JP6062884B2 - Component-embedded substrate, manufacturing method thereof, and mounting body - Google Patents

Description

  The present invention relates to a component-embedded substrate that incorporates an electronic component, a manufacturing method thereof, and a mounting body.

  In order to respond to the demand for further miniaturization and higher performance mainly in small precision electronic equipment in recent years, for example, by using the component-embedded substrate technology, the electronic components such as semiconductor devices are being miniaturized and the higher integration is supported. The need is increasing. 2. Description of the Related Art A component built-in substrate (for example, see Patent Document 1 below) is known as a component using the component built-in substrate technology.

  This component-embedded substrate is formed by laminating a plurality of unit substrates and incorporating a plurality of electronic components in the laminating direction, and a plurality of double-sided substrates in which electronic components are accommodated in the opening are laminated in the laminating direction. Is laminated between other unit substrates including a double-sided substrate. Thereby, the thickness of the part which accommodates an electronic component is made thin, and thickness reduction of the whole component built-in board | substrate is achieved.

Japanese Patent No. 5427305

  In a commonly used electronic component made of a silicon semiconductor, for example, when the Tj temperature (semiconductor element temperature) is 175 ° C. or higher, the semiconductor element itself may be destroyed by heat. Therefore, the thermal design is performed so that the Tj temperature in the operation of the electronic component falls within a range of 80 ° C. to 100 ° C., for example.

  However, in the conventional component-embedded substrate disclosed in Patent Document 1, an insulating resin material such as an epoxy resin or a polyimide resin having a thermal conductivity coefficient of about 0.2 W / mk is provided around the built-in electronic component. The structure covered with is adopted. Further, only an adhesive layer made of an insulating resin material or an intermediate substrate is interposed between the plurality of electronic components.

  This insulating resin material exhibits a thermal conductivity coefficient of about 1/1000 times that of a metal material such as copper having a thermal conductivity coefficient of about 370 W / mk. For this reason, there is a problem that the heat of the electronic component is not easily diffused, and a structural design in consideration of heat dissipation characteristics is required.

  The present invention has been made in view of the above-described problems, and has a component-embedded board that can dissipate heat by diffusing the heat of the built-in electronic component in the layer while reducing the thickness of the entire component-embedded board. An object is to provide a manufacturing method and a mounting body.

  The component-embedded substrate according to the present invention is a component-embedded substrate having a multilayer structure in which a plurality of unit substrates are stacked and a plurality of electronic components are embedded in the stacking direction, and the plurality of unit substrates are first insulating layers. A first substrate having an opening in which the first electronic component is accommodated, and a first wiring layer formed adjacent to the first substrate and formed on a surface of the second insulating layer on the first substrate side And an intermediate substrate provided with a first adhesive layer provided at least on the first substrate side of the second insulating layer, wherein the first wiring layer and the first electronic component of the intermediate substrate are bonded to the first adhesive layer. It is characterized by being arranged and laminated so as to face each other through layers.

  According to the component-embedded substrate according to the present invention, the first wiring layer of the intermediate substrate adjacent to the first substrate via the first adhesive layer and the first electronic component housed in the opening of the first substrate are It is arranged and laminated so as to face each other through one adhesive layer. For this reason, since the heat of the first electronic component is conducted to the first wiring layer through the first adhesive layer, the heat spreads through the first wiring layer and can be diffused and dissipated in the layer. Further, since the first electronic component is accommodated in the opening of the first substrate, it is not necessary to arrange an insulator spacer for accommodating the first electronic component between the unit substrates, and the entire component-embedded substrate is thin. Can be achieved.

  In one embodiment of the present invention, the plurality of unit substrates are disposed on the opposite side of the intermediate substrate from the first substrate, have a third insulating layer, and overlap the first electronic component in the stacking direction. A second substrate having an opening accommodating a second electronic component at a position, wherein the intermediate substrate includes a second wiring layer formed on a surface of the second insulating layer on the second substrate side, and the second substrate The first adhesive layer is provided on the second substrate side of the two insulating layers.

  In another embodiment of the present invention, the intermediate substrate is disposed and laminated such that the second wiring layer and the second electronic component face each other with the first adhesive layer interposed therebetween.

  In still another embodiment of the present invention, the plurality of unit substrates are disposed between the second substrate and the intermediate substrate, and a third wiring layer formed on one surface of the fourth insulating layer and A second adhesive layer provided on the other surface side of the fourth insulating layer, having a via that penetrates the fourth insulating layer and connects the third wiring layer and the second electronic component; The intermediate substrate is arranged and laminated such that the second wiring layer and the third wiring layer are opposed to each other with the first adhesive layer interposed therebetween.

  In still another embodiment of the present invention, at least one of the first and second wiring layers of the intermediate substrate is formed in a region that does not overlap with the third wiring layer of the third substrate in the stacking direction. .

