JP5061660B2 - Laser processing method and dust collector used therefor - Google Patents

Description

  The present invention relates to a laser processing method, and more particularly to a laser processing method for performing processing while collecting dust generated during laser processing, and a dust collector used therefor.

  2. Description of the Related Art Conventionally, a laser processing method for performing processing such as naming and marking on a product such as a semiconductor wafer with a laser is known. The dust generated during the laser processing needs to be collected by a dust collector, and a single dust collector is installed in correspondence with a manufacturing apparatus such as a laser processing apparatus that performs laser processing.

  FIG. 8 is a diagram showing a state in which a conventional external dust collector is applied to a manufacturing apparatus 400 that houses a laser processing apparatus. In FIG. 8, a dust collector 300 is installed externally via a duct 45 with respect to the manufacturing apparatus 400, and dust generated during processing by the manufacturing apparatus 400 is collected by the dust collector 300 via the duct 45. It is configured as follows.

  On the other hand, FIG. 9 is an aspect view when a conventional single dust collector 300 is accommodated in the manufacturing apparatus 400. In FIG. 9, the manufacturing apparatus 400 and the dust collector 300 are accommodated in one cabinet 95, and dust generated by processing of the manufacturing apparatus 400 is collected in the cabinet 95.

In addition, the laser marking device is equipped with a dust collection box that surrounds the work piece and its surroundings, and the dust collection box is provided with a plurality of air suction ports and dust collection discharge ports that are horizontally opposed and connected to the dust collection box during processing. A technology is known in which a laminar air flow parallel to the surface of the workpiece is formed by the collected dust collector, and the dust is efficiently absorbed by the air flow without turbulence in one direction ( For example, see Patent Document 1).
JP 2002-35984 A

  However, in the manufacturing apparatus 400 using the conventional dust collector 300 shown in FIG. 8, since the dust collector 300 is added externally to the manufacturing apparatus 400, the dust collector 300 for the external dust collector is housed in the clean room that accommodates them. There was a problem that a space had to be provided.

  Moreover, in the aspect which accommodated the conventional dust collector 300 shown in FIG. 9 in the cabinet 95 of the manufacturing apparatus 400, there existed a problem that a dead space arises in the upper part of the dust collector 300, and the manufacturing apparatus 400 also becomes large according to it. It was.

  Furthermore, in the technique described in Patent Document 1, the dust collector itself is externally attached in the same manner as in the embodiment of FIG. 8, and it is necessary to spend the space required for this.

  Accordingly, the present invention is configured such that the main components of the dust collector are separately and independently configured in a cabinet that accommodates the manufacturing apparatus, and each is disposed at a desired position with sufficient space, thereby collecting the dust collector. It is an object of the present invention to provide a laser processing method for performing laser processing while performing dust, and a dust collector used therefor.

In order to achieve the above object, a laser processing method according to the first invention includes a dust collection port (10) in a processing cabinet (90) having an aligner (60) and a laser head (50), A dust collecting part (20) and an exhaust fan (30);
Disposing a static elimination blow generator (80) at a position facing the dust collection port (10),
The semiconductor device is aligned by the aligner (60),
While irradiating a laser beam from the laser head (50) to the semiconductor device on which the alignment has been performed , while discharging air discharged by the discharge blow generator (80) to the dust collection port (10), While performing laser processing,
The dust collection port (10) sucks in air containing dust generated during the processing by the suction force of the exhaust fan (30),
Next, the dust collection unit (20) collects and removes the dust from the inhaled air,
Next, the exhaust fan (30) exhausts the air from which the dust has been removed to the outside of the cabinet (90).

Thereby, it becomes possible to arrange each element constituting the dust collector in a desired position in one processing cabinet, and it is possible to collect dust during laser processing while realizing space saving , Laser processing can be performed by collecting dust while preventing charging of the semiconductor device .

According to a second aspect of the present invention, in the laser processing method according to the first aspect, the dust collection part (20) has a size of eyes from the dust collection port (10) side toward the exhaust fan (30) side. Is provided with a multistage filter (20a) that becomes smaller in order,
The air is collected through the multistage filter (20a). As a result, dust can be collected in order starting from dust with larger particles, and laser processing can be performed while efficiently collecting dust without placing a heavy burden on the exhaust fan that sucks air containing dust.

