating protective layer 2c by a semi-additive method. It is formed using. In the wafer process stage, probing inspection is performed to determine whether the characteristics are good or bad. As shown in FIG. 3D, a plurality of IC chips 2 separated by dicing and separating along the boundaries between the IC element regions X, Y, and Z are taken out.

  In general, the semiconductor material substrate or the chip internal wiring layer which is the base of the IC chip 2 is protected with an inorganic insulating film such as a Si oxide film or a nitride film. It is also possible to directly form the rewiring layer 2B thereon using a coating.

  Next, a manufacturing method related to the assembly of the electronic component built-in wiring board will be described with reference to FIG.

  First, in the step shown in FIG. 4A, an electronic component chip 2 made of an IC chip corresponding to the non-defective product selected in the step shown in FIG. 3C is prepared. The non-defective chip 2 is aligned with the assembly member A related to the first wiring board 4 manufactured in the process shown in FIG. 2E by the IC chip mounter, and the material of the adhesive layer 5c and The first through electrode 4d is temporarily bonded by heating at a temperature lower than the curing temperature of the conductive paste. Specifically, the first rewiring layer 2B is temporarily bonded to the lower surfaces of the first through electrode 4d and the adhesive layer 5c.

  In the step shown in FIG. 4B, the assembly member B related to the second wiring board 6 is aligned and stacked on the assembly member A. The assembly member B has the second insulating substrate 6a, the second wiring layer 6b, the second through hole 6c, the second through electrode 6d, and the adhesive layer 6e already shown in FIG. The shape, pattern, and the like are different from those of the assembly member A, but are manufactured through the same materials and processes as those of the assembly member A shown in FIG. The lower end surfaces of the plurality of second through electrodes 6d are arranged in contact with the first wiring layers 4b of the assembly member A, respectively.

  Below the assembly member A, the heat dissipating substrate 1 serving as a support substrate is disposed so as to overlap. The heat radiating substrate 1 is made of copper foil having a thickness of 100 μm, and the conductive paste described above is formed on the upper surface thereof at a position facing the lower surface (back surface) of the IC chip 2 by, for example, screen printing using a metal mask. As an example, the heat conductive adhesive layer 3 as a plurality of protruding heat conductive path vias is formed in advance. Further, the heat radiating substrate 1 may be made of a metal material such as a metal plate in which the aforementioned molybdenum or invar alloy is sandwiched between copper from both sides.

  A spacer 5 a is disposed between the assembly member A and the heat dissipation substrate 1. As the spacer 5a, a resin film having a thickness of 40 μm, in which an opening H slightly larger than the outer peripheral wall shape of the IC chip 2 is used, and the side periphery of the IC chip 2 is separated and surrounded. Placed in. The spacer 5a is preferably made of the same material as the first and second insulating substrates in order to make it difficult for thermal distortion to occur due to the relationship with other members.

  However, other resins or metals that can reduce the thermal strain can be used for the spacer 5a material. The material of the adhesive layer 5b previously attached to the lower surface of the spacer 5a can be selected as appropriate, but is preferably the same material as the adhesive layers 5c and 6e.

  Next, in the step shown in FIG. 4C, each member such as the heat dissipation substrate 1, the spacer 5a, the assembly member A, the assembly member B, and the electronic component chip 2 arranged as shown in FIG. They are superimposed on each other in close proximity to each other.

  In the step shown in FIG. 4 (d), the superposed body shown in FIG. 4 (c) is mounted on a vacuum curing press and heat-pressed in a reduced pressure atmosphere of 1 kPa or less, so Is batch heat pressed. During the batch hot pressing, the adhesive layers 5b and 5c are thermally cured, and at the same time, the conductive paste used for the first and second through electrodes 4d and 6d and the heat conductive adhesive layer 3 is thermally cured.

  By the batch heat pressing, the lower end surface portion of the first through electrode 4d of the first wiring board 4 is firmly connected to the surface of the rewiring layer 2B of the electronic component chip 2 so as to be crushed, and the first wiring board 4 The spacer 5a is bonded and fixed by the adhesive layer 5c. The lower end surface portion of the second through electrode 6d of the second wiring board 6 is firmly connected to the surface of the first wiring layer 4b of the first wiring board 4 so as to be crushed, and the first and second wirings The substrates 4 and 6 are bonded and fixed to each other by the adhesive layer 6e, and the spacer 5a is bonded and fixed to the surface of the heat dissipation substrate 1 by the adhesive layer 6e.

  As a result of the collective pressing, the insulating sealing layer 5 is formed by integrating the spacer 5a and the adhesive layers 5b and 5c on both sides thereof. Since the adhesive layers 5b and 5c are plastically flowed so as to fill the space / gap between the heat dissipation substrate 1, the electronic component chip 2 and the first wiring substrate 4 during pressing, the electronic component chip 2 is It is in a state of being embedded in the insulating sealing layer 5.