  A method for manufacturing a component-embedded substrate according to the present invention is a method for manufacturing a component-embedded substrate having a multilayer structure in which a plurality of unit substrates are stacked and a plurality of electronic components are embedded in the stacking direction. Forming a first substrate by forming an opening for accommodating the first electronic component in one insulating layer, and forming a first wiring on a surface of the second insulating layer disposed on the first substrate side as the unit substrate; Forming an intermediate substrate by forming a layer and forming a first adhesive layer on at least the first substrate side of the second insulating layer; and housing the first electronic component in the opening of the first substrate The intermediate substrate is arranged adjacent to the first substrate so that the first wiring layer and the first electronic component face each other with the first adhesive layer interposed therebetween, and a plurality of unit substrates are arranged in the stacking direction. And a step of laminating.

  According to the component-embedded substrate manufacturing method of the present invention, the first electronic component is accommodated in the opening of the first substrate manufactured as the unit substrate, and the first wiring layer is formed on the first substrate. A component-embedded substrate in which a plurality of unit substrates are stacked in the stacking direction so that the intermediate substrate is disposed adjacently via the first adhesive layer, and the first wiring layer and the first electronic component face each other via the first adhesive layer Therefore, it is possible to easily manufacture a component-embedded substrate that exhibits the same effects as those of the component-embedded substrate.

  In one embodiment of the present invention, the second substrate is manufactured by forming an opening in the third insulating layer as the unit substrate in which the second electronic component is accommodated at a position overlapping the first electronic component in the stacking direction. And the step of producing the intermediate substrate includes forming a second wiring layer on a surface of the second insulating layer disposed on the second substrate side, and forming the second insulating layer on the second substrate side. In the step of laminating and laminating the first adhesive layer, the second substrate is disposed on the opposite side of the intermediate substrate from the intermediate substrate and laminated.

  In another embodiment of the present invention, in the step of laminating, the second electronic component and the second wiring layer are opposed to each other with the first adhesive layer interposed between the second substrate and the intermediate substrate. Are arranged and laminated.

  In still another embodiment of the present invention, a third wiring layer is formed on one surface of the fourth insulating layer as the unit substrate, and the third wiring layer and the second wiring penetrate through the fourth insulating layer. Forming a via connected to an electronic component, and providing a second adhesive layer on the other surface side of the fourth insulating layer to produce a third substrate, and in the step of laminating, the third substrate Between the second substrate and the intermediate substrate, the second wiring layer and the third wiring layer are disposed so as to face each other with the first adhesive layer interposed therebetween.

  In still another embodiment of the present invention, in the step of manufacturing the intermediate substrate, at least one of the first and second wiring layers does not overlap with the third wiring layer of the third substrate in the stacking direction. To form.

  The mounting body according to the present invention is such that another electronic component is surface-mounted on at least one mounting surface of the front and back surfaces of the component-embedded substrate.

  According to the present invention, it is possible to dissipate heat by diffusing heat of a built-in electronic component in the layer while reducing the thickness of the entire component-embedded substrate.

It is sectional drawing which shows the component built-in board | substrate which concerns on the 1st Embodiment of this invention. It is a top view which shows the intermediate board of the same component built-in board. It is a flowchart which shows the manufacturing process by the manufacturing method of the same component built-in substrate. It is a flowchart which shows the manufacturing process by the manufacturing method of the same component built-in substrate. It is a flowchart which shows the manufacturing process by the manufacturing method of the same component built-in substrate. It is a flowchart which shows the manufacturing process by the manufacturing method of the same component built-in substrate. It is sectional drawing which shows the same component built-in board | substrate for every manufacturing process. It is sectional drawing which shows the same component built-in board | substrate for every manufacturing process. It is sectional drawing which shows the same component built-in board | substrate for every manufacturing process. It is sectional drawing which shows the mounting body provided with the component built-in board | substrate which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the component built-in board | substrate which concerns on the 2nd Embodiment of this invention. It is a top view which shows the intermediate board of the same component built-in board. It is sectional drawing which shows the component built-in board | substrate which concerns on the 3rd Embodiment of this invention. It is a top view which shows the intermediate board of the same component built-in board. It is sectional drawing which shows the component built-in board | substrate which concerns on the 4th Embodiment of this invention. It is sectional drawing which shows the component built-in board | substrate which concerns on the 5th Embodiment of this invention.

  Hereinafter, a component-embedded substrate, a manufacturing method thereof, and a mounting body according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view showing a component-embedded substrate according to the first embodiment of the present invention. FIG. 2 is a top view showing the intermediate board of the component built-in board. FIG. 1 is a view showing a cross section taken along line A-A ′ in FIG. 2. As shown in FIGS. 1 and 2, the component-embedded substrate 1 according to the first embodiment is formed by stacking a plurality of unit substrates and incorporating a plurality of electronic components 80 and 90 in the stacking direction.

  The component-embedded substrate 1 has a structure in which a plurality of double-sided substrates 10 as a unit substrate, an intermediate substrate 20, and a plurality of single-sided substrates 30 are collectively laminated by, for example, thermocompression bonding. In the component-embedded substrate 1, the double-sided substrate 10 disposed below the intermediate substrate 20 in the stacking direction functions as a first substrate.