A third invention is the laser processing method according to the first or second invention,
The amount of air sucked into the dust collection port (10) is larger than the amount of air discharged from the static elimination blow generator (80). Thereby, floating of dust due to the charge removal blow can be prevented, and dust collection can be performed efficiently by using the charge removal blow effectively.

4th invention is the laser processing method of any one concerning 1st- 3rd invention,
The alignment is characterized in that alignment is performed so that a region to be processed of the semiconductor device is disposed on the dust collection port (10) side. Thereby, it becomes the positional relationship by which the dust collection opening is installed near the to-be-processed area | region where dust generate | occur | produces, and the generated dust can be collected effectively.

A dust collector according to a fifth invention is a dust collector (100) for collecting dust generated in a processing cabinet (90) during laser processing of a semiconductor device,
A dust collection port (10) provided in the vicinity of a region to be processed of the semiconductor device;
A static elimination blow generator (80) provided at a position facing the dust collection port (10);
A dust collecting part (20) connected to the dust collecting port (10) by a duct (41) and provided at a desired position in the cabinet (90);
The suction side is connected to the dust collecting part (20) by a duct (42), the discharge side is connected to a duct (43) communicating with the outside of the cabinet (90), and is arranged at a desired position in the cabinet (90). And an exhaust fan (30).

  Thereby, it can be set as the dust collector which can be arrange | positioned in space-saving using an empty space in the cabinet for laser processing.

  Note that the reference numerals in the parentheses are given for easy understanding, are merely examples, and are not limited to the illustrated modes.

  According to the present invention, each element constituting the dust collecting device can be arranged at a desired position in one processing cabinet, and dust during laser processing can be collected while realizing space saving. Can do.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic configuration diagram of a dust collector 100 according to an embodiment to which the present invention is applied. A dust collector 100 according to the present embodiment includes a dust collection port 10, a dust collection unit 20, an exhaust fan 30, and a duct 40 that sequentially connects them. In the dust collector 100 according to the present embodiment, unlike the dust collector 300 described in the prior art, each of the constituent elements 10, 20, and 30 is individually configured independently, and these constituent elements are connected by a duct 40. It is configured as follows.

  The dust collection port 10 is a suction port for sucking air containing dust generated during laser processing. Since the workpiece for laser processing is a semiconductor device such as a semiconductor wafer, for example, it is preferable to have an opening large enough to cover this processing region. The dust collection port 10 is preferably provided near the position where laser processing is performed, but the dust collection port 10 is configured independently as in the dust collection device 100 according to the present embodiment. If so, the dust collection port 10 can be arranged at a desired position near the region to be processed.

  The dust collection unit 20 is means for collecting dust through the air containing the dust collected by the dust collection port 10. Although details will be described later, for example, the dust collection unit 20 may include a filter and collect dust with the filter. If there are other dust collection methods and means, dust may be collected by them, and the contained dust is collected by passing air containing dust sent from the dust collection port 10. As long as it can be removed from the air, the type and form are not limited. In addition, the dust collection unit 20 usually occupies a large volume in the dust collector, and in the conventional dust collector, since other components are further integrated and configured as a unit, the entire volume becomes large. If the dust collecting unit 20 is configured as a single unit like the dust collecting device 100 used in the present embodiment, the volume can be greatly reduced, so that a space that can be placed in the cabinet 90 is easily provided. Can do.

  The exhaust fan 30 is a means for sucking air from which dust has been removed by the dust collecting unit 20 through the duct 40 and exhausting the air to the outside. In the present embodiment, a suction force for sucking air from the dust collection port 10 is generated via the duct 40 by the suction force of the exhaust fan 30.

  As described above, the dust collecting apparatus 100 according to the present embodiment includes the dust collection port, the dust collection unit, and the exhaust fan, which are the main components, separately as a single unit, which are connected by the duct 40 as a whole. Since the dust collector 100 is comprised, a component can be arrange | positioned in a desired position in each.