  In other words, the insulating sealing layer 5 does not need to be specially formed with a concave portion for storing an electronic component chip in advance, and it is easy to enclose the electronic component chip 2 by flow deformation so that it is a major part of the package. Can be configured.

  By the way, the heat conductive adhesive layer 3 may have a single layer shape bonded over the entire lower surface of the electronic component chip 2. When the heat conductive adhesive layer 3 is configured as a plurality of protruding heat conductive vias as described above, the heat conductive adhesive layer 3 is formed on the heat dissipation substrate 1 with a distribution pattern of a plurality of islands. The distribution pattern of the heat conductive adhesive layer 3 is, for example, a grid pattern or a lattice pattern by screen printing of a conductive paste, or the individual island shapes are easily formed into various shapes such as a circular shape and a rectangular shape. be able to.

  After the step shown in FIG. 4D, a solder resist layer 7 is formed on the upper surface of the second wiring substrate 6 as shown in FIG. The resist layer 7 is formed by screen-printing a liquid photosensitive resin, exposing and developing with a mask pattern that exposes a part of the surface of each second wiring layer 6b corresponding to each second through electrode 6d. Is done. Thereafter, a pattern of solder paste is printed on the surface of the second wiring substrate 6 and reflowed to form a plurality of external terminal electrodes 8 made of ball-shaped solder bumps. Each of the second wiring layers 6b and the second through-holes are formed. Connected to the electrode 6d.

  According to the electronic component built-in wiring board and the manufacturing method according to the embodiment of the present invention manufactured as described above, the heat from the electronic component chip 2 is transmitted to the outside through the heat conductive adhesive layer 3 and the heat dissipation substrate 1. Since the heat is radiated, the electrical operation of the electronic component chip 2 can be stabilized. For this reason, it is possible to mount even an electronic component chip having a large calorific value that could not be incorporated in the prior art, and the application range of the electronic component chip can be expanded.

  Further, when each of the through electrodes 4d and 6d is made of the same conductive paste as that of the heat conductive adhesive layer 3, heat dissipation from the through electrodes 4d and 6d to the external terminal electrode 8 side is also obtained. It is done.

  Further, the insulating sealing layer 5 constituting the main part of the package can seal the electronic component chip 2 with a simple structure, and a special space forming process for accommodating the electronic component chip 2 can be performed. There is no need to do.

  Each wiring board such as each of the wiring boards 4 and 6 uses a single-sided metal foil-clad wiring board material such as a single-sided CCL, and the first and second through electrodes 4d and 6d for interlayer connection are made of a conductive paste. It can be formed by printing filling. Therefore, compared to the above-described conventional built-up method (see Patent Document 1), the plating process can be eliminated in all processes, and the production time and production cost can be greatly reduced.

  In addition, the heat dissipation substrate 1, the electronic component chip 2, and the first and second wiring substrates are bonded and fixed to each other by the adhesive layers 5b, 5c, and 6e by the batch heat pressing process, and the package substrate laminated structure is pressed once. Therefore, as compared with the built-up method, the heat history applied to these laminated members and the deterioration of the members can be significantly reduced.

  Furthermore, even if a defective product is generated in each of the manufacturing process of the first and second wiring boards 4 and 6, the manufacturing process of the electronic component chip 2 and the manufacturing process of the heat dissipation board 1 with the heat conductive adhesive layer 3, it is not in each case. Non-defective products can be excluded, and accumulation of yield deterioration can be avoided. Therefore, through the assembly steps shown in FIGS. 4A to 4D, a high-quality electronic component built-in wiring board using each non-defective member can be reliably manufactured without waste.

  In addition, although the example which used the semiconductor element chip | tip with the rewiring layer 2B for the said electronic component chip 2 was shown as one Embodiment, the arrangement | positioning of the electrode layer provided in the semiconductor element chip | tip, and penetration of the said 1st wiring board 4 were shown. If the arrangement of the electrodes is matched, the through electrode can be directly connected to the electrode layer. In this case, the semiconductor element chip may be a bare chip not provided with the rewiring layer 2B. .

  Next, an electronic component built-in wiring board according to another embodiment of the present invention will be described with reference to FIG. The electronic component built-in wiring board of the embodiment shown in FIG. 5A is an example in which the spacer 5a in the insulating sealing layer 5 formed in the one embodiment is omitted. That is, for example, the thickness of the adhesive layer 5c bonded to the lower surface of the first insulating substrate 4a shown in FIG. 4 is such that the electronic component chip 2 can be sufficiently embedded in the batch heating press process of FIG. In the case of the thickness, the spacer 5a can be omitted, and the insulating sealing layer 5 can be constituted only by the thick adhesive layer 5c. In this example, the total thickness of the electronic component built-in wiring board can be made thinner than in the case of the one embodiment.