  Further, the double-sided substrate 10 disposed above the intermediate substrate 20 in the stacking direction is used as a second substrate, and the single-sided substrate 30 disposed between the double-sided substrate 10 and the intermediate substrate 20 as the second substrate is Each functions as a third substrate. Each electronic component 80, 90 has, for example, a back surface 81a, 91a side facing upward in the stacking direction and an electrode forming surface 81b, 91b side facing down in the stacking direction in the opening 19 formed in each double-sided substrate 10. Each of them is housed in the state of facing.

  The electronic component 80 accommodated in the opening 19 of the double-sided substrate 10 that functions as the first substrate functions as the first electronic component and is accommodated in the opening 19 of the double-sided substrate 10 that functions as the second substrate. The electronic component 90 functions as a second electronic component. The electronic components 80 and 90 incorporated in the component-embedded substrate 1 are not limited to two as described above, and more electronic components 80 and 90 may be incorporated.

  Each double-sided substrate 10 includes, for example, a resin base 11 as a film-like first and third insulating layers, and wirings 12 formed on both sides of the resin base 11, respectively. In addition, each double-sided substrate 10 includes vias 13 that are formed by plating in via holes 2 that penetrate one wiring 12 and resin base material 11 and connect the respective wirings 12.

  Moreover, each double-sided board 10 is provided with the opening part 19 which removed the resin base material 11 and the wiring 12 in the predetermined location, respectively. Electronic parts 80 and 90 are accommodated in the openings 19, respectively. In the case where the first and second substrates are not configured by the double-sided substrate 10, it is sufficient to configure the first and second substrates by the resin base material 11 and the opening 19.

  The intermediate substrate 20 is adjacent to, for example, at least one double-sided substrate 10 (the double-sided substrate 10 on the lower side in the stacking direction in FIG. 1), and a resin base material 21 as a film-like second insulating layer, and the resin base material 21 and wirings 22 as first and second wiring layers formed on the lower surface and the upper surface in the stacking direction, respectively.

  Further, the intermediate substrate 20 includes an adhesive layer 9 as a first adhesive layer provided on at least the double-sided substrate 10 side of the resin base material 21 (both sides of the resin base material 21 in FIG. 1). Further, the intermediate substrate 20 includes a via 23 made of a conductive paste filled in the via hole 3 penetrating the resin base material 21 together with the adhesive layer 9.

  As shown in FIG. 2, the wiring 22 is formed in a solid state over almost the entire surface on both surfaces of the resin base material 21, including the region 29 overlapping with the electronic component 80 surrounded by the broken line in FIG. 2 in the stacking direction. ing. In the present embodiment, the via 23 is formed so as not to be connected to the wiring 22 in the surface direction.

  The via 23 functions as a conductive via for interlayer signal transmission, for example. The vias 23 are formed at predetermined intervals along the outer periphery of the end portion in a region slightly inside the end portion in the surface direction of the resin base material 21 in the intermediate substrate 20. A wiring 22 (hereinafter referred to as “downward wiring”) 22 formed on the lower surface of the resin base material 21 in the stacking direction is disposed opposite to the back surface 81a of the electronic component 80 with the adhesive layer 9 interposed therebetween. A wiring 22 (hereinafter referred to as “upper wiring”) 22 formed on the upper surface of the resin base material 21 in the stacking direction is disposed to face the lower wiring 22 through the resin base material 21. Yes.

  For this reason, the heat of the electronic component 80 is once transmitted from the back surface 81a and the like to the adhesive layer 9, and then transmitted to the lower wiring 22, and then spreads and diffuses in the surface direction along the lower wiring 22. . Further, the heat transmitted to the lower wiring 22 is further transmitted to the upper wiring 22 through the resin base material 21, and similarly spreads in the surface direction along the upper wiring 22 to be diffused and dissipated. Accordingly, the wiring 22 of the intermediate substrate 20 functions as a heat dissipation layer that diffuses the heat of the electronic component 80 within the layer.

  Each single-sided substrate 30 includes, for example, a film-like resin base material 31 and wirings 32 as third wiring layers formed on one surface of the resin base material 31. Each single-sided substrate 30 is filled and formed in an adhesive layer 9a as a second adhesive layer provided on the other surface side of the resin base material 31, and via holes 4 penetrating the adhesive layer 9a and the resin base material 31. And a via 33 made of a conductive paste. Note that bumps 49 made of, for example, solder are formed on the wirings 32 exposed to the outside of the single-sided board 30 respectively arranged on the outermost layer side of the component-embedded substrate 1.

  Although details will be described later, the double-sided substrate 10 and the intermediate substrate 20 can be constituted by double-sided CCL (double-sided copper-clad laminate), and the single-sided substrate 30 can be constituted by single-sided CCL (single-sided copper-clad laminate). Each resin base material 11, 21, 31 is made of a low dielectric material resin film having a thickness of about 12 μm to 25 μm, for example. As the resin film, for example, polyimide (PI), polyolefin (PO), liquid crystal polymer (LCP), or the like can be used.