  FIG. 2 is a side view showing a laser processing apparatus 200 and a dust collecting apparatus 100 used for executing a laser processing method according to an embodiment to which the present invention is applied. In FIG. 2, a laser processing apparatus 200 used in the present embodiment is housed in a cabinet 90, and includes a laser head 50 that performs laser processing, an aligner 60, a peripheral device including a power source, a control unit, a transfer robot, and the like. 70.

  Further, as described in FIG. 1, as the components of the dust collector 100, the dust collector 10, the dust collector 20, the exhaust fan 30, and ducts 41, 42, and 43 that connect them are provided. Prepare.

  First, the laser processing apparatus 200 will be described.

  The laser head 50 is a laser generation source for irradiating a semiconductor device, which is an object to be processed, with a laser. Characters and symbols may be printed on the workpiece by laser emitted from the laser head 50, or processing for cutting the workpiece or making holes may be performed. For example, the laser processing apparatus 200 may be a laser marking apparatus that uses a semiconductor wafer as an object to be processed and performs predetermined printing on the semiconductor wafer, and in that case, printing that performs printing on the semiconductor wafer with a laser. Processing will be performed.

  As the type of laser emitted from the laser head 50, an appropriate type of laser may be applied depending on the type of processing and the type of processing object.

  The aligner 60 is a means for positioning the semiconductor device that is the workpiece. The aligner 60 may have a function of placing a semiconductor device such as a semiconductor wafer thereon and supporting it from below, and rotating and positioning it. For example, when the workpiece is a semiconductor wafer, the aligner 60 may perform alignment by the position of an orientation flat (orientation flat) formed on the semiconductor wafer.

  The peripheral device 70 includes a power source, a control unit, a transport robot, and the like, and may include a device that transports and controls a semiconductor device that is necessary for the laser processing apparatus 200 to perform laser processing smoothly.

  Next, the laser processing method according to the present embodiment will be described including the relationship with the dust collector 100 according to the present embodiment.

  First, the semiconductor device introduced into the cabinet 90 is placed on the aligner 60. You may perform the conveyance to the aligner 60, for example using the conveyance robot mentioned later.

  Next, the aligner 60 performs alignment of the semiconductor device using, for example, an orientation flat of the semiconductor device. Thereby, the to-be-processed area | region of the semiconductor device which laser-processes is arrange | positioned in the position in which the laser processing by laser beam irradiation is possible. For example, when the laser beam is irradiated vertically downward from the laser head 50, alignment is performed so that the region to be processed is located directly below the position where the laser head beam is emitted.

  Next, when the alignment process is completed, a laser beam is emitted from the laser head 50 to irradiate a processing region of the semiconductor device, and laser processing is performed. The laser processing may be, for example, printing on a semiconductor wafer.

  During the laser processing, dust is generated from the processing region of the semiconductor device. Dust generated by the laser processing is collected by the dust collector 100, and laser processing is performed while collecting the dust. Hereinafter, dust collection by the dust collector 100 will be described.

  As described with reference to FIG. 1, the dust collector 100 according to the present embodiment includes a dust collection port 10, a dust collection unit 20, and an exhaust fan 30, which are connected by a duct 40. The arrangement | positioning is not one lump, but each is arrange | positioned in the distant position in the cabinet 90. FIG.

  The dust collection port 10 is disposed in the vicinity of the aligner 60 and is disposed in the vicinity of the semiconductor device that is the workpiece. Accordingly, air containing dust is effectively sucked before the dust is scattered or scattered at a position where the amount of dust generated when the semiconductor device is laser processed is large.

  Note that the air containing dust is sucked in by creating a negative pressure flow that sucks the surrounding air from the dust collection port 10 through the ducts 42 and 41 by the suction force of the exhaust fan 30 as exhaust means. Inhale. The air containing the dust sucked through the dust collection port 10 is sent to the dust collection unit 20 through the duct 41.

