JP5071118B2 - セラミック電子部品 - Google Patents

セラミック電子部品 Download PDF

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Publication number
JP5071118B2
JP5071118B2 JP2008010121A JP2008010121A JP5071118B2 JP 5071118 B2 JP5071118 B2 JP 5071118B2 JP 2008010121 A JP2008010121 A JP 2008010121A JP 2008010121 A JP2008010121 A JP 2008010121A JP 5071118 B2 JP5071118 B2 JP 5071118B2
Authority
JP
Japan
Prior art keywords
electrode
resin
main body
external electrode
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008010121A
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English (en)
Japanese (ja)
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JP2009170835A (ja
JP2009170835A5 (enExample
Inventor
千尋 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2008010121A priority Critical patent/JP5071118B2/ja
Publication of JP2009170835A publication Critical patent/JP2009170835A/ja
Publication of JP2009170835A5 publication Critical patent/JP2009170835A5/ja
Application granted granted Critical
Publication of JP5071118B2 publication Critical patent/JP5071118B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2008010121A 2008-01-21 2008-01-21 セラミック電子部品 Active JP5071118B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008010121A JP5071118B2 (ja) 2008-01-21 2008-01-21 セラミック電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008010121A JP5071118B2 (ja) 2008-01-21 2008-01-21 セラミック電子部品

Publications (3)

Publication Number Publication Date
JP2009170835A JP2009170835A (ja) 2009-07-30
JP2009170835A5 JP2009170835A5 (enExample) 2011-03-03
JP5071118B2 true JP5071118B2 (ja) 2012-11-14

Family

ID=40971654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008010121A Active JP5071118B2 (ja) 2008-01-21 2008-01-21 セラミック電子部品

Country Status (1)

Country Link
JP (1) JP5071118B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5246207B2 (ja) 2010-06-04 2013-07-24 株式会社村田製作所 チップ型電子部品
US9490055B2 (en) 2011-10-31 2016-11-08 Murata Manufacturing Co., Ltd. Ceramic electronic component and manufacturing method thereof
US8988855B2 (en) 2011-10-31 2015-03-24 Murata Manufacturing Co., Ltd. Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particle
US9202640B2 (en) 2011-10-31 2015-12-01 Murata Manufacturing Co., Ltd. Ceramic electronic component and manufacturing method thereof
JP6673273B2 (ja) * 2016-09-28 2020-03-25 株式会社村田製作所 電子部品
KR102760393B1 (ko) * 2019-08-23 2025-02-03 삼성전기주식회사 적층형 전자 부품

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3887870B2 (ja) * 1997-04-02 2007-02-28 松下電器産業株式会社 導電接続構造体
JP2005217126A (ja) * 2004-01-29 2005-08-11 Kyocera Corp コンデンサの製造方法
JP2007073883A (ja) * 2005-09-09 2007-03-22 Rohm Co Ltd チップ型コンデンサ
EP1965397B1 (en) * 2005-12-22 2019-03-20 Namics Corporation Thermosetting conductive paste and multilayer ceramic component having external electrode which is formed by using such thermosetting conductive paste

Also Published As

Publication number Publication date
JP2009170835A (ja) 2009-07-30

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