  The wirings 12, 22, and 32 are made of a conductive material such as copper foil patterned on the resin base materials 11, 21, 31, for example. The wiring 22 of the intermediate substrate 20 is formed in a substantially solid shape on the resin base material 21 as shown in FIG. The electronic components 80 and 90 built in the component built-in substrate 1 are composed of active components of semiconductor elements such as transistors, integrated circuits (ICs) and diodes, and passive components such as resistors, capacitors, relays and piezoelectric elements.

  The electronic components 80 and 90 shown in FIG. 1 are, for example, WLP (Wafer Level Package) subjected to rewiring. A plurality of rewiring electrodes 81 and 91 formed on pads (not shown) are provided on the electrode forming surfaces 81b and 91b side of the electronic components 80 and 90, and around these rewiring electrodes 81 and 91, respectively. An insulating layer (not shown) is formed.

  The vias 23 and 33 are made of conductive paste filled in the via holes 3 and 4, respectively. The conductive paste is, for example, at least one kind of low electrical resistance metal particles selected from nickel, gold, silver, copper, aluminum, iron and the like, and at least one kind selected from tin, bismuth, indium, lead and the like. And low melting point metal particles.

  The conductive paste is made of a paste in which a binder component mainly composed of epoxy, acrylic, urethane or the like is mixed with these metal particles. The conductive paste thus configured has a metal sintered type characteristic in which the curing temperature is about 150 ° C. to 200 ° C. and the melting point after curing is about 260 ° C. or more.

  In addition, the conductive paste has a characteristic that, for example, the contained low melting point metal can be melted at 200 ° C. or less to form an alloy, and in particular, can form an intermetallic compound with copper or silver. Yes. Therefore, the connection portions between the vias 23 and 33 and the wirings 12 and 32 are alloyed by an intermetallic compound at the time of thermocompression bonding in a batch.

  The conductive paste can be composed of a nanopaste in which fillers such as gold, silver, copper, and nickel having a nanometer particle size are mixed with the binder component as described above. In addition, the conductive paste can be constituted by a paste in which metal particles such as nickel are mixed with the binder component as described above. In this case, the conductive paste has a characteristic that electrical connection is made when the metal particles come into contact with each other.

  Moreover, as a filling method of the conductive paste into the via holes 3 and 4, for example, a printing method, a spin coating method, a spray coating method, a dispensing method, a laminating method, and a method using these in combination can be used. As described above, the via 13 is formed by plating applied to the via hole 2 in order to connect the wirings 12 formed on both surfaces of the resin base material 11 to each other.

  In the component-embedded substrate according to the first embodiment, as shown in FIG. 1, the intermediate substrate 20, the double-sided substrate 10, and the single-sided substrate 30 including the intermediate substrate 20 from the intermediate substrate 20 toward the lower side in the stacking direction. The single-sided substrate 30, the double-sided substrate 10, and the single-sided substrate 30 are laminated in six layers from the intermediate substrate 20 toward the upper side in the stacking direction.

  The intermediate substrate 20 is connected to the lower-side double-sided substrate 10 and the upper-side single-sided substrate 30 by an adhesive layer 9 provided on the intermediate substrate 20, and each double-sided substrate 10 and the single-sided substrate 30 are connected to the single-sided substrate 30. They are connected by the provided adhesive layers 9a. In addition, in each single-sided substrate 30 excluding the single-sided substrate 30 arranged at the top in the stacking direction, a part of the via 33 is connected to the rewiring electrodes 81 and 91 of the electronic components 80 and 90 on the adhesive layer 9a side. .

  In addition, each single-sided substrate 30 is arranged in a state where the other of the via 33 is connected to the wiring 12 or the via 13 and the wiring 32 is located on the opposite side of the resin base 31 from the electronic components 80 and 90 side. . The adhesive layers 9 and 9a are made of, for example, an organic adhesive material containing a volatile component such as epoxy or acrylic.

  In the component-embedded substrate 1 configured as described above, the wiring 22 is formed on both surfaces of the intermediate substrate 20 that is disposed adjacent to the double-sided substrate 10 in which the electronic component 80 is accommodated via the adhesive layer 9 as described above. Yes. For this reason, since the heat of the electronic component 80 is transmitted to the wiring 22 functioning as a heat dissipation layer through the adhesive layer 9 and the resin base material 21, for example, this heat is diffused in the layer in the surface direction of the wiring 22 to dissipate heat. It becomes possible to do.

  In addition, since the electronic components 80 and 90 are accommodated in the opening 19 of the double-sided substrate 10 and are built in the stacking direction, the thickness of the place where the electronic components 80 and 90 are built is almost equal to the thickness of the double-sided substrate 10. The thickness can be adjusted, and an insulating spacer or the like for housing the electronic components 80 and 90 is not required between the unit substrates, so that the thickness of the entire component-embedded substrate can be reduced and the thickness can be reduced.