  The dust collection unit 20 collects dust by passing air containing dust sucked in through the dust collection port 10. For example, the dust collecting unit 20 may be configured to collect dust with a filter, and may collect dust by passing air containing dust through a filter provided in the dust collecting unit 20. The filter configuration inside the dust collection unit 20 will be described later.

  The dust collection unit 20 has a height substantially the same as that of the aligner 60 and is placed at a position close to the left wall in the cabinet 90. Thus, for example, when there is a space on the left side in the cabinet 90, the dust collection unit 20 can be arranged using the space. In FIG. 2, the dust collection unit 20 is disposed near the left side wall in the cabinet 90, but where the space is enough to place the dust collection unit 20 in space, the dust collection unit 20 is disposed anywhere. May be. Thus, the dust collector 100 can be arranged by effectively utilizing the space in the cabinet 90 by making the dust collector 20 a single independent configuration.

  After the dust-containing air passes through the dust collection unit 20 and the dust is collected and removed by the dust collection unit 20, the collected air is sent to the exhaust fan 30 via the duct 42.

  The purified air sucked by the exhaust fan 30 through the duct 42 is exhausted to the outside of the cabinet 90 through the duct 43. The cabinet 90 is usually installed in a clean room (not shown), and laser processing is generally performed in the clean room. However, the clean room is usually connected to the outside of the clean room for exhaust. Often, large ducts are provided under the floor or walls. Therefore, the tip of the duct 43 may be connected to the exhaust duct of such a clean room. In the example of FIG. 2, for example, such a duct may be provided under the floor and connected to a discharge port communicating with the duct provided on the floor of the clean room. With this configuration, laser processing can be performed while saving space without scattering dust in the clean room.

  Various types of exhaust fan 30 may be applied, and the type and form thereof are not limited. It is preferable that the rotation speed of the exhaust fan 30 is variable so that it can be adapted to various laser processing. Thereby, the suction force of the dust and air in the dust collection port 10 and the suction force which allows the air in the dust collection part 20 to pass through can be adjusted.

  As described above, according to the laser processing method according to the present embodiment, by applying the dust collector 100 according to the present embodiment, which is arranged to save space, the dust collection efficiency is achieved while saving space. Therefore, it is possible to provide an effective laser processing method that realizes high dust collection and does not hinder laser processing due to dust.

  Next, with reference to FIG. 3 and FIG. 4, an example of the configuration inside the dust collecting unit 20 of the dust collecting apparatus 100 according to the present embodiment will be described.

  FIG. 3 is a cross-sectional view showing one aspect of the filter configuration inside the dust collection unit 20. In FIG. 3, the dust collection unit 20 constitutes a multistage filter 20 a including three stages of a filter 21, a filter 22, and a filter 23. As described above, the filter configuration may be a multistage filter including a plurality of filters 21, 22, and 23.

  In FIG. 3, air containing dust is sent from the upper part of the filter 21, air passes in the order of the filter 21, the filter 22, and the filter 23, and is filtered from the lower part of the filter 23 to remove the dust. It is configured to be discharged and sent to a duct 42 connected to the exhaust fan 30.

  In the multistage filter 20a, the coarseness of each filter is preferably different. For example, the most upstream filter 21 has the coarsest mesh, the second filter 22 has a finer mesh than the filter 21, and the most downstream filter 23 has a finer mesh than the filter 22. Also good. When a fine filter is used from the first-stage filter 21 in the multi-stage filter or the multi-layer filter, a large amount of dust is caught by the first-stage filter 21 from the beginning, so that the exhaust fan 30 needs a large suction force.

  On the other hand, when the coarse filter 21 is used first and arranged so as to be finer, the first filter 21 collects and removes only dust having a large particle diameter, and the second filter. 22 is supplied with air containing only dust having a particle size smaller than that of the first-stage filter 21, and the first-stage filter 21 is installed in the second stage by installing a filter 22 having a finer particle than the first-stage filter 21. It is possible to collect dust having a particle size that could not be collected by the above method. Similarly, a filter having a mesh size corresponding to the finally required dust collection capacity smaller than that of the second-stage filter 22 may be installed in the third-stage filter 23. As a result, the dust is removed from the air containing the dust supplied through the second-stage filter 22 with the dust collecting ability that is finally required, and the purified air is exhausted to the duct 42. be able to.