  The electronic component built-in wiring board of the embodiment shown in FIG. 5B is an example in which both the spacer 5a and the second wiring board 6 used in the embodiment are omitted. In other words, when the electronic component (IC) chip 2 has a small number of functions and the number of external terminal electrodes 8 can be reduced, it is sufficient to use only the first wiring board 4 described above. In this case, since it is not necessary to widen the periphery of the planar pattern of the first wiring layer 4b to the outside of the electronic component chip 2, the outer dimensions (areas) of the heat dissipation board 1 and the first wiring board 4 can be set as in the embodiment. It can be made smaller than the case, and the spacer 5a can be omitted.

  The electronic component built-in wiring board of the embodiment shown in FIG. 5C is made of another functional element such as a capacitor or a resistor instead of the electronic component chip 2 made of the IC chip used in the embodiment. This is an example using an electronic component chip 21. The electronic component chip 21 has electrode layers 21b provided at both ends of the functional element portion 21a, and the electrode layers 21b are connected to the first through electrodes 4d.

  In the present invention, various electronic component chips can be used as described above, and such an electronic component chip achieves the object of the present invention regardless of whether it is a bare chip form or a packaged chip form. can do.

  The wiring board may be a multi-layered laminate of one layer or two or more layers depending on the number of functions of the electronic component chip, and the wiring layer provided on the wiring board is a rewiring for the electronic component chip. It can also be called a layer.

  Next, the difference between the electronic component built-in wiring board and manufacturing method according to the present invention and the Patent Documents 2 to 4 will be supplementarily described. According to these patent documents, in order to form a package cavity for storing electronic components, the frame 6 is used in the technique of Patent Document 2, and the dam forming material 30 is used in the technique of Patent Document 3. The technique of document 4 discloses that a plurality of green sheets having openings are overlapped with a plurality of green sheets having no openings to provide a recess 14 as shown in FIGS. In other words, special part processing is required to establish the package cavity. On the other hand, in the electronic component built-in wiring board according to the present invention, the insulating sealing layer 5 can be configured to include an adhesive layer, and the electronic component can be formed by batch hot pressing. Since the package can be configured with a structure that can be embedded in the adhesive material layer 5, there is an advantage that the structure is simple and the package forming process is remarkably simplified.

It is sectional drawing which shows the electronic component built-in type wiring board which concerns on one Embodiment of this invention. It is a figure for demonstrating the manufacturing method relevant to the 1st wiring board which concerns on one Embodiment of this invention, (a)-(e) is sectional drawing according to the process. , It is a figure for demonstrating the manufacturing method of the electronic component chip | tip (IC chip) which concerns on one Embodiment of this invention, (a)-(d) is sectional drawing according to the individualization process. It is a figure for demonstrating the manufacturing method of the electronic component built-in type wiring board which concerns on one Embodiment of this invention, (a)-(d) is sectional drawing according to the assembly process. It is sectional drawing which shows three types of examples (a)-(c) regarding the electronic component built-in type wiring board which concerns on other embodiment of this invention.

Explanation of symbols

1 heat radiation substrate 2, 21 an electronic component chip 2a semiconductor substrate 2b electrode layer 2c insulating protection layer 2B rewiring layer 3 heat-conducting adhesive layer 4 and 6 the first wiring board, the second wiring board 4a, 6a first insulating substrate, the second Insulating substrate 4b, 6b 1st wiring layer, 2nd wiring layer 4c, 6c 1st through-hole, 2nd through-hole 4d, 6d 1st through-electrode, 2nd through-electrode 5 Insulating sealing layer 5a Spacer 5b, 5c, 6e Adhesive layer 7 Protective mask 8 External terminal h Small hole H Spacer opening X, Y, Z IC element region

Claims (2)

Forming a wiring board by patterning a wiring layer on one surface of the insulating substrate;
Forming a through hole corresponding to a part of the wiring layer in the insulating substrate;
Forming a through electrode that is filled in the through hole and has one end surface connected to the wiring layer and the other end surface exposed on the other surface of the insulating substrate;
An electronic component chip having an electrode layer on one surface is prepared, the other end surface of the through electrode is electrically connected to the electrode layer, and the electronic component chip is bonded to the other surface of the insulating substrate. Integrating them with each other;
Forming a heat conductive adhesive layer for heat dissipation in a plurality of protrusions on the surface on which the electronic component chip is to be mounted on the heat dissipation substrate;
The electronic component chip and said heat conducting adhesive layers mutually aligned to the wiring substrate, a step of superimposing the electronic component chip and the heat dissipation substrate,
Interposing an insulating sealing material surrounding the electronic component chip between the heat dissipation board and the wiring board and performing a batch hot press in the overlapping direction;
A method of manufacturing a wiring board with a built-in electronic component, comprising: In the central portion of the wiring layer corresponding to the through hole, the step of communicating with the through hole and forming a small hole having a smaller diameter than the through hole,
Step, the through hole and the method of manufacturing the electronic component built-in wiring board according to claim 1, characterized by forming the through electrode by filling a conductive paste into the small hole to form the through electrode .

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