  Furthermore, after the double-sided board 10, the intermediate board 20 and the single-sided board 30 having a simple structure are manufactured and the electronic components 80 and 90 are accommodated, for example, the back surface 81a of the electronic component 80 and the lower wiring 22 are connected by thermal vias. Since the component-embedded substrate 1 can be manufactured by batch lamination by thermocompression bonding without being connected, the manufacturing process can be simplified.

  The electronic components 80 and 90 accommodated in the opening 19 are surrounded by the adhesive layers 9 and 9a, and the resin base material 21 of the intermediate substrate 20 is interposed between the electronic components 80 and 90 in the stacking direction. doing. For this reason, even if the wafer die of the electronic components 80 and 90 is thin, the volume in the opening 19 can be adjusted, the mechanical strength in the stacking direction is ensured, the handling property is improved, and the insulation reliability between the electronic components 80 and 90 is increased. Can also be increased.

Next, a manufacturing method of the component built-in substrate 1 according to the first embodiment will be described.
3 to 6 are flowcharts showing manufacturing steps according to the method for manufacturing the component-embedded substrate. 7 to 9 are cross-sectional views showing the component-embedded substrate for each manufacturing process. First, the manufacturing process of the single-sided substrate 30 will be described with reference to FIG.

  As shown in FIG. 3, a single-sided CCL in which a conductor layer made of a solid copper foil or the like is formed on one surface of a resin base material 31 is prepared. Then, an etching resist is formed on the one-sided CCL conductor, for example, by photolithography, and then etching is performed to form a pattern of the wiring 32 (step S100).

  As for the formation of the wiring 32, a conductive thin film is formed on the resin substrate 31 by vapor deposition or sputtering, for example, and then a plating resist is formed by photolithography or the like, followed by electrolytic plating and peeling of the plating resist by a known semi-additive method. The wiring 32 may be formed by a method of removing the conductive thin film previously formed by etching.

  The single-sided CCL used in step S100 has a structure in which, for example, a resin base 31 having a thickness of about 25 μm is bonded to a conductor layer made of a copper foil having a thickness of about 12 μm. As this single-sided CCL, what was produced by apply | coating a polyimide varnish to copper foil by the well-known casting method, for example, and hardening the varnish can be used.

  In addition, as single-sided CCL, a seed layer is formed on a polyimide film by sputtering, and copper is grown by plating to form a conductor layer, or a rolled or electrolytic copper foil and a polyimide film are bonded together with an adhesive. What was produced can also be used.

  The resin base material 31 does not necessarily need to be made of a polyimide film, and may be made of a plastic film such as a liquid crystal polymer as described above. The same applies to the resin base materials 11 and 21. For the etching, an etchant mainly composed of ferric chloride or cupric chloride can be used.

  Next, an adhesive material is pasted on the other surface of the resin base 31 opposite to the wiring 32 side by lamination or the like (step S102) to form the adhesive layer 9a. For example, an epoxy thermosetting film having a thickness of about 25 μm can be used as the adhesive material to be attached in step S102.

  For bonding the adhesive, a vacuum laminator may be used, for example, heating and pressing with a pressure of 0.3 MPa at a temperature at which the adhesive does not cure in an atmosphere under reduced pressure. The adhesive used for the adhesive layers 9 and 9a is not limited to the epoxy thermosetting resin, but may be an acrylic adhesive or a thermoplastic adhesive typified by thermoplastic polyimide. Good. Further, the adhesive material does not necessarily have to be in the form of a film, and may be obtained by applying a varnish-like resin.

  After the adhesive layer 9a is formed, the via hole 4 penetrating the adhesive layer 9a and the resin base material 31 is irradiated from the adhesive layer 9a toward the wiring 32 using a laser device such as a UV-YAG laser. It is formed at a predetermined location (step S104). The formed via hole 4 is subjected to, for example, plasma desmear processing.

In addition, the via hole 4 may be formed by a carbon dioxide laser (CO ₂ laser), an excimer laser, or the like, or may be formed by drilling or chemical etching. The desmear treatment can be performed with a mixed gas of CF ₄ and O ₂ (tetrafluoromethane + oxygen), but other inert gases such as Ar (argon) can also be used. Furthermore, the desmear process may be a wet desmear process using a chemical solution instead of a so-called dry process.

  After the via hole 4 is formed, the conductive paste having the above-described configuration is filled into the via hole 4 by a method such as screen printing (step S106), and the via 33 is formed. In this way, a plurality of single-sided substrates 30 having the resin base material 31 on which the wiring 32 and the vias 33 are formed and provided with the adhesive layer 9a are manufactured.

  Note that the rewiring electrodes 81 and 91 of the electronic components 80 and 90 separately manufactured as necessary are aligned with predetermined vias of the single-sided substrate 30 by using, for example, an electronic component mounting machine (mounter) (not shown). Then, the electronic components 80 and 90 are temporarily bonded and mounted by heating at a temperature lower than the curing temperature of the conductive layer 9a of the single-sided substrate 30 and the via 33 (step S108). In this way, a plurality of single-sided substrates 30 on which the single-sided substrate 30 and the electronic components 80 and 90 are mounted are prepared.