  The thickness and the number of steps of the filter 20a may be freely designed and configured according to the required dust collection capacity, application, and the like. For example, if a high dust collection capability is required, the thickness of each filter 21, 22, 23 may be increased, or the number of stages may be increased, for example, as a 5-stage filter 20a. Also good. Conversely, if the required dust collection capacity is low, the thickness of the filters 21, 22, 23 may be reduced, or the two-stage filter 20 a including the filters 21, 22 may be configured.

  These conditions may be appropriately adjusted according to the density, the number of cells, the tensile strength, the elongation rate, and the like of the filters 21, 22, and 23. For example, in terms of the number of cells (cells / 25 mm), the coarsest filter 21 in the first stage is 8 ± 2 (cells / 25 mm), and the coarse filter 22 in the second stage is 13 ± 3 ( (Pieces / 25 mm), the balance may be set such that the smallest filter 23 in the third stage is 35 (pieces / 25 mm) or less.

  Further, the filter 20a may be configured to be easily replaceable by being set in a dedicated case and opening the door and pulling it out like a drawer.

  FIG. 4 is a perspective view of a part of the filter 20 a of the dust collection unit 20. In FIG. 4, the filters 21, 22, and 23 are set in the special case 24 in the filter 20 a portion, and the door 25 is opened. The filters 21, 22, and 23 have frames 21 a, 22 a, and 23 a constituting an outer frame, and are configured so that they can be installed by being inserted horizontally into the dedicated case 24 like a drawer. In the case of replacement due to filter deterioration, breakage, or the like, if the filters 21, 22, 23 configured like this drawer are pulled out and replaced with new filters 21, 22, 23, the filter 20a can be easily replaced. Exchange work can be performed.

  As described above, since the dust collection unit 20 is configured independently, it is not necessary to incorporate the dust collection unit 20 into the entire package of the dust collector. Therefore, the dust collection unit 20 itself can be configured simply and easily. In addition, it is possible to realize a simple dust collector 100 in which the filter can be replaced.

  In addition, the structure of the dust collection part 20 demonstrated in FIG. 3 or FIG. 4 is only an example of the embodiment, As the dust collection part 20 using the other filter 20a, or the dust collection part 20 using another means It may be configured.

  Next, one aspect of the horizontal arrangement in the cabinet 90 of the laser processing apparatus 200 used in the laser processing method according to the present embodiment will be described.

  FIG. 5 is a plan view of the inside of the cabinet 90. In FIG. 5, the laser processing apparatus 200 applied to the present embodiment includes a laser head 50, an aligner 60, each driver unit 71, and an air part 72. In addition, loaders 73 and 74 and a transfer robot 75 are provided as a delivery mechanism for a semiconductor device such as a semiconductor wafer. And as a component which concerns on the dust collector 100, the dust collection port 10, the dust collection part 20, the exhaust fan 30, the duct 40, and the static elimination blow generator 80 are provided.

  Next, a description will be given of components that have been described for the first time in FIG. 5 and have not been described so far.

  Each driver unit 71 is a control unit including a power source and the like that performs drive control of each device in the cabinet 90.

  The air part 72 is an air supply part provided with a solenoid valve, a tube, and the like.

  The loaders 73 and 74 are places where a semiconductor device such as a semiconductor wafer to be processed is placed and stands by. The loader 73 and the loader 74 are provided with the two loaders 74 and 74 simultaneously mounting the semiconductor device before processing, or processing into a free loader while one of the loaders is processing. This is because by placing the semiconductor device before the processing, it is possible to continuously process the semiconductor devices before the processing in the two loaders 73 and 74, thereby shortening the processing time. Further, it may be used to separate the mounting location of the semiconductor device before processing and the semiconductor device after processing.

  The transfer robot 75 is a robot for carrying in and out the semiconductor device to the aligner 60. The transfer robot 75 places the semiconductor device before processing out of the loaders 73 and 74, takes out the semiconductor device from the one that has started processing, and supplies it to the aligner 60. Then, after the laser processing is completed, the processed semiconductor device on the aligner 60 is unloaded, and the semiconductor device is supplied to loaders 73 and 74 on which the processed semiconductor device is placed.