Next, the manufacturing process of the double-sided substrate 10 will be described with reference to FIG.
First, as shown in FIG. 4, a double-sided CCL in which a conductor layer is formed on both sides of the resin base material 11 is prepared (step S200), and the via hole 2 is formed at a predetermined location as described above (step S202). For example, plasma desmear processing is performed.

  Next, panel plating is performed on the entire surface of the resin base material 11 (step S204), a plating layer is formed on the conductor layer and in the via hole 2, and a prototype of the wiring 12 and the via 13 is formed. Then, etching or the like is performed on both surfaces of the resin base material 11 to pattern the wirings 12 and vias 13 (step S206).

  Finally, the resin base material 11 in which the electronic components 80 and 90 are incorporated is removed by irradiating laser light using a laser device such as the UV-YAG laser as described above, and has a predetermined opening diameter. The opening 19 is formed (step S208), and a plurality of the double-sided substrates 10 having the opening 19 in which the electronic components 80 and 90 are accommodated are manufactured.

Next, the manufacturing process of the intermediate substrate 20 will be described with reference to FIG.
First, as shown to Fig.7 (a), the double-sided CCL by which the conductor layer 8 was formed on both surfaces of the resin base material 21 which consists of polyimide films, for example is prepared (step S300). Then, as shown in FIG. 7B, the wiring 22 is formed on both surfaces by performing etching or the like (step S302).

  Next, as illustrated in FIG. 7C, for example, an adhesive is pasted on both sides of the resin base material 21 (step S <b> 304) to form the adhesive layer 9. And as shown in FIG.7 (d), the mask material 7 is affixed on the surface layer of each contact bonding layer 9 (step S306), and a laser beam is irradiated to a predetermined location.

  Thereby, as shown in FIG.7 (e), the via hole 3 which penetrates the mask material 7, the contact bonding layer 9, and the resin base material 21 is formed (step S308). In step S308, the via hole 3 is formed so that the wiring 22 is not exposed in the via hole 3 in which the via 23 will be formed later.

  Then, as shown in FIG. 7F, the formed via hole 3 is filled with a conductive paste (step S310), and finally the mask material 7 is removed as shown in FIG. Step S312), the via 23 is formed. As a result, the intermediate substrate 20 having the resin base material 21 in which the adhesive layer 9 and the wiring 22 are provided on both sides and the vias 23 are formed is manufactured.

  When the plurality of double-sided substrates 10, the intermediate substrate 20, and the plurality of single-sided substrates 30 are manufactured in this manner, as shown in FIGS. 6 and 8, the electronic components 80 and 90 mounted on the single-sided substrates 30 and the double-sided substrates While aligning with the opening part 19 of the board | substrate 10, each via | veer 23,33 and each wiring 12,32 are aligned and positioned, and are laminated | stacked (step S400).

  Finally, for example, when thermocompression bonding is performed, batch lamination is performed by thermocompression bonding by heating and pressurizing in a reduced pressure atmosphere of 1 kPa or less using a vacuum press machine (step S402). The component built-in substrate 1 as shown in FIG. 9 is manufactured. Thereafter, if the bumps 49 are formed on the outermost layer wiring 32 as necessary, the component-embedded substrate 1 as shown in FIG. 1 can be manufactured.

  At the time of batch stacking, the conductive paste filled in the via holes 3 and 4 is cured and alloyed simultaneously with the curing of the adhesive layers 9 and 9a in the interlayer and the opening 19. And the alloy strength of the intermetallic compound can increase the mechanical strength of the connecting portions of the wirings 12 and 32 and the vias 23 and 33, and can improve the connection reliability. The lamination process of the substrates 10, 20, and 30 is not limited to batch lamination by thermocompression bonding.

  FIG. 10 is a cross-sectional view showing a mounting body including the component built-in substrate according to the first embodiment of the present invention. The mounting body 100 is obtained by surface-mounting other electronic components 98 and 99 different from the built-in electronic components 80 and 90 on the front and back sides of the component-embedded substrate 1 according to the first embodiment. The surface-mounted electronic components 98 and 99 are connected to the wiring 32 at a predetermined location on the single-sided substrate 30 through bumps 49 formed by solder reflow processing at a temperature of about 260 ° C., for example.

  In the example shown in the figure, one electronic component 98 is mounted on the back side of the component-embedded substrate 1 and two electronic components 99 are mounted on the front side, but the two electronic components 99 on the front side are further molded resin. It is sealed on the wiring 32 by a resin member 97 such as. Also in the mounting body 100 configured in this manner, the heat of the electronic component 80 built in the component built-in substrate 1 is diffused in the layer by the wiring 22 of the intermediate substrate 20 to dissipate heat, and the same effects as described above. An effect can be produced.

  Further, since the intermediate substrate 20 is interposed, distortion and deformation of the entire component-embedded substrate 1 are suppressed, so that the surface mounting of the electronic components 98 and 99 can be reliably performed. At the same time, since solder is not used as a constituent member of the component-embedded substrate 1, the solder does not remelt inside the substrate during solder reflow, and high connection reliability can be ensured.

  FIG. 11 is a cross-sectional view showing a component-embedded substrate according to the second embodiment of the present invention. FIG. 12 is a top view showing the intermediate board of the component built-in board. FIG. 11 is a view showing a cross section taken along line B-B ′ in FIG. 12. In the following description, the same reference numerals are attached to portions that overlap the already described portions, and the description may be omitted.

  As shown in FIGS. 11 and 12, the component-embedded substrate 1A according to the second embodiment includes a single-sided substrate 30 in which the wiring 22 on the upper side of the intermediate substrate 20 is connected to the electronic component 90 on the upper side in the stacking direction. This is different from the component-embedded substrate 1 according to the first embodiment in that it is formed in a region that does not overlap the wiring 32 in the stacking direction.

  That is, the upper wiring 22 is formed in a pattern that is not formed in the region 29a overlapping the wiring 32 in the stacking direction in the region 29 as shown in FIG. As a result, the same effects as the above-described effects can be obtained, and the wiring 22 on the upper side of the intermediate substrate 20 and the wiring 32 connected to the electronic component 90 of the single-sided substrate 30 immediately above the contact can be contacted at the time of batch lamination. In addition, the electrical connection reliability can be further improved.

  FIG. 13 is a cross-sectional view showing a component built-in substrate according to a third embodiment of the present invention. FIG. 14 is a top view showing an intermediate board of the component built-in board. FIG. 13 is a view showing a cross section taken along line C-C ′ in FIG. 14. As shown in FIGS. 13 and 14, the component-embedded substrate 1 </ b> B according to the third embodiment includes the wirings 32 on the single-sided substrate 30 in which the upper and lower wirings 22 of the intermediate substrate 20 face each other in the stacking direction. The point that it is not overlapped with the wiring 12 of the double-sided substrate 10 in the stacking direction and is patterned in, for example, a lattice pattern in the region surrounded by the vias 23 is the same as the component built-in substrate 1A according to the second embodiment. It is different. In addition, the pattern of the wiring 22 can be composed of not only a grid pattern but also various patterns based on a heat radiation design.

  FIG. 15 is a cross-sectional view showing a component built-in substrate according to a fourth embodiment of the present invention. In FIG. 15, the illustration of the bumps 49 is omitted. As shown in FIG. 15, the component-embedded substrate 1 </ b> C according to the fourth embodiment is substantially solid in a region where the wiring 22 of the intermediate substrate 20 is surrounded by the vias 23, and the stacking direction is higher than that of the intermediate substrate 20. This is different from the component-embedded substrate 1 according to the first embodiment in that the arrangement configuration of each substrate on the upper side of the component is different.

  That is, in the component built-in substrate 1 </ b> C, the double-sided substrate 10 and the single-sided substrate 30 are arranged in this order from the intermediate substrate 20 toward the upper side in the stacking direction. In addition, the back surfaces 81a and 91a of the electronic components 80 and 90 accommodated in the openings of the double-sided substrates 10 are stacked so as to face each other with the intermediate substrate 20 interposed therebetween.

  And the point which the single-sided board | substrate 30 arrange | positioned in the outermost surface layer of the components built-in board 1 by such a structure is abbreviate | omitted from the components built-in board 1 which concerns on 1st Embodiment. The stacked arrangement of the substrates 10, 20, and 30 is such that the single-sided substrate 30, the double-sided substrate 10, the intermediate substrate 20, the double-sided substrate 10, and the single-sided substrate are respectively arranged from the upper side in the stacking direction to the lower side or from the lower side to the upper side. 30.

  The heat of the electronic component 90 is transferred to the wiring 22 on the upper side of the intermediate substrate 20 through the adhesive layer 9 and diffused and radiated. As described above, the component-embedded substrate 1C according to the fourth embodiment can realize a component-embedded substrate having a five-layer structure in which a plurality of electronic components 80 and 90 are incorporated and the heat dissipation characteristics are improved.

  FIG. 16 is a cross-sectional view showing a component built-in substrate according to a fifth embodiment of the present invention. In FIG. 16, the illustration of the bumps 49 is omitted. As shown in FIG. 16, the component built-in substrate 1 </ b> D according to the fifth embodiment is substantially solid in a region where the wirings 22 of the intermediate substrate 20 are surrounded by the vias 23. The lower wiring 22 is formed in a region that does not overlap with the wiring 32 of the single-sided substrate 30 connected to the upper and lower electronic components 90 and 80 in the stacking direction, and more than the intermediate substrate 20. The difference in the arrangement configuration of the substrates on the lower side in the stacking direction is different from the component-embedded substrate 1A according to the second embodiment.

  That is, in the component built-in substrate 1 </ b> D, the single-sided substrate 30, the double-sided substrate 10, and the single-sided substrate 30 are arranged in this order from the intermediate substrate 20 toward the lower side in the stacking direction. In addition, the electrode forming surfaces 91b and 81b of the electronic components 90 and 80 accommodated in the openings of each double-sided substrate 10 are stacked so that the single-sided substrate 30, the intermediate substrate 20 and the single-sided substrate 30 are opposed to each other in the stacking direction. Has been placed. The wirings 32 connected to the electronic components 90 and 80 in each single-sided substrate 30 adjacent to the intermediate substrate 20 are arranged to face each other with the adhesive layer 9 and the resin base material 21 interposed therebetween.