  The neutralization blow generator 80 is a means for supplying the blown air that has been neutralized to the semiconductor device during laser processing. Although details will be described later, means for generating such blown air that has been neutralized may be provided.

  In the laser processing apparatus 200 according to the present embodiment having such components, paying attention to the plane configuration, the laser head 50 that is the laser processing apparatus main body and the space on the right side of the aligner 60 are used. The dust collection port 10, the dust collection unit 20, and the exhaust fan 30 are arranged in a flow of the duct 40 that draws a circle or a spiral. When all the components are integrated, a large rectangular parallelepiped (rectangular in plan) is formed as a whole, and the dead space becomes large. However, by making each component independent as described above, the dust collection port 10 is arranged in the vicinity of the laser head 50 to improve the dust collection efficiency, and the relatively small exhaust fan 30 is made by the air parts 72. The dust collector 100 can be configured by using the space to be formed and arranged so as to surround the aligner 60 as a whole. Therefore, the dust collector 100 can be compactly disposed around the laser processing apparatus main bodies 50 and 60, and has an arrangement configuration that fits well in the rectangular cabinet 90.

  Thus, if the dust collector 100 according to the present embodiment is arranged in the cabinet 90 and dust collection is performed while performing laser processing as described above, the dust collection is achieved while realizing space saving. It can be set as a highly effective laser processing method.

  Next, the positional relationship between the static elimination blow generator 80 and the dust collecting port 10 will be described with reference to FIG. FIG. 6 is a side view for explaining an embodiment according to the laser processing method provided with the static elimination blow generator 80.

  In FIG. 6, the laser processing apparatus 200 applied to the present embodiment includes a laser head 50 and an aligner 60, and a semiconductor wafer W is placed on the aligner 60. Near the semiconductor wafer W and on the side where the laser head 50 is provided, a dust collection port 10 is provided. And the static elimination blow generator 80 is provided in the upper position facing the dust collecting port 10.

  In the laser processing method according to the present embodiment, the laser processing on the semiconductor wafer W is often not the central portion constituting the semiconductor chip but the end region where no wiring is formed. Therefore, the laser head 50 is disposed offset from the center of the aligner 60 so that the laser irradiation to the end of the semiconductor wafer W is easy.

  Therefore, the dust collection port 10 can be disposed at a position close to the region where laser irradiation is performed. On the other hand, the static elimination blow generator 80 is disposed at a position opposite to the dust collection port 10 and away from the place where laser processing is performed.

  As described above, the static elimination blow 80 is a means for supplying the blown air to the semiconductor wafer W during laser processing. Since the static elimination blow generator 80 is provided opposite to the dust collection port 10, the blow of air generated by the static elimination blow generator 80 is a flow of air toward the dust collection port 10. Therefore, the static elimination blow promotes the dust generated from the semiconductor device during laser processing to be pushed toward the dust collection port 10 and sucked by the opposing dust collection port 10. The reason why the blown air is discharged is that if the air blow is simply supplied as it is, the semiconductor device is adversely affected by static electricity of the air. Accordingly, the static elimination blow generator 80 plays a role of accelerating dust suction of the dust collection port 10 by blowing dust generated from the semiconductor device toward the dust collection port 10 without being affected by static electricity by blowing the discharged air.

  As described above, as in the laser processing method according to the present embodiment, the discharge blow generator 80 is further provided, and the laser processing is performed while supplying the discharge blow, and the generated dust is reliably collected by collecting the dust. Thus, laser processing can be performed effectively without the laser processing being hindered by the presence of dust.

  FIG. 7 is an enlarged plan view of a region where laser processing of the semiconductor wafer W is performed in the embodiment according to FIG.