  Accordingly, the same effects as the above-described effects can be obtained, and the upper and lower wirings 22 of the intermediate substrate 20 and the wirings 32 connected to the electronic components 90 and 80 of the respective single-sided substrates 30 can be collectively displayed. There is no contact during lamination, and the electrical connection reliability can be further improved.

  Even with the configurations of the component-embedded substrates 1A to 1D according to the second to fifth embodiments, the heat of the electronic components incorporated in the substrate is diffused and dissipated in the layers, and the components can be manufactured with a simple manufacturing process. The same effect as the effect of 1st Embodiment that can achieve thickness reduction of the whole built-in board | substrate can be show | played.

DESCRIPTION OF SYMBOLS 1 Component-embedded substrate 2, 3, 4 Via hole 9, 9a Adhesive layer 10 Double-sided substrate 11, 21, 31 Resin base material 12, 22, 32 Wiring 13, 23, 33 Via 19 Opening 20 Intermediate substrate 30 Single-sided substrate 80, 90 Electronic component 81, 91 Redistribution electrode 81a, 91a Back surface 81b, 91b Electrode forming surface 100 Mounting body

Claims (2)

A multilayered component-embedded substrate in which a plurality of unit substrates are stacked and a plurality of electronic components are embedded in the stacking direction,
The plurality of unit substrates are:
A first substrate having a first insulating layer and having an opening accommodating a first electronic component;
What is the second insulating layer , the first wiring layer formed on the surface of the second insulating layer on the first substrate side, adjacent to the first substrate, and the surface of the second insulating layer on the first substrate side second wiring layer formed on the opposite side, a first adhesive layer and said second insulating layer and the first adhesive layer prior SL provided on the first substrate side and the opposite side of the second insulating layer through And an intermediate substrate comprising a first interlayer conductive layer formed in a non-connected manner with the first wiring layer and the second wiring layer ,
A second insulating layer disposed on the opposite side of the intermediate substrate from the first substrate, having a third insulating layer, and having an opening that accommodates the second electronic component at a position overlapping the first electronic component in the stacking direction; Two substrates,
A fourth insulating layer disposed between the second substrate and the intermediate substrate, a third wiring layer formed on one surface of the fourth insulating layer, and penetrating through the fourth insulating layer; A third substrate including a via connecting the layer and the second electronic component, and a second adhesive layer provided on the other surface side of the fourth insulating layer ,
The first substrate, the intermediate substrate and the third substrate, the first wiring layer and the first electronic component is disposed so as to face each other through the first adhesive layer Rutotomoni, the second wiring layer And the third wiring layer are arranged and laminated so as to face each other with the first adhesive layer interposed therebetween ,
Built-in component characterized in that at least the second wiring layer of the first and second wiring layers of the intermediate substrate is formed in a region not overlapping with the third wiring layer of the third substrate in the stacking direction. substrate. A method for manufacturing a component-embedded substrate having a multilayer structure in which a plurality of unit substrates are stacked and a plurality of electronic components are embedded in a stacking direction,
Forming a first substrate by forming an opening for accommodating the first electronic component in the first insulating layer as the unit substrate; and
A first wiring layer is formed on a surface of the second insulating layer that is disposed on the first substrate side as the unit substrate, and the second insulating layer is disposed on a surface that is disposed on the opposite side of the first substrate side. forming a second wiring layer, wherein the two first substrate side before Symbol of the insulating layer and the opposite side provided with a first adhesive layer, through said second insulating layer and the first adhesive layer the first wiring layer And forming an intermediate substrate by forming a first interlayer conductive layer that is not connected to the second wiring layer ;
Forming a second substrate by forming an opening in the third insulating layer as the unit substrate in a position where the second electronic component overlaps the first electronic component in the stacking direction;
A third wiring layer is formed on one surface of the fourth insulating layer as the unit substrate, and a via passing through the fourth insulating layer and connected to the third wiring layer and the second electronic component is formed. Providing a second adhesive layer on the other surface side of the fourth insulating layer to produce a third substrate;
The first electronic component is accommodated in the opening of the first substrate, and the intermediate substrate is placed on the first substrate with the first wiring layer and the first electronic component interposed through the first adhesive layer. Arranging the second substrate on the side opposite to the first substrate with respect to the intermediate substrate, and laminating a plurality of the unit substrates in the laminating direction ;
With
In the step of manufacturing the intermediate substrate, at least the second wiring layer of the first and second wiring layers is formed in a region that does not overlap with the third wiring layer of the third substrate in the stacking direction;
In the step of laminating, the third substrate is disposed between the second substrate and the intermediate substrate so that the second wiring layer and the third wiring layer are opposed to each other with the first adhesive layer interposed therebetween. And manufacturing the component-embedded substrate.

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