  In FIG. 7, the semiconductor wafer W is provided with an orientation flat B, which serves as a reference when alignment by the aligner 60 is performed. The semiconductor wafer W is rotationally positioned by the position of the orientation flat B. In the laser processing method according to the present embodiment, the processing area A to be laser processed is arranged on the position side of the dust collection port 10. Align so that. Accordingly, the dust collection port 10 is set in the immediate vicinity of the laser irradiation area A, and dust generated during laser processing can be efficiently collected.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the present invention. Can be added.

  In particular, in the laser processing method according to the present embodiment, the dust collection port 10, the dust collection unit 20, and the exhaust fan 30, which are the main components of the dust collection device 100, are separated from each other in the cabinet 90. 40, the long duct 40 is not provided, and the dust collection port 10, the dust collection unit 20, and the exhaust fan 30 are directly connected if there is a space in which these can be placed together. It is also possible to configure a single unit. Depending on the situation of the space in the cabinet 90, it may be preferable to arrange them integrally. Even in such a case, the laser processing method according to the present embodiment and the dust collector 100 used in this method are compatible. Is possible. Thus, according to the laser processing method and the dust collector 100 used therefor according to the present embodiment, even if the situation in the cabinet 90 changes variously, it is possible to flexibly deal with various uses and aspects. .

It is a composition outline figure of dust collecting device 100 concerning an embodiment to which the present invention is applied. It is the side view which showed the laser processing apparatus 200 and dust collector 100 which are used in order to perform the laser processing method which concerns on embodiment to which this invention is applied. It is sectional drawing which shows the one aspect | mode of the dust collection part 20 of the dust collector 100 which concerns on this Embodiment. 4 is a perspective view of a filter 20a portion of the dust collection unit 20. FIG. It is a top view in the cabinet 90. FIG. It is explanatory drawing of embodiment of the laser processing method provided with the static elimination blow generator. 3 is an enlarged plan view of a region where laser processing of a semiconductor wafer W is performed. FIG. It is the figure which showed the state which applied the conventional external type dust collector to the manufacturing apparatus. It is an aspect figure at the time of accommodating the conventional dust collector 300 in the manufacturing apparatus 400. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Dust collection port 20 Dust collection part 20a, 21, 22, 23 Filter 24 Dedicated case 25 Door 30 Exhaust fan 40, 41, 42, 43, 45 Duct 50 Laser head 60 Aligner 70 Peripheral device 71 Each driver unit 72 Air parts 73 , 74 Loader 75 Transport robot 80 Static electricity blow generator 90, 95 Cabinet 100, 300 Dust collector (dust collector)
200, 400 Laser processing equipment

Claims (5)

In the processing cabinet having an aligner and a laser head, a dust collection port, a dust collection unit, and an exhaust fan are provided.
Disposing a static elimination blow generator at a position facing the dust collection port,
Align the semiconductor device with the aligner,
While performing laser processing while irradiating a laser from the laser head to the semiconductor device where the alignment has been performed, collecting air by discharging the air discharged by the discharge blow generator to the dust collection port ,
The dust collection port sucks air containing dust generated during the processing by the suction force of the exhaust fan,
Next, the dust collecting unit collects and removes the dust from the inhaled air,
Next, the exhaust fan exhausts the air from which the dust has been removed to the outside of the cabinet. The dust collection unit includes a multi-stage filter in which the size of the eyes becomes smaller in order from the dust collection port side toward the exhaust fan side,
The laser processing method according to claim 1, wherein the air is collected through the multistage filter. 3. The laser processing method according to claim 1, wherein an air suction amount of the dust collection port is larger than an amount of air discharged from the static elimination blow generator. The alignment, the processed region of the semiconductor device, the laser processing method according to any one of claims 1 to 3, characterized in that alignment is performed so as to be arranged in the dust collecting port side. A dust collector that collects dust generated in a processing cabinet during laser processing of a semiconductor device,
A dust collection port provided near a region to be processed of the semiconductor device;
A static elimination blow generator provided at a position facing the dust collection port;
Connected to the dust collection port by a duct, and a dust collection unit provided at a desired position in the cabinet;
An exhaust fan connected to the dust collecting portion by a duct and having a discharge side connected to a duct communicating with the outside of the cabinet and disposed at a desired position in the cabinet. .

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